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WO2008111309A1 - 認識マークおよび回路基板の製造方法 - Google Patents

認識マークおよび回路基板の製造方法 Download PDF

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Publication number
WO2008111309A1
WO2008111309A1 PCT/JP2008/000537 JP2008000537W WO2008111309A1 WO 2008111309 A1 WO2008111309 A1 WO 2008111309A1 JP 2008000537 W JP2008000537 W JP 2008000537W WO 2008111309 A1 WO2008111309 A1 WO 2008111309A1
Authority
WO
WIPO (PCT)
Prior art keywords
holes
lamination
mark
circuit substrate
recognition mark
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/000537
Other languages
English (en)
French (fr)
Inventor
Toshiaki Takenaka
Yukihiro Hiraishi
Takao Okamoto
Masaya Mada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2008535820A priority Critical patent/JP5035249B2/ja
Priority to US12/297,076 priority patent/US20090178839A1/en
Priority to CN200880000335.6A priority patent/CN101543144B/zh
Publication of WO2008111309A1 publication Critical patent/WO2008111309A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4679—Aligning added circuit layers or via connections relative to previous circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0242—Cutting around hole, e.g. for disconnecting land or Plated Through-Hole [PTH] or for partly removing a PTH
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1136—Conversion of insulating material into conductive material, e.g. by pyrolysis
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

表裏に離型フィルム（２ａ、２ｂ）を張り付けたプリプレグシート（１）に、製品の貫通孔（３）、積層認識マーク用貫通孔（７ａ、７ｂ）、Ｘ線認識マーク用貫通孔（８ａ、８ｂ）を形成し、積層認識マーク用貫通孔（７ａ、７ｂ）をマスキングして、製品の貫通孔（３）およびＸ線認識マーク用貫通孔（８ａ、８ｂ）に導電性ペースト（４）を充填した後、離型フィルム（２ａ、２ｂ）を剥離して回路基板を製造するもので、積層認識マーク用貫通孔（７ａ、７ｂ）には導電性ペースト（４）が充填されないので、積層精度が高い認識マークが容易に得られ、積層精度が向上し、高密度で品質の優れた回路形成基板が得られる。
PCT/JP2008/000537 2007-03-14 2008-03-12 認識マークおよび回路基板の製造方法 Ceased WO2008111309A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008535820A JP5035249B2 (ja) 2007-03-14 2008-03-12 回路基板の製造方法
US12/297,076 US20090178839A1 (en) 2007-03-14 2008-03-12 Recognition mark and method for manufacturing circuit board
CN200880000335.6A CN101543144B (zh) 2007-03-14 2008-03-12 识别标志以及电路基板的制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-064751 2007-03-14
JP2007064751 2007-03-14

Publications (1)

Publication Number Publication Date
WO2008111309A1 true WO2008111309A1 (ja) 2008-09-18

Family

ID=39759252

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/000537 Ceased WO2008111309A1 (ja) 2007-03-14 2008-03-12 認識マークおよび回路基板の製造方法

Country Status (5)

Country Link
US (1) US20090178839A1 (ja)
JP (2) JP5035249B2 (ja)
CN (1) CN101543144B (ja)
TW (1) TWI412315B (ja)
WO (1) WO2008111309A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011155162A1 (ja) * 2010-06-08 2011-12-15 パナソニック株式会社 多層配線基板および多層配線基板の製造方法
US11338393B2 (en) 2015-10-30 2022-05-24 Laser Systems Inc. Manufacturing method of processed resin substrate and laser processing apparatus

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102036508A (zh) * 2011-01-05 2011-04-27 惠州中京电子科技股份有限公司 多层hdi线路板盲孔开窗工艺
CN102523703A (zh) * 2012-01-06 2012-06-27 汕头超声印制板公司 一种pcb板上背钻孔的制作方法
CN104349610B (zh) * 2013-07-24 2018-03-27 北大方正集团有限公司 印制电路板子板及印制电路板的制造方法和印制电路板
KR102065873B1 (ko) * 2019-02-20 2020-01-13 도시오 오쿠노 전자 디바이스 검사용 컨택트 시트 및 컨택트 시트의 범프 일체형 리드 형성 방법
CN111465218A (zh) * 2020-03-19 2020-07-28 国巨电子（中国）有限公司 一种低温共烧陶瓷及其填孔方法
JP2022047385A (ja) * 2020-09-11 2022-03-24 キオクシア株式会社 プリント配線基板およびメモリシステム

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JPH1187932A (ja) * 1997-09-02 1999-03-30 Toshiba Corp 多層配線板の製造方法
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JP2002111204A (ja) * 2000-09-29 2002-04-12 Toppan Printing Co Ltd 多層配線基板の製造方法
JP2002217540A (ja) * 2001-01-17 2002-08-02 Matsushita Electric Ind Co Ltd 多層配線基板の製造方法及びその装置
JP2002290033A (ja) * 2001-03-23 2002-10-04 Kyocera Corp 多層配線基板の製造方法
JP2003318535A (ja) * 2002-04-18 2003-11-07 Mitsui Chemicals Inc プリント配線板の製造方法
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JPH1187932A (ja) * 1997-09-02 1999-03-30 Toshiba Corp 多層配線板の製造方法
JP2000013023A (ja) * 1998-06-19 2000-01-14 Matsushita Electric Ind Co Ltd 多層プリント配線板の製造方法
JP2002111204A (ja) * 2000-09-29 2002-04-12 Toppan Printing Co Ltd 多層配線基板の製造方法
JP2002217540A (ja) * 2001-01-17 2002-08-02 Matsushita Electric Ind Co Ltd 多層配線基板の製造方法及びその装置
JP2002290033A (ja) * 2001-03-23 2002-10-04 Kyocera Corp 多層配線基板の製造方法
JP2003318535A (ja) * 2002-04-18 2003-11-07 Mitsui Chemicals Inc プリント配線板の製造方法
JP2004235243A (ja) * 2003-01-28 2004-08-19 Fujikura Ltd 多層基板用基材、多層基板およびその製造方法
JP2006324378A (ja) * 2005-05-18 2006-11-30 Matsushita Electric Ind Co Ltd 多層プリント配線板およびその製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011155162A1 (ja) * 2010-06-08 2011-12-15 パナソニック株式会社 多層配線基板および多層配線基板の製造方法
JPWO2011155162A1 (ja) * 2010-06-08 2013-08-01 パナソニック株式会社 多層配線基板および多層配線基板の製造方法
US11338393B2 (en) 2015-10-30 2022-05-24 Laser Systems Inc. Manufacturing method of processed resin substrate and laser processing apparatus

Also Published As

Publication number Publication date
TWI412315B (zh) 2013-10-11
US20090178839A1 (en) 2009-07-16
CN101543144B (zh) 2012-12-05
TW200845863A (en) 2008-11-16
JP2012164999A (ja) 2012-08-30
JP5035249B2 (ja) 2012-09-26
JPWO2008111309A1 (ja) 2010-06-24
CN101543144A (zh) 2009-09-23
JP5333623B2 (ja) 2013-11-06

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