Classifications

• • C—CHEMISTRY; METALLURGY
  • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
  • C22C—ALLOYS
  • C22C9/00—Alloys based on copper
  • C22C9/04—Alloys based on copper with zinc as the next major constituent
• • C—CHEMISTRY; METALLURGY
  • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
  • C22C—ALLOYS
  • C22C9/00—Alloys based on copper
  • C22C9/10—Alloys based on copper with silicon as the next major constituent

Definitions

• Copper-zinc-silicon alloy its use and its manufacture
• the invention relates to a copper-zinc-silicon alloy and a use and production of such a copper-zinc-silicon alloy.
• the overriding requirement for copper-zinc-silicon alloys is that they be dezincification-resistant and machinable. A good machinability of such
• Brass alloys have hitherto been realized by the addition of lead, as described for example in EP 1 045 041 A1. Recently, however, lead-free brass alloys have been developed with good machining properties, as described for example in EP 1 038 981 A1 and DE 103 08 778 B3. Both the lead-free and lead-containing Cu-Zn-Si alloys tend to oxidize at temperatures between 300 0 C and 800 0 C and form a scale layer. This scale layer adheres only loosely to the metal, dissolves easily and spreads over the production facilities, with the result that they are contaminated disturbing. The cleaning of the production equipment is complex, whereby the production costs are high.
• a disadvantage of the previously known Cu-Zn-Si alloys is that the mechanical properties of the material change over long workpieces, since the material is not homogeneous.
• the present invention is therefore the
• the first object with respect to an alloy is achieved according to the invention by a copper-zinc-silicon alloy comprising in weight percent 70 to 80% copper, 1 to 5% silicon, 0.0001 to 0.5% boron, 0 to 0.2% Phosphorus and / or arsenic as well as the remainder of zinc and unavoidable impurities.
• the copper content is between 70 and 80%, because copper contents below 70% or above 80% would adversely affect the machinability of the alloy.
• the boron concentration in the alloy is between 0.0001 to 0.5%.
• the flow properties of the melt is increased and the susceptibility to stress corrosion cracking is reduced.
• the remaining essential alloying content is zinc.
• Zinc-silicon alloy is solved by a use for electrotechnical Components for sanitary engineering components, for containers for the transport or storage of liquids or gases, for components subject to torsion, for recyclable components, for drop forgings, for semi-finished products, for strips, for sheets, for profiles, for sheets or as kneading or rolling cast alloys.
• the Cu-Zn-Si alloy is used for contacts, pins or fasteners in electrical engineering, for example, as a stationary contacts or fixed contacts to which also clamps and connectors or plug contacts belong.
• the alloy has a high corrosion resistance to liquid and gaseous media. In addition, it is extremely resistant to dezincification and stress corrosion cracking. As a result, the alloy is particularly suitable for use in containers for the transport or storage of liquids or gases, in particular for containers in the
• Refrigeration technology or for pipes, water fittings, tap extensions, pipe connectors and valves in sanitary engineering Refrigeration technology or for pipes, water fittings, tap extensions, pipe connectors and valves in sanitary engineering.
• the low corrosion rates also ensure that the metal permeability, that is the property by the action of liquid or gaseous media
• alloy according to the invention is in the field of recyclable components.
• the insensitivity to stress corrosion cracking recommends the alloy for use in screwed or clamped connections in which large elastic energy sources are stored for technical reasons.
• the use of the alloy is particularly suitable for all tensile and / or torsional stressed components, in particular for screws and nuts. After cold forming, the material reaches high values for the yield strength. Thus, in screw, which must not deform plastically, larger tightening torques can be realized.
• the yield ratio of the Cu-Zn-Si alloy is smaller than that of automatic brass. Screw connections that are tightened only once and deliberately overstretched, thus achieve particularly high holding forces. Uses of Cu-Zn-Si alloy arise for both tubular and band-shaped starting materials. It is also well suited for milling or punching tapes, sheets and plates, especially for keys, engraving, for decorative purposes or for punched grid applications.
• the third object with regard to a production of such a copper-zinc-silicon alloy is achieved by conventional continuous casting and hot rolling between 600 to 760 0 C with subsequent forming, in particular cold rolling, preferably supplemented by further annealing and
• the object with regard to a production of such a copper-zinc-silicon alloy is also achieved by conventional continuous casting and extrusion at up to 76O 0 C, preferably between 650 and 680 0 C and cooling in air.
• this comprises 75 to 77% copper, 2.8 to 4% silicon and 0.001 to 0.1% boron and 0.03 to 0.1% phosphorus and / or arsenic, in addition to zinc as a residual element and unavoidable impurities.
• the copper-zinc-silicon alloy comprises at least one element in wt .-% from the group lead with 0.01 to 2.5%, tin with 0.01 to 2%, iron with 0.01 to 0.3%, cobalt at 0.01 to 0.3%, nickel at 0.01 to 0.3% and manganese at 0.01 to 0.3%.
• the alloy advantageously comprises at least one element in wt .-% from the group 0.01 to 0.1% lead, 0.01 to 0.2% tin, 0.01 to 0.1% iron, 0, 01 to 0.1% cobalt, 0.01 to 0.1% nickel and 0.01 to 0.1% manganese.
• the Cu-Zn-Si alloy additionally comprises at least one element in% by weight with up to 0.5% silver, up to 0.5%
• Aluminum, up to 0.5% magnesium, up to 0.5% antimony, up to 0.5% titanium and up to 0.5% zirconium preferably from the group from 0.01 to 0.1% silver, 0 , 01 to 0.1% aluminum, 0.01 to 0.1% magnesium, 0.01 to 0.1% antimony, 0.01 to 0.1% titanium and 0.01 to 0.1% zirconium.
• the Cu-Zn-Si alloy additionally comprises at least one element in wt .-% from the group of up to 0.3% cadmium, to
• 0.3% chromium, up to 0.3% selenium, up to 0.3% tellurium and up to 0.3% bismuth preferably from the group consisting of 0.01-0.3% cadmium, 0.01-0.3% Chromium, 0.01 - 0.3% selenium, 0.01 - 0.3% tellurium and 0.01 - 0.3% bismuth.
• 1 shows the formation of a scale layer after annealing for 2 h at 600 0 C on a CuZn21Si3P alloy without added boron (a), a CuZn21 Si3P alloy with 0.0004% boron (b) and a CuZn21Si3P alloy with
• Fig. 2 shows the formation of the cast structure of a CuZn21Si3P alloy without added boron (a), a CuZn21Si3P alloy with 0.0004% boron (b) and a CuZn21 Si3P alloy with 0.009% boron (c).
• the CuZn21Si3P alloys underlying the exemplary embodiment have concentration variations of the proportions, with copper between 75.8 and 76.1%, silicon between 3.2 and 3.4% and phosphorus between 0.07 and 0.1% together with zinc as remaining portion and inevitable impurities.
• Alloy examples show a different boron content of 0%, 0.004% and 0.009%.
• the alloys are produced by continuous casting, followed by extrusion at temperatures below 76O 0 C, preferably between 650 and 68O 0 C, and rapid cooling.
• Fig. 1a A highly scaled surface of a boron-free CuZn21Si3P alloy is shown in Fig. 1a.
• the surface of the sample appears in Fig. 1 a for the most part gray.
• This gray color reflects the scaled surface of the CuZn21Si3P alloy.
• the CuZn21Si3P alloy with a boron content of 0.0004% in Fig. 1b shows a much larger number of white-appearing spots on the surface of the alloy than the boron-free alloy. These white spots give metallic bright areas of the alloy.
• Boron concentrations of 0.0001 - 0.5% limit the formation of scale in Cu-Zn-Si alloys while significantly increasing the adhesion of the scale to the metal, thereby avoiding undesirable contamination of the production equipment.
• Alloys Boron also has a positive effect on the mechanical properties, since boron makes the alloy structure more homogeneous.
• This change in the alloy structure is shown in FIG. 2 as a function of the boron concentration. While a CuZn21Si3P alloy without the addition of boron shows a coarse, inhomogeneous structure (FIG. 2a), a CuZn21Si3P alloy with 0.0004% boron has a much more homogeneous microstructure, which is already very much shows uniform grain sizes (Fig. 2b).
• a further increase in the boron content to 0.009% causes a CuZn21Si3P alloy is even more uniform or the homogeneity has become even greater, the grain structure is no longer visible to the naked eye (Fig. 2c).
• CuZn21 Si3P alloy without addition of boron differs at the beginning compared to the end of the rod by more than 60 N / mm 2 .
• a corresponding alloy with a boron content of 0.0004% has only a difference in tensile strength of less than 40 N / mm 2 between the beginning and the end of the rod.
• the material thus has consistently identical mechanical properties. It is therefore achieved a uniform strength over the entire press length away. The reason for this is the grain-refining effect of the boron.
• the table summarizes the relationship between the boron content of a Cu-Zn-Si alloy and the increasing homogeneity of the alloy structure or the decreasing strength differences within a pressed workpiece.

Landscapes

• Chemical & Material Sciences (AREA)
• Engineering & Computer Science (AREA)
• Materials Engineering (AREA)
• Mechanical Engineering (AREA)
• Metallurgy (AREA)
• Organic Chemistry (AREA)
• Conductive Materials (AREA)
• Silicon Compounds (AREA)
• Cell Electrode Carriers And Collectors (AREA)

Priority Applications (9)

Applications Claiming Priority (2)

Related Child Applications (1)

Publications (1)

Family

ID=34969314

Family Applications (1)

Country Status (15)

Cited By (1)

Families Citing this family (32)

Citations (5)

Family Cites Families (12)

• 2005
  • 2005-05-13 KR KR1020077007251A patent/KR101010906B1/ko not_active Expired - Lifetime
  • 2005-05-13 CA CA2582972A patent/CA2582972C/en not_active Expired - Lifetime
  • 2005-05-13 BR BRPI0516067-7A patent/BRPI0516067B1/pt active IP Right Grant
  • 2005-05-13 DE DE502005009545T patent/DE502005009545D1/de not_active Expired - Lifetime
  • 2005-05-13 AT AT05747601T patent/ATE466965T1/de active
  • 2005-05-13 WO PCT/EP2005/005238 patent/WO2006039951A1/de not_active Ceased
  • 2005-05-13 PL PL05747601T patent/PL1812612T3/pl unknown
  • 2005-05-13 EP EP05747601A patent/EP1812612B1/de not_active Expired - Lifetime
  • 2005-05-13 PT PT05747601T patent/PT1812612E/pt unknown
  • 2005-05-13 ES ES05747601T patent/ES2343532T3/es not_active Expired - Lifetime
  • 2005-05-13 CN CNB2005800317665A patent/CN100510132C/zh not_active Expired - Lifetime
  • 2005-05-13 JP JP2007535030A patent/JP5148279B2/ja not_active Expired - Lifetime
  • 2005-05-27 MY MYPI20052420A patent/MY145376A/en unknown
  • 2005-05-30 TW TW094117687A patent/TWI369405B/zh not_active IP Right Cessation
  • 2005-10-11 US US11/247,544 patent/US20060078458A1/en not_active Abandoned
• 2009
  • 2009-06-03 US US12/477,612 patent/US20090280026A1/en not_active Abandoned

Patent Citations (5)

Non-Patent Citations (1)

Also Published As

Similar Documents

Legal Events