JPH11224913A5 - - Google Patents
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- Publication number
- JPH11224913A5 JPH11224913A5 JP1998024874A JP2487498A JPH11224913A5 JP H11224913 A5 JPH11224913 A5 JP H11224913A5 JP 1998024874 A JP1998024874 A JP 1998024874A JP 2487498 A JP2487498 A JP 2487498A JP H11224913 A5 JPH11224913 A5 JP H11224913A5
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- semiconductor device
- hole
- mounting
- terminal
- connection terminal
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Description
【００１２】
【課題を解決するための手段】
上記第１の目的及び第２の目的を達成するために、請求項１の発明の半導体装置の実装方法は、貫通孔が形成された配線板と、該貫通孔の開口周縁部分の少なくとも一部に形成された偏平な第１の接触子及び前記貫通孔の内面部分に形成された第２の接触子の少なくとも一方で構成された端子部と、前記配線板に搭載されると共に、前記端子部と電気的に接続された半導体素子と、を備えた半導体装置において、予め実装基板に突状の接続端子を含む電極部を設け、上記請求項１に記載の半導体装置の前記貫通孔内に、前記接続端子を挿入して接合することにより、前記電極部を半導体装置に設けられた端子部に電気的に接続して半導体装置を実装基板に実装することを特徴としている。
[0012]
[Means for solving the problem]
In order to achieve the first and second objects, the method for mounting a semiconductor device of the invention of claim 1 comprises a semiconductor device having a wiring board in which a through hole is formed, a terminal portion consisting of at least one of a flat first contactor formed on at least a part of the opening periphery of the through hole and a second contactor formed on the inner surface of the through hole, and a semiconductor element mounted on the wiring board and electrically connected to the terminal portion, characterized in that an electrode portion including a protruding connection terminal is provided on a mounting board in advance, and the connection terminal is inserted and joined into the through hole of the semiconductor device described in claim 1, thereby electrically connecting the electrode portion to the terminal portion provided on the semiconductor device and mounting the semiconductor device on the mounting board.
すなわち、請求項１の発明の半導体装置の実装方法により実装される半導体装置では、上記構成とすることにより、端子部が配線板から突出しない様にして取り扱い中の負荷により端子部が変形するのを防止している。 In other words, in a semiconductor device mounted by the semiconductor device mounting method of the invention of claim 1, the above-mentioned configuration prevents the terminal portion from protruding from the wiring board, thereby preventing the terminal portion from being deformed due to loads during handling.
本請求項１の発明の半導体装置の実装方法により実装される半導体装置において、端子部を形成する偏平な第１の接触子は、例えば、配線板の表面にメッキなどにより形成した金属膜または導電性物質よりなる膜や、貫通孔内に充填した金属の配線板の上下面に露出する部分などにより構成することができる。また、端子部を形成する第２の接触子は、例えば、配線板に設けられた貫通孔の内面にメッキなどにより形成した金属膜または導電性物質よりなる膜や、貫通孔内に充填した金属に配線板を貫通するように設けた孔の内面部分などにより構成することができる。 In the semiconductor device mounted by the semiconductor device mounting method of the present invention, the flat first contactor forming the terminal portion can be formed, for example, by a metal film or a film made of a conductive material formed on the surface of the wiring board by plating or the like, or by a portion of a metal filled in a through hole that is exposed on the top and bottom surfaces of the wiring board, etc. The second contactor forming the terminal portion can be formed, for example, by a metal film or a film made of a conductive material formed on the inner surface of a through hole provided in the wiring board by plating or the inner surface of a hole provided in the metal filled in the through hole so as to penetrate the wiring board, etc.
このように、本発明の半導体装置の実装方法により実装される半導体装置では、第１の接触子と第２の接触子のうち少なくとも一方が実装基板との接合方法に合わせて形成される実装基板の接続端子と接続可能な領域に設けられていればよい。 In this way, in a semiconductor device mounted by the semiconductor device mounting method of the present invention, at least one of the first contactor and the second contactor may be provided in an area connectable to a connection terminal of the mounting substrate that is formed in accordance with the bonding method with the mounting substrate.
貫通孔の内面に設けられる第２の接触子の形成位置は、例えば、後述する請求項３の実装方法では内面全面としたり、後述する請求項３の実装方法では、内面の一部とするなどのように、実装基板との接合方法に合わせて決定することもできる。 The position of the second contact provided on the inner surface of the through hole can be determined in accordance with the joining method with the mounting board, for example, on the entire inner surface in the mounting method of claim 3 described later, or on a part of the inner surface in the mounting method of claim 3 described later.
このように請求項１の半導体装置の実装方法により実装される半導体装置は、従来では配線板の下面側に突出して形成させた外部端子を、貫通孔の開口周縁部分の少なくとも一部に形成された偏平な第１の接触子及び貫通孔の内面部分に形成された第２の接触子の少なくとも一方で構成された端子部としているため、端子部が取り扱い中に邪魔にならず、取り扱い中に端子部が変形して短絡などの接合不良を起こす恐れがない。 In this way, the semiconductor device mounted by the semiconductor device mounting method of claim 1 has a terminal portion consisting of at least one of a flat first contactor formed on at least a part of the opening periphery of the through hole and a second contactor formed on the inner surface of the through hole, instead of the external terminal that was conventionally formed protruding from the underside of the wiring board.Therefore, the terminal portion does not get in the way during handling, and there is no risk of the terminal portion deforming during handling and causing poor connection such as a short circuit.
したがって、実装基板に対して良好な接合信頼性を有する半導体装置とすることができ、この様な半導体装置と実装基板との接合は、以下のように行われる。 Therefore, the semiconductor device can be made to have good bonding reliability with respect to the mounting substrate, and the bonding between such a semiconductor device and the mounting substrate is carried out as follows .
実装基板の電極部は、上記の半導体装置に設けられた貫通孔に挿入可能に構成された突状の接続端子を含み、この接続端子が貫通孔内に入り込んだ状態で接合されることにより半導体装置と実装基板とを電気的に接続するとともに、実装基板に対する半導体装置の位置を固定する。 The electrode portion of the mounting substrate includes a protruding connection terminal configured to be insertable into a through hole provided in the semiconductor device, and this connection terminal is joined while inserted into the through hole, thereby electrically connecting the semiconductor device and the mounting substrate and fixing the position of the semiconductor device relative to the mounting substrate.
また、半導体装置と実装基板との接合は、半導体装置の貫通孔の形状に合わせて半田で形成した突状の接続端子を貫通孔内に嵌め合わせたのち、リフロー処理して接合するようにしてもよいし、後述する請求項３及び請求項４のようにしてもよく、実装基板に設けられた突状の接続端子が貫通孔内で固定されることにより半導体装置と実装基板とが電気的に接続する構成であれば、本発明では特に限定しない。 Furthermore, the joining of the semiconductor device and the mounting substrate may be performed by fitting a protruding connection terminal formed of solder to match the shape of the through hole of the semiconductor device into the through hole and then performing a reflow process to join them, or as described in claims 3 and 4 below.The present invention is not particularly limited as long as the semiconductor device and the mounting substrate are electrically connected by fixing the protruding connection terminal provided on the mounting substrate within the through hole.
また、請求項１の発明によれば、突状の接続端子を貫通孔内に挿入して半導体装置を実装基板に実装するため、半導体装置に設けられた端子部とこの端子部に対応して形成された実装基板の突状の接続端子とを確実に接合できるので、実装基板の接続端子と半導体装置の外部端子との位置合わせが簡単で、精度良く接合することができる。 Furthermore, according to the invention of claim 1 , the semiconductor device is mounted on the mounting board by inserting the protruding connection terminal into the through hole, so that the terminal portion provided on the semiconductor device and the protruding connection terminal of the mounting board formed to correspond to this terminal portion can be reliably joined, making it easy to align the connection terminal of the mounting board with the external terminal of the semiconductor device, and enabling precise joining.
請求項２の発明は、上記第３と第４の目的を達成するために、請求項１に記載の半導体装置の実装方法において、前記貫通孔内に挿入された前記接続端子の該貫通孔から突出した部分に押圧力を加えて変形させることにより前記端子部と前記接続端子とを接合することを特徴としている。 In order to achieve the third and fourth objects, the invention of claim 2 is characterized in that, in the semiconductor device mounting method described in claim 1 , the terminal portion and the connection terminal are joined by applying a pressing force to the portion of the connection terminal inserted into the through hole and deforming it, which protrudes from the through hole.
また、請求項３の発明は、上記第３と第４の目的を達成するために、請求項１に記載の半導体装置の実装方法において、前記接続端子を加熱して溶融させることにより前記接続端子と前記端子部とを接合することを特徴としている。 In addition, in order to achieve the above-mentioned third and fourth objects, the invention of claim 3 is characterized in that, in the semiconductor device mounting method described in claim 1 , the connection terminal and the terminal portion are joined by heating and melting the connection terminal.
また、請求項３の発明によれば、溶融した突状の接続端子は貫通孔内に留まるため、隣り合う接続端子同士が接合して半田ブリッジが形成される恐れがないという利点もある。 Furthermore, according to the invention of claim 3 , since the molten protruding connection terminals remain in the through holes, there is an advantage that there is no risk of adjacent connection terminals joining together to form a solder bridge.
また、請求項４の発明の半導体装置は、上記第１の目的を達成するために、実装基板側に開口する有底の孔が形成された配線板と、該有底の孔の内面部分の少なくとも一部に形成された端子部と、前記配線板に搭載されると共に、前記端子部と電気的に接続された半導体素子と、を備えている。 In addition, in order to achieve the first object described above, the semiconductor device of the invention of claim 4 comprises a wiring board having a bottomed hole formed therein that opens to the mounting board side, a terminal portion formed on at least a part of the inner surface of the bottomed hole, and a semiconductor element mounted on the wiring board and electrically connected to the terminal portion.
すなわち、請求項４の発明では、上記構成とすることにより、端子部が配線板から突出しない様にして取り扱い中の負荷により端子部が変形するのを防いでいる。 That is, in the invention of claim 4 , the above-mentioned configuration prevents the terminal portion from protruding from the wiring board, thereby preventing the terminal portion from being deformed by the load during handling.
本請求項４の発明において、端子部は、例えば、配線板の下面に形成した有底の孔の内面にメッキなどにより形成した金属膜または導電性物質よりなる膜の表面や、配線板の内部のある一定の深さまで形成した金属層内に設けた有底の孔の内面などにより構成することができる。また、有底の孔の形状は限定しないが、例えば、配線板の下面内に開口しその断面が円形または多角形である有底の筒状とすることができる。 In the invention of claim 4 , the terminal portion can be formed, for example, by the surface of a metal film or a film made of a conductive material formed by plating or the like on the inner surface of a bottomed hole formed in the underside of the wiring board, or the inner surface of a bottomed hole provided in a metal layer formed to a certain depth inside the wiring board, etc. The shape of the bottomed hole is not limited, but can be, for example, a bottomed cylindrical shape that opens into the underside of the wiring board and has a circular or polygonal cross section.
このように請求項４の半導体装置は、従来では配線板の下面側に突出して形成させた外部端子を、配線板に形成された有底の孔の内面部分の少なくとも一部に形成した端子部としているため、端子部が取り扱い中に邪魔にならず、取り扱い中に端子が変形して短絡などの接合不良を起こす恐れがない。 In this way, in the semiconductor device of claim 4 , the external terminals that were previously formed by protruding from the underside of the wiring board are formed as terminal portions on at least a part of the inner surface of a bottomed hole formed in the wiring board, so that the terminal portions do not get in the way during handling, and there is no risk of the terminals deforming during handling and causing poor connections such as short circuits.
したがって、実装基板に対して良好な接合信頼性を有する半導体装置とすることができる。なお、この様な半導体装置と実装基板との接合は、後述する請求項５の発明のように行うことができる。 Therefore, the semiconductor device can be provided with good bonding reliability to the mounting substrate. The bonding between such a semiconductor device and the mounting substrate can be performed as in the fifth aspect of the present invention, which will be described later.
請求項５の発明の半導体装置の実装方法は、上記第２の目的を達成するために、予め実装基板に突状の接続端子を含む電極部を設け、上記請求項４に記載の半導体装置の前記有底の孔内に、前記接続端子を挿入して接合することにより、前記電極部を半導体装置に設けられた端子部に電気的に接続して半導体装置を実装基板に実装することを特徴としている。 In order to achieve the second object, the method for mounting a semiconductor device of the invention of claim 5 is characterized in that an electrode portion including a protruding connection terminal is provided on a mounting substrate in advance, and the connection terminal is inserted into and joined to the bottomed hole of the semiconductor device described in claim 4 , thereby electrically connecting the electrode portion to the terminal portion provided on the semiconductor device and mounting the semiconductor device on the mounting substrate.
実装基板の電極部は、請求項４に記載の半導体装置に設けられた有底の孔に挿入可能に構成された突状の接続端子を含み、この接続端子が有底の孔内に入り込んだ状態で接合されることにより半導体装置と実装基板とを電気的に接続するとともに、実装基板に対する半導体装置の位置を固定する。 The electrode portion of the mounting substrate includes a protruding connection terminal configured to be insertable into a bottomed hole provided in the semiconductor device described in claim 4 , and this connection terminal is joined in a state where it is inserted into the bottomed hole, thereby electrically connecting the semiconductor device and the mounting substrate and fixing the position of the semiconductor device relative to the mounting substrate.
また、請求項５の発明によれば、半導体装置に設けられた端子部とこの端子部に対応して形成された実装基板の突状の接続端子とを確実に接合できるので、実装基板の接続端子と半導体装置の端子部との位置合わせが簡単で、精度良く接合することができる。 Furthermore, according to the invention of claim 5 , the terminal portion provided on the semiconductor device and the protruding connection terminal of the mounting board formed to correspond to this terminal portion can be reliably joined, so that the alignment of the connection terminal of the mounting board with the terminal portion of the semiconductor device is simple and precise joining can be achieved.
【００８９】
【発明の効果】
以上説明したように、請求項１の発明によれば、半導体装置に設けられた端子部が半導体装置の取り扱い中に邪魔にならず、取り扱い中に端子が変形して短絡などの接合不良を起こす恐れのない半導体装置を、実装基板に対して半導体装置の端子部と実装基板の接続端子との位置合わせが簡単で精度良く接合することができる、という効果がある。
[0089]
[Effects of the Invention]
As described above, according to the invention of claim 1, the terminal portions of the semiconductor device do not get in the way when the semiconductor device is handled, and there is no risk of the terminals deforming during handling and causing poor bonding such as short circuits , and the terminal portions of the semiconductor device can be easily aligned with the connection terminals of the mounting board and bonded with high precision.
また、請求項２及び請求項３の発明によれば、パッケージクラックの発生しない半導体装置のパッケージにクラックを発生させないで実装できる、という効果がある。 Furthermore, according to the second and third aspects of the present invention, there is an effect that the semiconductor device can be mounted without causing cracks in the package.
請求項４の発明によれば、端子部が半導体装置の取り扱い中に邪魔にならず、取り扱い中に端子が変形して短絡などの接合不良を起こす恐れのない半導体装置が得られる、という効果がある。 According to the fourth aspect of the present invention, there is an effect that the terminal portions do not get in the way when the semiconductor device is handled, and a semiconductor device can be obtained in which there is no risk of the terminals being deformed during handling, causing a short circuit or other poor connection.
さらに、請求項５の発明によれば、請求項４の半導体装置を実装基板に対して半導体装置の端子部と実装基板の接続端子との位置合わせが簡単で精度良く接合することができる、という効果がある。 Furthermore, according to the fifth aspect of the present invention, there is an effect that the semiconductor device of the fourth aspect can be easily aligned with the connection terminals of the mounting board and can be bonded with high precision.
Claims (5)
予め実装基板に突状の接続端子を含む電極部を設け、
前記半導体装置の前記貫通孔内に、前記接続端子を挿入して接合することにより、前記電極部を前記半導体装置に設けられた端子部に電気的に接続して前記半導体装置を実装基板に実装することを特徴とする半導体装置の実装方法。 A semiconductor device comprising: a wiring board having a through hole formed therein; a terminal portion comprising at least one of a flat first contact formed on at least a part of the periphery of the opening of the through hole and a second contact formed on the inner surface of the through hole; and a semiconductor element mounted on the wiring board and electrically connected to the terminal portion,
An electrode portion including a protruding connection terminal is provided on the mounting substrate in advance,
A method for mounting a semiconductor device, comprising inserting and joining the connection terminal into the through hole of the semiconductor device, thereby electrically connecting the electrode portion to a terminal portion provided on the semiconductor device, and mounting the semiconductor device on a mounting substrate.
該有底の孔の内面部分の少なくとも一部に形成された端子部と、 a terminal portion formed on at least a part of the inner surface of the bottomed hole;
前記配線板に搭載されると共に、前記端子部と電気的に接続された半導体素子と、 a semiconductor element mounted on the wiring board and electrically connected to the terminal portion;
を備えた半導体装置。 A semiconductor device comprising:
上記請求項４に記載の半導体装置の前記有底の孔内に、前記接続端子を挿入して接合することにより、前記電極部を前記半導体装置に設けられた端子部に電気的に接続して前記半導体装置を実装基板に実装することを特徴とする半導体装置の実装方法。A method for mounting a semiconductor device, comprising inserting and joining the connection terminal into the bottomed hole of the semiconductor device described in claim 4, thereby electrically connecting the electrode portion to a terminal portion provided on the semiconductor device and mounting the semiconductor device on a mounting substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP02487498A JP3938810B2 (en) | 1998-02-05 | 1998-02-05 | Mounting method of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP02487498A JP3938810B2 (en) | 1998-02-05 | 1998-02-05 | Mounting method of semiconductor device |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH11224913A JPH11224913A (en) | 1999-08-17 |
| JPH11224913A5 true JPH11224913A5 (en) | 2005-08-18 |
| JP3938810B2 JP3938810B2 (en) | 2007-06-27 |
Family
ID=12150359
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP02487498A Expired - Fee Related JP3938810B2 (en) | 1998-02-05 | 1998-02-05 | Mounting method of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3938810B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006093295A (en) * | 2004-09-22 | 2006-04-06 | Nichia Chem Ind Ltd | Semiconductor device and manufacturing method thereof |
| JP4828997B2 (en) * | 2006-04-24 | 2011-11-30 | ルネサスエレクトロニクス株式会社 | SEMICONDUCTOR PACKAGE AND ITS MOUNTING METHOD, AND INSULATED WIRING BOARD USED FOR THE SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD |
| JP5125349B2 (en) * | 2007-09-21 | 2013-01-23 | カシオ計算機株式会社 | Mounting structure and mounting method of semiconductor device |
| DE102017006406B4 (en) * | 2017-07-07 | 2021-04-29 | Tdk-Micronas Gmbh | Packaged IC component |
-
1998
- 1998-02-05 JP JP02487498A patent/JP3938810B2/en not_active Expired - Fee Related
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