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WO2008081904A1 - 凹版及びこれを用いた導体層パターン付き基材 - Google Patents

凹版及びこれを用いた導体層パターン付き基材 Download PDF

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Publication number
WO2008081904A1
WO2008081904A1 PCT/JP2007/075205 JP2007075205W WO2008081904A1 WO 2008081904 A1 WO2008081904 A1 WO 2008081904A1 JP 2007075205 W JP2007075205 W JP 2007075205W WO 2008081904 A1 WO2008081904 A1 WO 2008081904A1
Authority
WO
WIPO (PCT)
Prior art keywords
engraved plate
base material
conductor layer
layer pattern
engraved
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2007/075205
Other languages
English (en)
French (fr)
Inventor
Susumu Naoyuki
Hisashige Kanbara
Minoru Tosaka
Kyosuke Suzuki
Toshirou Okamura
Yoshihito Kikuhara
Masami Negishi
Tadayasu Fujieda
Kouichi Tsuyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007099332A external-priority patent/JP4967765B2/ja
Priority claimed from JP2007152658A external-priority patent/JP2008305703A/ja
Priority claimed from JP2007183130A external-priority patent/JP2009021412A/ja
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to EP07860426A priority Critical patent/EP2098362A4/en
Priority to CN200780045844.6A priority patent/CN101557927B/zh
Priority to US12/439,685 priority patent/US8673428B2/en
Publication of WO2008081904A1 publication Critical patent/WO2008081904A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N1/00—Printing plates or foils; Materials therefor
    • B41N1/04—Printing plates or foils; Materials therefor metallic
    • B41N1/06—Printing plates or foils; Materials therefor metallic for relief printing or intaglio printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
    • B32B3/14—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material characterised by a face layer formed of separate pieces of material which are juxtaposed side-by-side
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C1/00—Forme preparation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N1/00—Printing plates or foils; Materials therefor
    • B41N1/12—Printing plates or foils; Materials therefor non-metallic other than stone, e.g. printing plates or foils comprising inorganic materials in an organic matrix
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/006—Nanostructures, e.g. using aluminium anodic oxidation templates [AAO]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0094—Shielding materials being light-transmitting, e.g. transparent, translucent
    • H05K9/0096—Shielding materials being light-transmitting, e.g. transparent, translucent for television displays, e.g. plasma display panel
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/2457—Parallel ribs and/or grooves
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24612—Composite web or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24612—Composite web or sheet
    • Y10T428/2462—Composite web or sheet with partial filling of valleys on outer surface
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/30—Self-sustaining carbon mass or layer with impregnant or other layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Physics & Mathematics (AREA)
  • Nanotechnology (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

　基材、及び前記基材の表面に絶縁層を備え、前記絶縁層に開口方向に向かって幅広で基材が露出している凹部が形成されている凹版及び凹版、及び凹版を用いて転写法により製造した導体層パターン付き基材及び導体層パターンを提供する。
PCT/JP2007/075205 2006-12-27 2007-12-27 凹版及びこれを用いた導体層パターン付き基材 Ceased WO2008081904A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP07860426A EP2098362A4 (en) 2006-12-27 2007-12-27 ENGRAVED PLATE AND BASE MATERIAL WITH CONCRETE STRUCTURE AND ENGRAVED PLATE
CN200780045844.6A CN101557927B (zh) 2006-12-27 2007-12-27 凹版和使用该凹版的带有导体层图形的基材
US12/439,685 US8673428B2 (en) 2006-12-27 2007-12-27 Engraved plate and substrate with conductor layer pattern using the same

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
JP2006-352549 2006-12-27
JP2006352549 2006-12-27
JP2007-099332 2007-04-05
JP2007099332A JP4967765B2 (ja) 2007-04-05 2007-04-05 凹版及びその製造方法
JP2007152658A JP2008305703A (ja) 2007-06-08 2007-06-08 パターンが施された金属箔の製造方法
JP2007-152658 2007-06-08
JP2007158735 2007-06-15
JP2007-158735 2007-06-15
JP2007-183130 2007-07-12
JP2007183130A JP2009021412A (ja) 2007-07-12 2007-07-12 表面黒化銅金属の製造法、導体層パターン付き基材の製造法、導体層パターン付き基材及びそれを用いた電磁波遮蔽部材

Publications (1)

Publication Number Publication Date
WO2008081904A1 true WO2008081904A1 (ja) 2008-07-10

Family

ID=39588586

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/075205 Ceased WO2008081904A1 (ja) 2006-12-27 2007-12-27 凹版及びこれを用いた導体層パターン付き基材

Country Status (6)

Country Link
US (1) US8673428B2 (ja)
EP (1) EP2098362A4 (ja)
KR (1) KR101581265B1 (ja)
CN (3) CN102765218B (ja)
TW (1) TWI466779B (ja)
WO (1) WO2008081904A1 (ja)

Cited By (23)

* Cited by examiner, † Cited by third party
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JP2009167523A (ja) * 2007-12-18 2009-07-30 Hitachi Chem Co Ltd めっき用導電性基材、その製造方法及びそれを用いた導体層パターン若しくは導体層パターン付き基材の製造方法、導体層パターン付き基材および透光性電磁波遮蔽部材
WO2010055869A1 (ja) * 2008-11-11 2010-05-20 トーカロ株式会社 印刷用ロールおよびその製造方法
EP2204676A1 (en) * 2008-12-30 2010-07-07 Samsung SDI Co., Ltd. Optical filter and flat display panel having the same
JP2010256537A (ja) * 2009-04-23 2010-11-11 Hitachi Chem Co Ltd 金属パターン及び導体層パターン付き基材の製造法、導体層パターン付き基材並びにそれを用いた電磁波遮蔽部材
JP2011122226A (ja) * 2009-12-14 2011-06-23 Tocalo Co Ltd 厚膜ｄｌｃ被覆部材およびその製造方法
US20110195278A1 (en) * 2008-10-16 2011-08-11 Atotech Deutschland Gmbh Metal plating additive, and method for plating substrates and products therefrom
JP4762368B2 (ja) * 2009-12-04 2011-08-31 三井金属鉱業株式会社 多孔質金属箔およびその製造方法
KR101082446B1 (ko) * 2008-12-30 2011-11-11 삼성에스디아이 주식회사 광학 필터 및 이를 구비하는 디스플레이 장치
CN102416789A (zh) * 2011-08-24 2012-04-18 上海希尔彩印制版有限公司 带有激光防伪线条凹版的制造方法
WO2012096233A1 (ja) * 2011-01-13 2012-07-19 三井金属鉱業株式会社 補強された多孔質金属箔およびその製造方法
JP2012154964A (ja) * 2011-01-21 2012-08-16 Think Laboratory Co Ltd パターン付ロール及びその製造方法
WO2013176029A1 (ja) * 2012-05-25 2013-11-28 株式会社シンク・ラボラトリー パターン付ロール及びその製造方法
WO2014125972A1 (ja) * 2013-02-12 2014-08-21 株式会社シンク・ラボラトリー 連続メッキ用パターニングロール及びその製造方法
JP2016510153A (ja) * 2013-03-07 2016-04-04 エルジー・ケム・リミテッド 金属細線を含む透明基板及びその製造方法
EP2370348A4 (en) * 2008-12-17 2016-12-21 3M Innovative Properties Co Preparation of Conductive Nanostructures on a Flexible Substrate
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WO2022177008A1 (ja) * 2021-02-22 2022-08-25 昭和電工マテリアルズ株式会社 樹脂組成物、硬化物、積層体、透明アンテナ及びその製造方法、並びに、画像表示装置
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JP2024056725A (ja) * 2018-07-06 2024-04-23 マーリン・ソーラー・テクノロジーズ・インコーポレイテッド 金属物品を黒化するための方法
JP7685084B2 (ja) 2018-07-06 2025-05-28 マーリン・ソーラー・テクノロジーズ・インコーポレイテッド 金属物品を黒化するための方法
CN110610656A (zh) * 2019-10-30 2019-12-24 Oppo广东移动通信有限公司 显示屏盖板及其制备方法和电子设备
JPWO2021131319A1 (ja) * 2019-12-25 2021-07-01
JP7523030B2 (ja) 2019-12-25 2024-07-26 パナソニックＩｐマネジメント株式会社 タッチセンサ
WO2022177008A1 (ja) * 2021-02-22 2022-08-25 昭和電工マテリアルズ株式会社 樹脂組成物、硬化物、積層体、透明アンテナ及びその製造方法、並びに、画像表示装置
WO2022177009A1 (ja) * 2021-02-22 2022-08-25 昭和電工マテリアルズ株式会社 樹脂組成物、硬化物、積層体、透明アンテナ及びその製造方法、並びに、画像表示装置
CN114951685A (zh) * 2022-06-10 2022-08-30 中化学科学技术研究有限公司 银纳米线及其制备方法、以及透明导电膜

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KR20090092278A (ko) 2009-08-31
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CN101557927A (zh) 2009-10-14
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