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WO2007036996A1 - Structure d’appui destinée à un substrat - Google Patents

Structure d’appui destinée à un substrat Download PDF

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Publication number
WO2007036996A1
WO2007036996A1 PCT/JP2005/017832 JP2005017832W WO2007036996A1 WO 2007036996 A1 WO2007036996 A1 WO 2007036996A1 JP 2005017832 W JP2005017832 W JP 2005017832W WO 2007036996 A1 WO2007036996 A1 WO 2007036996A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
plate
holding
surface receiving
receiving plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2005/017832
Other languages
English (en)
Japanese (ja)
Inventor
Michiya Yokota
Yoshikazu Ohtani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Engineering Co Ltd
Original Assignee
Shin Etsu Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Engineering Co Ltd filed Critical Shin Etsu Engineering Co Ltd
Priority to PCT/JP2005/017832 priority Critical patent/WO2007036996A1/fr
Priority to CNB2005800233477A priority patent/CN100533513C/zh
Priority to KR1020077002543A priority patent/KR101038026B1/ko
Priority to JP2007505310A priority patent/JP3943590B2/ja
Priority to TW095102289A priority patent/TW200712020A/zh
Publication of WO2007036996A1 publication Critical patent/WO2007036996A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136277—Active matrix addressed cells formed on a semiconductor substrate, e.g. of silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2209/00—Apparatus and processes for manufacture of discharge tubes

Definitions

  • the present invention relates to a glass substrate such as CF glass or TFT glass or a synthetic resin substrate in the manufacturing process of a flat panel display such as a liquid crystal display (LCD) or a plasma display (PDP).
  • a substrate holding structure used for a substrate assembling apparatus including a substrate laminating machine for holding and sticking and bonding, and a substrate transporting apparatus for transporting a substrate.
  • the present invention relates to a substrate holding structure that holds a substrate with respect to the holding surface at a plurality of dispersed positions and holds the substrate while ensuring flatness.
  • a plurality of openings are provided in each of the holding surfaces of the pressure plate and the table, and a rotation actuator and a vertical drive actuator are provided in each of these openings.
  • the adhesive member is attached to the tip of the rotating shaft where the rotary actuator also extends, and the adhesive member is moved and exposed within the opening by the operation of the vertical drive actuator.
  • There is one that retreats and peels the adhesive member off the substrate cover see, for example, Patent Document 1).
  • Patent Document 1 Japanese Patent Application Laid-Open No. 2003-273508 (Page 3-5, Fig. 1-5)
  • the thin adhesive member may not contact the substrate, so that the adhesive force is insufficient and the substrate may be displaced or dropped.
  • the invention described in claim 1 aims to achieve the flatness on the holding surface side that is required even when rubber is used as the elastic material.
  • the invention described in claim 2 aims to improve the followability by elastic deformation in the longitudinal direction of the surface receiving plate.
  • the invention described in claim 3 is intended to reliably prevent the substrate from being displaced due to insufficient adhesive force.
  • the invention according to claim 1 of the present invention is configured such that a plurality of voids are dispersed and recessed in the holding surface, and the openings of these voids are fixed to be elastically deformable.
  • Each plate is covered with a plate, and a surface receiving plate having a inertia material force smaller than the opening of the gap is attached to the center of each fixed plate so as to protrude toward the substrate, and the fixed plate and the surface receiving plate are attached.
  • These dispersed surface receiving plates are brought into contact with the substrate and held while being flatly supported, and the above-mentioned gap is formed by elastic deformation of the integrated fixing plate and surface receiving plate. It is characterized by being used as a escape space.
  • the invention according to claim 2 is the structure of the invention according to claim 1, wherein a through hole is opened in the fixing plate, and an internal force of the through hole is a surface receiving plate along at least the substrate side surface of the fixing plate.
  • a through hole is opened in the fixing plate, and an internal force of the through hole is a surface receiving plate along at least the substrate side surface of the fixing plate.
  • a structure is added in which the compressive deformation of the substrate-side laminated portion of the surface receiving plate is moved to the opposite side through the through hole.
  • the invention described in claim 3 is intended to reliably prevent the substrate from being displaced due to insufficient adhesive force.
  • the invention according to claim 1 is formed by dispersing a plurality of gaps on the holding surface and forming recesses, covering the openings of these gaps with fixing plates, respectively, at substantially the center of each fixing plate, Attach a bearing plate that has a smaller elastic material force than the opening of the above-mentioned gap so that it protrudes toward the substrate. If there is variation in the thickness of the surface receiving plate that is elastic material force by holding it while flatly receiving it, the thickness of the surface receiving plate becomes larger as the surface receiving plate comes into contact with the substrate. The fixed plate or the surface receiving plate is elastically deformed toward the gap, and this elastic deformation is released to the air gap, so that the thickness V is large, and the surface receiving plate sinks toward the air gap. of Receiving plate and Ru are flat I fire.
  • a through hole is formed in the fixing plate, and at least the surface of the fixing plate facing the substrate is formed from the inside of the through hole. Therefore, when there is variation in the thickness dimension of the substrate-side laminated portion of the surface receiving plate by forming the surface receiving plate, the substrate-side laminated portion of the surface receiving plate having a large thickness is brought into contact with the substrate. Then, the substrate side laminated part of the surface receiving plate is compressed and deformed, and is moved to the opposite side through the through-hole, thereby increasing the thickness dimension !, and the substrate side laminated part of the surface receiving plate sinks to the gap side. And flattened with the other laminated parts on the substrate side of the surface receiving plate.
  • the face plate is integrally formed from the inside of the through hole along at least the substrate side surface of the fixed plate, it is possible to prevent the position plate from being misaligned with respect to the fixed plate. Handling of fixed plate and bearing plate is easy.
  • the invention of claim 3 provides an adhesive portion on the surface of the surface receiving plate so that the adhesive portion can be surely brought into contact with the substrate. Adhesion is retained.
  • the substrate holding structure A of the present invention is provided in a substrate bonding apparatus that bonds and holds a glass substrate such as a liquid crystal display (LCD) panel is shown.
  • LCD liquid crystal display
  • This substrate laminating machine holds two glass substrates D and D on holding surfaces 1 and 1, which are arranged in parallel with each other, as shown in FIGS.
  • the upper and lower holding plates B and C are relatively adjusted in the ⁇ ⁇ direction (horizontal direction), and the substrates D and D
  • the upper substrate D is forcibly peeled from the holding surface 1 of the upper holding plate B and is instantaneously pressure-bonded to the annular adhesive (seal material) E on the lower substrate D.
  • the two are sealed and overlapped, and thereafter, a pressure difference between the substrates D and D is pressurized to a predetermined gap between the substrates D and D.
  • the upper and lower holding plates B and C are supported by an elevating means (not shown) so as to be relatively movable in the Z direction (up and down direction), and the upper and lower holding plates B and C are moved in the vertical direction.
  • the substrates D and D are set on the holding surfaces 1 and 1, respectively, and then the upper and lower holding plates B and C are brought close by the operation of the lifting means to form the closed space S.
  • a plurality of surface receiving portions made of an elastic material are distributed, and these surface receiving portions are arranged on the upper and lower substrates D and D.
  • the back surface D1 of the substrate D can be prevented from being displaced in the ⁇ direction (lateral displacement) with respect to the holding surface 1 by holding it detachably while being in contact with the flat surface. If the surface of the surface receiving portion is formed of an adhesive member, the substrate D can be held in an adhesive state.
  • the holding surfaces 1 and 1 on the substrate side of the upper and lower holding plates B and C are provided with the substrate holding structure A of the present invention.
  • a plurality of voids 2 are dispersed and recessed in the holding surface 1 facing the back surface D1 of the substrate D as shown in FIGS.
  • the opening is covered with an elastically deformable material such as stainless steel or other metal, or a fixed plate 3 that is also difficult to elastically deform, and the above-mentioned gap portion 2 is provided at the approximate center of each fixed plate 3.
  • the fixing plate 3 and the surface receiving plate 4 are integrated by attaching a surface receiving plate 4 which is smaller than the opening area of the substrate and made of rubber or a similar elastic material so as to protrude toward the back surface D1 of the substrate D. /!
  • the gap 2, the fixed plate 3 and the surface receiving plate 4 are unitized, and a large number of units U are distributed at equal intervals on the holding surface 1 so that each unit U is arranged on the back surface D1 of the substrate D.
  • Each of the surface receiving plates 4 is held in contact with each other in a flat shape, and the gap 2 is used as a clearance space when the integrated fixed plate 3 and surface receiving plate 4 are elastically deformed. And then.
  • about 200 sets of the unit U are arranged at a pitch of about 100 mm with respect to the holding surface 1 whose XY dimension is, for example, 1500 X 1800 mm.
  • a gap portion 2 is formed in a disc shape with respect to the holding surface 1, and a disc shape having a larger diameter than that is formed.
  • the gap plate 2 is arranged so as to cover the entire gap portion 2 with the elastically deformable fixing plate 3, and its peripheral portion is attached to the holding surface 1 with a screw or the like.
  • the rubber bearing plate 4 formed in a disk shape smaller than the opening area of the rubber plate is integrally fixed with an adhesive, and the surface receiving plate 4 is brought into contact with the substrate D to be flat. It is held while receiving
  • the thickness dimensions of some of the surface receiving plates 4 are When the thickness of the other surface receiving plate 4 is larger than that of the other surface receiving plate 4, the surface receiving plate 4 ′ having a larger thickness as shown in FIG. 1 (c) comes into contact with the back surface D1 of the substrate D.
  • the fixing plate 3 supporting it is elastically deformed toward the gap 2, this elastic deformation is released to the gap 2, so that the surface receiving plate 4 ′ having a large thickness sinks toward the gap 2. And flattened with the face plate 4 of the other unit U.
  • the gap portion 2 is recessed in a rectangular plate shape with respect to the holding surface 1 as shown in Figs. 2 (a) to 2 (c), whereby a large rectangular plate-like fixing plate is formed. 3 so that the gap 2 is partially covered, and both ends thereof are attached to the holding surface 1 with screws or the like, and the opening area of the gap 2 is approximately at the center of the fixing plate 3.
  • the configuration in which the rubber bearing plate 4 formed in a smaller rectangular plate shape is fixed integrally with an adhesive is different from that in the first embodiment shown in FIG. The same as in Example 1.
  • the second embodiment shown in FIG. 2 can achieve the same operational effects as the first embodiment described above.
  • a cavity 2 recessed in the holding surface 1 as shown in Figs. 3 (a) to 3 (c) is covered with a fixing plate 3 having a material force that is not easily elastically deformed.
  • a plurality of through holes 3a are opened in the thickness direction of the fixing plate 3 at appropriate intervals, and an elastic material (rubber) is made from the inside of the through holes 3a along at least the substrate side surface of the fixing plate 3.
  • the surface receiving plate 4 is integrally formed, and the substrate side laminated portion (surface side laminated portion) 4a of the surface receiving plate 4 is caused to float (flow) to the opposite side 4b through the through hole 3a.
  • the configuration that escapes to the gap portion 2 is different from the first embodiment shown in FIG. 1 and the second embodiment shown in FIG. 2, and the other configurations are the same as the first and second embodiments. .
  • the gap 2, the fixing plate 3, and the surface receiving plate 4 are formed in the same disk shape as in the first embodiment shown in FIG. 1, and a round hole is opened as the through hole 3a.
  • the substrate-side stacked portion 4a and the back-side stacked portion 4b are formed at the same time by integrally forming along both the front and back surfaces of the fixing plate 3 through the through holes 3a.
  • Example 2 shown in FIG. 2 may be used, or a hole having a shape other than a round hole such as a square hole may be opened as the through hole 3a. It is possible.
  • the substrate side stacked portions 4a of some of the surface receiving plates 4 are included. Thickness dimensional force of other surface plate 4
  • the substrate side laminated part 4a may be thicker than the thickness dimension.
  • Example 3 shown in FIG. 3 also has the same effects as those of Example 1 and Example 2 described above.
  • the substrate side of the elastic material (rubber) surface receiving plate 4 is compared to that obtained by elastically deforming the fixed plate 3 as in Example 1 and flattening with the other surface receiving plate 4. Since the laminated portion 4a 'is easily elastically deformed even if the contact force with the substrate D is small, the followability by the elastic deformation in the longitudinal direction (Z direction) of the surface receiving plate 4 is improved, and the flattening is performed. As a result, the required flatness of the holding surface 1 can be more reliably achieved, and as a result, the substrate can be bonded with higher accuracy.
  • the surface receiving plate 4 is formed in a body from the inside of the through hole 3a along at least the substrate side surface of the fixed plate 3, the surface receiving plate 4 is fixed to the fixed plate 3 and integrated. Compared to the first embodiment, the position plate 4 can be prevented from being displaced with respect to the fixed plate 3 and the fixed plate 3 and the surface plate 4 can be handled easily.
  • the face plate 4 is integrally formed along both the front and back surfaces of the fixing plate 3 through the hole 3a, there is an advantage that it is further improved.
  • the substrate side laminated portion 4a of the surface receiving plate 4 formed on the surface of the fixed plate 3 on the substrate side.
  • the substrate-side laminated part 4a when the substrate-side laminated part 4a is compressed and deformed, it does not expand in the horizontal direction ( ⁇ ⁇ direction) and moves (flows) to the opposite side 4b. There is also an advantage that there is no adverse effect when deployed.
  • This Example 4 is a rubber bearing that is formed in a disc shape or a rectangular plate shape so as to allow the substrate D to be adhered and held as shown in Figs. 4 (a) and 4 (b).
  • An adhesive portion 4c is provided on the surface of the plate 4, and a lift pin 5 is provided as a means for separating the adhesive portion 4c from the substrate D. By the extension movement of the lift pin 5, the back surface D1 of the substrate D is removed from the adhesive portion 4c.
  • the configuration for forced peeling is different from Example 1 shown in FIG. 1 and Example 2 shown in FIG. 2 and Example 3 shown in FIG. Same as Example 2 and Example 3.
  • the adhesive portion 4c is preferably disposed close to a later-described lift pin 5 and is partially disposed so as to be annular along the periphery of a later-described through hole 5a. .
  • the force for surface treatment of the bearing plate 4 which is also a rubber material or the like
  • the adhesive portion 4c is formed integrally with the surface of the surface receiving plate 4 only at a desired location on the surface thereof, or formed integrally therewith.
  • the lift pin 5 is used when the substrate D is transferred from the substrate transfer robot (not shown) to the upper and lower holding plates B and C, and the lift pin 5 is fixed to the fixing plate 3 from the gap 2 of the holding surface 1. Further, a through hole 5a penetrating linearly across the surface receiving plate 4 is opened, and it is disposed inside the through hole 5a so as to reciprocate toward the substrate D! /.
  • the gap 2, the fixed plate 3, and the surface receiving plate 4 are shown in the same disk shape as in the first embodiment shown in FIG.
  • FIGS. 5 (a) and 5 (b) show a process in which the held substrates D and D are bonded together by the substrate bonding apparatus including the substrate holding structure A having such a structure.
  • a large number of units U having the above-described structure are incorporated into the base la of the lower holding plate C to adhere and hold the back surface D1 of the lower substrate D, and the upper holding plate. Hold the back surface D 1 of the upper substrate D immovably by the electrostatic chuck 6 built in B.
  • a large number of units U having the above-described structure can be incorporated to adhere and hold the back surface D1 of the upper substrate D.
  • the upper and lower holding plates B and C approach each other to form a closed space S between them, and then the upper and lower holding plates B and C adjust and move in the XY 0 direction, and the substrates D and D Then, the upper substrate D is forcibly separated from the holding surface 1 of the upper holding plate B as shown in Fig. 5 (b), and the annular adhesive (sealant) on the lower substrate D is then removed.
  • the two substrates D and D are pressurized to a predetermined gap by the pressure difference generated between the inside and outside of the substrates D and D! /
  • Example 4 shown in FIG. 4 and FIG. 5 also provides the same operational effects as those of Example 1, Example 2 and Example 3 described above, and additionally, the lower holding plate C has the holding surface 1.
  • Example 5 As a means for separating the adhesive portion 4c and the substrate D as shown in Figs. 6 (a) and 6 (b), a pedestal lb that can be raised and lowered with respect to the holding surface 1, and a recess provided in the pedestal.
  • a large number of elevating units U ⁇ consisting of the gap 2, fixed plate 3 and face plate 4 are arranged so as to be able to reciprocate vertically so as to approach or separate from the base plate D with respect to the holding surface 1 respectively.
  • the configuration in which the entire lifting unit U including the adhesive portion 4c provided on the surface of the surface receiving plate 4 is forcibly removed from the back surface D1 of the substrate D by driving the actuator 7 is shown in FIG. (a) Unlike Example 4 shown in (b) and FIGS. 5 (a) and (b), the other configurations are the same as Example 4.
  • a large number of lifting units U ⁇ having the above-described structure can be incorporated in both the holding surfaces 1 and 1 of the upper and lower holding plates B and C so as to be reciprocally movable.
  • the upper and lower holding plates B and C have a large number of adhesive portions 4c provided on both the holding surfaces 1 and 1, respectively. An effect is obtained that the back surface Dl, D1 of D, D1 can be securely contacted and adhered and held, thereby preventing the substrate D from being displaced due to insufficient adhesion.
  • the substrate holding structure A of the present invention is provided in a substrate bonding apparatus for bonding and holding a glass substrate such as a liquid crystal display (LCD) panel
  • the present invention is not limited to this. Even if it is installed on a substrate assembly device other than this substrate bonding device, a substrate transport device that transports substrates, or a substrate other than the glass substrate for LCD panels is adhesively held good.
  • the substrate bonding apparatus for bonding the upper and lower substrates D, D in a vacuum has been described.
  • the present invention is not limited to this, and a substrate bonding apparatus for bonding the substrates D, D in the atmosphere may be used.
  • the same effect as the above-described vacuum bonding apparatus can be obtained.
  • FIG. 1 (a) is a partial plan view showing Example 1 of the substrate holding structure of the present invention, (b) is a longitudinal front view, and (c) shows during elastic deformation. It is a vertical front view.
  • FIG. 2 (a) is a partial plan view showing Example 2 of the substrate holding structure of the present invention, (b) is a longitudinal front view, and (c) is a longitudinal front view showing during elastic deformation. It is.
  • FIG. 3 (a) is a partial plan view showing Embodiment 3 of the substrate holding structure of the present invention, (b) is a longitudinal front view, and (c) is a longitudinal front view showing the state of elastic deformation. It is.
  • FIG. 4 (a) is a partial plan view showing Example 4 of the substrate holding structure of the present invention, and (b) is a longitudinal front view.
  • FIG. 5 is a reduced longitudinal sectional front view in which the substrate holding structure of Example 4 is incorporated in a substrate bonding apparatus, and its operation process is shown in (a) and (b).
  • FIG. 6 is a reduced longitudinal front view showing Example 5 in which the substrate holding structure of the present invention is incorporated in a substrate bonding apparatus, and its operation steps are shown in (a) and (b).

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

Le problème à résoudre dans le cadre de cette invention concerne l’obtention de la planéité requise sur le côté de la surface d’appui même si du caoutchouc sert de matériau élastique. La solution proposée consiste à disperser sur toute la surface d’appui (1) des espaces renfoncés (2), et à couvrir individuellement les ouvertures des espaces (2) par des plaques de fixation (3). Sensiblement au centre de chaque plaque de fixation (3), une plaque de réception de surface (4) en matériau élastique et de taille inférieure à celle de chaque espace (2) est installée, faisant saillie vers un substrat (D) afin d’incorporer la plaque de fixation (3) et la plaque de réception de surface (4). Les plaques de réception de surface (4) étant dispersées, elles viennent individuellement au contact du substrat afin d’offrir un appui uniforme à la surface du substrat (D), et si un écart apparaît dans l’épaisseur des plaques (4) en matériau élastique, une plaque de réception de surface (4’) présentant une épaisseur accrue vient alors au contact du substrat (D). Ainsi, la plaque de réception de surface (4’) ou la plaque de fixation associée (3) est élastiquement déformée vers l’espace (2) afin de permettre à la déformation élastique d’être libérée dans l’espace (2), permettant alors à la plaque (4’) pourvue d’une épaisseur accrue de s’abaisser du côté de l’espace (2) pour affleurer les autres plaques de réception de surface (4).
PCT/JP2005/017832 2005-09-28 2005-09-28 Structure d’appui destinée à un substrat Ceased WO2007036996A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
PCT/JP2005/017832 WO2007036996A1 (fr) 2005-09-28 2005-09-28 Structure d’appui destinée à un substrat
CNB2005800233477A CN100533513C (zh) 2005-09-28 2005-09-28 基板保持结构
KR1020077002543A KR101038026B1 (ko) 2005-09-28 2005-09-28 기판 지지 구조
JP2007505310A JP3943590B2 (ja) 2005-09-28 2005-09-28 基板保持構造
TW095102289A TW200712020A (en) 2005-09-28 2006-01-20 Substrate holding structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2005/017832 WO2007036996A1 (fr) 2005-09-28 2005-09-28 Structure d’appui destinée à un substrat

Publications (1)

Publication Number Publication Date
WO2007036996A1 true WO2007036996A1 (fr) 2007-04-05

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PCT/JP2005/017832 Ceased WO2007036996A1 (fr) 2005-09-28 2005-09-28 Structure d’appui destinée à un substrat

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JP (1) JP3943590B2 (fr)
KR (1) KR101038026B1 (fr)
CN (1) CN100533513C (fr)
TW (1) TW200712020A (fr)
WO (1) WO2007036996A1 (fr)

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US9023611B2 (en) 2009-02-06 2015-05-05 Beth Israel Deaconess Medical Center Charged-balanced imaging agents
US10493169B2 (en) 2009-02-06 2019-12-03 Beth Israel Deaconess Medical Center Use of charge-balanced imaging agents for determining renal function
CN112750746A (zh) * 2019-10-29 2021-05-04 佳能特机株式会社 基板保持单元、基板保持构件、基板保持装置及基板处理装置

Families Citing this family (6)

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TW200712020A (en) 2007-04-01
JPWO2007036996A1 (ja) 2009-04-02
KR101038026B1 (ko) 2011-05-31
TWI317353B (fr) 2009-11-21
JP3943590B2 (ja) 2007-07-11

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