WO2007036996A1 - Substrate holding structure - Google Patents

Abstract

[PROBLEMS] Required flatness on the holding surface side is achieved even if rubber is used as an elastic material. [MEANS FOR SOLVING PROBLEMS] Recessed air gaps (2) are arranged scattered in a holding surface (1), and the openings of the air gaps (2) are individually covered by fixation plates (3). At substantially the center of each fixation plate (3), a surface receiving plate (4) formed of an elastic material with a size smaller than that of each air gap (2) is installed, projecting toward a substrate (D) to integrate the fixation plate (3) and the surface receiving plate (4). Since the surface receiving plates (4) arranged in a scattered manner are individually made to be in contact with the substrate to evenly support the substrate (D) surface, if there is a variation in the thickness of the plates (4) formed of an elastic material, a surface receiving plate (4’) having an increased thickness is in contact with the substrate (D). As a result, the surface receiving plate (4’) or the associated fixation plate (3) is elastically deformed toward the air gap (2) to allow the elastic deformation to be released into the air gap (2), thereby the plate (4’) with the increased thickness sags down to the air gap (2) side to be flush with the other surface receiving plates (4).

Description

 Specification

 Substrate holding structure

 Technical field

 [0001] The present invention relates to a glass substrate such as CF glass or TFT glass or a synthetic resin substrate in the manufacturing process of a flat panel display such as a liquid crystal display (LCD) or a plasma display (PDP). The present invention relates to a substrate holding structure used for a substrate assembling apparatus including a substrate laminating machine for holding and sticking and bonding, and a substrate transporting apparatus for transporting a substrate.

 More specifically, the present invention relates to a substrate holding structure that holds a substrate with respect to the holding surface at a plurality of dispersed positions and holds the substrate while ensuring flatness.

 Background art

 Conventionally, as this type of substrate holding structure, a plurality of openings are provided in each of the holding surfaces of the pressure plate and the table, and a rotation actuator and a vertical drive actuator are provided in each of these openings. The adhesive member is attached to the tip of the rotating shaft where the rotary actuator also extends, and the adhesive member is moved and exposed within the opening by the operation of the vertical drive actuator. When sticking while positioning and positioning the adhesive member in each opening, twist the adhesive member against the substrate surface with the rotation actuator or use the vertical drive actuator to twist the force. There is one that retreats and peels the adhesive member off the substrate cover (see, for example, Patent Document 1).

 [0003] Patent Document 1: Japanese Patent Application Laid-Open No. 2003-273508 (Page 3-5, Fig. 1-5)

 Disclosure of the invention

 Problems to be solved by the invention

However, in such a conventional substrate holding structure, two substrates are bonded together by holding a plurality of adhesive members in contact with the substrate and holding them flatly. The flatness required for the holding surface side that receives this surface is in the range of several tens of μm even for a large substrate having a side exceeding 1000 mm, for example. On the other hand, as the material of the adhesive member to be received, an elastic material such as rubber is mainly used in order to perform reliable adhesion. However, the dimensional accuracy of this rubber is vague and is several hundred / zm. .

 Therefore, when rubber is used as the material for the pressure-sensitive adhesive member for receiving the surface, only the rubber arrangement portion of the holding surface for receiving the substrate becomes unevenness of several hundreds / zm, which is required. Flatness (several tens / zm) could not be achieved, and as a result, there was a problem that it was impossible to attach substrates with high precision!

 In addition, the thin adhesive member may not contact the substrate, so that the adhesive force is insufficient and the substrate may be displaced or dropped.

[0005] Of the present invention, the invention described in claim 1 aims to achieve the flatness on the holding surface side that is required even when rubber is used as the elastic material.

 In addition to the object of the invention described in claim 1, the invention described in claim 2 aims to improve the followability by elastic deformation in the longitudinal direction of the surface receiving plate.

 In addition to the object of the invention described in claim 1 or 2, the invention described in claim 3 is intended to reliably prevent the substrate from being displaced due to insufficient adhesive force. Means for solving the problem

[0006] In order to achieve the above-mentioned object, the invention according to claim 1 of the present invention is configured such that a plurality of voids are dispersed and recessed in the holding surface, and the openings of these voids are fixed to be elastically deformable. Each plate is covered with a plate, and a surface receiving plate having a inertia material force smaller than the opening of the gap is attached to the center of each fixed plate so as to protrude toward the substrate, and the fixed plate and the surface receiving plate are attached. These dispersed surface receiving plates are brought into contact with the substrate and held while being flatly supported, and the above-mentioned gap is formed by elastic deformation of the integrated fixing plate and surface receiving plate. It is characterized by being used as a escape space.

The invention according to claim 2 is the structure of the invention according to claim 1, wherein a through hole is opened in the fixing plate, and an internal force of the through hole is a surface receiving plate along at least the substrate side surface of the fixing plate. Are integrally formed, and a structure is added in which the compressive deformation of the substrate-side laminated portion of the surface receiving plate is moved to the opposite side through the through hole. In addition to the object of the invention described in claim 1 or 2, the invention described in claim 3 is intended to reliably prevent the substrate from being displaced due to insufficient adhesive force. The invention's effect

 [0007] Of the present invention, the invention according to claim 1 is formed by dispersing a plurality of gaps on the holding surface and forming recesses, covering the openings of these gaps with fixing plates, respectively, at substantially the center of each fixing plate, Attach a bearing plate that has a smaller elastic material force than the opening of the above-mentioned gap so that it protrudes toward the substrate. If there is variation in the thickness of the surface receiving plate that is elastic material force by holding it while flatly receiving it, the thickness of the surface receiving plate becomes larger as the surface receiving plate comes into contact with the substrate. The fixed plate or the surface receiving plate is elastically deformed toward the gap, and this elastic deformation is released to the air gap, so that the thickness V is large, and the surface receiving plate sinks toward the air gap. of Receiving plate and Ru are flat I fire.

 Therefore, even when rubber is used as the elastic material, the required flatness on the holding surface side can be achieved.

 As a result, on the holding surface side for receiving the substrate, only the rubber arrangement portions do not have unevenness of several hundreds / z m, and the substrates can be bonded with high accuracy.

[0008] In the invention of claim 2, in consideration of the effect of the invention of claim 1, a through hole is formed in the fixing plate, and at least the surface of the fixing plate facing the substrate is formed from the inside of the through hole. Therefore, when there is variation in the thickness dimension of the substrate-side laminated portion of the surface receiving plate by forming the surface receiving plate, the substrate-side laminated portion of the surface receiving plate having a large thickness is brought into contact with the substrate. Then, the substrate side laminated part of the surface receiving plate is compressed and deformed, and is moved to the opposite side through the through-hole, thereby increasing the thickness dimension !, and the substrate side laminated part of the surface receiving plate sinks to the gap side. And flattened with the other laminated parts on the substrate side of the surface receiving plate.

 Accordingly, it is possible to improve the copyability due to the elastic deformation in the vertical direction of the surface receiving plate.

As a result, the required flatness on the holding surface side can be achieved more reliably, and further High precision substrate bonding is possible.

 In addition, since the face plate is integrally formed from the inside of the through hole along at least the substrate side surface of the fixed plate, it is possible to prevent the position plate from being misaligned with respect to the fixed plate. Handling of fixed plate and bearing plate is easy.

 [0009] In addition to the effects of the invention of claim 1 or 2, the invention of claim 3 provides an adhesive portion on the surface of the surface receiving plate so that the adhesive portion can be surely brought into contact with the substrate. Adhesion is retained.

 Therefore, it is possible to reliably prevent the substrate from being displaced due to insufficient adhesive force. BEST MODE FOR CARRYING OUT THE INVENTION

 [0010] The case where the substrate holding structure A of the present invention is provided in a substrate bonding apparatus that bonds and holds a glass substrate such as a liquid crystal display (LCD) panel is shown.

 This substrate laminating machine holds two glass substrates D and D on holding surfaces 1 and 1, which are arranged in parallel with each other, as shown in FIGS. After the inside of the closed space S defined around them reaches a predetermined degree of vacuum, the upper and lower holding plates B and C are relatively adjusted in the Θ Θ direction (horizontal direction), and the substrates D and D After that, the upper substrate D is forcibly peeled from the holding surface 1 of the upper holding plate B and is instantaneously pressure-bonded to the annular adhesive (seal material) E on the lower substrate D. The two are sealed and overlapped, and thereafter, a pressure difference between the substrates D and D is pressurized to a predetermined gap between the substrates D and D.

 More specifically, the upper and lower holding plates B and C are supported by an elevating means (not shown) so as to be relatively movable in the Z direction (up and down direction), and the upper and lower holding plates B and C are moved in the vertical direction. In the separated state, the substrates D and D are set on the holding surfaces 1 and 1, respectively, and then the upper and lower holding plates B and C are brought close by the operation of the lifting means to form the closed space S.

[0012] Then, when the air is exhausted from the closed space S by the operation of the intake means (not shown) to reach a predetermined degree of vacuum, the upper and lower holding plates B are operated by the operation of the horizontal moving means (not shown). , C is adjusted and moved in the XY 0 direction with respect to the other, so that coarse alignment and fine alignment are sequentially performed as alignment (alignment) between the substrates D and D held by them. It is.

 [0013] After these alignments are completed and the upper and lower substrates D and D are overlapped, air or nitrogen is supplied into the closed space S, and the atmosphere in the closed space S is returned to atmospheric pressure. Then, pressurize evenly by the pressure difference generated between the inside and outside of both substrates D, D, and crush to a predetermined gap with the liquid crystal sealed.

 [0014] Further, on the holding surfaces 1 and 1 on the substrate side of the upper and lower holding plates B and C, a plurality of surface receiving portions made of an elastic material are distributed, and these surface receiving portions are arranged on the upper and lower substrates D and D. The back surface D1 of the substrate D can be prevented from being displaced in the ΧΥΘ direction (lateral displacement) with respect to the holding surface 1 by holding it detachably while being in contact with the flat surface. If the surface of the surface receiving portion is formed of an adhesive member, the substrate D can be held in an adhesive state.

 [0015] However, when a rubber material is used as the elastic material of the surface receiving portion, the dimensional accuracy of the rubber is several hundreds; zm. The unevenness was several hundreds / zm, and the flatness (tens of tens / zm) required as the holding surface 1 of the holding plates B and C of the substrate bonding apparatus was not achieved.

 [0016] Therefore, in order to solve such a problem, at least one or both of the holding surfaces 1 and 1 on the substrate side of the upper and lower holding plates B and C are provided with the substrate holding structure A of the present invention. . In the substrate holding structure A of the present invention, a plurality of voids 2 are dispersed and recessed in the holding surface 1 facing the back surface D1 of the substrate D as shown in FIGS. The opening is covered with an elastically deformable material such as stainless steel or other metal, or a fixed plate 3 that is also difficult to elastically deform, and the above-mentioned gap portion 2 is provided at the approximate center of each fixed plate 3. The fixing plate 3 and the surface receiving plate 4 are integrated by attaching a surface receiving plate 4 which is smaller than the opening area of the substrate and made of rubber or a similar elastic material so as to protrude toward the back surface D1 of the substrate D. /!

[0017] The gap 2, the fixed plate 3 and the surface receiving plate 4 are unitized, and a large number of units U are distributed at equal intervals on the holding surface 1 so that each unit U is arranged on the back surface D1 of the substrate D. Each of the surface receiving plates 4 is held in contact with each other in a flat shape, and the gap 2 is used as a clearance space when the integrated fixed plate 3 and surface receiving plate 4 are elastically deformed. And then. To give a specific example, about 200 sets of the unit U are arranged at a pitch of about 100 mm with respect to the holding surface 1 whose XY dimension is, for example, 1500 X 1800 mm.

 Embodiments of the present invention will be described below with reference to the drawings.

 Example 1

 [0018] In the first embodiment, as shown in Figs. 1 (a) and (b), a gap portion 2 is formed in a disc shape with respect to the holding surface 1, and a disc shape having a larger diameter than that is formed. The gap plate 2 is arranged so as to cover the entire gap portion 2 with the elastically deformable fixing plate 3, and its peripheral portion is attached to the holding surface 1 with a screw or the like. The rubber bearing plate 4 formed in a disk shape smaller than the opening area of the rubber plate is integrally fixed with an adhesive, and the surface receiving plate 4 is brought into contact with the substrate D to be flat. It is held while receiving

[0019] Then, in a state where the unit U composed of the gap 2, the fixed plate 3, and the surface receiving plate 4 is dispersedly arranged with respect to the holding surface 1, the thickness dimensions of some of the surface receiving plates 4 are When the thickness of the other surface receiving plate 4 is larger than that of the other surface receiving plate 4, the surface receiving plate 4 ′ having a larger thickness as shown in FIG. 1 (c) comes into contact with the back surface D1 of the substrate D. When the fixing plate 3 supporting it is elastically deformed toward the gap 2, this elastic deformation is released to the gap 2, so that the surface receiving plate 4 ′ having a large thickness sinks toward the gap 2. And flattened with the face plate 4 of the other unit U.

 [0020] Accordingly, even when rubber having a dimensional accuracy of several hundreds of z / zm is used as the material of the surface receiving plate 4, the required flatness of the holding surface 1, several tens of meters, can be achieved. As a result, highly accurate substrate bonding becomes possible.

 Example 2

[0021] In the second embodiment, the gap portion 2 is recessed in a rectangular plate shape with respect to the holding surface 1 as shown in Figs. 2 (a) to 2 (c), whereby a large rectangular plate-like fixing plate is formed. 3 so that the gap 2 is partially covered, and both ends thereof are attached to the holding surface 1 with screws or the like, and the opening area of the gap 2 is approximately at the center of the fixing plate 3. Unlike the embodiment 1 shown in FIG. 1, the configuration in which the rubber bearing plate 4 formed in a smaller rectangular plate shape is fixed integrally with an adhesive is different from that in the first embodiment shown in FIG. The same as in Example 1. [0022] Therefore, the second embodiment shown in FIG. 2 can achieve the same operational effects as the first embodiment described above. Example 3

 [0023] In the third embodiment, a cavity 2 recessed in the holding surface 1 as shown in Figs. 3 (a) to 3 (c) is covered with a fixing plate 3 having a material force that is not easily elastically deformed. A plurality of through holes 3a are opened in the thickness direction of the fixing plate 3 at appropriate intervals, and an elastic material (rubber) is made from the inside of the through holes 3a along at least the substrate side surface of the fixing plate 3. The surface receiving plate 4 is integrally formed, and the substrate side laminated portion (surface side laminated portion) 4a of the surface receiving plate 4 is caused to float (flow) to the opposite side 4b through the through hole 3a. The configuration that escapes to the gap portion 2 is different from the first embodiment shown in FIG. 1 and the second embodiment shown in FIG. 2, and the other configurations are the same as the first and second embodiments. .

 In the illustrated example, the gap 2, the fixing plate 3, and the surface receiving plate 4 are formed in the same disk shape as in the first embodiment shown in FIG. 1, and a round hole is opened as the through hole 3a. In this example, the substrate-side stacked portion 4a and the back-side stacked portion 4b are formed at the same time by integrally forming along both the front and back surfaces of the fixing plate 3 through the through holes 3a.

 Although not shown as other examples, the same rectangular plate shape as in Example 2 shown in FIG. 2 may be used, or a hole having a shape other than a round hole such as a square hole may be opened as the through hole 3a. It is possible.

 [0025] Then, in a state in which the units U including the gap 2, the fixed plate 3, and the surface receiving plate 4 are dispersedly arranged on the holding surface 1, the substrate side stacked portions 4a of some of the surface receiving plates 4 are included. Thickness dimensional force of other surface plate 4 The substrate side laminated part 4a may be thicker than the thickness dimension.

 In this case, as shown in FIG. 3 (c), when the base plate side laminated portion 4 of the large thickness plate 4 'comes into contact with the back surface D1 of the substrate D, the substrate of the surface plate ^ The side laminated part 4a 'itself compressively deforms, and its elastic material (rubber) loosens (flows) through the through hole 3a to the opposite side 4b, so that this compressive deformation is released to the gap part 2, thereby increasing the thickness. The board-side laminated portion 4 of the surface receiving plate 4 ′ having a large dimension sinks to the gap 2 side, and is flattened with the substrate-side laminated portion 4a of the other unit U surface receiving plate 4.

Therefore, Example 3 shown in FIG. 3 also has the same effects as those of Example 1 and Example 2 described above. In addition to this, the substrate side of the elastic material (rubber) surface receiving plate 4 is compared to that obtained by elastically deforming the fixed plate 3 as in Example 1 and flattening with the other surface receiving plate 4. Since the laminated portion 4a 'is easily elastically deformed even if the contact force with the substrate D is small, the followability by the elastic deformation in the longitudinal direction (Z direction) of the surface receiving plate 4 is improved, and the flattening is performed. As a result, the required flatness of the holding surface 1 can be more reliably achieved, and as a result, the substrate can be bonded with higher accuracy.

 [0027] Further, since the surface receiving plate 4 is formed in a body from the inside of the through hole 3a along at least the substrate side surface of the fixed plate 3, the surface receiving plate 4 is fixed to the fixed plate 3 and integrated. Compared to the first embodiment, the position plate 4 can be prevented from being displaced with respect to the fixed plate 3 and the fixed plate 3 and the surface plate 4 can be handled easily. When the face plate 4 is integrally formed along both the front and back surfaces of the fixing plate 3 through the hole 3a, there is an advantage that it is further improved.

 [0028] Further, as compared with the first embodiment in which the surface receiving plate 4 is fixed to the fixed plate 3 and integrally formed, the substrate side laminated portion 4a of the surface receiving plate 4 formed on the surface of the fixed plate 3 on the substrate side. In addition to being able to reduce the thickness, when the substrate-side laminated part 4a is compressed and deformed, it does not expand in the horizontal direction (ΧΥ Θ direction) and moves (flows) to the opposite side 4b. There is also an advantage that there is no adverse effect when deployed.

 Example 4

 [0029] This Example 4 is a rubber bearing that is formed in a disc shape or a rectangular plate shape so as to allow the substrate D to be adhered and held as shown in Figs. 4 (a) and 4 (b). An adhesive portion 4c is provided on the surface of the plate 4, and a lift pin 5 is provided as a means for separating the adhesive portion 4c from the substrate D. By the extension movement of the lift pin 5, the back surface D1 of the substrate D is removed from the adhesive portion 4c. The configuration for forced peeling is different from Example 1 shown in FIG. 1 and Example 2 shown in FIG. 2 and Example 3 shown in FIG. Same as Example 2 and Example 3.

 [0030] In the illustrated example, the adhesive portion 4c is preferably disposed close to a later-described lift pin 5 and is partially disposed so as to be annular along the periphery of a later-described through hole 5a. .

As this arrangement method, the force for surface treatment of the bearing plate 4 which is also a rubber material or the like By performing processing similar to this, the adhesive portion 4c is formed integrally with the surface of the surface receiving plate 4 only at a desired location on the surface thereof, or formed integrally therewith.

The lift pin 5 is used when the substrate D is transferred from the substrate transfer robot (not shown) to the upper and lower holding plates B and C, and the lift pin 5 is fixed to the fixing plate 3 from the gap 2 of the holding surface 1. Further, a through hole 5a penetrating linearly across the surface receiving plate 4 is opened, and it is disposed inside the through hole 5a so as to reciprocate toward the substrate D! /.

Further, in the illustrated example, the gap 2, the fixed plate 3, and the surface receiving plate 4 are shown in the same disk shape as in the first embodiment shown in FIG.

 Although not shown as an example other than that, it is also possible to make the same rectangular plate shape as in the second embodiment shown in FIG. 2, and in the same way as in the third embodiment shown in FIG. It is also possible to open the through hole 3a and integrally form the surface receiving plate 4 along both the front and back surfaces of the fixing plate 3 through the through hole 3a.

[0033] FIGS. 5 (a) and 5 (b) show a process in which the held substrates D and D are bonded together by the substrate bonding apparatus including the substrate holding structure A having such a structure.

[0034] In the example shown in Fig. 5 (a), a large number of units U having the above-described structure are incorporated into the base la of the lower holding plate C to adhere and hold the back surface D1 of the lower substrate D, and the upper holding plate. Hold the back surface D 1 of the upper substrate D immovably by the electrostatic chuck 6 built in B. As another modification, instead of the electrostatic chuck 6 of the upper holding plate B, a large number of units U having the above-described structure can be incorporated to adhere and hold the back surface D1 of the upper substrate D.

 [0035] After that, the upper and lower holding plates B and C approach each other to form a closed space S between them, and then the upper and lower holding plates B and C adjust and move in the XY 0 direction, and the substrates D and D Then, the upper substrate D is forcibly separated from the holding surface 1 of the upper holding plate B as shown in Fig. 5 (b), and the annular adhesive (sealant) on the lower substrate D is then removed. The two substrates D and D are pressurized to a predetermined gap by the pressure difference generated between the inside and outside of the substrates D and D! /

Accordingly, Example 4 shown in FIG. 4 and FIG. 5 also provides the same operational effects as those of Example 1, Example 2 and Example 3 described above, and additionally, the lower holding plate C has the holding surface 1. Many adhesives deployed in There is an advantage that the part 4c can securely contact and hold the back surface Dl of the substrate D, thereby reliably preventing the displacement of the substrate D due to insufficient adhesive force.

 Example 5

 [0037] In Example 5, as a means for separating the adhesive portion 4c and the substrate D as shown in Figs. 6 (a) and 6 (b), a pedestal lb that can be raised and lowered with respect to the holding surface 1, and a recess provided in the pedestal. A large number of elevating units U〃 consisting of the gap 2, fixed plate 3 and face plate 4 are arranged so as to be able to reciprocate vertically so as to approach or separate from the base plate D with respect to the holding surface 1 respectively. The configuration in which the entire lifting unit U including the adhesive portion 4c provided on the surface of the surface receiving plate 4 is forcibly removed from the back surface D1 of the substrate D by driving the actuator 7 is shown in FIG. (a) Unlike Example 4 shown in (b) and FIGS. 5 (a) and (b), the other configurations are the same as Example 4.

 [0038] In the illustrated example, instead of the electrostatic chuck 6 incorporated in the upper holding plate B of Example 4 shown in Figs. 5 (a) and 5 (b), a number of reciprocating lift units U〃 having the above-described structure are reciprocated. The configuration is the same as that of the third embodiment except that it is freely movable.

 As another modification, a large number of lifting units U〃 having the above-described structure can be incorporated in both the holding surfaces 1 and 1 of the upper and lower holding plates B and C so as to be reciprocally movable.

 Therefore, in the fifth embodiment shown in FIG. 6, compared to the fourth embodiment described above, the upper and lower holding plates B and C have a large number of adhesive portions 4c provided on both the holding surfaces 1 and 1, respectively. An effect is obtained that the back surface Dl, D1 of D, D1 can be securely contacted and adhered and held, thereby preventing the substrate D from being displaced due to insufficient adhesion.

 In addition, it is required even if rubber with a dimensional accuracy of several hundred / zm is used for the material of each face plate 4 on both the holding surfaces 1 and 1 on the upper and lower holding plates B and C. The flatness of the holding surface 1 to be achieved can be several tens of meters, and as a result, there is an advantage that an operational effect that enables highly accurate substrate bonding is obtained.

[0040] Although the substrate holding structure A of the present invention is provided in a substrate bonding apparatus for bonding and holding a glass substrate such as a liquid crystal display (LCD) panel, the present invention is not limited to this. Even if it is installed on a substrate assembly device other than this substrate bonding device, a substrate transport device that transports substrates, or a substrate other than the glass substrate for LCD panels is adhesively held good.

 [0041] Further, the substrate bonding apparatus for bonding the upper and lower substrates D, D in a vacuum has been described. However, the present invention is not limited to this, and a substrate bonding apparatus for bonding the substrates D, D in the atmosphere may be used. However, the same effect as the above-described vacuum bonding apparatus can be obtained.

 Brief Description of Drawings

 [0042] [FIG. 1] (a) is a partial plan view showing Example 1 of the substrate holding structure of the present invention, (b) is a longitudinal front view, and (c) shows during elastic deformation. It is a vertical front view.

 FIG. 2 (a) is a partial plan view showing Example 2 of the substrate holding structure of the present invention, (b) is a longitudinal front view, and (c) is a longitudinal front view showing during elastic deformation. It is.

 [FIG. 3] (a) is a partial plan view showing Embodiment 3 of the substrate holding structure of the present invention, (b) is a longitudinal front view, and (c) is a longitudinal front view showing the state of elastic deformation. It is.

 FIG. 4 (a) is a partial plan view showing Example 4 of the substrate holding structure of the present invention, and (b) is a longitudinal front view.

 FIG. 5 is a reduced longitudinal sectional front view in which the substrate holding structure of Example 4 is incorporated in a substrate bonding apparatus, and its operation process is shown in (a) and (b).

 FIG. 6 is a reduced longitudinal front view showing Example 5 in which the substrate holding structure of the present invention is incorporated in a substrate bonding apparatus, and its operation steps are shown in (a) and (b).

 Explanation of symbols

 [0043] A Substrate holding structure B Upper holding plate

 C Lower holding plate C1 Base

 D substrate D1 back

 E Ring adhesive (sealant) S Closed space

 U unit U group Lifting unit

 1 Holding surface la, lb pedestal

 2 Cavity 3 Fixing plate

 3a Through hole 4-sided receiving plate

4 'Thick surface receiving plate 4a Board side laminated part (front side laminated part) 4b Opposite side (back side laminated part) 4c Adhesive part Lift pin 5a through hole

Electrostatic chuck 7actuator

Claims

The scope of the claims  [1] In a substrate holding structure that holds the substrate (D) against the holding surface (1) at a plurality of dispersed positions and holds the substrate while ensuring flatness.  A plurality of gaps (2) are dispersed and recessed in the holding surface (1), and the openings of these gaps (2) are covered with fixing plates (3), respectively, at the approximate center of each fixing plate (3). Then, attach the surface receiving plate (4) having an elastic material force smaller than the opening of the gap (2) so as to protrude toward the substrate (D), and attach the fixed plate (3) and the surface receiving plate (4). The dispersed face receiving plates (4) are brought into contact with the substrate (D) and held while being flatly received, and the gap (2) is integrated. A substrate holding structure that is used as a relief space for elastic deformation of the fixed plate (3) and the surface receiving plate (4).  [2] A through hole (3a) is opened in the fixing plate (3), and a surface receiving plate (4) is formed from the inside of the through hole (3a) along at least the substrate side surface of the fixing plate (3). The substrate according to claim 1, wherein the substrate is integrally formed, and the compressive deformation of the substrate-side laminated portion (4a) of the surface receiving plate (4) is allowed to float to the opposite side (4b) through the through hole (3a). Retaining structure.  [3] The substrate holding structure according to claim 1 or 2, wherein an adhesive portion (4c) is provided on a surface of the surface receiving plate (4).