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USD674760S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD674760S1
USD674760S1 US29/399,979 US201129399979F USD674760S US D674760 S1 USD674760 S1 US D674760S1 US 201129399979 F US201129399979 F US 201129399979F US D674760 S USD674760 S US D674760S
Authority
US
United States
Prior art keywords
semiconductor device
view
top plan
ornamental design
perspective
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/399,979
Inventor
Eiji Mochizuki
Toshio Denta
Tadanori YAMADA
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Assigned to FUJI ELECTRIC CO., LTD. reassignment FUJI ELECTRIC CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: DENTA, Toshio, YAMADA, TADANORI, MOCHIZUKI, EIJI
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Publication of USD674760S1 publication Critical patent/USD674760S1/en
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Description

FIG. 1 is a perspective view of front, top plan and right side of a semiconductor device showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof.
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom view thereof; and,
FIG. 8 is a cross-sectional view taken along line 8-8 in FIG. 2 view omitting interior mechanism thereof.

Claims (1)

  1. The ornamental design for a semiconductor device, as shown and described.
US29/399,979 2011-04-01 2011-08-22 Semiconductor device Active USD674760S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPD2011-007641 2011-04-01
JP2011007641 2011-04-01

Publications (1)

Publication Number Publication Date
USD674760S1 true USD674760S1 (en) 2013-01-22

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Family Applications (1)

Application Number Title Priority Date Filing Date
US29/399,979 Active USD674760S1 (en) 2011-04-01 2011-08-22 Semiconductor device

Country Status (1)

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US (1) USD674760S1 (en)

Cited By (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD689833S1 (en) * 2011-05-19 2013-09-17 Fuji Electric Co., Ltd. Semiconductor device
USD693318S1 (en) * 2011-10-27 2013-11-12 Sumitomo Electric Industries, Ltd. Semiconductor module for power conversion
USD703625S1 (en) * 2012-12-06 2014-04-29 Samsung Electro-Mechanics Co., Ltd. Power semiconductor module
USD705184S1 (en) * 2013-07-11 2014-05-20 Fuji Electric Co., Ltd. Semiconductor module
USD717253S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717256S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717254S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717255S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719113S1 (en) * 2012-09-20 2014-12-09 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719537S1 (en) * 2013-05-08 2014-12-16 Mitsubishi Electric Corporation Semiconductor device
USD719926S1 (en) * 2012-09-20 2014-12-23 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD721048S1 (en) * 2013-06-17 2015-01-13 Fuji Electric Co., Ltd. Semiconductor module
USD721340S1 (en) * 2012-12-21 2015-01-20 Fuji Electric Co., Ltd. Semiconductor module
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
USD748595S1 (en) * 2015-02-03 2016-02-02 Infineon Technologies Ag Power semiconductor module
USD754084S1 (en) * 2013-08-21 2016-04-19 Mitsubishi Electric Corporation Semiconductor device
USD755742S1 (en) * 2015-02-18 2016-05-10 Semiconductor Components Industries, Llc Power device package
USD755741S1 (en) * 2015-02-18 2016-05-10 Semiconductor Components Industries, Llc Power device package
USD759604S1 (en) * 2015-06-17 2016-06-21 Mitsubishi Electric Corporation Semiconductor device
USD761746S1 (en) * 2014-11-04 2016-07-19 Sumitomo Electric Industries, Ltd. Semiconductor module for power conversion
USD762597S1 (en) 2014-08-07 2016-08-02 Infineon Technologies Ag Power semiconductor module
USD770994S1 (en) * 2014-04-02 2016-11-08 Mitsubishi Electric Corporation Power semiconductor device
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD845906S1 (en) * 2017-03-09 2019-04-16 Sendyne Corporation Electrical shunt
USD856947S1 (en) * 2017-10-19 2019-08-20 Rohm Co., Ltd. Semiconductor device
USD893439S1 (en) * 2018-05-07 2020-08-18 Adura Led Solutions Llc Circuit board having arrangements of light-emitting diodes
USD900759S1 (en) * 2018-11-07 2020-11-03 Rohm Co., Ltd. Semiconductor device
USD902164S1 (en) * 2019-01-24 2020-11-17 Toshiba Memory Corporation Integrated circuit card
USD903613S1 (en) 2018-06-26 2020-12-01 Rohm Co., Ltd. Semiconductor module
USD906273S1 (en) * 2018-11-07 2020-12-29 Rohm Co., Ltd. Semiconductor device
USD913978S1 (en) * 2018-06-26 2021-03-23 Rohm Co., Ltd. Semiconductor module
USD933618S1 (en) * 2018-10-31 2021-10-19 Asahi Kasei Microdevices Corporation Semiconductor module

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US4994902A (en) * 1988-11-30 1991-02-19 Hitachi, Ltd. Semiconductor devices and electronic system incorporating them
US5444297A (en) * 1992-06-17 1995-08-22 Mitsubishi Denki Kabushiki Kaisha Noise resistant semiconductor power module
USD389808S (en) * 1996-01-09 1998-01-27 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
US20010038143A1 (en) * 1997-06-12 2001-11-08 Yukio Sonobe Power semiconductor module
US6521983B1 (en) * 2000-08-29 2003-02-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device for electric power
US6995461B2 (en) * 2001-07-23 2006-02-07 Fuji Electric Co., Ltd. Semiconductor device
US7425757B2 (en) * 2003-12-22 2008-09-16 Fuji Electric Device Technology Co., Ltd. Semiconductor power module
USD589012S1 (en) * 2008-03-17 2009-03-24 Fuji Electric Device Technology Co., Ltd. Semiconductor device
USD606951S1 (en) * 2008-11-14 2009-12-29 Fuji Electric Device Technology Co, Ltd. Semiconductor device
US7706146B2 (en) * 2006-04-20 2010-04-27 Fairchild Korea Semiconductor Ltd Power system module and method of fabricating the same
US20100149774A1 (en) * 2008-12-17 2010-06-17 Mitsubishi Electric Corporation Semiconductor device
US7868451B2 (en) * 2006-05-30 2011-01-11 Kokusan Denki Co. Ltd. Resin sealing semiconductor device and electronic device using resin sealing semiconductor device
US20110044012A1 (en) * 2006-12-15 2011-02-24 Mitsubishi Electric Corporation Semiconductor device
US8093692B2 (en) * 2007-03-26 2012-01-10 Mitsubishi Electric Corporation Semiconductor device packaging including a power semiconductor element
US8102655B2 (en) * 2007-09-27 2012-01-24 Sanyo Semiconductor Co., Ltd. Circuit device
US8107255B2 (en) * 2007-09-27 2012-01-31 Sanyo Semiconductor Co., Ltd. Circuit device and method of manufacturing the same
USD653634S1 (en) * 2010-10-28 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD653633S1 (en) * 2010-12-14 2012-02-07 Fuji Electric Co., Ltd. Semiconductor

Patent Citations (18)

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US4994902A (en) * 1988-11-30 1991-02-19 Hitachi, Ltd. Semiconductor devices and electronic system incorporating them
US5444297A (en) * 1992-06-17 1995-08-22 Mitsubishi Denki Kabushiki Kaisha Noise resistant semiconductor power module
USD389808S (en) * 1996-01-09 1998-01-27 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
US20010038143A1 (en) * 1997-06-12 2001-11-08 Yukio Sonobe Power semiconductor module
US6521983B1 (en) * 2000-08-29 2003-02-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device for electric power
US6995461B2 (en) * 2001-07-23 2006-02-07 Fuji Electric Co., Ltd. Semiconductor device
US7425757B2 (en) * 2003-12-22 2008-09-16 Fuji Electric Device Technology Co., Ltd. Semiconductor power module
US7706146B2 (en) * 2006-04-20 2010-04-27 Fairchild Korea Semiconductor Ltd Power system module and method of fabricating the same
US7868451B2 (en) * 2006-05-30 2011-01-11 Kokusan Denki Co. Ltd. Resin sealing semiconductor device and electronic device using resin sealing semiconductor device
US20110044012A1 (en) * 2006-12-15 2011-02-24 Mitsubishi Electric Corporation Semiconductor device
US8093692B2 (en) * 2007-03-26 2012-01-10 Mitsubishi Electric Corporation Semiconductor device packaging including a power semiconductor element
US8102655B2 (en) * 2007-09-27 2012-01-24 Sanyo Semiconductor Co., Ltd. Circuit device
US8107255B2 (en) * 2007-09-27 2012-01-31 Sanyo Semiconductor Co., Ltd. Circuit device and method of manufacturing the same
USD589012S1 (en) * 2008-03-17 2009-03-24 Fuji Electric Device Technology Co., Ltd. Semiconductor device
USD606951S1 (en) * 2008-11-14 2009-12-29 Fuji Electric Device Technology Co, Ltd. Semiconductor device
US20100149774A1 (en) * 2008-12-17 2010-06-17 Mitsubishi Electric Corporation Semiconductor device
USD653634S1 (en) * 2010-10-28 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD653633S1 (en) * 2010-12-14 2012-02-07 Fuji Electric Co., Ltd. Semiconductor

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* Cited by examiner, † Cited by third party
Title
Starpower ID—IPM Application Note, Power Modules,. May 17, 2010, Application Note AN Rev.02, Starpower Semiconductor Ltd. pp. 1-71.

Cited By (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD689833S1 (en) * 2011-05-19 2013-09-17 Fuji Electric Co., Ltd. Semiconductor device
USD693318S1 (en) * 2011-10-27 2013-11-12 Sumitomo Electric Industries, Ltd. Semiconductor module for power conversion
USD719926S1 (en) * 2012-09-20 2014-12-23 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717256S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717255S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719113S1 (en) * 2012-09-20 2014-12-09 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717253S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717254S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD703625S1 (en) * 2012-12-06 2014-04-29 Samsung Electro-Mechanics Co., Ltd. Power semiconductor module
USD721340S1 (en) * 2012-12-21 2015-01-20 Fuji Electric Co., Ltd. Semiconductor module
USD719537S1 (en) * 2013-05-08 2014-12-16 Mitsubishi Electric Corporation Semiconductor device
USD769834S1 (en) 2013-05-08 2016-10-25 Mitsubishi Electric Corporation Semiconductor device
USD721048S1 (en) * 2013-06-17 2015-01-13 Fuji Electric Co., Ltd. Semiconductor module
USD705184S1 (en) * 2013-07-11 2014-05-20 Fuji Electric Co., Ltd. Semiconductor module
USD785577S1 (en) 2013-08-21 2017-05-02 Mitsubishi Electric Corporation Semiconductor device
USD805485S1 (en) 2013-08-21 2017-12-19 Mitsubishi Electric Corporation Semiconductor device
USD754084S1 (en) * 2013-08-21 2016-04-19 Mitsubishi Electric Corporation Semiconductor device
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
USD777124S1 (en) * 2014-04-02 2017-01-24 Mitsubishi Electric Corporation Power semiconductor device
USD783550S1 (en) * 2014-04-02 2017-04-11 Mitsubishi Electric Corporation Power semiconductor device
USD770994S1 (en) * 2014-04-02 2016-11-08 Mitsubishi Electric Corporation Power semiconductor device
USD772182S1 (en) * 2014-04-02 2016-11-22 Mitsubishi Electric Corporation Power semiconductor device
USD762597S1 (en) 2014-08-07 2016-08-02 Infineon Technologies Ag Power semiconductor module
USD761746S1 (en) * 2014-11-04 2016-07-19 Sumitomo Electric Industries, Ltd. Semiconductor module for power conversion
USD748595S1 (en) * 2015-02-03 2016-02-02 Infineon Technologies Ag Power semiconductor module
USD755741S1 (en) * 2015-02-18 2016-05-10 Semiconductor Components Industries, Llc Power device package
USD755742S1 (en) * 2015-02-18 2016-05-10 Semiconductor Components Industries, Llc Power device package
USD759604S1 (en) * 2015-06-17 2016-06-21 Mitsubishi Electric Corporation Semiconductor device
USD845906S1 (en) * 2017-03-09 2019-04-16 Sendyne Corporation Electrical shunt
USD856947S1 (en) * 2017-10-19 2019-08-20 Rohm Co., Ltd. Semiconductor device
USD893439S1 (en) * 2018-05-07 2020-08-18 Adura Led Solutions Llc Circuit board having arrangements of light-emitting diodes
USD913978S1 (en) * 2018-06-26 2021-03-23 Rohm Co., Ltd. Semiconductor module
USD903613S1 (en) 2018-06-26 2020-12-01 Rohm Co., Ltd. Semiconductor module
USD1046799S1 (en) 2018-10-31 2024-10-15 Asahi Kasei Microdevices Corporation Semiconductor module
USD933618S1 (en) * 2018-10-31 2021-10-19 Asahi Kasei Microdevices Corporation Semiconductor module
USD900759S1 (en) * 2018-11-07 2020-11-03 Rohm Co., Ltd. Semiconductor device
USD906273S1 (en) * 2018-11-07 2020-12-29 Rohm Co., Ltd. Semiconductor device
USD902164S1 (en) * 2019-01-24 2020-11-17 Toshiba Memory Corporation Integrated circuit card

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