AU9531198A - Sintered heat sink - Google Patents
Sintered heat sinkInfo
- Publication number
- AU9531198A AU9531198A AU95311/98A AU9531198A AU9531198A AU 9531198 A AU9531198 A AU 9531198A AU 95311/98 A AU95311/98 A AU 95311/98A AU 9531198 A AU9531198 A AU 9531198A AU 9531198 A AU9531198 A AU 9531198A
- Authority
- AU
- Australia
- Prior art keywords
- heat sink
- sintered heat
- sintered
- sink
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/003—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
-
- H10W40/257—
-
- H10W40/43—
-
- H10W40/47—
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
- F28F2255/18—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes sintered
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE29714730U DE29714730U1 (en) | 1997-08-20 | 1997-08-20 | Heatsinks, in particular for electronic components |
| DE29714730 | 1997-08-20 | ||
| DE29814078U DE29814078U1 (en) | 1998-08-08 | 1998-08-08 | Sintered heat sink |
| DE29814078 | 1998-08-08 | ||
| PCT/DE1998/002405 WO1999009594A1 (en) | 1997-08-20 | 1998-08-18 | Sintered heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU9531198A true AU9531198A (en) | 1999-03-08 |
Family
ID=26060629
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU95311/98A Abandoned AU9531198A (en) | 1997-08-20 | 1998-08-18 | Sintered heat sink |
Country Status (2)
| Country | Link |
|---|---|
| AU (1) | AU9531198A (en) |
| WO (1) | WO1999009594A1 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19934554A1 (en) | 1999-07-22 | 2001-01-25 | Michael Stollenwerk | Heat exchanger has cooling body with channel structure for introducing the cooling medium |
| FR2836282B1 (en) * | 2002-02-19 | 2004-04-02 | Commissariat Energie Atomique | ALVEOLAR STRUCTURE AND METHOD OF MANUFACTURING SUCH A STRUCTURE |
| US6898082B2 (en) | 2002-05-10 | 2005-05-24 | Serguei V. Dessiatoun | Enhanced heat transfer structure with heat transfer members of variable density |
| DE10343020B4 (en) * | 2003-09-16 | 2018-01-18 | Mayser Holding Gmbh & Co. Kg | Heatsink, especially for electronic components |
| DE102009028605A1 (en) | 2009-08-18 | 2011-02-24 | Robert Bosch Gmbh | Electric machine |
| SG11201502447VA (en) * | 2012-10-01 | 2015-04-29 | Forced Physics Llc | Device and method for temperature control |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2853951A1 (en) * | 1978-12-14 | 1980-07-03 | Demetron | Contact plate for semiconductor devices or chips - uses porous copper or silver plate covered on both sides with non-porous metal layers |
| JPS58125855A (en) * | 1982-01-21 | 1983-07-27 | Matsushita Electric Works Ltd | Cooling structure of semiconductor element |
| CA1238428A (en) * | 1987-08-21 | 1988-06-21 | John J. Kost | Thermally enhanced integrated circuit carrier package |
| CA1261482A (en) * | 1988-06-22 | 1989-09-26 | John J. Kost | Self-contained thermal transfer integrated circuit carrier package |
| EP0510734A1 (en) * | 1991-02-20 | 1992-10-28 | Akzo Nobel N.V. | Heat exchanging member, more particularly for cooling a semiconductor module |
| IL108860A (en) * | 1994-03-04 | 1998-10-30 | Elisra Gan Ltd | Heat radiating element |
-
1998
- 1998-08-18 WO PCT/DE1998/002405 patent/WO1999009594A1/en not_active Ceased
- 1998-08-18 AU AU95311/98A patent/AU9531198A/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| WO1999009594A1 (en) | 1999-02-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |