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WO2000079852A1 - Process for interconnecting predetermined points of two electroconducting layers which are separated by a laminar insulating material, and printed circuit board obtained - Google Patents

Process for interconnecting predetermined points of two electroconducting layers which are separated by a laminar insulating material, and printed circuit board obtained Download PDF

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Publication number
WO2000079852A1
WO2000079852A1 PCT/ES1999/000183 ES9900183W WO0079852A1 WO 2000079852 A1 WO2000079852 A1 WO 2000079852A1 ES 9900183 W ES9900183 W ES 9900183W WO 0079852 A1 WO0079852 A1 WO 0079852A1
Authority
WO
WIPO (PCT)
Prior art keywords
layers
pins
electroconductive
holes
electroconducting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/ES1999/000183
Other languages
Spanish (es)
French (fr)
Inventor
José Antonio CUBERO PINTEL
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lear Automotive EEDS Spain SL
Original Assignee
Lear Automotive EEDS Spain SL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lear Automotive EEDS Spain SL filed Critical Lear Automotive EEDS Spain SL
Priority to PCT/ES1999/000183 priority Critical patent/WO2000079852A1/en
Publication of WO2000079852A1 publication Critical patent/WO2000079852A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/526—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures the printed circuits being on the same board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/1081—Special cross-section of a lead; Different cross-sections of different leads; Matching cross-section, e.g. matched to a land
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Definitions

  • (1) composed of a laminar substrate (2), of dielectric material, coated on both sides by two layers (3a, 3b) electroconductors, electrically connected to each other through electroconducting pins (5), inserted in holes (4 ) made in said predetermined points of said element (1), being defined between holes (4) and spikes (5) separation spaces (4a), said spikes being
  • electroconductive material is an electroconductive adhesive (6a) locally deposited by means of deposition techniques such as screen printing, dispensing dosage, deposition by delivery rollers and the like.
  • electroconductive material is an electroconductive metal (6b), such as Cu, NI, Ag, Sn and its alloys, deposited by electrolytic techniques. 5.
  • electroconductive metal 6b
  • 6b electroconductive metal
  • Method according to claim 1 characterized by further comprising the step of: (f) performing a finishing treatment of the external surfaces of both layers (3a, 3b) electroconductors that includes a polishing.
  • step (d) further includes a chemical biting
  • the electroconductive material provided in step (e) is a conductive adhesive (6a) deposited locally by means of deposition techniques such as screen printing, dispensing dosing, deposition by delivery rollers and the like; and said finishing treatment of the external surfaces of both layers (3a, 3b) carried out in step (f) further includes curing said conductive adhesive.
  • the thickness of the layers (3a, 3b) is at least about 400 ⁇ m, suitable for power circuits.
  • the 14 electroconductive material provided in step (e) is a metal (6b), such as Cu, NI, Ag, Sn and its alloys, deposited electrolytically, and because the thickness of the electroconductive layers is less than necessary, being completed until desired final thickness by said electrolytic deposition of said metal, such as Cu, NI, Ag, Sn and its alloys, whose desired final thickness is at least about 400 ⁇ m, suitable for power circuits.
  • a metal such as Cu, NI, Ag, Sn and its alloys
  • step (c) said plastic deformation reduces the length of the pins (5) until it is equal to the thickness of the element (1), said ends (5b) being of the pins (5) flush to the respective outer faces of the layers (3a, 3b).
  • Electroconductive material (6a, 6b) is an electroconductive adhesive locally deposited by means of deposition techniques such as screen printing, dispensing dosing, delivery by delivery rollers and the like.
  • said electroconductive material (6a, 6b) is an electroconductive metal, such as Cu, NI, Ag, Sn and its alloys, deposited by electrolytic techniques, the final thickness of which is the layers
  • (3a, 3b) electroconductors at least about 400 ⁇ m, suitable for power circuits.
  • Double-sided printed circuit characterized in that it comprises a plurality of tracks configured from a plate to form a double-sided printed circuit according to claim 11, whose tracks are interconnected through said predetermined points.
  • the present invention concerns a method for interconnecting predetermined points of two electroconductive layers, separated by a sheet insulator of dielectric material, suitable for the manufacture of printed circuit boards (PCBs), especially with thicknesses of said electroconductive layers of 400 ⁇ m or higher, intended for power transmission applications.
  • the proposed method makes possible the connection of electroconductive tracks obtained from said conductive layers, of both opposite faces of the board or PCB, by means of electroconductive pins that allow the passage through currents of significant intensity, within The power transmission range.
  • the invention also concerns a plate, as an intermediate product for manufacturing printed circuits and printed circuits manufactured according to the proposed method.
  • the aforementioned double-sided PCBs with electroconductive layers of a thickness of 400 ⁇ m and greater find a substantial application in electrical distribution boxes for automobiles.
  • Said boxes such as the one described for example in patent GB-A-2 263 817 (MAI-92), of the current applicant, constitute a centralized electrical connection system in the vehicle, acting as a support for protective equipment, as well as for various other electrical components, such as relays, diodes, electronic control modules and connectors. It should be noted that all connections between the aforementioned components are made in the box by means of one or more PCBs, from which it is feasible to distribute / receive power and control signals to / from various parts of the vehicle.
  • the invention relates to an appropriate method for the manufacture of double-sided printed circuits, consisting of avoiding the solder joint stages of said electroconductive pins that communicate the conductive tracks of double-sided PCBs, typically known as short transverse pins, whose electrical and mechanical connection is currently made, conventionally, by inserting said pins by mechanical means into 2 holes / transverse holes, made in the PCB, to subsequently, by a wave welding process, and in continuous, establish corresponding welding points or surfaces between protruding ends of the pins and the conductive parts of the internal surface of the holes, in their openings corresponding to the tracks of the printed circuits to be connected.
  • thermomechanical stress occurs on the weld and, as a consequence of a large number of thermal cycles, fatigue that can translate in the formation of cracks.
  • the present invention is based on a radically different principle that avoids welding, providing the mechanical and electrical connection of said electroconductive pins, transverse to a double-sided PCB, by providing heat-free electroconductive material that fills at least some regions. of defined separation spaces between holes / holes and electroconductive pins, whose regions are comprised between portions of the pins and respective electroconductive adjacent areas of the mouths of said holes, corresponding to the electroconductive layers.
  • the method now recommended in the present invention significantly improves the results in terms of the damages and structural stresses that can be 4 produce on the printed circuit board, minimizing thermomechanical fatigue which will have a favorable impact on the working conditions in which said printed circuit must operate, in particular if it is used in electrical distribution boxes in motor vehicles.
  • the proposed method allows the union to be done only once, which provides advantages in terms of processing times
  • the application of the recommended procedure also allows 100% removal of lead alloys, since the components (tabs, sockets, etc.), as there is no risk of refusion, can be subsequently welded to the PCB with an alloy such as 96SN4Ag, which has a very favorable impact on the environmental conditions of the process.
  • the method according to this invention thus entails, in essence, the following phases: - a previous stage of anchoring and contact of the electroconductive pins with the drills, according to the technique itself known, referred to above, leaving free spaces between spike and hole, and the ends of said pins being protruding on both sides of the PCB;
  • the aforementioned pressing stage of the ends of the pins is preferred, since it provides an excellent mechanical and electrical connection of the pins, prior to the cold contribution of the electroconductive material, as well as an eventual flush of the ends of said pins which favors the operations of said contribution, although good results could also be obtained by inserting, for example, section spikes 5 polygonal transverse of relatively high number of faces, for example, between 6 and 12 faces, possibly with a length calibrated according to the thickness of the plate.
  • the mechanical and electrical connection that is achieved through the insertion and eventual pressing of the pins 5 is not sufficient for the actual operating conditions of the PCB, eg used in automotive electrical centralized junction boxes, which may involve vibrations. , thermal variations, etc., so that the aforementioned subsequent stage of consolidation of said connections is necessary by means of heat-free contribution of an electroconductive material.
  • the second procedure where the electroconductive material is an adhesive, allows variations in the order of the operations to be carried out, that is, from said dielectric sheet substrate, coated on both sides of conductive layers and:
  • the conductive copper layer of each of the faces of the substrate has a thickness less than the desired end, for example 400 ⁇ m, reaching this value after the electrolytic treatment operation which deposits a uniform copper layer on each of the aforementioned layers.
  • the problems of structural stresses that occurred in conventional welding have been totally avoided, as well as the spaces that remained between the lateral surface of the spike and the circular perimeter of the conductive layer that delimits 6 both ends of the hole / hole using a layer of Cu.
  • the proposed method comprises, in a preferred embodiment, the following steps, executed sequentially:
  • step (f) perform a finishing treatment of the external surfaces of both layers (3a, 3b) electroconductors that includes a polish.
  • said treatment preparatory of the external surfaces of both layers (3a, 3b) carried out in step (d) also includes a chemical biting; and said finishing treatment of the outer surfaces of both layers (3a, 3b) performed in step (f) further includes curing said conductive adhesive.
  • Fig. 1 is a perspective view of a portion of a starting element for the manufacture of a PCB printed circuit board
  • Fig. 2 is a perspective view, partially sectioned, of the portion of the element of Fig. 1 which holes have been made
  • Fig. 3 is a perspective view, partially sectioned, illustrating the insertion of a pin into one of the holes in Fig. 2
  • Figs. 4 to 10 are each a combination of a plan view of a portion of the element of Fig.
  • Fig. 4 illustrates the result of the application of the conventional prior art procedure
  • Figs. 5 to 7 illustrate the result of the application of a first embodiment variant of the process of the present invention
  • Figs. 8 to 10 illustrate the result of the application of a second variant embodiment of the process of the present invention.
  • an element consisting of a laminar substrate 2, of dielectric material, coated on both sides by two electroconductive layers 3a, 3b is generally indicated .
  • Said element 1 is the same as those conventionally used for the manufacture of printed circuit boards, in which tracks are obtained 8 electroconductors, of complex paths, by means of a chemical attack procedure of layers 3a, 3b of electroconductive material of both faces of the dielectric substrate 2.
  • connection In many applications, an interconnection of predetermined points of both layers 3a, 3b electroconductors through the insulating substrate 2 is required. In power transmission applications, as is the case to which the method of the present invention is primarily directed, said connection must be made by a conductive material that has a large sectional area so as not to offer an unwanted electrical resistance. to the passage of the current.
  • a plurality of transverse holes 4 are made at said predetermined points of said element 1. Simultaneously to the realization of said holes 4, holes 8 can be made for the Assembly of electronic components, although these can be practiced equally effectively after interconnection of the electroconductive layers 3a, 3b.
  • Fig. 3 which consists in the insertion into said holes 4 of electroconductive pins 5, by means of an insertion force I which guarantees a pressure adjustment thereof.
  • said pins 5 are of length greater than the thickness of the element 1 and of polygonal cross-section, in this case square, inscribable in a circle of diameter slightly greater than the diameter of said holes 4, so that said pins 5 are mechanically connected to pressure in the holes 4, with edges 5a of the pins 5 in contact with the inner wall of the hole 4. In this way, between the walls of the holes 4 and the flanks of the pins 5, separation spaces 4a are defined, while ends 5b of the pins 5 are slightly protruding on both sides of the element 1.
  • a square-shaped stem of 1.2 mm side is used, which implies a diagonal of 1.697 mm which ensures a provisional mechanical and electrical connection of the pin 5 with the layers 3a, 3b that must be subsequently consolidated, to guarantee a long service life of the PCB to be produced.
  • Fig. 4 illustrates the conventional method of the prior art, referred to, which consists in the welding of the ends 5b protruding to the layer 3a of one side of the element 1 in a first step of providing material of welding 9a and that of the ends 5b to the layer 3b on the opposite side in a second stage, with the contribution of a welding material 9b, with the drawbacks set forth above.
  • said electrical connection of layers 3a, 3b through the pins 5 is made by providing, without heat, an electroconductive material that fills at least regions of said separation spaces 4a comprised between portions of the pins 5 and respective adjacent electroconductive areas of the walls of said holes 4, corresponding to layers 3a, 3b. Said contribution without heat is carried out, according to the invention, according to two alternative techniques.
  • a first alternative is exemplified in which the material supplied without heat is an electroconductive adhesive 6a, deposited in a localized manner by means of techniques such as screen printing, dispensing by dispensing, deposition by delivery rollers, etc.
  • the electroconductive layers 3a, 3b, separated by the substrate 2 are of a thickness hl suitable for power transmission applications, whose thickness hl is preferably 400 ⁇ m or more.
  • a pin 5 of square profile cross section is inserted into a hole 4 of said element 1, as explained above.
  • a pressure P is applied on the ends 5b of the pin 5 protruding on both sides of the element 1.
  • the pin 5 is deformed decreasing in length while increasing in thickness, whereby, the edges 5a of the pin are pressed even more against the walls of the hole 4, so that the separation spaces 4a decrease in size.
  • the ends 5b of the pins 5 are flush with the outer surfaces of the electroconductive layers 3a, 3b in order to facilitate subsequent operations. 10
  • the localized application of said electroconductive adhesive 6a (Fig. 7) is carried out so that it fills at least those portions of the separation spaces 4a between the ends 5b of the pins 5 and the conductive part of the orifice openings 4 corresponding to layers 3a, 3b electroconductors.
  • the application of said conductive adhesive implies, at least, a previous biting operation and a subsequent curing operation.
  • a further stage of cleaning layers 3a, 3b should be provided depending on the method of application of said adhesive, for example deposited by rollers.
  • a second alternative is exemplified in which the material provided without heat is a metal, such as Cu, NI, Ag, Sn and its alloys, or other, deposited by electrolytic techniques.
  • the contribution metal 6b covers the entire surface of the layers 3a, 3b as well as the ends 5b of the pin 5 and those portions of the separation spaces 4a between the ends 5b of the pins 5 and the conductive part of the openings of the hole 4 corresponding to the electroconductive layers 3a, 3b, forming coatings of thickness h3.
  • Said thickness h3 complements the initial thickness h2 of layers 3a, 3b until they are provided with a final thickness h4 suitable for the aforementioned power transmission applications.
  • Said final thickness h4 desired is approximately 400 ⁇ m or more.
  • the input metal 6b is the same as the layers 3a, 3b, or has a great affinity with it for physical and chemical characteristics, in order to eliminate stresses due to, for example, different coefficients of thermal expansion.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

Process for interconnecting predetermined points of two electroconducting layers which are separated by a laminar insulating material, and printed circuit board obtained, comprising the use of an element (1) consisting of a dielectric substrate (2) quoted on each side by two electroconducting layers (3a, 3b) which are electrically connected by conducting pins (5) which are inserted into holes (4) made at said predetermined point of the element (1); a separation space (4a) is provided between the hole (4) and the pin (5). The pins (5) are mechanically and electrically joined to said electroconducting layers (3a, 3b), the electric connection to the layers (3a, 3b) being obtained through the pins (5) by bringing, without heat, and electroconductor material which fills at least some regions of said separation spaces (4a) comprised between some portions of the pins (5) and respective adjacent electroconducting areas of the walls of said holes (4) which correspond to the layers (3a, 3b).

Description

REIVINDICACIONES

1.- Método de interconexión de puntos predeterminados de dos capas electroconductoras separadas por un aislante laminar en donde se parte de un elemento1.- Method of interconnection of predetermined points of two electroconductive layers separated by a sheet insulator where part of an element

(1) compuesto de un substrato (2) laminar, de material dieléctrico, revestido por ambas caras por sendas capas (3a, 3b) electroconductoras, conectadas eléctricamente entre sí a través de unas espigas (5) electroconductoras, insertadas en unos orificios (4) practicados en dichos puntos predeterminados de dicho elemento (1), quedando definidos entre orificios (4) y espigas (5) unos espacios de separación (4a), estando dichas espigas(1) composed of a laminar substrate (2), of dielectric material, coated on both sides by two layers (3a, 3b) electroconductors, electrically connected to each other through electroconducting pins (5), inserted in holes (4 ) made in said predetermined points of said element (1), being defined between holes (4) and spikes (5) separation spaces (4a), said spikes being

(5) unidas mecánica y eléctricamente a dichas capas (3a, 3b) electroconductoras, caracterizado porque la citada conexión eléctrica de las capas (3a, 3b) a través de las espigas (5) se realiza por aportación sin calor de un material electroconductor que llena al menos unas regiones de dichos espacios de separación (4a) comprendidas entre unas porciones de las espigas (5) y unas respectivas zonas adyacentes electroconductoras de las paredes de dichos orificios (4), correspondientes a las capas (3a, 3b). 2.- Método, según la reivindicación 1, caracterizado porque las espigas (5) electroconductoras son de sección transversal poligonal inscribible en un círculo de diámetro ligeramente superior al diámetro de dichos orificios (4).(5) mechanically and electrically connected to said electroconductive layers (3a, 3b), characterized in that said electrical connection of the layers (3a, 3b) through the pins (5) is carried out by heat-free contribution of an electroconductive material that it fills at least some regions of said separation spaces (4a) comprised between portions of the pins (5) and respective adjacent electroconductive areas of the walls of said holes (4), corresponding to the layers (3a, 3b). 2. Method according to claim 1, characterized in that the electroconducting pins (5) are of polygonal cross-section inscribable in a circle of diameter slightly larger than the diameter of said holes (4).

3.- Método, según la reivindicación 1 ó 2, caracterizado porque dicho material electroconductor es un adhesivo electroconductor (6a) localmente depositado mediante técnicas de deposición tales como serigrafía, dosificación por dispensación, deposición por rodillos repartidores y similares.3. Method according to claim 1 or 2, characterized in that said electroconductive material is an electroconductive adhesive (6a) locally deposited by means of deposition techniques such as screen printing, dispensing dosage, deposition by delivery rollers and the like.

4.- Método, según la reivindicación 1 ó 2, caracterizado porque dicho material electroconductor es un metal electroconductor (6b), tal como Cu, NI, Ag, Sn y sus aleaciones, depositado mediante técnicas electrolíticas. 5.- Método, según la reivindicación 1, caracterizado por comprender secuencialmente los pasos de:4. Method according to claim 1 or 2, characterized in that said electroconductive material is an electroconductive metal (6b), such as Cu, NI, Ag, Sn and its alloys, deposited by electrolytic techniques. 5. Method according to claim 1, characterized by sequentially understanding the steps of:

(a) realizar dichos orificios (4) transversales pasantes, cilindricos, en unos puntos predeterminados del elemento (1), afectando dicho substrato (2) y las capas (3a, 3b); (b) insertar en cada orificio (4) una de las espigas (5), de longitud superior al grosor del elemento (1), de sección transversal poligonal inscribible en un círculo de diámetro ligeramente superior al diámetro de dichos orificios (4), de manera que dichas espigas (5) queden conectadas mecánicamente a presión 13 en los orificios (4), con unas aristas (5a) de las espigas (5) en contacto con la pared interior del orificio (4), definiendo entre ambos dichos espacios de separación (4a) y con unos extremos (5b) de las espigas (5) sobresaliendo ligeramente por ambos lados del elemento (1); (c) prensar los extremos (5b) de las espigas (5) que sobresalen por ambos lados del elemento (1), de manera que se produzca una deformación plástica de las espigas (5) reduciendo su longitud y aumentando el área de su sección transversal, causando un aplastamiento de las aristas (5a) contra las paredes de los orificios (4) que proporciona una mayor conexión mecánica, un mejor contacto eléctrico de las espigas (5) con cada una de las capas (3a, 3b) y una reducción de los espacios de separación (4a); (d) realizar un tratamiento preparatorio de las superficies externas de ambas capas (3a, 3b) que incluye al menos un pulido para eliminar rebabas en los extremos de las espigas (5); y (e) aportar dicho material electroconductor a los espacios de separación (4a), de manera que se incremente el grado de contacto eléctrico entre las espigas (5) y las respectivas capas (3a, 3b). 6.- Método, según la reivindicación 1, caracterizado por comprender además el paso de: (f) realizar un tratamiento de acabado de las superficies externas de ambas capas (3a, 3b) electroconductoras que incluye un pulido. 7.- Método, de acuerdo con la Reivindicación 6, caracterizado porque: dicho tratamiento preparatorio de las superficies externas de ambas capas (3a, 3b) realizado en el paso (d) incluye además un mordentado químico; el material electroconductor aportado en el paso (e) es un adhesivo conductor (6a) depositado localmente mediante técnicas de deposición tales como serigrafía, dosificación por dispensación, deposición por rodillos repartidores y similares; y dicho tratamiento de acabado de las superficies externas de ambas capas (3a, 3b) realizado en el paso (f) incluye además un curado de dicho adhesivo conductor. 8.- Método, de acuerdo con la Reivindicación 7, caracterizado porque el grosor de las capas (3a, 3b) es al menos de aproximadamente 400 μm, apto para circuitos de potencia.(a) making said through (cylindrical) transverse holes (4) at predetermined points of the element (1), affecting said substrate (2) and the layers (3a, 3b); (b) insert into each hole (4) one of the pins (5), of length greater than the thickness of the element (1), of polygonal cross-section inscribable in a circle of diameter slightly larger than the diameter of said holes (4), so that said pins (5) are mechanically connected under pressure 13 in the holes (4), with edges (5a) of the pins (5) in contact with the inner wall of the hole (4), defining between said said separation spaces (4a) and with ends (5b) of the pins (5) protruding slightly on both sides of the element (1); (c) press the ends (5b) of the pins (5) that protrude on both sides of the element (1), so that there is a plastic deformation of the pins (5) reducing their length and increasing the area of their section transverse, causing a crushing of the edges (5a) against the walls of the holes (4) that provides a greater mechanical connection, a better electrical contact of the pins (5) with each of the layers (3a, 3b) and a reduction of separation spaces (4a); (d) perform a preparatory treatment of the external surfaces of both layers (3a, 3b) that includes at least one polishing to remove burrs at the ends of the pins (5); and (e) providing said electroconductive material to the separation spaces (4a), so as to increase the degree of electrical contact between the pins (5) and the respective layers (3a, 3b). 6. Method according to claim 1, characterized by further comprising the step of: (f) performing a finishing treatment of the external surfaces of both layers (3a, 3b) electroconductors that includes a polishing. 7. Method according to Claim 6, characterized in that: said preparatory treatment of the external surfaces of both layers (3a, 3b) carried out in step (d) further includes a chemical biting; The electroconductive material provided in step (e) is a conductive adhesive (6a) deposited locally by means of deposition techniques such as screen printing, dispensing dosing, deposition by delivery rollers and the like; and said finishing treatment of the external surfaces of both layers (3a, 3b) carried out in step (f) further includes curing said conductive adhesive. 8. Method according to Claim 7, characterized in that the thickness of the layers (3a, 3b) is at least about 400 μm, suitable for power circuits.

9.- Método, de acuerdo con la Reivindicación 5 ó 6, caracterizado porque el 14 material electroconductor aportado en el paso (e) es un metal (6b), tal como Cu, NI, Ag, Sn y sus aleaciones, depositado electrolíticamente, y porque el grosor de las capas electroconductoras es menor del necesario, siendo completado hasta el grosor final deseado mediante dicha deposición electrolítica de dicho metal, tal como Cu, NI, Ag, Sn y sus aleaciones, cuyo grosor final deseado es al menos de aproximadamente 400 μm, apto para circuitos de potencia.9. Method according to Claim 5 or 6, characterized in that the 14 electroconductive material provided in step (e) is a metal (6b), such as Cu, NI, Ag, Sn and its alloys, deposited electrolytically, and because the thickness of the electroconductive layers is less than necessary, being completed until desired final thickness by said electrolytic deposition of said metal, such as Cu, NI, Ag, Sn and its alloys, whose desired final thickness is at least about 400 μm, suitable for power circuits.

10.- Método, de acuerdo con la Reivindicación 5, caracterizado porque en el paso (c), dicha deformación plástica reduce la longitud de las espigas (5) hasta igualarla al grosor del elemento (1), quedando dichos extremos (5b) de las espigas (5) enrasados a las respectivas caras externas de las capas (3a, 3b).10. Method according to Claim 5, characterized in that in step (c), said plastic deformation reduces the length of the pins (5) until it is equal to the thickness of the element (1), said ends (5b) being of the pins (5) flush to the respective outer faces of the layers (3a, 3b).

11.- Placa para formar un circuito impreso de doble cara, cuya placa comprende un elemento (1) compuesto de un substrato (2) laminar, de material dieléctrico, revestido por ambas caras por sendas capas (3a, 3b) electroconductoras, caracterizada porque dichas capas (3a, 3b) están conectadas eléctricamente entre sí a través de unas espigas (5) electroconductoras, insertadas mediante ajuste a presión en unos orificios (4) practicados en unos puntos de dicho elemento (1) predeterminados en función de un circuito a grabar con posterioridad, quedando definidos entre orificios (4) y espigas (5) unos espacios de separación (4a), estando dichas espigas (5) unidas mecánica y eléctricamente a dichas capas (3a, 3b) electroconductoras mediante un material electroconductor (6a, 6b), aportado sin calor, que llena al menos unas regiones de dichos espacios de separación (4a) comprendidas entre unas porciones de las espigas (5) y unas respectivas zonas adyacentes electroconductoras de las paredes de dichos orificios (4), correspondientes a las capas (3a, 3b).11.- Plate to form a double-sided printed circuit, whose plate comprises an element (1) composed of a sheet substrate (2), of dielectric material, coated on both sides by two electroconductive layers (3a, 3b), characterized in that said layers (3a, 3b) are electrically connected to each other by means of electroconductive pins (5), inserted by means of pressure adjustment in holes (4) made in predetermined points of said element (1) in function of a circuit a record later, being defined between holes (4) and pins (5) separation spaces (4a), said pins (5) being mechanically and electrically connected to said electroconductive layers (3a, 3b) by means of an electroconductive material (6a, 6b), provided without heat, which fills at least some regions of said separation spaces (4a) comprised between portions of the pins (5) and respective electroconductive adjacent areas of the pair Edes of said holes (4), corresponding to the layers (3a, 3b).

12.- Placa, según la reivindicación 11, caracterizada porque las espigas (5) electroconductoras son de sección transversal poligonal inscribible en un círculo de diámetro ligeramente superior al diámetro de dichos orificios (4). • 12. Plate according to claim 11, characterized in that the electroconducting pins (5) are of polygonal cross-section inscribable in a circle of diameter slightly larger than the diameter of said holes (4). •

13.- Placa, según la reivindicación 11 ó 12, caracterizada porque dicho material electroconductor (6a, 6b) es un adhesivo electroconductor localmente depositado mediante técnicas de deposición tales como serigrafía, dosificación por dispensación, deposición por rodillos repartidores y similares.13. Plate according to claim 11 or 12, characterized in that said electroconductive material (6a, 6b) is an electroconductive adhesive locally deposited by means of deposition techniques such as screen printing, dispensing dosing, delivery by delivery rollers and the like.

14.- Placa, según la reivindicación 13, caracterizada porque el grosor de las capas (3a, 3b) electroconductoras es al menos de aproximadamente 400 μm, apto para circuitos de potencia. 1514. Plate according to claim 13, characterized in that the thickness of the electroconductive layers (3a, 3b) is at least about 400 μm, suitable for power circuits. fifteen

15.- Placa, según la reivindicación 11 ó 12, caracterizada porque dicho material electroconductor (6a, 6b) es un metal electroconductor, tal como Cu, NI, Ag, Sn y sus aleaciones, depositado mediante técnicas electrolíticas, siendo el grosor final de las capas15. Plate according to claim 11 or 12, characterized in that said electroconductive material (6a, 6b) is an electroconductive metal, such as Cu, NI, Ag, Sn and its alloys, deposited by electrolytic techniques, the final thickness of which is the layers

(3a, 3b) electroconductoras al menos de aproximadamente 400 μm, apto para circuitos de potencia.(3a, 3b) electroconductors at least about 400 μm, suitable for power circuits.

16.- Placa, según la reivindicación 11 ó 12, caracterizada porque unos extremos (5b) de dichas espigas (5) están enrasados a las respectivas caras externas de las capas (3a, 3b).16. Plate according to claim 11 or 12, characterized in that ends (5b) of said pins (5) are flush with the respective outer faces of the layers (3a, 3b).

17.- Placa, según una cualquiera de las reivindicaciones 11 a 16, caracterizada porque comprende unos agujeros (8) de montaje de componentes electrónicos realizados antes o después de la interconexión de las capas (3a, 3b) electroconductoras.17. Plate according to any one of claims 11 to 16, characterized in that it comprises holes (8) for mounting electronic components made before or after the interconnection of the electroconductive layers (3a, 3b).

18.- Circuito impreso de doble cara, caracterizado porque comprende una pluralidad de pistas configuradas a partir de una placa para formar un circuito impreso de doble cara de acuerdo con la reivindicación 11 , cuyas pistas están interconectadas a través de dichos puntos predeterminados.18. Double-sided printed circuit, characterized in that it comprises a plurality of tracks configured from a plate to form a double-sided printed circuit according to claim 11, whose tracks are interconnected through said predetermined points.

19.- Circuito impreso de doble o múltiples capas, del tipo que comprende una pluralidad de pistas configuradas a partir del material de al menos dos capas (3a, 3b) electroconductoras separadas por un substrato (2) laminar de material dieléctrico, estando las pistas de una capa conectadas eléctricamente a las pistas de la capa opuesta a través de unas espigas (5) electroconductoras, insertadas mediante ajuste a presión en unos orificios (4) practicados en unos puntos predeterminados afectando el substrato (2) y ambas pistas a unir, quedando definidos entre orificios (4) y espigas (5) unos espacios de separación (4a), estando dichas espigas (5) unidas mecánica y eléctricamente a dichas pistas obtenidas de las capas (3a, 3b) electroconductoras, existiendo unos medios de unión mecánica y eléctrica de dichas espigas (5) a dichas capas (3a, 3b) electroconductoras, caracterizado porque dicha conexión eléctrica entre puntos predeterminados de las pistas se realiza, posteriormente a la obtención de las mismas, mediante el método de acuerdo con cualquiera de las reivindicaciones 5 a 8. 119.- Printed circuit of double or multiple layers, of the type comprising a plurality of tracks configured from the material of at least two layers (3a, 3b) electroconductors separated by a sheet substrate (2) of dielectric material, the tracks being of a layer electrically connected to the tracks of the opposite layer through electroconducting pins (5), inserted by means of pressure adjustment in holes (4) made at predetermined points affecting the substrate (2) and both tracks to be joined, being defined between holes (4) and spikes (5) separation spaces (4a), said spikes (5) being mechanically and electrically connected to said tracks obtained from the electroconductive layers (3a, 3b), there being mechanical joining means and electrical of said pins (5) to said electroconductive layers (3a, 3b), characterized in that said electrical connection between predetermined points of the tracks is subsequently made to obtain them, by the method according to any of claims 5 to 8. one

MÉTODO DE INTERCONEXIÓN DE PUNTOS PREDETERMINADOS DE DOSMETHOD OF INTERCONNECTION OF DEFAULT POINTS OF TWO

CAPAS ELECTROCONDUCTORAS SEPARADAS POR UN AISLANTEELECTROCONDUCTOR COATS SEPARATED BY AN INSULATION

LAMINAR. Y PLACA Y CIRCUITO IMPRESO OBTENIDOSLAMINATE. AND PRINTED CIRCUIT AND CIRCUIT OBTAINED

Campo de la Invención La presente invención concierne, a un método para interconectar puntos predeterminados de dos capas electroconductoras, separadas por un aislante laminar de material dieléctrico, apto para la fabricación de placas de circuito impreso (PCB), en especial con unos grosores de dichas capas electroconductoras de 400 μm o superiores, previstos para aplicaciones de transmisión de potencia. El método propuesto hace posible la conexión de unas pistas electroconductoras obtenidas a partir de dichas capas conductoras, de ambas caras opuestas de la placa o PCB, por medio de unas espigas electroconductoras que permiten el paso a su través de corrientes de intensidad importante, dentro de la gama de transmisión de potencia.Field of the Invention The present invention concerns a method for interconnecting predetermined points of two electroconductive layers, separated by a sheet insulator of dielectric material, suitable for the manufacture of printed circuit boards (PCBs), especially with thicknesses of said electroconductive layers of 400 μm or higher, intended for power transmission applications. The proposed method makes possible the connection of electroconductive tracks obtained from said conductive layers, of both opposite faces of the board or PCB, by means of electroconductive pins that allow the passage through currents of significant intensity, within The power transmission range.

La invención también concierne a una placa, como producto intermedio para fabricar circuitos impresos y a unos circuitos impresos fabricados conforme al método propuesto.The invention also concerns a plate, as an intermediate product for manufacturing printed circuits and printed circuits manufactured according to the proposed method.

Los citados PCB de doble cara con capas electroconductoras de un grosor de 400 μm y superiores encuentran una aplicación substancial en cajas de distribución eléctrica para automóviles. Dichas cajas, tal como la descrita por ejemplo en la patente GB-A-2 263 817 (MAI-92), del actual solicitante, constituyen un sistema de conexión eléctrica centralizado en el vehículo, actuando como soporte para equipos de protección, así como para otros diversos componentes eléctricos, tales como relés, diodos, módulos de control electrónico y conectores. Conviene destacar que todas las conexiones entre los citados componentes se efectúan en la caja por medio de uno o varios PCB, a partir de los cuales es factible distribuir/recibir potencia y señales de control a/desde diversas partes del vehículo.The aforementioned double-sided PCBs with electroconductive layers of a thickness of 400 μm and greater find a substantial application in electrical distribution boxes for automobiles. Said boxes, such as the one described for example in patent GB-A-2 263 817 (MAI-92), of the current applicant, constitute a centralized electrical connection system in the vehicle, acting as a support for protective equipment, as well as for various other electrical components, such as relays, diodes, electronic control modules and connectors. It should be noted that all connections between the aforementioned components are made in the box by means of one or more PCBs, from which it is feasible to distribute / receive power and control signals to / from various parts of the vehicle.

Más concretamente, la invención se refiere a un método apropiado para la fabricación de circuitos impresos de doble cara, consistente en evitar las etapas de unión por soldadura de las referidas espigas electroconductoras que comunican las pistas conductoras de los PCB de doble cara, típicamente conocidas como espigas transversales cortas, cuya conexión eléctrica y mecánica se realiza en la actualidad, convencionalmente, por inserción de dichas espigas por medios mecánicos en unos 2 orificios/taladros transversales, realizados en el PCB, para, posteriormente, mediante un proceso de soldadura por ola, y en continuo, establecer unos correspondientes puntos o superficies de soldadura entre unos extremos sobresalientes de las espigas y las partes conductoras de la superficie interna de los taladros, en sus embocaduras correspondientes a las pistas de los circuitos impresos a conectar.More specifically, the invention relates to an appropriate method for the manufacture of double-sided printed circuits, consisting of avoiding the solder joint stages of said electroconductive pins that communicate the conductive tracks of double-sided PCBs, typically known as short transverse pins, whose electrical and mechanical connection is currently made, conventionally, by inserting said pins by mechanical means into 2 holes / transverse holes, made in the PCB, to subsequently, by a wave welding process, and in continuous, establish corresponding welding points or surfaces between protruding ends of the pins and the conductive parts of the internal surface of the holes, in their openings corresponding to the tracks of the printed circuits to be connected.

Antecedentes de la invenciónBackground of the invention

A título de ejemplo del proceso referido de soldadura de las espigas electroconductoras, en la fabricación de circuitos impresos de doble cara, y especialmente en circuitos de potencia podemos referir la citada patente GB-A-2263 817, y en particular la Fig. 2 de sus dibujos.As an example of the referred welding process of electroconductive pins, in the manufacture of double-sided printed circuits, and especially in power circuits we can refer to the aforementioned patent GB-A-2263 817, and in particular Fig. 2 of Your drawings

El proceso para la interconexión de pistas de cobre de 400 μm en circuitos de doble cara, según descrito e ilustrado en dicho antecedente consiste en:The process for the interconnection of 400 μm copper tracks in double-sided circuits, as described and illustrated in said background consists of:

- inserción de espigas cortas (que sobresalen ligeramente por una y otra cara de las capas conductoras) en los taladros correspondientes, realizados previamente por punzonado;- insertion of short spikes (slightly protruding on either side of the conductive layers) into the corresponding holes, previously made by punching;

- soldadura por ola de las espigas cortas mediante una aleación tal como 63Sn37PB; el proceso de soldadura se realiza en 2 etapas para la unión de la espiga corta por una y otra cara del circuito impreso.- wave welding of short pins by means of an alloy such as 63Sn37PB; The welding process is carried out in 2 stages for the union of the short pin on both sides of the printed circuit.

Debido a que la unión soldada de la referida espiga electroconductora a las capas o pistas electroconductoras de una y otra cara del PCB a menudo tiene que soportar cambios de temperatura, típicamente variaciones entre -40 °C y 85° C, y a la existencia de diferencias entre los coeficientes de expansión térmica de los diferentes materiales que intervienen en la unión (soldadura, cobre, substrato), sobre la soldadura se produce una tensión termomecánica y, como consecuencia de un gran número de ciclos térmicos, una fatiga que puede llegar a traducirse en la formación de grietas.Because the welded joint of the aforementioned electroconductive pin to the electroconductive layers or tracks on either side of the PCB often has to withstand temperature changes, typically variations between -40 ° C and 85 ° C, and the existence of differences between the thermal expansion coefficients of the different materials involved in the union (welding, copper, substrate), a thermomechanical stress occurs on the weld and, as a consequence of a large number of thermal cycles, fatigue that can translate in the formation of cracks.

Por otra parte, es importante minimizar o evitar la refusión de la primera soldadura cuando se efectúa la segunda con el objeto de aminorar los efectos de la fatiga termomecánica a consecuencia del estrés térmico. A tal efecto se están estudiando aleaciones más resistentes térmica y mecánicamente para evitar la refusión: tal es el caso de la nueva aleación 96SN4Ag. Cabe citar asimismo la patente US-A-5.601.227 del actual solicitante, que describe una aleación especial con un 95 % de Sn y un 5% de Sb o un 52% de Sn, 45% Pb y 3% de Sb con un punto de fusión superior a 183°C 3 especialmente favorables para la soldadura de circuitos impresos.On the other hand, it is important to minimize or avoid the refusion of the first weld when the second is performed in order to reduce the effects of thermomechanical fatigue as a result of thermal stress. To this end, more thermally and mechanically resistant alloys are being studied to avoid refusion: such is the case of the new 96SN4Ag alloy. It is also worth mentioning the US-A-5,601,227 patent of the current applicant, which describes a special alloy with 95% Sn and 5% Sb or 52% Sn, 45% Pb and 3% Sb with a melting point higher than 183 ° C 3 especially favorable for welding printed circuits.

En la solicitud de patente EP-A-0877 539, este solicitante ha propuesto también un método para obtener una mejora de la soldadura, en particular para las espigas transversales soldadas por sus extremos a las dos caras conductoras de un circuito impreso, consistente en utilizar procedimientos de soldadura de diferentes características sobre cada uno de los extremos de la espiga, de manera que las dos soldaduras no resulten cualitativamente afectadas entre sí. Para ello se describe en dicho documento la utilización de unas aleaciones de soldadura con puntos de fusión distintos para cada uno de los extremos de la espiga a soldar, con el fin de evitar la refusión durante la segunda soldadura (la cual continúa realizándose con la aleación estaño/plomo, cuyo punto de fusión es de 183 °C) de la primera. A tal efecto se propone una aleación binaria basada en estaño y plata que presenta una mayor resistencia a la fatiga termomecánica. Exposición de la invenciónIn patent application EP-A-0877 539, this applicant has also proposed a method for obtaining a welding improvement, in particular for the transverse pins welded at their ends to the two conductive faces of a printed circuit, consisting of using welding procedures of different characteristics on each of the ends of the pin, so that the two welds are not qualitatively affected with each other. For this purpose, the use of welding alloys with different melting points for each of the ends of the pin to be welded is described, in order to avoid refusion during the second weld (which continues with the alloy tin / lead, whose melting point is 183 ° C) from the first. For this purpose, a binary alloy based on tin and silver is proposed, which has a greater resistance to thermomechanical fatigue. Exhibition of the invention

La presente invención, se fundamenta en un principio radicalmente diferente que evita la soldadura, proporcionándose la unión mecánica y eléctrica de dichas espigas electroconductoras, transversales a un PCB de doble cara, mediante la aportación sin calor de un material electroconductor que llena al menos unas regiones de unos espacios de separación definidos entre orificios/ taladros y espigas electroconductoras, cuyas regiones están comprendidas entre unas porciones de las espigas y unas respectivas zonas adyacentes electroconductoras de las embocaduras de dichos orificios, correspondientes a las capas electroconductoras.The present invention is based on a radically different principle that avoids welding, providing the mechanical and electrical connection of said electroconductive pins, transverse to a double-sided PCB, by providing heat-free electroconductive material that fills at least some regions. of defined separation spaces between holes / holes and electroconductive pins, whose regions are comprised between portions of the pins and respective electroconductive adjacent areas of the mouths of said holes, corresponding to the electroconductive layers.

Ha de señalarse que en el procedimiento convencional de fabricación de circuitos impresos, ilustrado por ejemplo en la patente ES-A-2021545 (MAI90) ya era conocido insertar en cada orificio del PCB una correspondiente espiga transversal, de longitud superior al grosor del PCB y de sección transversal cuadrangular inscribible en un círculo de diámetro ligeramente superior al diámetro de dichos orificios, quedando definidos entre orificios y espigas unos espacios de separación, cuyas espigas quedan conectadas mecánicamente a presión en los orificios, y con los extremos de las espigas sobresaliendo ligeramente por ambos lados del PCB, facilitando un posicionado correcto de dichas espigas para realizar sobre cada uno de dichos extremos las referidas operaciones de soldadura.It should be noted that in the conventional process of manufacturing printed circuits, illustrated for example in the patent ES-A-2021545 (MAI90) it was already known to insert in each hole of the PCB a corresponding transverse pin, of length greater than the thickness of the PCB and of quadrangular cross-section inscribable in a circle of diameter slightly greater than the diameter of said holes, being defined between holes and spikes a separation spaces, whose spikes are mechanically connected under pressure in the holes, and with the ends of the spikes protruding slightly by both sides of the PCB, facilitating correct positioning of said pins to perform on each of said ends the said welding operations.

El método preconizado ahora en la presente invención mejora notablemente los resultados en lo que se refiere a los daños y tensiones estructurales que se pueden 4 producir sobre la placa o circuito impreso, minimizando la fatiga termomecánica lo que repercutirá favorablemente en las condiciones de trabajo en las que debe operar dicho circuito impreso, en particular si se utiliza en cajas de distribución eléctrica en vehículos a motor. Además, en relación con los procedimientos convencionales referidos que comportan dos etapas de paso por una soldadura por ola, sobre cada una de las caras del PCB, el método propuesto permite realizar la unión de una sola vez, lo cual proporciona ventajas en cuanto a los tiempos de procesado.The method now recommended in the present invention significantly improves the results in terms of the damages and structural stresses that can be 4 produce on the printed circuit board, minimizing thermomechanical fatigue which will have a favorable impact on the working conditions in which said printed circuit must operate, in particular if it is used in electrical distribution boxes in motor vehicles. In addition, in relation to the conventional procedures referred to, which involve two stages of passage through a wave solder, on each of the faces of the PCB, the proposed method allows the union to be done only once, which provides advantages in terms of processing times

La aplicación del procedimiento preconizado permite además la eliminación al 100% de las aleaciones con plomo, ya que los componentes (lengüetas, hembrillas, etc.), al no existir el riesgo de la refusión, pueden soldarse posteriormente al PCB con una aleación tal como 96SN4Ag, lo que incide muy favorablemente en las condiciones medioambientales del proceso.The application of the recommended procedure also allows 100% removal of lead alloys, since the components (tabs, sockets, etc.), as there is no risk of refusion, can be subsequently welded to the PCB with an alloy such as 96SN4Ag, which has a very favorable impact on the environmental conditions of the process.

Las uniones entre espiga y capas conductoras son robustas y en el caso de que dicho aporte se realice por técnicas electrolíticas, dicha unión estará formada por el mismo metal (cobre) y, por lo tanto, se eliminará el efecto de los diferentes coeficientes de expansión térmica, lo cual minimizará la fatiga termomecánica.The joints between spike and conductive layers are robust and in the case that said contribution is made by electrolytic techniques, said union will be formed by the same metal (copper) and, therefore, the effect of the different expansion coefficients will be eliminated thermal, which will minimize thermomechanical fatigue.

El método conforme a esta invención comporta así, en esencia, las siguientes fases: - una etapa previa de anclaje y contacto de las espigas electroconductoras con los taladros, según técnica en sí conocida, anteriormente referida, dejando unos espacios libres entre espiga y orificio, y quedando los extremos de dichas espigas sobresaliendo por ambas caras del PCB;The method according to this invention thus entails, in essence, the following phases: - a previous stage of anchoring and contact of the electroconductive pins with the drills, according to the technique itself known, referred to above, leaving free spaces between spike and hole, and the ends of said pins being protruding on both sides of the PCB;

- una segunda etapa en la que se procede a un prensado de los extremos de las citadas espigas para incrementar la unión mecánica y eléctrica de las mismas al orificio/taladro y capas conductoras y lograr un enrasado de los extremos de dichas espigas con las capas conductoras;- a second stage in which the ends of the aforementioned pins are pressed to increase their mechanical and electrical connection to the hole / hole and conductive layers and achieve a flush of the ends of said pins with the conductive layers ;

- la aportación, sin calor, de un material electroconductor.- the contribution, without heat, of an electroconductive material.

La citada etapa de prensado de los extremos de las espigas es preferida, puesto que proporciona una excelente conexión mecánica y eléctrica de las espigas, previamente a la aportación en frío del material electroconductor, así como un eventual enrasado de los extremos de dichas espigas que favorece las operaciones de dicha aportación, aunque también se podrían obtener buenos resultados insertando, por ejemplo, espigas de sección 5 transversal poligonal de relativamente elevado número de caras, por ejemplo, de entre 6 y 12 caras, eventualmente con una longitud calibrada de acuerdo con el grosor de la placa. Sin embargo, la conexión mecánica y eléctrica que se consigue mediante la inserción y eventual prensado de las espigas 5 no es suficiente para las condiciones reales de funcionamiento del PCB, por Ej. utilizado en cajas de conexión eléctrica centralizada en automoción, que pueden implicar vibraciones, variaciones térmicas, etc., por lo que se hace necesaria la citada etapa posterior de consolidación de dichas conexiones mediante aportación sin calor de un material electroconductor.The aforementioned pressing stage of the ends of the pins is preferred, since it provides an excellent mechanical and electrical connection of the pins, prior to the cold contribution of the electroconductive material, as well as an eventual flush of the ends of said pins which favors the operations of said contribution, although good results could also be obtained by inserting, for example, section spikes 5 polygonal transverse of relatively high number of faces, for example, between 6 and 12 faces, possibly with a length calibrated according to the thickness of the plate. However, the mechanical and electrical connection that is achieved through the insertion and eventual pressing of the pins 5 is not sufficient for the actual operating conditions of the PCB, eg used in automotive electrical centralized junction boxes, which may involve vibrations. , thermal variations, etc., so that the aforementioned subsequent stage of consolidation of said connections is necessary by means of heat-free contribution of an electroconductive material.

La referida aportación sin calor de un material electroconductor puede realizarse, conforme a la invención, mediante diversos procedimientos:Said heat-free contribution of an electroconductive material can be carried out, according to the invention, by various procedures:

- aportación, mediante técnicas electrolíticas, de un metal, tal como Cu, NI, Ag, Sn y sus aleaciones, u otro;- contribution, by electrolytic techniques, of a metal, such as Cu, NI, Ag, Sn and its alloys, or other;

- aportación, mediante técnicas de deposición localizada, tales como serigrafía, dosificación por dispensación, deposición por rodillos repartidores, etc., de un adhesivo conductor.- Contribution, by means of localized deposition techniques, such as screen printing, dispensing dosing, delivery by delivery rollers, etc., of a conductive adhesive.

El segundo procedimiento, en donde el material electroconductor es un adhesivo, permite variaciones en el orden de las operaciones a realizar, es decir, partir de dicho substrato laminar dieléctrico, revestido por ambas caras de unas capas conductoras y:The second procedure, where the electroconductive material is an adhesive, allows variations in the order of the operations to be carried out, that is, from said dielectric sheet substrate, coated on both sides of conductive layers and:

- realizar sobre el mismo unos circuitos con una pluralidad de pistas que ulteriormente se conectarán mediante del método propuesto, o alternativamente- perform on it circuits with a plurality of tracks that will subsequently be connected by the proposed method, or alternatively

- efectuar en primer lugar la conexión de puntos predeterminados de las dos capas conductoras de una y otra cara del substrato, mediante el método según la invención, llegando a un producto intermedio o placa, y después configurar sobre cada una de las capas conductoras el correspondiente circuito con sus pistas electroconductoras.- firstly connect the predetermined points of the two conductive layers on both sides of the substrate, by the method according to the invention, reaching an intermediate product or plate, and then configure on each of the conductive layers the corresponding circuit with its electroconductive tracks.

En la variante de aportación de material electroconductor por procedimientos electrolíticos, la capa de cobre conductora de cada una de las caras del substrato tiene un grosor inferior al final deseado, por ejemplo de 400 μm, llegando a este valor después de la operación de tratamiento electrolítico que deposita un estrato de cobre uniforme sobre cada una de las citadas capas. Sin embargo mediante este método se han evitado totalmente los problemas de tensiones estructurales que se producían en la soldadura convencional, así como se han cubierto totalmente los espacios que quedaban entre la superficie lateral de la espiga y el perímetro circular de la capa conductora que delimita 6 ambos extremos del orificio/ taladro mediante una capa de Cu.In the variant of electroconductive material contribution by electrolytic procedures, the conductive copper layer of each of the faces of the substrate has a thickness less than the desired end, for example 400 μm, reaching this value after the electrolytic treatment operation which deposits a uniform copper layer on each of the aforementioned layers. However, by this method the problems of structural stresses that occurred in conventional welding have been totally avoided, as well as the spaces that remained between the lateral surface of the spike and the circular perimeter of the conductive layer that delimits 6 both ends of the hole / hole using a layer of Cu.

En esencia el método que se propone comprende, en una realización preferida los siguientes pasos, ejecutados secuencialmente:In essence, the proposed method comprises, in a preferred embodiment, the following steps, executed sequentially:

(a) realizar unos orificios transversales pasantes, cilindricos, en unos puntos predeterminados del conjunto de substrato y capas conductoras, afectando a dicho substrato y a dichas capas;(a) make through, cylindrical, transverse holes at predetermined points of the substrate assembly and conductive layers, affecting said substrate and said layers;

(b) insertar en cada orificio una correspondiente espiga, de longitud superior al grosor del citado conjunto, de sección transversal poligonal inscribible en un círculo de diámetro ligeramente superior al diámetro de dichos orificios, de manera que dichas espigas queden conectadas mecánicamente a presión en los orificios, con unas aristas de las espigas en contacto con la pared interior del orificio, definiendo entre ambos dichos espacios de separación y con unos extremos de las espigas sobresaliendo ligeramente por ambos lados del elemento; (c) prensar los extremos de las espigas que sobresalen por ambos lados del elemento, de manera que se produzca una deformación plástica de las espigas reduciendo su longitud y aumentando el área de su sección transversal, causando un aplastamiento de las aristas contra las paredes de los orificios que proporciona una mayor conexión mecánica, un mejor contacto eléctrico de las espigas con cada una de las capas y una reducción de los espacios de separación; (d) realizar un tratamiento preparatorio de las superficies externas de ambas capas, que incluye un pulido para eliminar rebabas en los extremos de las espigas; y (e) aportar dicho material electroconductor a los espacios de separación, de manera que se incremente el grado de contacto eléctrico entre las espigas y las respectivas capas.(b) insert into each hole a corresponding pin, of a length greater than the thickness of said assembly, of polygonal cross-section inscribable in a circle of diameter slightly greater than the diameter of said holes, so that said pins are mechanically connected to pressure in the holes, with edges of the pins in contact with the inner wall of the hole, defining between said said spaces of separation and with ends of the pins slightly protruding on both sides of the element; (c) press the ends of the pins protruding on both sides of the element, so that a plastic deformation of the pins occurs reducing their length and increasing the area of their cross section, causing a crushing of the edges against the walls of the holes that provide greater mechanical connection, better electrical contact of the pins with each of the layers and a reduction of the separation spaces; (d) perform a preparatory treatment of the outer surfaces of both layers, which includes a polish to remove burrs at the ends of the pins; and (e) providing said electroconductive material to the separation spaces, so as to increase the degree of electrical contact between the pins and the respective layers.

En la variante de ejecución en donde la aportación de material electroconductor es una sustancia adhesiva con propiedades de conducción eléctrica, se prevé una etapa adicional:In the execution variant where the contribution of electroconductive material is an adhesive substance with electrical conduction properties, an additional step is provided:

(f) realizar un tratamiento de acabado de las superficies externas de ambas capas (3a, 3b) electroconductoras que incluye un pulido. Además, cuando se aplica dicho adhesivo conductor, dicho tratamiento preparatorio de las superficies extemas de ambas capas (3a, 3b) realizado en el paso (d) incluye además un mordentado químico; y dicho tratamiento de acabado de las superficies exte as de ambas capas (3a, 3b) realizado en el paso (f) incluye además un curado de dicho adhesivo conductor.(f) perform a finishing treatment of the external surfaces of both layers (3a, 3b) electroconductors that includes a polish. In addition, when said conductive adhesive is applied, said treatment preparatory of the external surfaces of both layers (3a, 3b) carried out in step (d) also includes a chemical biting; and said finishing treatment of the outer surfaces of both layers (3a, 3b) performed in step (f) further includes curing said conductive adhesive.

Breve descripción de los dibujosBrief description of the drawings

La invención se comprenderá mejor a partir de una descripción detallada de unos ejemplos de realización preferidos de la misma, que debe ser leída con referencia a los dibujos esquemáticos adjuntos, que han de considerarse a título ilustrativo y no limitativo, en los que: la Fig. 1 es una vista en perspectiva de una porción de un elemento de partida para la fabricación de una placa de circuito impreso PCB; la Fig. 2 es una vista en perspectiva, parcialmente seccionada, de la porción del elemento de la Fig. 1 al que se le han practicado unos orificios; la Fig. 3 es una vista en perspectiva, parcialmente seccionada, que ilustra la inserción de una espiga en uno de los orificios de la Fig. 2; las Figs. 4 a 10 son, cada una, una combinación de una vista en planta de una porción del elemento de la Fig. 1 con uno de dichos orificios y una espiga insertada en el mismo, y un vista en sección transversal tomada por la línea señalada por unas flechas en la vista en planta, en cuyas figuras; la Fig. 4 ilustra el resultado de la aplicación del procedimiento convencional del estado de la técnica; las Figs. 5 a 7 ilustran el resultado de la aplicación de una primera variante de realización del procedimiento de la presente invención; y las Figs. 8 a 10 ilustran el resultado de la aplicación de una segunda variante de realización del procedimiento de la presente invención.The invention will be better understood from a detailed description of some preferred embodiments thereof, which should be read with reference to the attached schematic drawings, which are to be considered by way of illustration and not limitation, in which: Fig. 1 is a perspective view of a portion of a starting element for the manufacture of a PCB printed circuit board; Fig. 2 is a perspective view, partially sectioned, of the portion of the element of Fig. 1 which holes have been made; Fig. 3 is a perspective view, partially sectioned, illustrating the insertion of a pin into one of the holes in Fig. 2; Figs. 4 to 10 are each a combination of a plan view of a portion of the element of Fig. 1 with one of said holes and a pin inserted therein, and a cross-sectional view taken along the line indicated by some arrows in the plan view, in whose figures; Fig. 4 illustrates the result of the application of the conventional prior art procedure; Figs. 5 to 7 illustrate the result of the application of a first embodiment variant of the process of the present invention; and Figs. 8 to 10 illustrate the result of the application of a second variant embodiment of the process of the present invention.

Descripción en detalle de unos ejemplos de realización preferidosDetailed description of preferred embodiments

Haciendo referencia en primer lugar a la Fig. 1 , en la misma, con la referencia numérica 1, se indica de manera general un elemento compuesto de un substrato 2 laminar, de material dieléctrico, revestido por ambas caras por sendas capas 3a, 3b electroconductoras. Dicho elemento 1 es igual a los que se utilizan convencionalmente para la fabricación de placas de circuito impreso, en las que se obtienen unas pistas 8 electroconductoras, de trayectorias complejas, mediante un procedimiento de ataque químico de las capas 3a, 3b de material electroconductor de ambas caras del substrato dieléctrico 2.Referring first to Fig. 1, therein, with the numerical reference 1, an element consisting of a laminar substrate 2, of dielectric material, coated on both sides by two electroconductive layers 3a, 3b is generally indicated . Said element 1 is the same as those conventionally used for the manufacture of printed circuit boards, in which tracks are obtained 8 electroconductors, of complex paths, by means of a chemical attack procedure of layers 3a, 3b of electroconductive material of both faces of the dielectric substrate 2.

En muchas de aplicaciones se requiere una interconexión de puntos predeterminados de ambas capas 3a, 3b electroconductoras a través del substrato 2 aislante. En aplicaciones de transmisión de potencia, como es el caso al que va principalmente dirigido el método de la presente invención, dicha conexión debe realizarse mediante un material conductor que presente un área de sección de paso lo suficientemente grande como para no ofrecer una resistencia eléctrica indeseada al paso de la corriente.In many applications, an interconnection of predetermined points of both layers 3a, 3b electroconductors through the insulating substrate 2 is required. In power transmission applications, as is the case to which the method of the present invention is primarily directed, said connection must be made by a conductive material that has a large sectional area so as not to offer an unwanted electrical resistance. to the passage of the current.

Para realizar dichas conexiones se procede, en primer lugar, a practicar una pluralidad de orificios 4 transversales (véase Fig. 2) en dichos puntos predeterminados de dicho elemento 1. Simultáneamente a la realización de dichos orificios 4 se pueden realizar unos agujeros 8 para el montaje de componentes electrónicos, aunque estos se pueden practicar con igual eficacia después de la interconexión de las capas 3a, 3b electroconductoras.To make said connections, first of all, a plurality of transverse holes 4 (see Fig. 2) are made at said predetermined points of said element 1. Simultaneously to the realization of said holes 4, holes 8 can be made for the Assembly of electronic components, although these can be practiced equally effectively after interconnection of the electroconductive layers 3a, 3b.

En la Fig. 3 se ilustra el siguiente paso, que consiste en la inserción en dichos orificios 4 de unas espigas 5 electroconductoras, mediante una fuerza de inserción I que garantiza un ajuste a presión de las mismas. Típicamente, dichas espigas 5 son de longitud superior al grosor del elemento 1 y de sección transversal poligonal, en este caso cuadrada, inscribible en un círculo de diámetro ligeramente superior al diámetro de dichos orificios 4, de manera que dichas espigas 5 quedan conectadas mecánicamente a presión en los orificios 4, con unas aristas 5a de las espigas 5 en contacto con la pared interior del orificio 4. De esta manera, entre las paredes de los orificios 4 y los flancos de las espigas 5 quedan definidos unos espacios de separación 4a, mientras que unos extremos 5b de las espigas 5 quedan sobresaliendo ligeramente por ambos lados del elemento 1.The following step is illustrated in Fig. 3, which consists in the insertion into said holes 4 of electroconductive pins 5, by means of an insertion force I which guarantees a pressure adjustment thereof. Typically, said pins 5 are of length greater than the thickness of the element 1 and of polygonal cross-section, in this case square, inscribable in a circle of diameter slightly greater than the diameter of said holes 4, so that said pins 5 are mechanically connected to pressure in the holes 4, with edges 5a of the pins 5 in contact with the inner wall of the hole 4. In this way, between the walls of the holes 4 and the flanks of the pins 5, separation spaces 4a are defined, while ends 5b of the pins 5 are slightly protruding on both sides of the element 1.

A modo de ejemplo, en el método de la presente invención, para un orificio 4 con un diámetro aproximado de 1,4 mm se utiliza una espiga de sección cuadrada de 1 ,2 mm de lado, lo que implica una diagonal de 1,697 mm que asegura una provisional conexión mecánica y eléctrica de la espiga 5 con las capas 3a, 3b que debe ser posteriormente consolidada, para garantía de una dilatada vida útil del PCB a producir.By way of example, in the method of the present invention, for a hole 4 with an approximate diameter of 1.4 mm, a square-shaped stem of 1.2 mm side is used, which implies a diagonal of 1.697 mm which ensures a provisional mechanical and electrical connection of the pin 5 with the layers 3a, 3b that must be subsequently consolidated, to guarantee a long service life of the PCB to be produced.

Lo expuesto hasta aquí es sustancialmente común con los métodos convencionales 9 utilizados en el estado de la técnica. Es en el siguiente paso, es decir, el de establecer una consolidación de dicha conexión mecánica y eléctrica de los extremos 5b de las espigas 5 a dichas capas 3a, 3b electroconductoras, donde el método de la presente invención aporta nuevas soluciones ventajosas, conforme a lo explicado. En la Fig. 4 se ilustra el método convencional del estado de la técnica, referido, que consiste en la realización de la soldadura de los extremos 5b sobresalientes a la capa 3a de un lado del elemento 1 en una primera etapa de aportación de material de soldadura 9a y la de los extremos 5b a la capa 3b del lado opuesto en una segunda etapa, con aportación de un material de soldadura 9b, con los inconvenientes expuestos anteriormente.The above is substantially common with conventional methods. 9 used in the state of the art. It is in the next step, that is, to establish a consolidation of said mechanical and electrical connection of the ends 5b of the pins 5 to said electroconductive layers 3a, 3b, where the method of the present invention provides new advantageous solutions, according to I explained it. Fig. 4 illustrates the conventional method of the prior art, referred to, which consists in the welding of the ends 5b protruding to the layer 3a of one side of the element 1 in a first step of providing material of welding 9a and that of the ends 5b to the layer 3b on the opposite side in a second stage, with the contribution of a welding material 9b, with the drawbacks set forth above.

Por contra, de acuerdo con la presente invención (véanse Figs. 5 a 10), la citada conexión eléctrica de las capas 3a, 3b a través de las espigas 5 se realiza por aportación, sin calor, de un material electroconductor que llena al menos unas regiones de dichos espacios de separación 4a comprendidas entre unas porciones de las espigas 5 y unas respectivas zonas adyacentes electroconductoras de las paredes de dichos orificios 4, correspondientes a las capas 3a, 3b. Dicha aportación sin calor se realiza, de acuerdo con la invención, según dos técnicas alternativas.On the other hand, according to the present invention (see Figs. 5 to 10), said electrical connection of layers 3a, 3b through the pins 5 is made by providing, without heat, an electroconductive material that fills at least regions of said separation spaces 4a comprised between portions of the pins 5 and respective adjacent electroconductive areas of the walls of said holes 4, corresponding to layers 3a, 3b. Said contribution without heat is carried out, according to the invention, according to two alternative techniques.

En las Figs. 5 a 7 se ejemplifica una primera alternativa en la que el material aportado sin calor es un adhesivo electroconductor 6a, depositado de manera localizada mediante técnicas tales como serigrafía, dosificación por dispensación, deposición por rodillos repartidores, etc.In Figs. 5 to 7, a first alternative is exemplified in which the material supplied without heat is an electroconductive adhesive 6a, deposited in a localized manner by means of techniques such as screen printing, dispensing by dispensing, deposition by delivery rollers, etc.

En el elemento 1 de la Fig. 5, las capas 3a, 3b electroconductoras, separadas por el substrato 2, son de un grosor hl adecuado para aplicaciones de transmisión de potencia, cuyo grosor hl es preferiblemente de 400 μm o más. Una espiga 5 de sección transversal de perfil cuadrado está insertada en un orificio 4 de dicho elemento 1, tal como se ha explicado anteriormente. A continuación, y con referencia a la Fig. 6, se aplica una presión P sobre los extremos 5b de la espiga 5 que sobresalen por ambos lados del elemento 1. Por el efecto de dicha presión P, la espiga 5 se deforma disminuyendo de longitud mientras que aumenta de grosor, con lo cual, las aristas 5a de la espiga se aprietan aún más contra las paredes del orificio 4, de manera que los espacios de separación 4a disminuyen de tamaño. Preferiblemente, los extremos 5b de las espigas 5 quedan enrasados con las superficies extemas de las capas 3a, 3b electroconductoras con el fin de facilitar las posteriores operaciones. 10In element 1 of Fig. 5, the electroconductive layers 3a, 3b, separated by the substrate 2, are of a thickness hl suitable for power transmission applications, whose thickness hl is preferably 400 µm or more. A pin 5 of square profile cross section is inserted into a hole 4 of said element 1, as explained above. Next, and with reference to Fig. 6, a pressure P is applied on the ends 5b of the pin 5 protruding on both sides of the element 1. By the effect of said pressure P, the pin 5 is deformed decreasing in length while increasing in thickness, whereby, the edges 5a of the pin are pressed even more against the walls of the hole 4, so that the separation spaces 4a decrease in size. Preferably, the ends 5b of the pins 5 are flush with the outer surfaces of the electroconductive layers 3a, 3b in order to facilitate subsequent operations. 10

Finalmente se procede a la aplicación localizada del mencionado adhesivo electroconductor 6a (Fig. 7) de manera que éste llena al menos aquellas porciones de los espacios de separación 4a comprendidas entre los extremos 5b de las espigas 5 y la parte conductora de las embocaduras del orificio 4 correspondientes a las capas 3a, 3b electroconductoras. La aplicación de dicho adhesivo conductor implica, al menos, una operación previa de mordentado y una operación posterior de curado. Además, según sea el método de aplicación del mencionado adhesivo por Ej. depositado por unos rodillos, deberá preverse uan etapa ulterior de limpieza de las capas 3a, 3b.Finally, the localized application of said electroconductive adhesive 6a (Fig. 7) is carried out so that it fills at least those portions of the separation spaces 4a between the ends 5b of the pins 5 and the conductive part of the orifice openings 4 corresponding to layers 3a, 3b electroconductors. The application of said conductive adhesive implies, at least, a previous biting operation and a subsequent curing operation. In addition, depending on the method of application of said adhesive, for example deposited by rollers, a further stage of cleaning layers 3a, 3b should be provided.

En las Figs. 8 a 10 se ejemplifica una segunda alternativa en la que el material aportado sin calor es un metal, tal como Cu, NI, Ag, Sn y sus aleaciones, u otro, depositado mediante técnicas electrolíticas.In Figs. 8 to 10 a second alternative is exemplified in which the material provided without heat is a metal, such as Cu, NI, Ag, Sn and its alloys, or other, deposited by electrolytic techniques.

En este caso se parte de un elemento 1 (ver la Fig. 8) en el que el grosor h2 de las capas 3a, 3b es menor al grosor final h4 deseado, apto para aplicaciones de transmisión de potencia. Por lo demás, la inserción de la espiga 5 y la posterior etapa de prensado (Fig. 9), preferida, son del todo equivalentes a las de la alternativa anterior, por lo que vale todo lo explicado con referencia a la misma.In this case, it is based on an element 1 (see Fig. 8) in which the thickness h2 of the layers 3a, 3b is less than the desired final thickness h4, suitable for power transmission applications. Moreover, the insertion of the pin 5 and the subsequent pressing stage (Fig. 9), preferred, are completely equivalent to those of the previous alternative, so everything explained with reference to it is worth it.

En la etapa final de deposición electrolítica (véase Fig. 10), el metal de aportación 6b cubre toda la superficie de las capas 3a, 3b así como los extremos 5b de la espiga 5 y aquellas porciones de los espacios de separación 4a comprendidas entre los extremos 5b de las espigas 5 y la parte conductora de las embocaduras del orificio 4 correspondientes a las capas 3a, 3b electroconductoras, formando unos revestimientos de grosor h3. Dicho grosor h3 complementa el grosor h2 inicial de las capas 3a, 3b hasta dotarlas de un grosor final h4 adecuado para las aplicaciones de transmisión de potencia anteriormente mencionadas. Dicho grosor final h4 deseado es de aproximadamente 400 μm o más. Convenientemente, el metal 6b de aportación es el mismo del que están constituidas las capas 3a, 3b, o presenta una gran afinidad con el mismo en cuanto a las características físicas y químicas, con el fin de eliminar tensiones debidas a, por ejemplo, diferentes coeficientes de dilatación térmica.In the final electrolytic deposition stage (see Fig. 10), the contribution metal 6b covers the entire surface of the layers 3a, 3b as well as the ends 5b of the pin 5 and those portions of the separation spaces 4a between the ends 5b of the pins 5 and the conductive part of the openings of the hole 4 corresponding to the electroconductive layers 3a, 3b, forming coatings of thickness h3. Said thickness h3 complements the initial thickness h2 of layers 3a, 3b until they are provided with a final thickness h4 suitable for the aforementioned power transmission applications. Said final thickness h4 desired is approximately 400 μm or more. Conveniently, the input metal 6b is the same as the layers 3a, 3b, or has a great affinity with it for physical and chemical characteristics, in order to eliminate stresses due to, for example, different coefficients of thermal expansion.

Con la utilización de esta segunda alternativa del método de la invención se producen unos elementos a partir de los cuales se obtendrán, por técnicas convencionales, placas de circuito impreso de doble cara, en las que las conexiones eléctricas entre unos puntos predeterminados de las pistas de una y otra cara estarán previamente efectuadas mediante el método de la presente invención. 11With the use of this second alternative of the method of the invention, elements are produced from which, by conventional techniques, double-sided printed circuit boards will be obtained, in which the electrical connections between predetermined points of the tracks of both sides will be previously made by the method of the present invention. eleven

Utilizando la primera alternativa, además del anterior elemento prefabricado, se pueden realizar interconexiones entre pistas de placas de circuito impreso de doble cara ya constituidas.Using the first alternative, in addition to the previous prefabricated element, interconnections between tracks of already constituted double-sided printed circuit boards can be made.

Un experto en la materia será capaz de introducir diversas variantes en los ejemplos de ejecución del método, descritos, sin salirse del alcance de la presente invención, el cual está definido por las reivindicaciones adjuntas. One skilled in the art will be able to introduce various variants in the examples of execution of the method, described, without departing from the scope of the present invention, which is defined by the appended claims.

PCT/ES1999/000183 1999-06-21 1999-06-21 Process for interconnecting predetermined points of two electroconducting layers which are separated by a laminar insulating material, and printed circuit board obtained Ceased WO2000079852A1 (en)

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