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WO1999009594A1 - Dissipateur de chaleur fritte - Google Patents

Dissipateur de chaleur fritte Download PDF

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Publication number
WO1999009594A1
WO1999009594A1 PCT/DE1998/002405 DE9802405W WO9909594A1 WO 1999009594 A1 WO1999009594 A1 WO 1999009594A1 DE 9802405 W DE9802405 W DE 9802405W WO 9909594 A1 WO9909594 A1 WO 9909594A1
Authority
WO
WIPO (PCT)
Prior art keywords
sintered
heat sink
cooling air
base plate
matrix
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE1998/002405
Other languages
German (de)
English (en)
Inventor
Frank Baxmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE29714730U external-priority patent/DE29714730U1/de
Priority claimed from DE29814078U external-priority patent/DE29814078U1/de
Application filed by Individual filed Critical Individual
Priority to AU95311/98A priority Critical patent/AU9531198A/en
Publication of WO1999009594A1 publication Critical patent/WO1999009594A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/003—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
    • F28F2255/18—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes sintered
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to a sintered heat sink for general use.
  • Cooling elements made of extruded aluminum profiles or composite systems are often used to transfer the excess heat generated by a heat source to the environment. With these heat sinks, only a surface / volume ratio of approx. 8 cm 2 maximum heat-exchanging surface per 1 cm 3 heat sink volume is achieved. The cooling effect that can be achieved with this is relatively low. The removal of large
  • EP 0 559 092 proposes a porous metal foam as a heat sink. With such a heat sink, the available cooling surface per unit volume is large. In such a heat sink, heat conduction poses problems because the pore density must be small for better heat conduction, which in turn requires a high flow resistance. The opposing requirements for heat conduction and flow resistance mean that only smaller heat transfer rates can be achieved with such heat sinks.
  • Utility model G 91 02 117 describes a heat sink for Peltier elements, which consists of a block of sintered material. With such a heat sink, more favorable conditions can be created since the heat conduction in sintered material is better than in metal foam. However, the performance of such a heat sink is considerably limited. Experiments have shown that if air is used as the coolant, this solution can only be used because of the high flow resistance if the sintered block is relatively coarse
  • Sintered material from about a particle size of 200 microns, is formed and the coolant is pressed at high pressure through the heat sink. Since a coarse sintered matrix has poorer thermal conductivity, larger amounts of heat can only be absorbed Be removed using liquid coolant. This leads to considerable additional expenses because liquid coolants can usually only be used as an intermediate medium.
  • the invention has for its object to provide such a sintered heat sink, in which a large surface area / volume ratio of the sintered matrix, good heat transfer properties and relatively small flow resistances are possible.
  • a heat sink should have a light and compact design and be easily adapted to different operating conditions.
  • Claim 8 possible. Its subclaim 9 is an advantageous embodiment of the solution according to claim 8. The other subclaims 10 to 16 are equally advantageous embodiments of the solutions according to claims 1 and 8
  • a coolant can flow into the heat sink without having to overcome a large flow resistance and exit on the opposite side after it has passed the sintered matrix wall. Since channels open to the inlet opening are adjacent to channels that are open to the outlet opening, the entire surface of the sintered matrix wall is available as a flow cross section. With the same surface area / volume ratio, the flow resistance of the sintered matrix can thereby be significantly reduced or, with the same flow resistance, a heat sink with a much larger one can be used Surface / volume ratio can be realized.
  • a heat sink for forced ventilation can be designed with a low-pressure fan with a surface / volume ratio of 12 to 20 cm 2 / cm 3 .
  • This type of heat sink according to the invention can be divided into two
  • the heat sink is cubic, i. H.
  • the sintered matrix is cubic on a substantially rectangular base plate, which serves as a carrier and heat distribution plate and with which the connection to the heat source is established.
  • the heat sink according to the invention is excellently suitable for practically all conventional applications in which heat sinks made from extruded profiles or similar constructions have previously been used.
  • heat sinks made from extruded profiles or similar constructions have previously been used.
  • With appropriate design of the heat sink it is possible to use the use of fans, blowers or even compressors to transfer much larger amounts of heat with a relatively small heat sink volume.
  • such a heat sink can also be designed such that the long sides of the sintered matrix walls are arranged at such an angle that the channels formed by them are the largest on the open side and the smallest on the closed side have a wide open space.
  • the transverse walls can be omitted in this variant of the invention. The longitudinal walls are then directly connected to one another and thus result in a sawtooth-shaped structure of the sintered matrix wall.
  • the heat sink is designed in the form of a cylinder ring, ie the sintered matrix is over a generally circular base plate in the form of a cylinder ring which serves as a carrier and heat distribution plate built up.
  • the longitudinal walls of the meandering sintered matrix wall are arranged radially or at an angle to the respective radial of the cylinder ring, running straight or in an arc shape.
  • the longitudinal walls do not run radially but at an angle to the radial, since pressure losses in the heat sink can thereby be avoided.
  • the adaptation can be further improved with an arcuate course.
  • the coolant is fed in via the inlet opening on the inside and discharged via its outer diameter.
  • the width of the channels increases with the diameter. This is particularly the case with the forced ventilation of the
  • heat sink is centrally attached to a rotating component to be cooled, it itself acts as a blower, making additional measures for forced ventilation unnecessary.
  • the surface / volume ratio can be increased for all the variants described above while simultaneously reducing the flow resistance in that the sintered matrix is divided into several levels by thin sintered matrix ceilings arranged parallel to the base plate .
  • the meandering sintered matrix walls are in each level is offset from one another so that their transverse walls are each above openings formed by the meandering sintered matrix wall immediately below.
  • a thin sintered, meandering sintered matrix wall is arranged between a base plate serving as a carrier and heat distribution plate and a cover plate in such a way that the flat parts of the transverse walls on one side with the base plate and are connected on the other side to the cover plate.
  • the channels formed with the cover plate are closed on the front side by sintered matrix parts, while the channels formed with the base plate are open at their front ends and form the outlet openings for the coolant.
  • the inlet opening for the coolant is formed by a recess in the cover plate, which is arranged there in relation to the extent of the longitudinal walls and extends over the entire width of the heat sink.
  • the transverse walls of the sintered matrix wall cannot generally be flowed through in this aforementioned variant, it is expedient to increase the usable surface area so that the transverse walls are designed with the smallest possible expansion.
  • the transverse walls are omitted in this variant of the invention, since the longitudinal walls are connected directly to one another and to the cover or base plate and thus result in a sawtooth structure of the sintered matrix wall.
  • cover plate itself is designed as a thin sintered matrix and can therefore be flowed through.
  • a recess forming the entry opening in the cover plate can, if necessary. omitted.
  • the sintered heat sink is made of
  • Sintered powders with a particle size of 20 to 600 ⁇ m are built up, whereby the best reproducibility is achieved with spherical particles.
  • Aluminum, copper or silver is particularly suitable as the sintered material.
  • Wall thicknesses of 0.5 to 3 mm and distances between the sintered matrix walls of 0.5 to 10 mm have proven to be advantageous dimensions for the sintered matrix walls.
  • Such fine structure sizes of 500 ⁇ m can be produced using new sintering processes, such as laser sintering.
  • a surface / volume ratio of up to a maximum of 500 cm 2 / cm 3 can be achieved.
  • At least the longitudinal walls of the sintered matrix walls are made thicker in the area of the base plate than in their areas further away from the base plate.
  • a continuous course results in a wedge-shaped cross section of the longitudinal walls.
  • the sintered matrix walls are formed from several layers with sintered powder of different particle sizes.
  • the area adjacent to the base plate has the smallest and more distant layers of larger particles.
  • the particles of the sintered matrix are sintered to one another to a greater extent in the region of the base plate than in regions which are further away from the base plate.
  • Variants to improve the heat conduction of the sintered matrix can be used in combination.
  • a wedge-shaped cross section can be realized, in whose lower area, which is closest to the base plate, the sintering is higher than in the areas above it. This has the advantage that the wedge shape does not have to be so strong in order to improve the thermal conductivity.
  • a further improvement of the heat sink according to the invention in particular if forced ventilation with coolant of higher pressure is to take place, is further possible in that the sintered matrix has a sintered chamber at the inlet opening in order to relax and distribute the coolant. If the coolant is from a compressor or other compressed air Provided source, it is useful that a connection element for the coolant is sintered to the chamber.
  • FIG. 2 shows a heat sink according to FIG. 1 in section parallel to the base plate
  • Fig. 4 shows a heat sink in the form of a cylinder ring
  • Fig. 5 is an axial section through a heat sink in the form of a cylinder ring
  • FIG. 6 is a perspective view of a heat sink in cubic form with a meandering matrix for a cooling air flow supplied perpendicular to the base plate,
  • FIG. 9 shows a greatly enlarged illustration of a sintered matrix wall with areas of different degrees of sintering
  • Fig. 10 Schematic representation of a heat sink with sintered expansion and distribution chamber and a sintered compressed air connection element.
  • FIG. 1 shows a heat sink according to the invention in a perspective view.
  • Sintered matrix walls 2 which also consist of copper, are arranged on a base plate 1 made of copper.
  • the base plate 1 is designed as a carrier and heat distribution plate for an electronic component, not shown.
  • the heat sink is laterally covered by the wall elements 4.
  • the base plate 1, the cover plate 3 and the wall elements 4 delimit the cooling air inlet side 5 and the cooling air outlet side 6 of the heat sink.
  • FIG. 2 shows a section A-A through the heat sink according to FIG. 1.
  • the section is parallel to the base plate 1.
  • the thin, porous sintered matrix wall 2 consists of a continuous series of longitudinal walls 7 and transverse walls 8.
  • the longitudinal walls 7 are arranged approximately in the direction of flow of the coolant and the transverse walls 8 are arranged perpendicularly thereto.
  • the cooling air inlet side 5 is separated from the cooling air outlet side 6 with the meandering sintered matrix wall 2, the base plate 1 and the cover plate 3.
  • the cooling air therefore flows inevitably from the cooling air inlet side 5 via the channels 9 formed between the longitudinal walls 7, through longitudinal walls 7 into the adjacent channels 10 and from there to the cooling air outlet side 6.
  • the cooling air can also directly from the cooling air inlet side 5 via the transverse walls 8 into the channels 10 leading to the cooling air outlet side 6, or flow out of the channels 9 directly via the transverse walls 10 bordering the cooling air outlet side 6.
  • the channels 9 formed by the longitudinal walls 7 have on the cooling air inlet side 5 the largest and on the cooling air outlet side 6 the smallest clear width.
  • the channels 10, however, have the smallest clear width on the cooling air inlet side 5 and the largest clear width on the side of the cooling air outlet side 6.
  • transverse walls 8 are so wide in at least two places that fastening elements, for example for an air fan, can be arranged at these points
  • the sintered matrix wall 2 is made of approximately spherical particles with a diameter of approximately 450 ⁇ m and a wall thickness of approximately 1 mm, forced ventilation with a pressure of 20 Pa, a heat sink temperature of 39 ° C and an ambient temperature of 20 ° C can be used a heat output of 100 W can be dissipated over a heat sink volume of 1170 cm 3 . This is significantly more than with conventional heat sinks made from extruded aluminum profiles under the same conditions.
  • the representation is greatly simplified.
  • the longitudinal walls 7 and transverse walls 8 are arranged in a continuous sequence in a first plane 11 in such a way that an open channel 9 lies on the cooling air inlet side 5 next to a channel 10 closed by a transverse wall 8.
  • the arrangement of the longitudinal walls 7 and transverse walls 8 on the cooling air inlet side 5 is such that a channel 10 closed with a transverse wall 8 lies above an open channel 9 of the level below.
  • the channels 10 are open and the channels 9 with transverse walls 8 closed.
  • the longitudinal walls 7 are arranged congruently across all levels 11.
  • the transverse walls 8 are only congruently arranged in every second plane 11.
  • the cooling air which flows into the channels 9 on the cooling air inlet side 5 can flow via the longitudinal walls 7 and sintered matrix ceilings 12 into the respective adjacent channels 10 and from there to the cooling air outlet side 6.
  • the flow path of the cooling air is symbolized by the streamlined arrows 13.
  • the cooling air can also flow directly into the channels 10 from the cooling air inlet side 5 via the transverse walls 8, or can reach the cooling air outlet side 6 directly from the channels 9 via the transverse walls 8.
  • FIG. 4 shows a heat sink according to the invention in the form of a cylinder ring.
  • the meandering sintered matrix wall 2 is arranged between a circular base plate 1 here and an annular cover plate 3.
  • the inner surface of the cylinder ring forms the cooling air inlet side 5 and the outer surface of the cylinder ring forms the cooling air outlet side 6 of the heat sink.
  • FIG. 5 shows the course of the sintered matrix wall 2 in a radial section BB through the cylindrical ring-shaped heat sink according to FIG. 4.
  • the longitudinal walls 7 of the sintered matrix wall 2 run on a straight line which, at the point of intersection with the inner surface of the cylinder ring, has an angle ⁇ of 55 ° with a radial 14 running through this point.
  • the longitudinal walls 7 are mutually connected on the cooling air inlet side 5 and the cooling air outlet side 6 to the transverse walls 8 and thus form the channels 9 closed on the cooling air inlet side 5 and the channels 10 closed on the cooling air outlet side 6.
  • the flow path of the cooling air is symbolized by the streamlined arrows 13.
  • Such a cylindrical ring-shaped heat sink is mounted centrally on a rotating object to be cooled, it itself acts as a blower, sucking in the cooling air via the cooling air inlet side 5 and blowing it out via the cooling air outlet side 6. Under favorable conditions, additional forced ventilation can be dispensed with in such a heat sink.
  • Fig. 6 shows a heat sink in cubic form, which is an advantageous embodiment for applications in which the cooling air is to be supplied perpendicular to the base plate 1.
  • the sintered matrix wall 2 is not connected to the end faces, but rather to the transverse walls 8 with the base plate 1 or with the cover plate 3.
  • the transverse walls 8 are made very short so as not to reduce the cross-section through which the flow can flow, because at the points at which the sintered matrix wall 2 is connected to the cover plate 3 or the base plate 1, the cooling air cannot flow through the sintered matrix wall.
  • the sintered matrix walls 2 form the channels 9 together with the cover plate 3 and, in conjunction with the base plate 1, the channels 10.
  • the cover plate 3 has a recess which extends over the entire width of the heat sink and forms the cooling air inlet side 5.
  • the channels 9 are on the cooling air outlet sides 6 with the
  • Sintered matrix parts 15 closed, the channels 10, however, open.
  • the cooling air flows from the cooling air inlet side 5 into the channels 9, from there through the sintered matrix walls 2 into the channels 10 and from there to the cooling air outlet side 6.
  • the flow path of the cooling air is symbolized by the streamlined arrows 13.
  • the cooling air can also pass directly from the channels 9 to the cooling air outlet side 6 via the sintered matrix parts 15.
  • FIG. 7 shows a wedge-shaped sintered matrix wall 2.
  • the heat conduction of this sintered matrix wall 2 is improved by this wedge shape.
  • the thermal conductivity is greater there and at the same time the heat dissipation is reduced because of the higher flow resistance.
  • the dimensioning of the wall thickness of the sintered matrix wall 2 takes place in such a way that in the area of the sintered matrix wall 2 facing away from the base plate 1, depending on the circumstances, the heat conduction and heat dissipation are approximately balanced. In the areas of the sintered matrix wall 2 closer to the base plate 1, the heat conduction outweighs the heat dissipation.
  • FIG. 8 shows a detail of a sintered matrix wall 2 which is arranged on the base plate 1 of a heat sink and is divided into four regions 16a to 16d.
  • a sinter powder with different particle diameters is used in each of these areas 16a to 16d.
  • the sintered powder with the smallest particle size is arranged in the region 16a and sintered powder with larger particles in each of the subsequent regions 16b to 16c.
  • the optimum sinter powder for the air pressure present in the application is the sinter powder with the largest particles in the 16d range. This means that the particle diameter for this area 16d is selected such that heat conduction and heat dissipation are approximately in equilibrium.
  • the sintered matrix wall 2 can be designed higher than a comparable sintered matrix wall 2 with uniformly large particles.
  • FIG. 9 finally shows a detail of a heat sink according to the invention in which the heat sinks arranged on the base plate 1
  • Sintered matrix wall 2 is divided into four layers 17a to 17d.
  • the sintered powder is sintered to one another to a different degree.
  • the optimum degree of sintering is present, for example, when the particles of the sinter powder are connected to one another via sinter necks, which make up about 30% of the particle diameter. This degree of verse tion is selected for the area 17d.
  • Its structure shows the magnification 17d '.
  • heat conduction and heat emission are then approximately equal in this area 17d.
  • the degree of sintering of the particles is greater in regions 17a to 17c.
  • the sintered necks In the region 17c, the structure of which shows the enlargement 17c, the sintered necks have a diameter of 60% of the particle diameter.
  • area 17b the structure of which shows enlargement 17b ', two to three and in each case form
  • Area 17a the structure of which shows enlargement 17a ', four to five particles of a conglomerate.
  • the heat conduction outweighs the heat dissipation in the regions 17a to 17c.
  • the overall height and thus the overall performance of the heat sink according to the invention can be increased.
  • Fig. 10 finally shows the cooling air inlet side 5 of a cubic sintered heat sink.
  • a chamber 18 for relaxing and distributing the cooling air is sintered in front of the cooling air inlet side 5.
  • the chamber 18 has a sintered pneumatic coupling 19 for the connection of a compressed air line. This arrangement can, using the
  • Laser sintering process can be produced in one operation with the heat sink. Despite relatively high expenditure for the necessary technological equipment, it is inexpensive to manufacture.
  • the invention is not tied to these exemplary embodiments. In particular, it is possible to use the sintered heat sink for heating components.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Dissipateur de chaleur fritté destiné à une utilisation générale, qui possède un rapport très élevé surfaces/volume allant jusqu'à 500 cm<3>/cm<2> et qui permet de dissiper de très grandes quantités de chaleur. Pour l'essentiel, le dissipateur de chaleur selon la présente invention se compose d'une matrice frittée constituée de parois minces sinueuses qui sont disposées entre une plaque de fond et une plaque de couverture. Les parois de la matrice frittée forment donc entre elles une pluralité de canaux par lesquels le liquide de refroidissement peut parvenir jusqu'aux surfaces très importantes des minces parois frittées de la matrice, avec des pertes de pression minimes.
PCT/DE1998/002405 1997-08-20 1998-08-18 Dissipateur de chaleur fritte Ceased WO1999009594A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU95311/98A AU9531198A (en) 1997-08-20 1998-08-18 Sintered heat sink

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE29714730U DE29714730U1 (de) 1997-08-20 1997-08-20 Kühlkörper, insbesondere für elektronische Bauelemente
DE29714730.7 1997-08-20
DE29814078U DE29814078U1 (de) 1998-08-08 1998-08-08 Gesinterter Kühlkörper
DE29814078.0 1998-08-08

Publications (1)

Publication Number Publication Date
WO1999009594A1 true WO1999009594A1 (fr) 1999-02-25

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1998/002405 Ceased WO1999009594A1 (fr) 1997-08-20 1998-08-18 Dissipateur de chaleur fritte

Country Status (2)

Country Link
AU (1) AU9531198A (fr)
WO (1) WO1999009594A1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19934554A1 (de) * 1999-07-22 2001-01-25 Michael Stollenwerk Wärmetauscher
EP1525633A2 (fr) * 2002-02-19 2005-04-27 Commissariat A L'energie Atomique STRUCTURE ALV&Eacute;OLAIRE ET PROC&Eacute;D&Eacute; DE FABRICATION D UNE TELLE STRUCTURE.
US6898082B2 (en) 2002-05-10 2005-05-24 Serguei V. Dessiatoun Enhanced heat transfer structure with heat transfer members of variable density
WO2011020665A3 (fr) * 2009-08-18 2012-03-29 Robert Bosch Gmbh Machine électrique
WO2014055323A1 (fr) * 2012-10-01 2014-04-10 Forced Physics Llc Dispositif et procédé de régulation de température
DE10343020B4 (de) * 2003-09-16 2018-01-18 Mayser Holding Gmbh & Co. Kg Kühlkörper, insbesondere für elektronische Bauelemente

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2853951A1 (de) * 1978-12-14 1980-07-03 Demetron Kontaktplatte fuer halbleiter-bauelemente
JPS58125855A (ja) * 1982-01-21 1983-07-27 Matsushita Electric Works Ltd 半導体素子の冷却構造
CA1238428A (fr) * 1987-08-21 1988-06-21 John J. Kost Boitier de circuit integre a dissipation de chaleur accrue
CA1261482A (fr) * 1988-06-22 1989-09-26 John J. Kost Boitier autonome pour circuits integres a transfert thermique
EP0510734A1 (fr) * 1991-02-20 1992-10-28 Akzo Nobel N.V. Corps d'échange de chaleur, en particulier pour le refroidissement d'un module semi-conducteur
WO1995023951A1 (fr) * 1994-03-04 1995-09-08 A. Bromberg & Co. Ltd. Element thermorayonnant

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2853951A1 (de) * 1978-12-14 1980-07-03 Demetron Kontaktplatte fuer halbleiter-bauelemente
JPS58125855A (ja) * 1982-01-21 1983-07-27 Matsushita Electric Works Ltd 半導体素子の冷却構造
CA1238428A (fr) * 1987-08-21 1988-06-21 John J. Kost Boitier de circuit integre a dissipation de chaleur accrue
CA1261482A (fr) * 1988-06-22 1989-09-26 John J. Kost Boitier autonome pour circuits integres a transfert thermique
EP0510734A1 (fr) * 1991-02-20 1992-10-28 Akzo Nobel N.V. Corps d'échange de chaleur, en particulier pour le refroidissement d'un module semi-conducteur
WO1995023951A1 (fr) * 1994-03-04 1995-09-08 A. Bromberg & Co. Ltd. Element thermorayonnant

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 007, no. 236 (E - 205) 20 October 1983 (1983-10-20) *

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19934554A1 (de) * 1999-07-22 2001-01-25 Michael Stollenwerk Wärmetauscher
WO2001007858A1 (fr) 1999-07-22 2001-02-01 Michael Stollenwerk Echangeur de chaleur
US6799428B1 (en) 1999-07-22 2004-10-05 Michael Stollenwerk Heat exchanger
EP1525633A2 (fr) * 2002-02-19 2005-04-27 Commissariat A L'energie Atomique STRUCTURE ALV&Eacute;OLAIRE ET PROC&Eacute;D&Eacute; DE FABRICATION D UNE TELLE STRUCTURE.
US6898082B2 (en) 2002-05-10 2005-05-24 Serguei V. Dessiatoun Enhanced heat transfer structure with heat transfer members of variable density
DE10343020B4 (de) * 2003-09-16 2018-01-18 Mayser Holding Gmbh & Co. Kg Kühlkörper, insbesondere für elektronische Bauelemente
CN102577047A (zh) * 2009-08-18 2012-07-11 罗伯特·博世有限公司 电机
US9000719B2 (en) 2009-08-18 2015-04-07 Robert Bosch Gmbh Electric machine
WO2011020665A3 (fr) * 2009-08-18 2012-03-29 Robert Bosch Gmbh Machine électrique
WO2014055323A1 (fr) * 2012-10-01 2014-04-10 Forced Physics Llc Dispositif et procédé de régulation de température
US10393409B2 (en) 2012-10-01 2019-08-27 Forced Physics, Llc Device and method for temperature control
US10677497B2 (en) 2012-10-01 2020-06-09 Forced Physics, Llc Device and method for temperature control
EP3944307A1 (fr) * 2012-10-01 2022-01-26 Forced Physics Llc Dispositif pour contrôler la temperature

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