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WO2007099760A1 - Composition antimigration des flux destinee a une brasure - Google Patents

Composition antimigration des flux destinee a une brasure Download PDF

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Publication number
WO2007099760A1
WO2007099760A1 PCT/JP2007/052492 JP2007052492W WO2007099760A1 WO 2007099760 A1 WO2007099760 A1 WO 2007099760A1 JP 2007052492 W JP2007052492 W JP 2007052492W WO 2007099760 A1 WO2007099760 A1 WO 2007099760A1
Authority
WO
WIPO (PCT)
Prior art keywords
group
composition
solder
flux
formula
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2007/052492
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English (en)
Japanese (ja)
Inventor
Ryo Hirabayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Seimi Chemical Ltd
Original Assignee
AGC Seimi Chemical Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AGC Seimi Chemical Ltd filed Critical AGC Seimi Chemical Ltd
Priority to JP2008502689A priority Critical patent/JP5124441B2/ja
Priority to CN2007800065678A priority patent/CN101389443B/zh
Publication of WO2007099760A1 publication Critical patent/WO2007099760A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]

Definitions

  • the present invention relates to a flux creeping prevention used as a pretreatment agent for preventing solder flux from creeping up when soldering an electronic component having electrical contacts or an electronic member such as a printed circuit board. Relates to the composition.
  • the present invention also relates to an electronic member such as an electronic component for soldering or a printed circuit board having a coating formed from the composition, a soldering method using the composition, and an electric product including the soldered electronic member. . Background art
  • a flux treatment is performed in advance to improve solder adhesion.
  • a general flux is a corrosive containing an acidic component in a solvent. For this reason, it is desirable to prevent flux from penetrating or adhering to electrical contact parts of electronic parts such as connectors, switches, volumes, semi-fixed resistors, or parts that do not require soldering of printed circuit boards. is there. In particular, it is necessary to prevent the flux from adhering or penetrating to parts that do not require soldering due to a phenomenon called ⁇ flux scooping up '' that occurs in the through-hole part of electronic parts, etc. There is.
  • the flux creep-up preventing agent used for this pretreatment is usually a composition containing a polymer having a solvent repellency with respect to the solvent of the flatus.
  • the flux solvent is typically IPA, so IPA repellent has been regarded as an indicator of flux creep-up prevention performance.
  • a polyfluoroalkyl group-containing polymer having high IPA repellency has been used as an active ingredient of the flux creep-up preventing agent.
  • R 2 is a hydrogen atom or a methyl group
  • R 3 to R 5 are each independently a methyl group or an alkoxy group having 1 to 3 carbon atoms
  • Patent Document 1 JP 2001-135926 A
  • Patent Document 2 Japanese Patent Laid-Open No. 2002-146271
  • soldering technology has changed significantly, and there is a trend toward miniaturization of soldered parts.
  • cream-like solder is printed on a printed circuit board, and surface mounting is performed thereon.
  • Reflow soldering in which components are placed and the solder is melted by infrared rays or hot air heating, is the mainstream.
  • the entire board is exposed to the solder melting temperature condition.
  • the solder of lead-free materials which are becoming mainstream due to environmental considerations, tends to have a melting temperature higher than the melting temperature of conventional lead solder (183 ° C), for example, about 35 ° C higher. There are also things.
  • flux scooping prevention agents are also required to have a flux scooping prevention performance in a special environment corresponding to solder.
  • a conventional flattening anti-cracking agent cannot sufficiently exhibit its performance by reflow soldering using cream solder as described above.
  • the present invention provides a flux that can exhibit high, high flux and anti-raising performance in the use of solder in surface mounting, which has been increasing recently.
  • the object is to provide an anti-raising composition.
  • Sarakuko provides an electronic component having a film made of the composition and an electronic member for solder such as a printed circuit board, a soldering method using the composition, and an electric product including the soldered electronic member. The purpose is.
  • the composition for preventing solder flux creeping provided by the present invention includes at least a polyfluoroalkyl group-containing unsaturated compound (hereinafter also referred to as compound (a)) represented by the following formula (a). And a copolymer containing a unit derived from one kind and at least one kind of a silane-containing (meth) acrylate (hereinafter also referred to as compound (b)) represented by the following formula (b).
  • R 1 hydrogen atom or methyl group
  • R f includes an etheric oxygen atom inserted between carbon and carbon bonds, and may be a polyfluoroalkyl group,
  • R 2 hydroxyl group or hydrolyzable functional group
  • R 4 each independently a hydrogen atom, a saturated alkyl group having 1 to 4 carbon atoms, a phenol group, n: an integer of 1 to 3,
  • n each independently an integer of 0 or 1
  • (4-n-m-1) is 1 or more.
  • the polyfluoroalkyl group in the formula (a) (in the formula (a), represented by R f group)
  • a fluoroalkyl group usually a perfluoroalkyl group having 1 to 20 carbon atoms, is preferred.
  • the copolymer according to the present invention has a power of 90% by mass or more of all the polyfluoroalkyl groups in the unit from which the above-described compound (a) force is also derived.
  • a perfluoroalkyl group of 3 or less is preferred.
  • the content of the unit derived from the compound (b) of the copolymer according to the present invention is usually 1 to 50% by mass.
  • the copolymer according to the present invention may further include a unit that also leads to a non-fluorinated unsaturated compound (c) force other than the compounds (a) and (b).
  • composition containing the copolymer as described above exhibits a high flux creeping-up preventing property with respect to the term solder mainly used in reflow soldering.
  • the composition for preventing solder flux creeping up of the present invention can be suitably used for soldering in surface mounting. Also, when the solder is lead-free solder, it can be suitably used.
  • the present invention also provides an electronic member for solder having a flux creeping-up preventing performance having a coating film having the composition strength of the present invention on part or all of its surface.
  • processed components to be soldered such as electronic components and printed boards are collectively referred to as electronic members.
  • a coating film having the composition force is formed on a part or all of the surface of the electronic member, and a part or all of the surface of the electronic member is treated with a soldering flux and then soldered.
  • An electronic member soldering method is also provided.
  • the composition for preventing solder flux scooping according to the present invention can exhibit a high flux scooping prevention performance, and is high even for cream solder mainly used in reflow soldering. Exhibits creeping prevention performance. For this reason, surface mount technology can also be supported. Furthermore, the creeping prevention composition of the present invention can maintain the creeping prevention performance even when the oil repellency is low by including a specific copolymer. In addition, it is possible to achieve the performance of preventing creeping and the improvement of post-workability at the same time.
  • the solder flux scooping-up composition (also referred to as "scooping-up preventing agent") of the present invention contains a specific copolymer as a coating component.
  • This copolymer is derived from at least one polyfluoroalkyl group-containing unsaturated compound represented by the following formula (a) and at least one silane-containing (meth) acrylate (b) described later. Contains units to be cut.
  • (meth) acrylate refers to either or both of acrylic acid ester and methacrylic acid ester.
  • R 1 is a hydrogen atom or a methyl group.
  • R f is a polyfluoroalkyl group.
  • the polyfluoroalkyl group means a group in which two or more hydrogen atoms of the alkyl group are substituted with fluorine atoms, and includes an etheric oxygen atom inserted between the carbon-carbon bond of the alkyl group. There may be.
  • the notation of a polyfluoroalkyl group or R f group is a superordinate concept of a polyfluoroalkyl group containing an etheric oxygen atom inserted between carbon-carbon bonds, unless otherwise specified. It means a generic term for both polyfluoroalkyl groups not containing and containing the oxygen atom.
  • the polyfluoroalkyl group (R f group) is usually a group having 2 or more fluorine substituents corresponding to an alkyl group having 1 to 20 carbon atoms, and has either a linear structure or a branched structure. It's good.
  • a partially or perfluoro-substituted alkyl group corresponding to a linear or branched alkyl group such as methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, nor,
  • groups having an oxypolyfluoroalkylene repeating unit such as loethylene and oxypolyfluoropropylene.
  • branched polyfluoroalkyl group examples include isopropyl group, 3-methylbutyl group, 5-methylhexyl group, and 7-methyloctyl perfluoro-substituted alkyl group.
  • the polyfurfuryl O b alkyl group containing no etheric oxygen atom In particular, a perfluoroalkyl group containing an etheric oxygen atom is selected.
  • R f group is substantially all fluorine-substituted per full O b alkyl group (hereinafter, also referred to as a group) is preferred instrument R F group having 1 to 20 carbon atoms preferable. In particular, an R F group having a main chain length (including side chains, carbon number) of 1 to 6 is preferred.
  • the R f group may be either a straight chain structure or a branched structure! /, But a straight chain structure is preferred. In the case of a branched structure, it is preferable that the branched portion is present at the terminal portion of the R f group and is a short chain having about 1 to 3 carbon atoms.
  • the contact angle can be used as an index. For example, the higher the contact angle with oil such as dodecane, the higher the oil repellency.
  • Q is a single bond or a divalent linking group.
  • divalent linking groups are shown below, but Q can be appropriately selected as long as it is a single bond or a divalent linking group, and is not limited thereto.
  • substituents examples include a halogen atom (F, Cl, Br, I), a cyan group, an alkoxy group (methoxy, ethoxy, butoxy, octyloxy).
  • Q is -Z- (Y)-(Z is a single bond, -O- or -NH-, and Y is an alkylene group, an amino group, a sulfole group, or These combined forces are preferably a divalent linking group obtained, and n is an integer of 0 or 1.
  • Y is preferably a linear alkylene group having 1 to 5 carbon atoms.
  • R 1 hydrogen atom or methyl group
  • Z Single bond, -O-, -NH-,
  • Y an alkylene group having 1 to 5 carbon atoms
  • Specific examples of the compound represented by the above formula (al) include the following polyfluoroalkyl group-containing acrylate or polyfluoroalkyl group-containing metatalylate.
  • the compound (a) in the present invention is It is not limited to these.
  • the copolymer according to the present invention may contain one or more of the above-mentioned compound (a) units that can also lead to the force! /, Or may contain two or more kinds.
  • the content of the unit in which the total amount of the compound ( a ) in the copolymer is also derived is preferably 50 to 99% by mass, more preferably 80 to 99% by mass.
  • the copolymer flux has a good ability to prevent the copolymer flux from rising.
  • the content of each polymer unit can be substantially regarded as a polymerization charge.
  • silane-containing (meth) acrylate which forms the copolymer according to the present invention is represented by the following formula (b). Is done.
  • branched alkylene group or a group composed of a combination of these divalent linking groups can be used, and more preferably a single bond or an alkylene group having 1 to 5 carbon atoms.
  • R 1 is a hydrogen atom or a methyl group.
  • R 2 is a hydroxyl group or a hydrolyzable functional group, and specific examples thereof include an alkoxy group having 1 to 3 carbon atoms and a halogen atom.
  • ⁇ is an integer of 1 to 3, and when ⁇ is 2 or 3, R 2 may be the same or different from each other.
  • n and 1 are each independently an integer of 0 or 1. (4—n—m—1) is 1 or more.
  • R 3 and R 4 are each independently a hydrogen atom, a saturated alkyl group having 1 to 4 carbon atoms, or a process group.
  • the compound (b) contains at least one hydrolyzable functional group from the viewpoint of adhesion to a component to be treated and prevention of creeping, that is, in the above formula (b).
  • n 3 among the forces including at least one R 2 which is a hydrolyzable functional group, and all R 2 are hydrolyzable functional groups.
  • the hydrolyzable functional group an alkoxy group is most easily handled and is more preferable immediately.
  • the alkoxy group is particularly preferably 1 to 3 carbon atoms, preferably 1 to 5 carbon atoms.
  • the copolymer according to the present invention may contain one or two or more of the above-mentioned compounds (b) which can also lead to the force.
  • the copolymer according to the present invention contains only 1% by mass of the unit derived from the compound (b), the creeping prevention performance is improved. If it is contained in an amount of 5% by mass or more, very high performance is exhibited. However, if a large number of units derived from compound (b) are contained, the stability of the copolymer tends to be impaired.
  • the amount is preferably 1 to 50% by mass, more preferably 5 to 20% by mass.
  • the copolymer according to the present invention includes one or more units derived from the compound (c) other than these units (a) and (b) as well as the unit from which the force is derived. It does not matter.
  • the compound (c) is not particularly limited as long as it is another compound capable of forming a copolymer with the above (a) and (b).
  • a compound (c) for example, it has no R f group and has a polymerizable unsaturated group.
  • Specific examples include polyolefin unsaturated esters such as acrylic acid, methacrylic acid and acrylic esters, compounds having vinyl groups, unsaturated esters having epoxy groups, amino groups and polymerizable unsaturated groups.
  • (meth) acrylic acid polyesters such as acrylic acid diesters, and compounds having a substituted amino group and a polymerizable unsaturated group.
  • R 5 is, for example, 1 H, —OH, —CH 2, 1 Cl, 1 CHO, 1 COOH, 1 CH 2 O,
  • 2 2 2 2 2 2 2 2 2 2 3 is CH OCOCH or the like.
  • R 6 is, for example, H, —CH, —CH CH OH, —CH CH N (CH), — (CH
  • R 7 is, for example, NHCH OH, —NHCH SO H, —NHC (CH 3) CH—C
  • n l ⁇ : LO
  • R 1 is a hydrogen atom or a methyl group
  • R 8 is an organic group (excluding a polyfluoroalkyl group)
  • p is an integer of 1 to 4.
  • the copolymer according to the present invention can contain the above-mentioned unit (d) that can also induce the compound (c) in an amount of 50% by mass or less depending on the type.
  • the molecular weight of the copolymer is moderately large, sufficient performance can be exhibited. On the other hand, if the molecular weight is too large, the solubility in a solvent becomes poor.
  • the molecular weight of the copolymer is a weight average molecular weight (Mw), and usually 1 ⁇ 10 3 to 1 ⁇ 10 7 is preferable, and 1 ⁇ 10 4 to 2 ⁇ 10 5 is particularly preferable.
  • the copolymer according to the present invention is not particularly limited with respect to the polymerization form except that it includes the compounds (a) and (b) as described above and a unit additionally derived from (polymerization form). Random, block, and graft are not particularly limited, but random copolymers are usually preferred.
  • the production method is not particularly limited, but in the present invention, addition polymerization can usually be performed based on an unsaturated group in each compound.
  • the polymerization can be carried out by appropriately adopting known addition polymerization conditions for unsaturated compounds.
  • the polymerization initiation source is not particularly limited, and usual initiators such as organic peroxides, azo compounds, and persulfates can be used.
  • the composition of the present invention containing the above copolymer is usually in a liquid form.
  • the copolymer is produced by solution polymerization using a solvent described later as a polymerization medium, and the liquid composition is directly prepared by polymerization.
  • the polymerization raw material is a gas such as salt or blue, use a pressure vessel to supply continuously under pressure.
  • the solvent for forming the composition is not particularly limited as long as it can dissolve or disperse the copolymer, and examples thereof include various organic solvents, water, and mixed media thereof.
  • polar solvents other than alcohol can be used as the main solvent.
  • the strength includes, for example, acetone-methylethylketone as a ketone system, ethyl acetate as an ester system, and tetrahydrofuran as an ether system, but is not limited thereto. Any fluorine-based solvent can be selected regardless of the chain length of the R f group in the copolymer.
  • Hyde mouth black fluorocarbon (HCFC) and (Perful mouth carbon (PFC) can also be used, but considering the social environmental issues, hyde mouth fluorocarbon (HFC) or hide mouth fluoroether (HFE) is preferred.
  • fluorinated solvents that can be used are shown below, but are not limited thereto.
  • m-Xylene hexafluoride hereinafter referred to as m-XHF
  • P-xylene hexafluoride hereinafter referred to as p-XHF
  • the creep-up preventing agent of the present invention usually contains the above copolymer in a concentration of preferably 0.01 to 20% by mass, more preferably 0.05 to 5% by mass. If the concentration of the copolymer is within this range, the anti-cracking performance can be sufficiently exerted and the stability of the composition is good.
  • the above-mentioned copolymer concentration of the anti-cracking agent may be a final concentration. For example, when the anti-creaking agent is directly prepared as a polymerization composition, the copolymer concentration of the polymerization composition immediately after polymerization is used. (Solid content) exceeds 20% by mass!
  • the high-concentration polymerization composition can be appropriately diluted so that the final desired concentration is obtained.
  • the scooping preventive agent of the present invention does not adversely affect the stability of the composition, the flux scooping prevention performance or the appearance, and if it is within the range, it contains other components than those described above. Also good. Such other components include, for example, the purpose of controlling the concentration of the polymer in the liquid when the pH adjusting agent, antifungal agent, and composition for preventing corrosion of the coating surface are used. Dyes, dye stabilizers, flame retardants, antifoaming agents, or antistatic agents for distinguishing from treated parts are included.
  • a coating film is formed on part or all of the surface of the electronic member with the above scooping preventive agent, and after part or all of the surface of the electronic member is treated with a soldering flux, An electronic member soldering method is provided.
  • the scooping-up inhibitor can be diluted to an arbitrary concentration according to the purpose and application and coated on the electronic member.
  • a coating method a general coating method can be employed. For example, there are methods such as dip coating, spray coating, or coating with an aerosol can filled with the composition of the present invention.
  • the electronic member include an electronic component having an electrical contact such as a connector, a switch, a volume, or a semi-fixed resistor, and a printed circuit board having an electrical contact.
  • the portion covered with the scooping preventive agent of the present invention include a portion where a flux scooping may occur when an electronic component such as a connector is soldered to a printed circuit board. More specifically, the base part of an electronic component such as a connector to be attached to the printed circuit board, the surface of the printed circuit board on which the electronic component body is mounted, or a through hole provided in the printed circuit board for attaching the electronic component, etc. It is done.
  • electronic parts or pre A coating method other than the above, which may cover the entire surface of the substrate can also be employed. For example, a method of full immersion or semi-immersion with good coating efficiency can be employed.
  • the scooping-up preventing agent After applying the scooping-up preventing agent, it is more preferable to perform drying at a temperature not lower than the boiling point of the solvent. Of course, if it is difficult to heat and dry due to the material of the parts to be processed, it should be dried while avoiding heating.
  • the heat treatment conditions should be selected according to the composition of the composition to be applied and the area of application.
  • the scooping preventive agent of the present invention forms a film on the surface of an electronic component or a printed circuit board and prevents scooping of the solder flux. Therefore, the present invention provides an electronic component or a printed circuit board in which corrosion due to flux is prevented.
  • the scooping preventive agent of the present invention is compatible with surface mounting technology, and exhibits high performance against reflow soldering, which was difficult with conventional flux scooping preventive agents. is there. Moreover, the scooping preventive agent of the present invention can be sufficiently applied to lead-free solder.
  • the electronic component or printed circuit board having the coating film formed on the surface as described above is then processed with a soldering flux and further soldered to become a soldered electronic component or printed circuit board.
  • the electronic component or printed circuit board is used for various electric products.
  • the electrical product is an excellent quality electrical product in which troubles caused by corrosion due to flux are prevented.
  • Specific examples of the electric products include devices for computer devices, televisions, audio devices (radio cassettes, compact discs, minidiscs), mobile phones, and the like.
  • the total charge is 60 g
  • the total amount of monomer is 100 parts by mass
  • dimethyl 2,2'-azobis (2-methylpropionate (V-601: 1 part by weight of Wako Pure Chemicals) and 399 parts by weight of metaxylene hexafluoride (m-XHF) as a solvent were reacted at 70 ° C for 18 hours.
  • Polymeric compositions 1-20 containing 20 were obtained.
  • each compound (a) shown as F (M) A in Table 3 was homopolymerized, and polymerized composition 21 containing polymers 21 to 25 ⁇ 25 was obtained. Further, the polymer shown in Table 4 was prepared in the same manner as in the above Production Example except that the compound (a) and compound (c) shown as C6FMA in Table 3 were used in the mass ratio shown in Table 4. Polymerized compositions 26-28 containing 26-28 were obtained.
  • the polymerization composition 120 was diluted to 0.1% using m-XHF, and evaluation of the flux-climbing force was prevented and the contact angle was measured. The results are shown in Table 5.
  • test pieces treated with silver plating (mesh thickness 3 ⁇ m) on the copper plate were immersed in each example and comparative example for 60 seconds and then dried at 110 ° C. for 5 minutes.
  • the specimen was fixed at an inclination of about 73 degrees and heated using a solder checker SAT-5100 manufactured by Les Force Co., Ltd.
  • a contact angle measurement with respect to normal hexadecane was performed on the glass plate treated in each example (1 minute immersion and then dried at 110 ° C. for 5 minutes).
  • a droplet projection contact angle meter manufactured by Kyowa Interface Science Co., Ltd. was used for the measurement of the contact angle.
  • the flux scooping prevention composition of the present invention has a very high scooping prevention performance.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

L'invention concerne une composition présentant un effet anti migration des flux élevé et qui peut être appliquée sur une brasure destinée à une fixation sur une surface. L'invention concerne également une composition anti migration des flux destinée à une brasure, qui comprend un copolymère ayant au moins une unité dérivée d'au moins un composé insaturé ayant un groupe polyfluoroalkyle et représenté par la formule (a) ainsi qu'une unité dérivée d'au moins un (méth)acrylate contenant du silane représenté par la formule (b) : (a) ; et (b) dans laquelle Q représente une liaison simple ou un groupe de liaison bivalent ; R1 représente un atome d'hydrogène ou un groupe méthyle ; Rf représente un groupe polyfluoroalkyle pouvant avoir un atome d'oxygène éthérique au sein d'une liaison carbone-carbone ; R2 représente un groupe hydroxyle ou un groupe fonctionnel hydrolysable ; R3 et R4 représentent indépendamment un atome d'hydrogène, un groupe alkyle saturé ayant de 1 à 4 atomes de carbone, ou un groupe phényle ; n représente un nombre entier compris entre 1 et 3 ; et m et l représentent indépendamment un nombre entier choisi parmi 0 et 1, sous réserve que le nombre représenté par la formule (4-n-M) soit supérieur ou égal à 1.
PCT/JP2007/052492 2006-03-01 2007-02-13 Composition antimigration des flux destinee a une brasure Ceased WO2007099760A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008502689A JP5124441B2 (ja) 2006-03-01 2007-02-13 半田用フラックス這い上がり防止組成物
CN2007800065678A CN101389443B (zh) 2006-03-01 2007-02-13 焊锡用熔剂上爬防止组合物

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006054976 2006-03-01
JP2006-054976 2006-03-01

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WO2007099760A1 true WO2007099760A1 (fr) 2007-09-07

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CN (1) CN101389443B (fr)
WO (1) WO2007099760A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009090798A1 (fr) * 2008-01-18 2009-07-23 Agc Seimi Chemical Co., Ltd. Composition contre le fluage de flux pour brasure, élément électronique pour brasure recouvert de la composition, procédé de brasage de l'élément, et appareil électrique
WO2011105223A1 (fr) * 2010-02-26 2011-09-01 アルプス電気株式会社 Agent de traitement de surface pour contacts électriques

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6049859A (ja) * 1983-08-30 1985-03-19 Asahi Glass Co Ltd 半田用フラツクスの這上り防止剤
JPH07201501A (ja) * 1993-12-28 1995-08-04 Dainippon Ink & Chem Inc 電子部品へのフラックス侵入防止方法
JPH1098253A (ja) * 1996-09-24 1998-04-14 Nof Corp 半田用フラックスの拡散防止剤
JPH10303536A (ja) * 1997-04-24 1998-11-13 Seimi Chem Co Ltd 半田用フラックス這い上がり防止剤組成物
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