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WO1996032742A1 - Installation destinee au traitement par flux plasmiques de plaques - Google Patents

Installation destinee au traitement par flux plasmiques de plaques Download PDF

Info

Publication number
WO1996032742A1
WO1996032742A1 PCT/RU1995/000064 RU9500064W WO9632742A1 WO 1996032742 A1 WO1996032742 A1 WO 1996032742A1 RU 9500064 W RU9500064 W RU 9500064W WO 9632742 A1 WO9632742 A1 WO 9632742A1
Authority
WO
WIPO (PCT)
Prior art keywords
plasma
corner
generator
πlasτin
owner
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/RU1995/000064
Other languages
English (en)
Russian (ru)
Other versions
WO1996032742A9 (fr
Inventor
Oleg Vyacheslavovich Sinyagin
Iskander Malikovich Tokmulin
Nikolai Alexandrovich Lavrentiev
Sergei Jurievich Matsak
Alexandr Mikhailovich Antropov
Vyacheslav Alexeevich Arkhangelsky
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zakrytoe Aktsionernoe Obschestvo Nauchno-Proizvodstvennaya 'az' Firma
Original Assignee
Zakrytoe Aktsionernoe Obschestvo Nauchno-Proizvodstvennaya 'az' Firma
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zakrytoe Aktsionernoe Obschestvo Nauchno-Proizvodstvennaya 'az' Firma filed Critical Zakrytoe Aktsionernoe Obschestvo Nauchno-Proizvodstvennaya 'az' Firma
Priority to PCT/RU1995/000064 priority Critical patent/WO1996032742A1/fr
Publication of WO1996032742A1 publication Critical patent/WO1996032742A1/fr
Publication of WO1996032742A9 publication Critical patent/WO1996032742A9/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H10P72/3411—
    • G—PHYSICS
    • G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
    • G21K—TECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
    • G21K5/00—Irradiation devices
    • G21K5/10—Irradiation devices with provision for relative movement of beam source and object to be irradiated

Definitions

  • Theme of management by the delivery of the owners of the plastics.
  • the owners of the plaques are secured on the wheels, which are strictly connected with the vertical shaft of the output.
  • the plasma generator is mounted with a separate indoor and outdoor unit, and its plasma is sprayed
  • the cost-effectiveness of the device is the low energy efficiency.
  • ⁇ ⁇ P ⁇ - - 2 - First of all, at the same time the energy of the plasma is consumed by the user, in general, by the way, there is a greater incidence of the incidence of the disease.
  • ⁇ nee ⁇ e ⁇ ivn ⁇ s ⁇ i is ⁇ lz ⁇ vaniya e ⁇ e ⁇ gii sledue ⁇ ⁇ a ⁇ zhe ⁇ ne- 5 s ⁇ i ⁇ , ch ⁇ ⁇ i ⁇ azhd ⁇ m edinichn ⁇ m v ⁇ zdeys ⁇ vii ⁇ lazmy snechala Part ene ⁇ gii ⁇ a ⁇ i ⁇ sya on ⁇ edva ⁇ i ⁇ elny nag ⁇ ev ⁇ ve ⁇ n ⁇ s ⁇ i ⁇ las ⁇ iny d ⁇ ⁇ em ⁇ e ⁇ a ⁇ u ⁇ y, ⁇ i ⁇ y na.chinayu ⁇ sya ⁇ ebue- mye ⁇ izi ⁇ - ⁇ imiches ⁇ i
  • Improving the capture of the manipulator with the possibility of turning 15 ° by 180 ° means that it is not only expensive, but it also allows for two-way treatment.
  • the replenishment of the owner of the channel for the extraction of gas and the use of non-compliant discharges in use will increase the power of holding the plates apart from the rotation of the holder. There is a 20% reduction in pressure of the inside of the medium, which is caused by exhaust gas through the use of centrifugal forces. A good execution of the agent does not result in the release of the plate.
  • the replenishment of the holder with the outlet for gas supply results in 25 times keeping the plate parallel to the bottom of the holder with a low gas charge ( ⁇ C, 5 mm).
  • the equidistant owners of the carrier exclude the possibility of shifting the plate when they are unloaded and disconnected, due to this, The quality is improving.
  • FIG. I - a device is deprecated for a plasma processing device and a plate.
  • 35 ⁇ a ⁇ ig. 2 - a general view of the elements inside the camera.
  • ⁇ a ⁇ ig. 3 the owner of the region ( ⁇ -th version).
  • ⁇ ⁇ ig. 4 - the owner of the plastish (2nd ve ⁇ a ⁇ ig. 5 is a diagram explaining the complications of the placement of a plasma plasma generator.
  • Fig. I contains a closed-circuit camera I with a system of 2 gas exchanges, a system of 3 power supply systems, a gas supply system 4.
  • the shaft 10 is connected with ⁇ g ⁇ de ⁇ zha ⁇ elyami II, tse ⁇ va ⁇ eli 12 and 13 for na ⁇ i ⁇ eli ⁇ b ⁇ aba ⁇ yveemy ⁇ ⁇ las ⁇ in.
  • Components II (Fig. 2) are placed with a 6 ⁇ standard pitch ⁇ -
  • Each host 12 is made in the form of a horizontal area 18 with a limiter 19, which are installed in the same way as the equipments of the plate.
  • Territory 18
  • the 20 is related to Act 2C, with its vertical return-and-forth movement.
  • the owners of 12 are installed with a right step, a short 6D, with a positive shaft from the outlet 9 of the supply of the owners II.
  • Duty II may be a discharge, for example, in the form of a horizontal service 31 with an emergency 32, but an emergency switch, but a Lateral disengagement of the breech was done 34 for gas exhaust through the operation of circuits of military forces
  • Product II (Fig. 4) can be made in the form of a horizontal area 35 with restraints 36 at the edges installed by the equipmen- tals that are installed. 5 35 Area 35 completed 37 for connection to the gas supply system.
  • the installation for a plasma processing tool works with the following process.
  • the ZS plate is placed on the host 12th downstairs, which is necessary for processing. There are 10 downloads to the ZS for downloading, but with a total of 14 owners II, they rely on the center of mass of the owner 12 and are free of charge.
  • 20 takes host 12 with a flat AP for access to the upper surface of an AP with a working environment II. Turns off the agent II, who quickly closes the plestin of the AP.
  • a user guide performed by fig. 3 ⁇ gda of neg ⁇ ⁇ s ⁇ eds ⁇ v ⁇ m ⁇ anala 33 ⁇ izv ⁇ di ⁇ - Xia ⁇ ach ⁇ e v ⁇ zdu ⁇ a, na ⁇ ime ⁇ , va ⁇ uumnym nas ⁇ s ⁇ m (on che ⁇ ezhe not ⁇ azan) ⁇ las ⁇ ina AP ⁇ ili ⁇ ae ⁇ ⁇ ⁇ tsev ⁇ y ⁇ ve ⁇ n ⁇ s ⁇ i b ⁇ a 32.
  • the switch is operated by turning 9 and turning the shaft 10 at a 120 ° angle to ensure that the given linear velocity of the plate is not affected by the “ ⁇ ” I m / sec.
  • ⁇ a ⁇ ⁇ a ⁇ de ⁇ zha ⁇ el II na ⁇ di ⁇ sya Ned tsen ⁇ va ⁇ elem 12, ⁇ for e ⁇ g ⁇ ⁇ dnimaga ⁇ tsen ⁇ va ⁇ el 12 vve ⁇ , ch ⁇ by lower ⁇ - ve ⁇ n ⁇ s ⁇ ⁇ las ⁇ iny 30 s ⁇ i ⁇ snulas with ve ⁇ ney ⁇ ve ⁇ n ⁇ s ⁇ y ⁇ tsen ⁇ va ⁇ elya 12.
  • the plate 30 is lowered into the host 12. Then, the middle 12 is lowered and removed from the middle 30.
  • the switch With a sew of 26, the switch is 24, along with a flat charger, it is rotated 180 ° from the other side, and the plug-in is plugged in and the room is plugged in. After processing the one-sided platform, the AP is downloaded to the host 12, it takes 24 from the center

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Apparatus For Radiation Diagnosis (AREA)

Abstract

Cette invention a trait à des opérations de traitement plasmique d'articles plats, par exemple, de plaques dans les domaines de l'électrotechnique et de l'électronique. Cette invention concerne essentiellement une installation destinée au traitement par flux plasmique de plaques, laquelle comprend un dispositif de rotation d'un support (11), un générateur (7) de plasma, des dispositifs de centrage (12) et des unités de stockage (13), ces éléments étant disposés dans une chambre close (1). La plaque devant être traitée (30) est retirée de l'unité de stockage (13), puis placée sur le dispositif de centrage (12). La plaque est ensuite saisie par le support (11) qui, en tournant avec elle autour de son axe, passera au dessus du générateur (7) de plasma, lequel traitera ladite plaque. Ce cycle peut se répéter un nombre de fois prédéterminé.
PCT/RU1995/000064 1995-04-11 1995-04-11 Installation destinee au traitement par flux plasmiques de plaques Ceased WO1996032742A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/RU1995/000064 WO1996032742A1 (fr) 1995-04-11 1995-04-11 Installation destinee au traitement par flux plasmiques de plaques

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/RU1995/000064 WO1996032742A1 (fr) 1995-04-11 1995-04-11 Installation destinee au traitement par flux plasmiques de plaques

Publications (2)

Publication Number Publication Date
WO1996032742A1 true WO1996032742A1 (fr) 1996-10-17
WO1996032742A9 WO1996032742A9 (fr) 1997-01-23

Family

ID=20129917

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/RU1995/000064 Ceased WO1996032742A1 (fr) 1995-04-11 1995-04-11 Installation destinee au traitement par flux plasmiques de plaques

Country Status (1)

Country Link
WO (1) WO1996032742A1 (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5767627A (en) * 1997-01-09 1998-06-16 Trusi Technologies, Llc Plasma generation and plasma processing of materials
US6105534A (en) * 1996-05-31 2000-08-22 Ipec Precision, Inc. Apparatus for plasma jet treatment of substrates
WO2000070659A1 (fr) * 1999-05-19 2000-11-23 Trusi Technologies, Llc Procedes et appareil de traitement au plasma
EP1030788A4 (fr) * 1997-11-20 2001-02-28 Trusi Technologies Llc Procedes et appareils de traitement au plasma
US6423923B1 (en) 2000-08-04 2002-07-23 Tru-Si Technologies, Inc. Monitoring and controlling separate plasma jets to achieve desired properties in a combined stream
US6749764B1 (en) 2000-11-14 2004-06-15 Tru-Si Technologies, Inc. Plasma processing comprising three rotational motions of an article being processed
CN103165500A (zh) * 2011-12-15 2013-06-19 江南大学 多臂轻质芯片供送机构

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0044567A1 (fr) * 1980-07-23 1982-01-27 Siemens Aktiengesellschaft Procédé de décapage d'une face de tranches de semiconducteurs
EP0140755A2 (fr) * 1983-09-30 1985-05-08 Fujitsu Limited Appareil de contrôle de plasma pour la fabrication de IC
WO1992021220A1 (fr) * 1991-05-24 1992-11-26 Opa (Overseas Publishers Association) Amsterdam, B.V. Appareil de traitement d'un corps solide

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0044567A1 (fr) * 1980-07-23 1982-01-27 Siemens Aktiengesellschaft Procédé de décapage d'une face de tranches de semiconducteurs
EP0140755A2 (fr) * 1983-09-30 1985-05-08 Fujitsu Limited Appareil de contrôle de plasma pour la fabrication de IC
WO1992021220A1 (fr) * 1991-05-24 1992-11-26 Opa (Overseas Publishers Association) Amsterdam, B.V. Appareil de traitement d'un corps solide

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6105534A (en) * 1996-05-31 2000-08-22 Ipec Precision, Inc. Apparatus for plasma jet treatment of substrates
US5767627A (en) * 1997-01-09 1998-06-16 Trusi Technologies, Llc Plasma generation and plasma processing of materials
EP1030788A4 (fr) * 1997-11-20 2001-02-28 Trusi Technologies Llc Procedes et appareils de traitement au plasma
US6323134B1 (en) 1997-11-20 2001-11-27 Tru-Si Technologies, Inc. Plasma processing methods and apparatus
US7179397B2 (en) 1997-11-20 2007-02-20 Tru-Si Technologies, Inc. Plasma processing methods and apparatus
WO2000070659A1 (fr) * 1999-05-19 2000-11-23 Trusi Technologies, Llc Procedes et appareil de traitement au plasma
US6261375B1 (en) 1999-05-19 2001-07-17 Tru-Si Technologies, Inc. Plasma processing methods and apparatus
US6287976B1 (en) 1999-05-19 2001-09-11 Tru-Si Technologies, Inc. Plasma processing methods and apparatus
US6423923B1 (en) 2000-08-04 2002-07-23 Tru-Si Technologies, Inc. Monitoring and controlling separate plasma jets to achieve desired properties in a combined stream
US6541729B2 (en) 2000-08-04 2003-04-01 Tru-Si Technologies, Inc. Monitoring and controlling separate plasma jets to achieve desired properties in a combined stream
US6749764B1 (en) 2000-11-14 2004-06-15 Tru-Si Technologies, Inc. Plasma processing comprising three rotational motions of an article being processed
CN103165500A (zh) * 2011-12-15 2013-06-19 江南大学 多臂轻质芯片供送机构

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