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WO2009090798A1 - Composition contre le fluage de flux pour brasure, élément électronique pour brasure recouvert de la composition, procédé de brasage de l'élément, et appareil électrique - Google Patents

Composition contre le fluage de flux pour brasure, élément électronique pour brasure recouvert de la composition, procédé de brasage de l'élément, et appareil électrique Download PDF

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Publication number
WO2009090798A1
WO2009090798A1 PCT/JP2008/071320 JP2008071320W WO2009090798A1 WO 2009090798 A1 WO2009090798 A1 WO 2009090798A1 JP 2008071320 W JP2008071320 W JP 2008071320W WO 2009090798 A1 WO2009090798 A1 WO 2009090798A1
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WO
WIPO (PCT)
Prior art keywords
group
polymer
solder
flux
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/071320
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English (en)
Japanese (ja)
Inventor
Ryo Hirabayashi
Fusae Ishiwata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Seimi Chemical Ltd
Original Assignee
AGC Seimi Chemical Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AGC Seimi Chemical Ltd filed Critical AGC Seimi Chemical Ltd
Priority to CN2008801253005A priority Critical patent/CN101952082B/zh
Priority to JP2009549962A priority patent/JP5295131B2/ja
Publication of WO2009090798A1 publication Critical patent/WO2009090798A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/203—Fluxing, i.e. applying flux onto surfaces
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/22—Esters containing halogen
    • C08F220/24—Esters containing halogen containing perhaloalkyl radicals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]

Definitions

  • a flux treatment for improving the adhesiveness of the solder is performed in advance.
  • a general flux is a corrosive agent containing an acidic component in a solvent. For this reason, it is undesirable for flux to penetrate or adhere to electrical contact parts of electronic parts such as connectors, switches, volumes, semi-fixed resistors, or parts that do not require soldering on printed circuit boards, and this must be prevented. .
  • the flux scooping up that occurs in the through-hole part of electronic parts due to the capillary phenomenon, the flux adheres to or penetrates into parts that are not soldered, causing corrosion. Need to prevent.
  • such a polymer is typically CH 2 ⁇ C (R 1 ) COO—QR f (wherein R 1 is a hydrogen atom or a methyl group, Q is a divalent linking group, R f is A polymer derived from a (meth) acrylate having a polyfluoroalkyl group represented by (C4-14 polyfluoroalkyl group) (see Patent Document 1).
  • the flux creeping-up preventing agent is required to be a very thin film in order to prevent contact failure due to the flux creeping-up preventing film processed on the contact part of the electronic component.
  • IPA performance at a very low concentration is required.
  • the present invention is a polymer containing a polymer unit derived from an unsaturated compound having a polyfluoroalkyl group having 6 or less carbon atoms, which has little influence on the living body and the environment.
  • a flux scooping prevention composition for a solder having a performance equivalent to that of a flux scooping prevention agent comprising a polymer containing a polymer unit derived from an unsaturated compound having a molecular weight of 8 or more and having a high flux scooping prevention performance With the goal.
  • the present invention is a polymer containing a polymer unit derived from an unsaturated compound having a polyfluoroalkyl group having 6 or less carbon atoms, which has little influence on the living body and the environment.
  • a polar group into the polymer and setting the weight average molecular weight of the polymer to 150,000 or more, a polymer unit derived from an unsaturated compound having 8 or more carbon atoms in a conventional polyfluoroalkyl group is obtained.
  • the present invention makes it possible to provide a flux scooping preventive agent having the same performance as the flux scooping preventive agent containing the polymer contained.
  • the solder flux creeping-up composition according to the present invention comprises a polymerization unit (A) derived from a compound represented by the following formula (a) and a polymerization unit (B) derived from an unsaturated compound containing a hydroxyl group.
  • A polymerization unit
  • B polymerization unit
  • Each polymer contains at least one polymer and has a weight average molecular weight (in terms of polymethyl methacrylate) of 150,000 or more.
  • R 1 a hydrogen atom or a methyl group
  • Q 1 a single bond or a divalent linking group
  • R f represents a polyfluoroalkyl group or polyfluoroether group having a main chain length of 1 to 6 carbon atoms.
  • a preferred R f group is a linear perfluoroalkyl group or perfluoroether group having 1 to 6 carbon atoms.
  • Q 1 is preferably a single bond or a linear alkylene group having 1 to 6 carbon atoms, an amino group, a sulfonyl group, or a combination thereof.
  • the polymerization unit (B) is preferably derived from a compound represented by the following formula (b). CH 2 ⁇ C (R 1 ) —C (O) O—Q 2 —OH (b) Wherein, R 1: same as in the formula (a), Q 2: 2 divalent linking group.
  • the solder flux creeping-up composition according to the present invention is usually in a liquid form, and preferably contains a polymer as described above at a concentration of 0.001 to 10% by mass.
  • Another aspect of the present invention is an electronic member that has a coating made of any of the above-described compositions on part or all of the soldering portion of the electronic member and has a solder flux creeping-up preventing performance.
  • the present invention also provides a method of forming a film made of any of the above-described compositions on a part or all of a part to be soldered of an electronic member, applying a part or all of the film with a soldering flux, A method of soldering an electronic member to be attached is provided, and an electric product including the electronic member soldered by the method is also provided.
  • (meth) acrylate represents both or one of acrylic ester and methacrylic ester.
  • the polymer contained in the composition for preventing creeping up of the solder flux of the present invention is a polymer unit (A) derived from a compound represented by the following formula (a): And at least one polymerization unit (B) derived from an unsaturated compound containing a hydroxyl group. CH 2 ⁇ C (R 1 ) —COO—Q 1 —R f (a)
  • the symbols in the formulas have the following meanings.
  • R 1 a hydrogen atom or a methyl group
  • Q 1 a single bond or a divalent linking group
  • R f a polyfluoroalkyl group or polyfluoroether group having a main chain length of 1 to 6 carbon atoms.
  • the polyfluoroalkyl group means a partially fluoro-substituted or perfluoro-substituted alkyl group in which two to all of the hydrogen atoms of the alkyl group are substituted with fluorine atoms.
  • the polyfluoroalkyl group represented by the R f group may have either a straight chain structure or a branched structure, but the main chain length (the number of carbon atoms not including the side chain) is an alkyl having 1 to 6 carbon atoms.
  • the polyfluoroether group means a group in which an etheric oxygen atom is inserted between one or more carbon-carbon atoms in the polyfluoroalkyl group.
  • the R f group preferably has a linear structure from the viewpoint of increasing the packing of the R f group. For the same reason, in the case of a branched structure, it is preferable that the branched portion is present at the terminal portion of the R f group.
  • the R f group is preferably a polyfluoroalkyl group. Further, the R f group is preferably a substantially perfluorinated perfluoroalkyl group (R F ), more preferably an R F group having a main chain length of 1 to 6 carbon atoms, It is particularly preferable that the R F group is.
  • Q 1 is a single bond or a divalent linking group.
  • the above linking group may have a substituent.
  • substituents include a halogen atom (F, Cl, Br, I), a hydroxyl group, a cyano group, an alkoxy group (methoxy, ethoxy, butoxy, octyl).
  • Q 1 can be appropriately selected as long as it is a single bond or a divalent linking group, but is a single bond or a linear or branched alkylene group having 1 to 6 carbon atoms, a phenylene group, an amino group (—N ( R)-), a sulfonyl group (—SO 2 —) and a divalent linking group selected from a combination thereof are preferable.
  • Specific examples of the divalent linking group in this combination include —N (R) —SO 2 —, the above alkylene group or phenylene group, and —NR—, —SO 2 — or —N (R) —SO. Examples thereof include a linking group to 2- .
  • the alkylene group is preferably linear.
  • a preferable one is represented by the following formula (a1).
  • p is an integer from 0 to 6
  • R 1 and R f are the same as those in the formula (a).
  • R f is a linear perfluoroalkyl group (R F ) having 1 to 6 carbon atoms
  • R F a linear perfluoroalkyl group
  • R 1 is the same as defined above, and Q 3 represents an alkylene group, a phenylene group, a cyclohexylene group, an ester bond, an amide bond, — (CH 2 CH 2 O) n —, — (CH 2 CH 2 CH 2 O) n- , or a combination thereof (where n is an integer from 1 to 30).
  • Q 3 represents an alkylene group, a phenylene group, a cyclohexylene group, an ester bond, an amide bond, — (CH 2 CH 2 O) n —, — (CH 2 CH 2 CH 2 O) n- , or a combination thereof (where n is an integer from 1 to 30).
  • These groups may have a substituent such as a hydroxyl group or an aryl group.
  • N 1 to 10 in Table 1 above
  • the polymer according to the present invention is a copolymer containing at least one of the above polymerized units (A) and polymerized units (B), and the polymerized units (B) are represented by the formula (b). It is preferable that the polymerization unit (A) is derived from the compound represented by the formula (a1) and the polymerization unit (B) is derived from the compound represented by the formula (b1). It is more preferable that they are used.
  • the content of polymer units (A) in the polymer is preferably 90% by mass or more, and more preferably 95% by mass or more.
  • the content of the polymerization unit (A) is 90% by mass or more, the IPA performance can be maintained and the creeping prevention performance can be maintained.
  • the content of the polymer units (B) in the polymer is preferably 0.1 to 10% by mass, more preferably 0.5 to 5% by mass.
  • the content is within the above range, the IPA performance of the copolymer is improved, and good anti-cracking performance of the flux can be obtained.
  • the content is too small, the creeping prevention performance is low, and when the content is too large, the solubility of the copolymer in the solvent is remarkably lowered.
  • the content of each polymerization unit can be substantially regarded as a polymerization charge amount.
  • the content is the total of the respective polymerization units.
  • the polymer according to the present invention may contain other polymer units (C) in addition to the polymer units (A) and (B) as described above.
  • the other polymerization unit (C) is not particularly limited as long as it is a polymerization unit derived from a compound that can be copolymerized with the compounds forming the above (A) and (B).
  • this compound include a compound (c) having a polymerizable group.
  • examples thereof include a compound (c) having an unsaturated group such as an acrylic acid compound (c2) and a further polymerizable compound (c3).
  • an acrylic acid compound (c2) and a further polymerizable compound (c3).
  • R 2 —H, CH 3 , —Cl, —CHO, —COOH, —CH 2 Cl, —CH 2 NH 2 , —CH 2 N (CH 3 ) 2 , —CH 2 N (CH 3 ) 3 Cl, —CH 2 NH 3 Cl, —CH 2 CN, —CH 2 COOH, —CH 2 N (CH 2 COOH) 2 , —CH 2 SH, —CH 2 SO 3 Na or —CH 2 OCOCH 3 .
  • the polymer according to the present invention can contain, as the polymerized unit (C), a polymerized unit derived from one or more of the compounds (c) as described above.
  • the total amount may be 50% by mass or less, preferably 20% by mass or less.
  • the polymer according to the present invention requires a high molecular weight for sufficiently exhibiting the creeping prevention performance in addition to the structure as described above.
  • the polymer has a weight average molecular weight (Mw) of 150,000 or more.
  • Mw weight average molecular weight
  • the molecular weight is preferably 180,000 or more, more preferably 200,000 or more.
  • the molecular weight is too large, solubility in a solvent and handling of a polymer become difficult, so that it is preferably at most 2 million, more preferably 1 million or less. Even 500,000 or less may be sufficient.
  • the weight average molecular weight is defined as GPC (gel permeation chromatography; column filler: styrene divinylbenzene copolymer, moving layer: polymethyl methacrylate (standard name) measured by Asahiklin AK-225 (trade name). Substance) The molecular weight in terms of conversion.
  • the polymer according to the present invention is not particularly limited with respect to the polymerization form and the like except that it includes the above-described polymerization units (A) and (B) and an additional polymerization unit (C).
  • the polymerization form may be any of random, block, graft and the like, and is not particularly limited, but usually a random copolymer is preferred.
  • the scooping preventive agent of the present invention is a liquid composition containing the above-mentioned polymer and usually dissolved or dispersed in a solvent.
  • the polymer is produced by solution polymerization using a solvent described later as a polymerization medium, and the liquid composition is directly prepared by polymerization.
  • the polymerization raw material compound is a gas such as vinyl chloride, it may be continuously supplied under pressure using a pressure vessel.
  • the solvent for forming the composition is not particularly limited as long as it can dissolve or disperse the polymer, and examples thereof include various organic solvents, water, and mixed media thereof.
  • the polymer is particularly easily dissolved in a fluorinated solvent, and hydrochlorofluorocarbon (HCFC) and perfluorocarbon (PFC) can also be used.
  • hydrochlorofluorocarbon (HCFC) and perfluorocarbon (PFC) can also be used.
  • hydrofluorocarbon (HFC) or hydrofluoroether (HFE) is preferable. Specific examples of usable fluorine-based solvents are shown below, but are not limited thereto.
  • m-XHF m-xylene hexafluoride
  • p-XHF p-xylene hexafluoride
  • CF 3 CH 2 CF 2 CH 3 CF 3 CH 2 CF 2 H
  • C 6 F 13 OCH 3 C 6 F 13 OC 2 H 5
  • C 3 F 7 OCH 3 C 3 F 7 OC 2 H 5
  • C 6 F 13 H CF 2 HCF 2 CH 2 OCF 2 CF 2 H
  • CF 3 (OCF 2 CF 2 ) n (OCF 2 ) m OCF 2 H m and n are each 1 to 20
  • CF 3 CF 2 CHCl 2 and CClF 2 CF 2 CHClF is a trade name of Asahi Clin AK-225 (manufactured by Asahi Glass Co., Ltd.), and CF 3 (CF 2 ) 3 OC 2 H 5 and (CF 3 )
  • a hydrofluoroether mixture with 2 CFCF 2 OC 2 H 5 is available under the trade name Novec HFE 7200 (manufactured by 3M).
  • the scooping preventive agent of the present invention may contain any desired component as long as it does not adversely affect the stability of the composition, the flux scooping prevention performance or the appearance.
  • Such components include, for example, pH control agents, rust preventives for preventing corrosion of the coating surface, the purpose of controlling the concentration of the polymer in the liquid when the composition is diluted, and untreated parts Dyes, dye stabilizers, flame retardants, antifoaming agents, antistatic agents, and the like.
  • a coating film of the scooping-up preventing agent as described above is formed on a part or all of the soldering portion of the surface of the electronic member, and after treating a part or all of the coating film with a soldering flux, An electronic member soldering method for soldering is provided.
  • the scooping-up preventing agent can be diluted to an arbitrary concentration according to the purpose and application and coated on the electronic member.
  • a coating method a general coating method can be employed. For example, there are methods such as dip coating, spray coating, or coating with an aerosol can filled with the composition of the present invention.
  • the electronic member include an electronic component having an electrical contact such as a connector, a switch, a volume, or a semi-fixed resistor, and a printed circuit board having an electrical contact.
  • the location covered with the scooping preventive agent of the present invention include a location where a flux scooping may occur when an electronic component such as a connector is soldered to a printed circuit board. More specifically, a base part of an electronic component such as a connector to be attached to the printed board, a substrate surface on the side of the printed board on which the electronic component main body is mounted, or a through hole provided in the printed board for attaching the electronic component, etc. It is done. Moreover, you may coat
  • the scooping preventive agent of the present invention forms a film on the surface of an electronic member such as an electronic component or a printed circuit board and prevents scooping of the solder flux. Therefore, according to the present invention, an electronic member such as an electronic component or a printed board in which corrosion due to flux is prevented is provided.
  • An electronic component such as an electronic component or a printed circuit board having a coating (dried) formed on the surface as described above or a printed board is then treated with a soldering flux, and then soldered.
  • the soldering method is not particularly limited, and is performed according to a conventionally known method.
  • the types of flux and solder are not particularly limited, and those commonly used for soldering electronic members can be used.
  • the electronic components or electronic members such as printed boards are used as materials for various electric products.
  • the electrical product is an excellent quality electrical product in which a failure caused by corrosion due to flux is prevented.
  • Specific examples of the electric products include devices for computer devices, televisions, audio devices (radio cassettes, compact discs, minidiscs), mobile phones, and the like.
  • Test 2 The polymerization compositions of Examples 1 to 5 were diluted with HFE7200 to prepare solder flux creep-up inhibitors having a polymer concentration of 1%. A test piece subjected to silver plating (3 ⁇ m) was dipped in each scooping preventive agent at room temperature for 1 minute, then taken out and dried at room temperature, and treated with a scooping preventive agent.
  • SAT-5100 (Resca Co., Ltd.) was used for the zero cross time measurement.
  • Solder used H63A-B20 (eutectic solder, Senju Metal Industry Co., Ltd.) Solder temperature: 235 ° C Flux: Rosin flux 25% IPA solution (Senju Metal Industry Co., Ltd.)
  • Base material Silver-plated plate (10 x 30 x 0.3 mm, Reska Co., Ltd.) Immersion conditions: Immersion speed: 20 mm / sec, Immersion depth: 2 mm, Immersion time: 10 sec Treatment conditions: After immersion for 1 minute, air-dry at room temperature for 20 minutes or more.
  • Table 4 shows the evaluation results of contact resistance and solder wettability (zero cross time).
  • the scooping-up preventing agent even when the treatment was performed at a concentration of 1% which is considerably higher than the concentration of a general scooping-up preventing agent, the contact resistance was almost the same as that of untreated. From this, it was confirmed that even if a film made of the scooping-up preventing agent is formed on the contact portion of the electrical component, the possibility of contact failure is very low. Moreover, since the zero cross time after the treatment at the above 1% concentration is also 1 second or less, it has been confirmed that even if the scooping prevention coating is processed on the soldered portion, it does not affect the soldering. .

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)

Abstract

L'invention se rapporte à une composition contre le fluage de flux pour une brasure qui présente des propriétés empêchant le fluage de flux comparables à celles d'un agent contre le fluage de flux classique comprenant un polymère contenant un groupe polyfluoroalkyle ayant 8 atomes de carbone ou plus. Une influence sur un organisme vivant et un environnement peut être considérablement réduite. La composition contre le fluage de flux comprend un polymère comprenant au moins un type d'une unité de polymérisation de (méth)acrylate (A) contenant un groupe perfluoroalkyle ayant 6 atomes de carbone ou moins et au moins un type d'une unité de polymérisation (B) dérivée d'un composé non saturé contenant un groupe hydroxyle. Le polymère a une masse moléculaire moyenne en poids (en termes de polyméthacrylate de méthyle) de pas moins de 150000.
PCT/JP2008/071320 2008-01-18 2008-11-25 Composition contre le fluage de flux pour brasure, élément électronique pour brasure recouvert de la composition, procédé de brasage de l'élément, et appareil électrique Ceased WO2009090798A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2008801253005A CN101952082B (zh) 2008-01-18 2008-11-25 焊剂上爬防止组合物、被覆了该组合物的锡焊用电子构件、该构件的锡焊方法及电气产品
JP2009549962A JP5295131B2 (ja) 2008-01-18 2008-11-25 はんだ用フラックス這い上がり防止組成物、該組成物を被覆したはんだ用電子部材、該部材のはんだ付け方法および電気製品

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008-008923 2008-01-18
JP2008008923 2008-01-18

Publications (1)

Publication Number Publication Date
WO2009090798A1 true WO2009090798A1 (fr) 2009-07-23

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PCT/JP2008/071320 Ceased WO2009090798A1 (fr) 2008-01-18 2008-11-25 Composition contre le fluage de flux pour brasure, élément électronique pour brasure recouvert de la composition, procédé de brasage de l'élément, et appareil électrique

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JP (1) JP5295131B2 (fr)
CN (1) CN101952082B (fr)
MY (1) MY150334A (fr)
WO (1) WO2009090798A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011021623A1 (fr) * 2009-08-20 2011-02-24 Ａｇｃセイミケミカル株式会社 Composé (méth) acrylamide n-substitué à teneur en groupe fluoroalkyle, polymère de ce composé et son utilisation
WO2011105223A1 (fr) * 2010-02-26 2011-09-01 アルプス電気株式会社 Agent de traitement de surface pour contacts électriques
WO2011152126A1 (fr) * 2010-06-02 2011-12-08 Dic株式会社 Composition cationiquement polymérisable, adhésif la contenant, et produit durci et plaque de polarisation obtenus à partir de celle-ci

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CN108250338B (zh) * 2017-12-27 2020-11-20 兰州大学 具有防爬移特性的聚合物及其制备方法

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JPH07201501A (ja) * 1993-12-28 1995-08-04 Dainippon Ink & Chem Inc 電子部品へのフラックス侵入防止方法
JPH08301909A (ja) * 1995-05-12 1996-11-19 Senju Metal Ind Co Ltd はんだ付け用フラックス滲み防止剤
JPH1133708A (ja) * 1997-07-15 1999-02-09 Seimi Chem Co Ltd 半田用フラックス這い上がり防止剤、該防止剤組成物およびその用途
JP2001135926A (ja) * 1999-11-02 2001-05-18 Seimi Chem Co Ltd 半田用フラックス這い上がり防止剤組成物とその用途
WO2007099760A1 (fr) * 2006-03-01 2007-09-07 Agc Seimi Chemical Co., Ltd. Composition antimigration des flux destinee a une brasure

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WO2011021623A1 (fr) * 2009-08-20 2011-02-24 Ａｇｃセイミケミカル株式会社 Composé (méth) acrylamide n-substitué à teneur en groupe fluoroalkyle, polymère de ce composé et son utilisation
US9000110B2 (en) 2009-08-20 2015-04-07 Agc Seimi Chemical Co., Ltd. Fluoroalkyl group-containing n-substituted (meth)acrylamide compound, polymer thereof, and use thereof
JP5719299B2 (ja) * 2009-08-20 2015-05-13 Ａｇｃセイミケミカル株式会社 フルオロアルキル基含有ｎ−置換（メタ）アクリルアミド化合物、その重合体およびその用途
WO2011105223A1 (fr) * 2010-02-26 2011-09-01 アルプス電気株式会社 Agent de traitement de surface pour contacts électriques
WO2011152126A1 (fr) * 2010-06-02 2011-12-08 Dic株式会社 Composition cationiquement polymérisable, adhésif la contenant, et produit durci et plaque de polarisation obtenus à partir de celle-ci
JP4947244B2 (ja) * 2010-06-02 2012-06-06 Ｄｉｃ株式会社 カチオン重合性組成物、それを含む接着剤、ならびに、それらを用いて得られた硬化物及び偏光板

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