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WO2000079852A1 - Procede d'interconnexion de points predetermines de deux couches electroconductrices separees par un isolant laminaire, et plaque et circuit imprime obtenus - Google Patents

Procede d'interconnexion de points predetermines de deux couches electroconductrices separees par un isolant laminaire, et plaque et circuit imprime obtenus Download PDF

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Publication number
WO2000079852A1
WO2000079852A1 PCT/ES1999/000183 ES9900183W WO0079852A1 WO 2000079852 A1 WO2000079852 A1 WO 2000079852A1 ES 9900183 W ES9900183 W ES 9900183W WO 0079852 A1 WO0079852 A1 WO 0079852A1
Authority
WO
WIPO (PCT)
Prior art keywords
layers
pins
electroconductive
holes
electroconducting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/ES1999/000183
Other languages
English (en)
Spanish (es)
Inventor
José Antonio CUBERO PINTEL
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lear Automotive EEDS Spain SL
Original Assignee
Lear Automotive EEDS Spain SL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lear Automotive EEDS Spain SL filed Critical Lear Automotive EEDS Spain SL
Priority to PCT/ES1999/000183 priority Critical patent/WO2000079852A1/fr
Publication of WO2000079852A1 publication Critical patent/WO2000079852A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/526—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures the printed circuits being on the same board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/1081—Special cross-section of a lead; Different cross-sections of different leads; Matching cross-section, e.g. matched to a land
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Definitions

  • (1) composed of a laminar substrate (2), of dielectric material, coated on both sides by two layers (3a, 3b) electroconductors, electrically connected to each other through electroconducting pins (5), inserted in holes (4 ) made in said predetermined points of said element (1), being defined between holes (4) and spikes (5) separation spaces (4a), said spikes being
  • electroconductive material is an electroconductive adhesive (6a) locally deposited by means of deposition techniques such as screen printing, dispensing dosage, deposition by delivery rollers and the like.
  • electroconductive material is an electroconductive metal (6b), such as Cu, NI, Ag, Sn and its alloys, deposited by electrolytic techniques. 5.
  • electroconductive metal 6b
  • 6b electroconductive metal
  • Method according to claim 1 characterized by further comprising the step of: (f) performing a finishing treatment of the external surfaces of both layers (3a, 3b) electroconductors that includes a polishing.
  • step (d) further includes a chemical biting
  • the electroconductive material provided in step (e) is a conductive adhesive (6a) deposited locally by means of deposition techniques such as screen printing, dispensing dosing, deposition by delivery rollers and the like; and said finishing treatment of the external surfaces of both layers (3a, 3b) carried out in step (f) further includes curing said conductive adhesive.
  • the thickness of the layers (3a, 3b) is at least about 400 ⁇ m, suitable for power circuits.
  • the 14 electroconductive material provided in step (e) is a metal (6b), such as Cu, NI, Ag, Sn and its alloys, deposited electrolytically, and because the thickness of the electroconductive layers is less than necessary, being completed until desired final thickness by said electrolytic deposition of said metal, such as Cu, NI, Ag, Sn and its alloys, whose desired final thickness is at least about 400 ⁇ m, suitable for power circuits.
  • a metal such as Cu, NI, Ag, Sn and its alloys
  • step (c) said plastic deformation reduces the length of the pins (5) until it is equal to the thickness of the element (1), said ends (5b) being of the pins (5) flush to the respective outer faces of the layers (3a, 3b).
  • Electroconductive material (6a, 6b) is an electroconductive adhesive locally deposited by means of deposition techniques such as screen printing, dispensing dosing, delivery by delivery rollers and the like.
  • said electroconductive material (6a, 6b) is an electroconductive metal, such as Cu, NI, Ag, Sn and its alloys, deposited by electrolytic techniques, the final thickness of which is the layers
  • (3a, 3b) electroconductors at least about 400 ⁇ m, suitable for power circuits.
  • Double-sided printed circuit characterized in that it comprises a plurality of tracks configured from a plate to form a double-sided printed circuit according to claim 11, whose tracks are interconnected through said predetermined points.
  • the present invention concerns a method for interconnecting predetermined points of two electroconductive layers, separated by a sheet insulator of dielectric material, suitable for the manufacture of printed circuit boards (PCBs), especially with thicknesses of said electroconductive layers of 400 ⁇ m or higher, intended for power transmission applications.
  • the proposed method makes possible the connection of electroconductive tracks obtained from said conductive layers, of both opposite faces of the board or PCB, by means of electroconductive pins that allow the passage through currents of significant intensity, within The power transmission range.
  • the invention also concerns a plate, as an intermediate product for manufacturing printed circuits and printed circuits manufactured according to the proposed method.
  • the aforementioned double-sided PCBs with electroconductive layers of a thickness of 400 ⁇ m and greater find a substantial application in electrical distribution boxes for automobiles.
  • Said boxes such as the one described for example in patent GB-A-2 263 817 (MAI-92), of the current applicant, constitute a centralized electrical connection system in the vehicle, acting as a support for protective equipment, as well as for various other electrical components, such as relays, diodes, electronic control modules and connectors. It should be noted that all connections between the aforementioned components are made in the box by means of one or more PCBs, from which it is feasible to distribute / receive power and control signals to / from various parts of the vehicle.
  • the invention relates to an appropriate method for the manufacture of double-sided printed circuits, consisting of avoiding the solder joint stages of said electroconductive pins that communicate the conductive tracks of double-sided PCBs, typically known as short transverse pins, whose electrical and mechanical connection is currently made, conventionally, by inserting said pins by mechanical means into 2 holes / transverse holes, made in the PCB, to subsequently, by a wave welding process, and in continuous, establish corresponding welding points or surfaces between protruding ends of the pins and the conductive parts of the internal surface of the holes, in their openings corresponding to the tracks of the printed circuits to be connected.
  • thermomechanical stress occurs on the weld and, as a consequence of a large number of thermal cycles, fatigue that can translate in the formation of cracks.
  • the present invention is based on a radically different principle that avoids welding, providing the mechanical and electrical connection of said electroconductive pins, transverse to a double-sided PCB, by providing heat-free electroconductive material that fills at least some regions. of defined separation spaces between holes / holes and electroconductive pins, whose regions are comprised between portions of the pins and respective electroconductive adjacent areas of the mouths of said holes, corresponding to the electroconductive layers.
  • the method now recommended in the present invention significantly improves the results in terms of the damages and structural stresses that can be 4 produce on the printed circuit board, minimizing thermomechanical fatigue which will have a favorable impact on the working conditions in which said printed circuit must operate, in particular if it is used in electrical distribution boxes in motor vehicles.
  • the proposed method allows the union to be done only once, which provides advantages in terms of processing times
  • the application of the recommended procedure also allows 100% removal of lead alloys, since the components (tabs, sockets, etc.), as there is no risk of refusion, can be subsequently welded to the PCB with an alloy such as 96SN4Ag, which has a very favorable impact on the environmental conditions of the process.
  • the method according to this invention thus entails, in essence, the following phases: - a previous stage of anchoring and contact of the electroconductive pins with the drills, according to the technique itself known, referred to above, leaving free spaces between spike and hole, and the ends of said pins being protruding on both sides of the PCB;
  • the aforementioned pressing stage of the ends of the pins is preferred, since it provides an excellent mechanical and electrical connection of the pins, prior to the cold contribution of the electroconductive material, as well as an eventual flush of the ends of said pins which favors the operations of said contribution, although good results could also be obtained by inserting, for example, section spikes 5 polygonal transverse of relatively high number of faces, for example, between 6 and 12 faces, possibly with a length calibrated according to the thickness of the plate.
  • the mechanical and electrical connection that is achieved through the insertion and eventual pressing of the pins 5 is not sufficient for the actual operating conditions of the PCB, eg used in automotive electrical centralized junction boxes, which may involve vibrations. , thermal variations, etc., so that the aforementioned subsequent stage of consolidation of said connections is necessary by means of heat-free contribution of an electroconductive material.
  • the second procedure where the electroconductive material is an adhesive, allows variations in the order of the operations to be carried out, that is, from said dielectric sheet substrate, coated on both sides of conductive layers and:
  • the conductive copper layer of each of the faces of the substrate has a thickness less than the desired end, for example 400 ⁇ m, reaching this value after the electrolytic treatment operation which deposits a uniform copper layer on each of the aforementioned layers.
  • the problems of structural stresses that occurred in conventional welding have been totally avoided, as well as the spaces that remained between the lateral surface of the spike and the circular perimeter of the conductive layer that delimits 6 both ends of the hole / hole using a layer of Cu.
  • the proposed method comprises, in a preferred embodiment, the following steps, executed sequentially:
  • step (f) perform a finishing treatment of the external surfaces of both layers (3a, 3b) electroconductors that includes a polish.
  • said treatment preparatory of the external surfaces of both layers (3a, 3b) carried out in step (d) also includes a chemical biting; and said finishing treatment of the outer surfaces of both layers (3a, 3b) performed in step (f) further includes curing said conductive adhesive.
  • Fig. 1 is a perspective view of a portion of a starting element for the manufacture of a PCB printed circuit board
  • Fig. 2 is a perspective view, partially sectioned, of the portion of the element of Fig. 1 which holes have been made
  • Fig. 3 is a perspective view, partially sectioned, illustrating the insertion of a pin into one of the holes in Fig. 2
  • Figs. 4 to 10 are each a combination of a plan view of a portion of the element of Fig.
  • Fig. 4 illustrates the result of the application of the conventional prior art procedure
  • Figs. 5 to 7 illustrate the result of the application of a first embodiment variant of the process of the present invention
  • Figs. 8 to 10 illustrate the result of the application of a second variant embodiment of the process of the present invention.
  • an element consisting of a laminar substrate 2, of dielectric material, coated on both sides by two electroconductive layers 3a, 3b is generally indicated .
  • Said element 1 is the same as those conventionally used for the manufacture of printed circuit boards, in which tracks are obtained 8 electroconductors, of complex paths, by means of a chemical attack procedure of layers 3a, 3b of electroconductive material of both faces of the dielectric substrate 2.
  • connection In many applications, an interconnection of predetermined points of both layers 3a, 3b electroconductors through the insulating substrate 2 is required. In power transmission applications, as is the case to which the method of the present invention is primarily directed, said connection must be made by a conductive material that has a large sectional area so as not to offer an unwanted electrical resistance. to the passage of the current.
  • a plurality of transverse holes 4 are made at said predetermined points of said element 1. Simultaneously to the realization of said holes 4, holes 8 can be made for the Assembly of electronic components, although these can be practiced equally effectively after interconnection of the electroconductive layers 3a, 3b.
  • Fig. 3 which consists in the insertion into said holes 4 of electroconductive pins 5, by means of an insertion force I which guarantees a pressure adjustment thereof.
  • said pins 5 are of length greater than the thickness of the element 1 and of polygonal cross-section, in this case square, inscribable in a circle of diameter slightly greater than the diameter of said holes 4, so that said pins 5 are mechanically connected to pressure in the holes 4, with edges 5a of the pins 5 in contact with the inner wall of the hole 4. In this way, between the walls of the holes 4 and the flanks of the pins 5, separation spaces 4a are defined, while ends 5b of the pins 5 are slightly protruding on both sides of the element 1.
  • a square-shaped stem of 1.2 mm side is used, which implies a diagonal of 1.697 mm which ensures a provisional mechanical and electrical connection of the pin 5 with the layers 3a, 3b that must be subsequently consolidated, to guarantee a long service life of the PCB to be produced.
  • Fig. 4 illustrates the conventional method of the prior art, referred to, which consists in the welding of the ends 5b protruding to the layer 3a of one side of the element 1 in a first step of providing material of welding 9a and that of the ends 5b to the layer 3b on the opposite side in a second stage, with the contribution of a welding material 9b, with the drawbacks set forth above.
  • said electrical connection of layers 3a, 3b through the pins 5 is made by providing, without heat, an electroconductive material that fills at least regions of said separation spaces 4a comprised between portions of the pins 5 and respective adjacent electroconductive areas of the walls of said holes 4, corresponding to layers 3a, 3b. Said contribution without heat is carried out, according to the invention, according to two alternative techniques.
  • a first alternative is exemplified in which the material supplied without heat is an electroconductive adhesive 6a, deposited in a localized manner by means of techniques such as screen printing, dispensing by dispensing, deposition by delivery rollers, etc.
  • the electroconductive layers 3a, 3b, separated by the substrate 2 are of a thickness hl suitable for power transmission applications, whose thickness hl is preferably 400 ⁇ m or more.
  • a pin 5 of square profile cross section is inserted into a hole 4 of said element 1, as explained above.
  • a pressure P is applied on the ends 5b of the pin 5 protruding on both sides of the element 1.
  • the pin 5 is deformed decreasing in length while increasing in thickness, whereby, the edges 5a of the pin are pressed even more against the walls of the hole 4, so that the separation spaces 4a decrease in size.
  • the ends 5b of the pins 5 are flush with the outer surfaces of the electroconductive layers 3a, 3b in order to facilitate subsequent operations. 10
  • the localized application of said electroconductive adhesive 6a (Fig. 7) is carried out so that it fills at least those portions of the separation spaces 4a between the ends 5b of the pins 5 and the conductive part of the orifice openings 4 corresponding to layers 3a, 3b electroconductors.
  • the application of said conductive adhesive implies, at least, a previous biting operation and a subsequent curing operation.
  • a further stage of cleaning layers 3a, 3b should be provided depending on the method of application of said adhesive, for example deposited by rollers.
  • a second alternative is exemplified in which the material provided without heat is a metal, such as Cu, NI, Ag, Sn and its alloys, or other, deposited by electrolytic techniques.
  • the contribution metal 6b covers the entire surface of the layers 3a, 3b as well as the ends 5b of the pin 5 and those portions of the separation spaces 4a between the ends 5b of the pins 5 and the conductive part of the openings of the hole 4 corresponding to the electroconductive layers 3a, 3b, forming coatings of thickness h3.
  • Said thickness h3 complements the initial thickness h2 of layers 3a, 3b until they are provided with a final thickness h4 suitable for the aforementioned power transmission applications.
  • Said final thickness h4 desired is approximately 400 ⁇ m or more.
  • the input metal 6b is the same as the layers 3a, 3b, or has a great affinity with it for physical and chemical characteristics, in order to eliminate stresses due to, for example, different coefficients of thermal expansion.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

L'invention concerne un procédé d'interconnexion de points prédéterminés de deux couches électroconductrices séparées par un isolant laminaire, et la plaque et le circuit imprimé obtenus, à partir d'un élément (1) composé d'un substrat (2) diélectrique, revêtu sur ses deux faces de couches (3a, 3b) électroconductrices connectées électriquement par des fiches de contact (5) conductrices et insérées dans des orifices (4) situés dans les points prédéterminés de l'élément (1). Un espace de séparation (4a) est laissé entre l'orifice (4) et la fiche de contact (5). Ces fiches de contact (5) sont unies mécaniquement et électriquement aux couches (3a, 3b) électroconductrices, la connexion électrique des couches (3a, 3b) s'effectuant à travers les fiches de contact (5) par l'application, sans chaleur, d'une matière électroconductrice remplissant au moins certaines zones desdits espaces de séparation (4a), comprises entre certaines parties des fiches de contact (5) et certaines parties des zones électroconductrices adjacentes des parois desdits orifices (4), correspondant aux couches (3a, 3b).
PCT/ES1999/000183 1999-06-21 1999-06-21 Procede d'interconnexion de points predetermines de deux couches electroconductrices separees par un isolant laminaire, et plaque et circuit imprime obtenus Ceased WO2000079852A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/ES1999/000183 WO2000079852A1 (fr) 1999-06-21 1999-06-21 Procede d'interconnexion de points predetermines de deux couches electroconductrices separees par un isolant laminaire, et plaque et circuit imprime obtenus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/ES1999/000183 WO2000079852A1 (fr) 1999-06-21 1999-06-21 Procede d'interconnexion de points predetermines de deux couches electroconductrices separees par un isolant laminaire, et plaque et circuit imprime obtenus

Publications (1)

Publication Number Publication Date
WO2000079852A1 true WO2000079852A1 (fr) 2000-12-28

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PCT/ES1999/000183 Ceased WO2000079852A1 (fr) 1999-06-21 1999-06-21 Procede d'interconnexion de points predetermines de deux couches electroconductrices separees par un isolant laminaire, et plaque et circuit imprime obtenus

Country Status (1)

Country Link
WO (1) WO2000079852A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2179780A1 (es) * 2001-06-04 2003-01-16 Lear Automotive Eeds Spain Metodo de soldadura por ultrasonidos de espigas de conexion entre dos capas electroconductoras separadas por un aislante laminar, y elemento de placa y circuito impreso obtenidos.

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1318654A (fr) * 1961-12-19 1963-02-22 Normacem Soc Procédé de fabrication de circuits électriques et circuits obtenus par ce procéde
DE1875150U (de) * 1961-12-22 1963-07-11 Kurt Niebling Thermoplastische Gedruckte elektrische schaltung.
US3912852A (en) * 1974-05-31 1975-10-14 Westinghouse Electric Corp Thin-film electrical circuit lead connection arrangement
US4562301A (en) * 1983-02-08 1985-12-31 Nippon Mektron Ltd. Through-hole pin for laminated circuit substrates and method of insertion thereof
JPH08288612A (ja) * 1995-04-14 1996-11-01 Nec Corp 電子回路装置及び電子部品実装方法
US5574629A (en) * 1989-06-09 1996-11-12 Sullivan; Kenneth W. Solderless printed wiring devices

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1318654A (fr) * 1961-12-19 1963-02-22 Normacem Soc Procédé de fabrication de circuits électriques et circuits obtenus par ce procéde
DE1875150U (de) * 1961-12-22 1963-07-11 Kurt Niebling Thermoplastische Gedruckte elektrische schaltung.
US3912852A (en) * 1974-05-31 1975-10-14 Westinghouse Electric Corp Thin-film electrical circuit lead connection arrangement
US4562301A (en) * 1983-02-08 1985-12-31 Nippon Mektron Ltd. Through-hole pin for laminated circuit substrates and method of insertion thereof
US5574629A (en) * 1989-06-09 1996-11-12 Sullivan; Kenneth W. Solderless printed wiring devices
JPH08288612A (ja) * 1995-04-14 1996-11-01 Nec Corp 電子回路装置及び電子部品実装方法

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
P. S. LENNON ET AL.: "Re-establishing interconnections in multilayer printed-circuit structures", IBM TECHNICAL DISCLOSURE BULLETIN., vol. 21, no. 3, August 1978 (1978-08-01), IBM CORP. NEW YORK., US, pages 980 - 981, XP002128319, ISSN: 0018-8689 *
PATENT ABSTRACTS OF JAPAN vol. 1997, no. 3 31 March 1997 (1997-03-31) *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2179780A1 (es) * 2001-06-04 2003-01-16 Lear Automotive Eeds Spain Metodo de soldadura por ultrasonidos de espigas de conexion entre dos capas electroconductoras separadas por un aislante laminar, y elemento de placa y circuito impreso obtenidos.
ES2179780B1 (es) * 2001-06-04 2004-10-16 Lear Automotive (Eeds) Spain, S.L. Metodo de soldadura por ultrasonidos de espigas de conexion entre dos capas electroconductoras separadas por un aislante laminar, y elemento de placa y circuito impreso obtenidos.

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