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WO2000067945A1 - Dispositif permettant d'enlever de la matiere sur des pieces a l'aide d'un faisceau laser - Google Patents

Dispositif permettant d'enlever de la matiere sur des pieces a l'aide d'un faisceau laser Download PDF

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Publication number
WO2000067945A1
WO2000067945A1 PCT/DE2000/001383 DE0001383W WO0067945A1 WO 2000067945 A1 WO2000067945 A1 WO 2000067945A1 DE 0001383 W DE0001383 W DE 0001383W WO 0067945 A1 WO0067945 A1 WO 0067945A1
Authority
WO
WIPO (PCT)
Prior art keywords
laser
pulse
arrangement
wavelength
drilling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE2000/001383
Other languages
German (de)
English (en)
Inventor
Friedrich Dausinger
Thomas Wawra
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to EP00936661A priority Critical patent/EP1097021A1/fr
Priority to JP2000616958A priority patent/JP2002543984A/ja
Publication of WO2000067945A1 publication Critical patent/WO2000067945A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Definitions

  • the invention relates to a device for removing material from a workpiece by means of a laser beam with the features of the preamble of the independent claims.
  • Such a device usually comprises a laser arrangement for generating a laser beam from at least one laser pulse, which has parameter values at least for laser wavelength, pulse duration, pulse spacing and laser intensity.
  • Devices of this type are used in particular to drill holes with the highest precision in a workpiece.
  • the invention is described below with reference to a laser drilling device, it is clear that the measures according to the invention can also be applied to other devices which cause a precise material removal by means of a laser beam on a workpiece, regardless of whether this material removal takes the form of a drilling, Milling or cutting process or the like. he follows.
  • the material When a laser hole is formed, the material is removed or expelled by liquefaction and evaporation at the point of impact of the laser beam.
  • the precision of such a laser drilling is incomplete expelled material, which mainly deposits as a melt in the borehole, is significantly impaired.
  • the laser intensity can be increased to improve the material output. This increases the vapor pressure generated by the laser beam and thus also the material output. However, an increased vapor pressure also results in an increased shielding of the laser beam, which reduces the drilling speed and the maximum achievable drilling depth.
  • the device according to the invention in particular if it is designed as a laser drilling device for machining workpieces made of solid material, has the advantage that the laser system works with at least two types of laser pulses, one type of laser pulse being selected by a suitable choice of its parameter values, e.g. when drilling, with regard to a maximum drilling depth and
  • Drilling speed is designed, while the other laser pulse type is optimized by a corresponding selection of its parameter values, for example when drilling with regard to a maximum material output.
  • the at least two types of laser pulses can be matched to one another in such a way that, for example in the case of a laser drilling device, there are optimal values for the maximum achievable drilling depth, for the drilling speed and for the precision of the drilling.
  • the invention is based on the knowledge that e.g. in laser drilling, the values for drilling depth, drilling progress and drilling quality depend particularly strongly on certain parameter values of the laser pulse. The important ones
  • Parameter values are laser wavelength and pulse duration.
  • an interaction of electromagnetic radiation with a plasma present in the borehole increases with the laser wavelength; the interaction increases proportionally to the square of the laser wavelength.
  • a larger laser wavelength has a stronger interaction with the plasma and thus causes a greater plasma formation and e ne greater pressure increase in the plasma, while a shorter laser wavelength forms less plasma and also passes through the plasma relatively unhindered.
  • a shorter laser wavelength therefore results in a higher drilling speed and a greater maximum drilling depth, while a larger laser wavelength improves the drilling quality.
  • the laser arrangement can be designed such that it generates a laser beam in which at least one laser pulse of one type follows at least one laser pulse of the other type. In this way, for example, when laser drilling
  • Drilling phases with high drilling speed and drilling phases with strong material drive can be generated with the help of a single laser beam.
  • the laser arrangement can be designed such that it generates two coaxial laser beams, one of which consists of at least one laser pulse of one type and the other of at least one laser pulse of the other type. In this way, one laser beam causes a high drilling speed and the other laser beam produces a high drilling quality.
  • the laser arrangement can have two laser generators or lasers, one of which generates a laser beam with at least one laser pulse of one type and the other generates a laser beam with at least one laser pulse of the other type, the laser arrangement then also having an optical arrangement which interconnects the lasers and aligns their laser beams coaxially.
  • Laser arrangements e.g. optimized either to achieve a high drilling speed or to achieve a high drilling precision, can be put together to form the device according to the invention, which uses the advantages of both lasers.
  • the pulse duration of at least one of the laser pulse types can be approximately as long as the time required to carry out a material removal process, in particular a drilling.
  • FIG. 1 is a circuit diagram-like Pzip view of a device according to the invention in a first embodiment
  • Fig. 2 is a circuit diagram-like P ⁇ nzipdargna the
  • a laser arrangement 1 m in a first embodiment according to FIG. 1 has a pulsed laser 2 suitable for drilling, which in particular can be a well-switched solid-state laser.
  • This laser 2 generates a laser beam 3, which is symbolized by a solid line.
  • This laser beam 3 is constructed from laser pulses that have a specific laser wavelength
  • this laser wavelength is 1064 nm, which is the fundamental wavelength of this laser type
  • the laser beam 3 is fed to a frequency multiplier 4, m the laser pulse by frequency multiplication can be generated with a shorter laser wavelength.
  • a frequency multiplier 4 usually consists of a crystal or of crystals that generate at least one associated harmonic wavelength from a fundamental wavelength.
  • the shorter laser wavelength is thus preferably a harmonic wavelength to the fundamental wavelength of the respective laser type; with an Nd: YAG aser, the harmonic wavelengths are, for example, 532 nm, 355 nm, 266 nm shorter laser wavelength can be used.
  • From the frequency multiplier 4 there emerges a first laser beam 5, shown with a solid line, the laser pulses of which have a longer laser wavelength, and a second laser beam 6, shown with a broken line, whose laser pulses have a shorter laser wavelength.
  • the laser beams 5 and 6 strike a first splitter mirror 7, which consists, for example, of a dielectric coated glass plate and has a high transmission for the longer laser wavelength and a high reflection for the shorter laser wavelength.
  • a beam interrupter 8 or 9 is arranged, for example by a mechanical interrupter, a so-called “chopper” or from an electrically controllable one
  • Beam switches eg Pockels cell
  • the two laser beams 5 and 6 are brought together again via a second splitter mirror 10 and aligned coaxially to one another.
  • the second divider mirror 10 also preferably consists of a dielectrically coated glass plate with high transmission for the larger laser wavelength and high reflection for the smaller laser wavelength.
  • laser pulses of one type can alternate with laser pulses of the other type (e.g. with a shorter laser wavelength). It is also possible to alternate a series of laser pulses of one type with a series of laser pulses of the other type. For a specific application, it can also be expedient to let the two laser beams 5 and 6 or their laser pulses strike the respective workpiece simultaneously.
  • a laser arrangement 11 in a device according to the invention is equipped with a pulsed laser 12 suitable for drilling, preferably with a solid-state laser, which has a resonator 13, in which a laser crystal 19 is arranged, for example is designed as a rod crystal or slab stall.
  • a first Brewster window 14 and a second Brewster window 15 are arranged in a resonator 13 of the laser arrangement on both sides of the laser 12, with the aid of which a linear polarization of the laser beam generated by the laser 12 is carried out.
  • a Pockels cell 16 is also arranged in the resonator 13, which is switched free running for laser pulses with a predetermined longer pulse duration and works as a good switch for laser pulses with a predetermined shorter pulse duration.
  • the long pulse duration can be 150 ⁇ s, for example, while the short pulse duration is 10 ns, for example.
  • an end mirror 17 and a coupling-out mirror 18 are arranged in the resonator 13.
  • the Brewster windows 14 and 15 are not required.
  • another suitable Q-switch can also be used. It is also possible to construct the device 11 with different laser wavelengths in order to adapt the coupling for shifted materials. In the device 11 according to FIG. 2, the laser excitation can take place both with flash lamps and with diodes.
  • the laser arrangement 11 can be operated in accordance with a second exemplary embodiment in such a way that laser pulses with a long pulse duration and laser pulses with a short pulse duration alternate.
  • a series of laser pulses of one type e.g. with a long one
  • Pulse duration follow a series of laser pulses of the other type (eg with a short pulse duration).
  • the pulse duration of one laser pulse type is at least a factor IO 3 greater or smaller than the pulse duration of the other laser pulse type. In this way, it is possible in particular to rapidly advance the hole to be drilled into a workpiece in a workpiece during a first drilling phase with laser pulses with the longer pulse duration and to clean or close this hole during a second drilling phase with laser pulses with the short pulse duration specify.
  • the laser arrangement 11 superimposes different laser wavelengths on the different pulse durations.
  • different laser wavelengths can be applied to the different pulse durations.
  • the respective laser arrangement has at least two laser systems, each of which generates a laser beam with a laser pulse type, the parameter values of the laser pulses in the laser systems being different.
  • Such a laser arrangement then has a corresponding optical arrangement in order to align the different laser beams coaxially with one another.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Lasers (AREA)

Abstract

Dispositif permettant d'enlever de la matière sur des pièces à l'aide d'un faisceau laser, en particulier dispositif de perçage par laser, qui comporte une source laser destinée à produire un faisceau laser constitué d'au moins une impulsion laser caractérisée par des valeurs de paramètres telles que par ex. la durée d'impulsion et la longueur d'onde laser. Selon la présente invention, la source laser est ainsi conçue qu'elle produit au moins deux types d'impulsions laser qui se distinguent pour ce qui est d'au moins une valeur de paramètre, ce qui permet d'améliorer la vitesse et la précision d'élimination de matière.
PCT/DE2000/001383 1999-05-06 2000-05-03 Dispositif permettant d'enlever de la matiere sur des pieces a l'aide d'un faisceau laser Ceased WO2000067945A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP00936661A EP1097021A1 (fr) 1999-05-06 2000-05-03 Dispositif permettant d'enlever de la matiere sur des pieces a l'aide d'un faisceau laser
JP2000616958A JP2002543984A (ja) 1999-05-06 2000-05-03 レーザを用いた工作物の除去装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19920813.1 1999-05-06
DE19920813A DE19920813A1 (de) 1999-05-06 1999-05-06 Vorrichtung zum Materialabtragen bei Werkstücken mittels Laserstrahl

Publications (1)

Publication Number Publication Date
WO2000067945A1 true WO2000067945A1 (fr) 2000-11-16

Family

ID=7907138

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2000/001383 Ceased WO2000067945A1 (fr) 1999-05-06 2000-05-03 Dispositif permettant d'enlever de la matiere sur des pieces a l'aide d'un faisceau laser

Country Status (4)

Country Link
EP (1) EP1097021A1 (fr)
JP (1) JP2002543984A (fr)
DE (1) DE19920813A1 (fr)
WO (1) WO2000067945A1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GR20020100116A (el) * 2002-03-01 2003-11-17 Ιδρυμα Τεχνολογιας Και Ερευνας (Ι.Τ.Ε.) Μεθοδος και συστημα για τον καθαρισμο επιφανειων με τη συγχρονη χρηση παλμων laser δυο διαφορετικων μηκων κυματος
EP1389158B1 (fr) * 2001-05-24 2005-08-03 Advanced Dicing Technologies Ltd. Decoupage au laser double de tranches de semi-conducteur
DE10119033B4 (de) * 2001-04-18 2005-11-03 Robert Bosch Gmbh Verfahren zum Abgleich eines Resonators in einem Oszillator
WO2006024585A1 (fr) * 2004-09-02 2006-03-09 Hitachi Via Mechanics, Ltd. Source de lumiere laser, procede pour usiner des pieces au moyen d'un rayon laser pulse
EP3335900A1 (fr) * 2016-12-13 2018-06-20 Giesecke+Devrient Currency Technology GmbH Découpe au laser et coloration au laser de documents de sécurité
WO2018162356A1 (fr) * 2017-03-07 2018-09-13 Robert Bosch Gmbh Procédé et dispositif de formation de rayonnement pour traitement au laser

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10358927B4 (de) 2003-12-16 2021-09-09 Carl Zeiss Meditec Ag Laservorrichtung und Verfahren zur Materialbearbeitung mittels Laserstrahlung
DE102004013475B4 (de) * 2004-03-18 2007-01-25 Lasertec Gmbh Verfahren und Vorrichtung zum Abtragen von Material
JP2005338137A (ja) * 2004-05-24 2005-12-08 Yokogawa Electric Corp レーザ光源装置
DE102007062182A1 (de) 2007-12-21 2009-06-25 Robert Bosch Gmbh Einspritzventil zum Abspritzen eines Fluids
DE102011000768B4 (de) * 2011-02-16 2016-08-18 Ewag Ag Laserbearbeitungsverfahren und Laserbearbeitungsvorrichtung mit umschaltbarer Laseranordnung
CN109044526B (zh) * 2018-07-03 2024-05-07 瑞尔通(苏州)医疗科技有限公司 一种双波长激光器及激光治疗仪
CN113210856B (zh) * 2021-04-22 2022-07-19 广东工业大学 Pcb短波长脉冲激光钻孔方法及相关钻孔装置

Citations (4)

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Publication number Priority date Publication date Assignee Title
WO1986002301A1 (fr) * 1984-10-16 1986-04-24 Advanced Laser Systems, Inc. Procede et appareil de percement a laser
DE4207169A1 (de) * 1992-03-06 1993-09-09 Siemens Solar Gmbh Laserbearbeitungsverfahren fuer ein werkstueck mit nicht ebener oberflaeche
US5635089A (en) * 1993-07-13 1997-06-03 University Of Florida Ceramic, metal and composite materials having increased surface area
EP0979710A1 (fr) * 1998-08-11 2000-02-16 Carglass Luxembourg Sarl Démontage de panneaux de verre

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US4839497A (en) * 1987-09-03 1989-06-13 Digital Equipment Corporation Drilling apparatus and method
GB2218660B (en) * 1988-05-16 1991-09-25 Lumonics Ltd Method of material processing using a laser beam
GB2286787A (en) * 1994-02-26 1995-08-30 Oxford Lasers Ltd Selective machining by dual wavelength laser

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1986002301A1 (fr) * 1984-10-16 1986-04-24 Advanced Laser Systems, Inc. Procede et appareil de percement a laser
DE4207169A1 (de) * 1992-03-06 1993-09-09 Siemens Solar Gmbh Laserbearbeitungsverfahren fuer ein werkstueck mit nicht ebener oberflaeche
US5635089A (en) * 1993-07-13 1997-06-03 University Of Florida Ceramic, metal and composite materials having increased surface area
EP0979710A1 (fr) * 1998-08-11 2000-02-16 Carglass Luxembourg Sarl Démontage de panneaux de verre

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
ANKRAVETS ET AL: "Increasing the efficiency of cutting aluminium alloys with a combined laser beam", SVAROCHNOE PROIZVODSTVO, vol. 44, no. 8, 1997, pages 142 - 146, XP000735299 *

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10119033B4 (de) * 2001-04-18 2005-11-03 Robert Bosch Gmbh Verfahren zum Abgleich eines Resonators in einem Oszillator
US7148762B2 (en) 2001-04-18 2006-12-12 Robert Bosch Gmbh Method for adjusting a resonator in an oscillator
EP1389158B1 (fr) * 2001-05-24 2005-08-03 Advanced Dicing Technologies Ltd. Decoupage au laser double de tranches de semi-conducteur
GR20020100116A (el) * 2002-03-01 2003-11-17 Ιδρυμα Τεχνολογιας Και Ερευνας (Ι.Τ.Ε.) Μεθοδος και συστημα για τον καθαρισμο επιφανειων με τη συγχρονη χρηση παλμων laser δυο διαφορετικων μηκων κυματος
EP1340556A3 (fr) * 2002-03-01 2003-12-17 Foundation for Research and Technology-Hellas (FO.R.T.H.), Institute of Electronic Structure and Laser Procédé et dispositif pour nettoyer des surfaces avec des impulsions laser temporairement coincidentes de deux longueurs d'onde différentes
WO2006024585A1 (fr) * 2004-09-02 2006-03-09 Hitachi Via Mechanics, Ltd. Source de lumiere laser, procede pour usiner des pieces au moyen d'un rayon laser pulse
EP3335900A1 (fr) * 2016-12-13 2018-06-20 Giesecke+Devrient Currency Technology GmbH Découpe au laser et coloration au laser de documents de sécurité
WO2018162356A1 (fr) * 2017-03-07 2018-09-13 Robert Bosch Gmbh Procédé et dispositif de formation de rayonnement pour traitement au laser
US11440136B2 (en) 2017-03-07 2022-09-13 Robert Bosch Gmbh Method and device for shaping radiation for laser processing

Also Published As

Publication number Publication date
DE19920813A1 (de) 2001-06-28
EP1097021A1 (fr) 2001-05-09
JP2002543984A (ja) 2002-12-24

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