USD674760S1 - Semiconductor device - Google Patents
Semiconductor device Download PDFInfo
- Publication number
- USD674760S1 USD674760S1 US29/399,979 US201129399979F USD674760S US D674760 S1 USD674760 S1 US D674760S1 US 201129399979 F US201129399979 F US 201129399979F US D674760 S USD674760 S US D674760S
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- US
- United States
- Prior art keywords
- semiconductor device
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- ornamental design
- perspective
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Claims (1)
- The ornamental design for a semiconductor device, as shown and described.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2011-007641 | 2011-04-01 | ||
| JP2011007641 | 2011-04-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD674760S1 true USD674760S1 (en) | 2013-01-22 |
Family
ID=47522000
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/399,979 Active USD674760S1 (en) | 2011-04-01 | 2011-08-22 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD674760S1 (en) |
Cited By (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD689833S1 (en) * | 2011-05-19 | 2013-09-17 | Fuji Electric Co., Ltd. | Semiconductor device |
| USD693318S1 (en) * | 2011-10-27 | 2013-11-12 | Sumitomo Electric Industries, Ltd. | Semiconductor module for power conversion |
| USD703625S1 (en) * | 2012-12-06 | 2014-04-29 | Samsung Electro-Mechanics Co., Ltd. | Power semiconductor module |
| USD705184S1 (en) * | 2013-07-11 | 2014-05-20 | Fuji Electric Co., Ltd. | Semiconductor module |
| USD717253S1 (en) * | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD717256S1 (en) * | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD717254S1 (en) * | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD717255S1 (en) * | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD719113S1 (en) * | 2012-09-20 | 2014-12-09 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD719537S1 (en) * | 2013-05-08 | 2014-12-16 | Mitsubishi Electric Corporation | Semiconductor device |
| USD719926S1 (en) * | 2012-09-20 | 2014-12-23 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD721048S1 (en) * | 2013-06-17 | 2015-01-13 | Fuji Electric Co., Ltd. | Semiconductor module |
| USD721340S1 (en) * | 2012-12-21 | 2015-01-20 | Fuji Electric Co., Ltd. | Semiconductor module |
| USD731491S1 (en) * | 2014-02-07 | 2015-06-09 | NimbeLink L.L.C. | Embedded cellular modem |
| USD748595S1 (en) * | 2015-02-03 | 2016-02-02 | Infineon Technologies Ag | Power semiconductor module |
| USD754084S1 (en) * | 2013-08-21 | 2016-04-19 | Mitsubishi Electric Corporation | Semiconductor device |
| USD755742S1 (en) * | 2015-02-18 | 2016-05-10 | Semiconductor Components Industries, Llc | Power device package |
| USD755741S1 (en) * | 2015-02-18 | 2016-05-10 | Semiconductor Components Industries, Llc | Power device package |
| USD759604S1 (en) * | 2015-06-17 | 2016-06-21 | Mitsubishi Electric Corporation | Semiconductor device |
| USD761746S1 (en) * | 2014-11-04 | 2016-07-19 | Sumitomo Electric Industries, Ltd. | Semiconductor module for power conversion |
| USD762597S1 (en) | 2014-08-07 | 2016-08-02 | Infineon Technologies Ag | Power semiconductor module |
| USD770994S1 (en) * | 2014-04-02 | 2016-11-08 | Mitsubishi Electric Corporation | Power semiconductor device |
| US9497570B2 (en) | 2014-02-06 | 2016-11-15 | Nimbelink Corp. | Embedded wireless modem |
| USD845906S1 (en) * | 2017-03-09 | 2019-04-16 | Sendyne Corporation | Electrical shunt |
| USD856947S1 (en) * | 2017-10-19 | 2019-08-20 | Rohm Co., Ltd. | Semiconductor device |
| USD893439S1 (en) * | 2018-05-07 | 2020-08-18 | Adura Led Solutions Llc | Circuit board having arrangements of light-emitting diodes |
| USD900759S1 (en) * | 2018-11-07 | 2020-11-03 | Rohm Co., Ltd. | Semiconductor device |
| USD902164S1 (en) * | 2019-01-24 | 2020-11-17 | Toshiba Memory Corporation | Integrated circuit card |
| USD903613S1 (en) | 2018-06-26 | 2020-12-01 | Rohm Co., Ltd. | Semiconductor module |
| USD906273S1 (en) * | 2018-11-07 | 2020-12-29 | Rohm Co., Ltd. | Semiconductor device |
| USD913978S1 (en) * | 2018-06-26 | 2021-03-23 | Rohm Co., Ltd. | Semiconductor module |
| USD933618S1 (en) * | 2018-10-31 | 2021-10-19 | Asahi Kasei Microdevices Corporation | Semiconductor module |
Citations (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4994902A (en) * | 1988-11-30 | 1991-02-19 | Hitachi, Ltd. | Semiconductor devices and electronic system incorporating them |
| US5444297A (en) * | 1992-06-17 | 1995-08-22 | Mitsubishi Denki Kabushiki Kaisha | Noise resistant semiconductor power module |
| USD389808S (en) * | 1996-01-09 | 1998-01-27 | Fuji Electric Co., Ltd. | Hybrid integrated circuit for electric power control |
| US20010038143A1 (en) * | 1997-06-12 | 2001-11-08 | Yukio Sonobe | Power semiconductor module |
| US6521983B1 (en) * | 2000-08-29 | 2003-02-18 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device for electric power |
| US6995461B2 (en) * | 2001-07-23 | 2006-02-07 | Fuji Electric Co., Ltd. | Semiconductor device |
| US7425757B2 (en) * | 2003-12-22 | 2008-09-16 | Fuji Electric Device Technology Co., Ltd. | Semiconductor power module |
| USD589012S1 (en) * | 2008-03-17 | 2009-03-24 | Fuji Electric Device Technology Co., Ltd. | Semiconductor device |
| USD606951S1 (en) * | 2008-11-14 | 2009-12-29 | Fuji Electric Device Technology Co, Ltd. | Semiconductor device |
| US7706146B2 (en) * | 2006-04-20 | 2010-04-27 | Fairchild Korea Semiconductor Ltd | Power system module and method of fabricating the same |
| US20100149774A1 (en) * | 2008-12-17 | 2010-06-17 | Mitsubishi Electric Corporation | Semiconductor device |
| US7868451B2 (en) * | 2006-05-30 | 2011-01-11 | Kokusan Denki Co. Ltd. | Resin sealing semiconductor device and electronic device using resin sealing semiconductor device |
| US20110044012A1 (en) * | 2006-12-15 | 2011-02-24 | Mitsubishi Electric Corporation | Semiconductor device |
| US8093692B2 (en) * | 2007-03-26 | 2012-01-10 | Mitsubishi Electric Corporation | Semiconductor device packaging including a power semiconductor element |
| US8102655B2 (en) * | 2007-09-27 | 2012-01-24 | Sanyo Semiconductor Co., Ltd. | Circuit device |
| US8107255B2 (en) * | 2007-09-27 | 2012-01-31 | Sanyo Semiconductor Co., Ltd. | Circuit device and method of manufacturing the same |
| USD653634S1 (en) * | 2010-10-28 | 2012-02-07 | Fuji Electric Co., Ltd. | Semiconductor |
| USD653633S1 (en) * | 2010-12-14 | 2012-02-07 | Fuji Electric Co., Ltd. | Semiconductor |
-
2011
- 2011-08-22 US US29/399,979 patent/USD674760S1/en active Active
Patent Citations (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4994902A (en) * | 1988-11-30 | 1991-02-19 | Hitachi, Ltd. | Semiconductor devices and electronic system incorporating them |
| US5444297A (en) * | 1992-06-17 | 1995-08-22 | Mitsubishi Denki Kabushiki Kaisha | Noise resistant semiconductor power module |
| USD389808S (en) * | 1996-01-09 | 1998-01-27 | Fuji Electric Co., Ltd. | Hybrid integrated circuit for electric power control |
| US20010038143A1 (en) * | 1997-06-12 | 2001-11-08 | Yukio Sonobe | Power semiconductor module |
| US6521983B1 (en) * | 2000-08-29 | 2003-02-18 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device for electric power |
| US6995461B2 (en) * | 2001-07-23 | 2006-02-07 | Fuji Electric Co., Ltd. | Semiconductor device |
| US7425757B2 (en) * | 2003-12-22 | 2008-09-16 | Fuji Electric Device Technology Co., Ltd. | Semiconductor power module |
| US7706146B2 (en) * | 2006-04-20 | 2010-04-27 | Fairchild Korea Semiconductor Ltd | Power system module and method of fabricating the same |
| US7868451B2 (en) * | 2006-05-30 | 2011-01-11 | Kokusan Denki Co. Ltd. | Resin sealing semiconductor device and electronic device using resin sealing semiconductor device |
| US20110044012A1 (en) * | 2006-12-15 | 2011-02-24 | Mitsubishi Electric Corporation | Semiconductor device |
| US8093692B2 (en) * | 2007-03-26 | 2012-01-10 | Mitsubishi Electric Corporation | Semiconductor device packaging including a power semiconductor element |
| US8102655B2 (en) * | 2007-09-27 | 2012-01-24 | Sanyo Semiconductor Co., Ltd. | Circuit device |
| US8107255B2 (en) * | 2007-09-27 | 2012-01-31 | Sanyo Semiconductor Co., Ltd. | Circuit device and method of manufacturing the same |
| USD589012S1 (en) * | 2008-03-17 | 2009-03-24 | Fuji Electric Device Technology Co., Ltd. | Semiconductor device |
| USD606951S1 (en) * | 2008-11-14 | 2009-12-29 | Fuji Electric Device Technology Co, Ltd. | Semiconductor device |
| US20100149774A1 (en) * | 2008-12-17 | 2010-06-17 | Mitsubishi Electric Corporation | Semiconductor device |
| USD653634S1 (en) * | 2010-10-28 | 2012-02-07 | Fuji Electric Co., Ltd. | Semiconductor |
| USD653633S1 (en) * | 2010-12-14 | 2012-02-07 | Fuji Electric Co., Ltd. | Semiconductor |
Non-Patent Citations (1)
| Title |
|---|
| Starpower ID—IPM Application Note, Power Modules,. May 17, 2010, Application Note AN Rev.02, Starpower Semiconductor Ltd. pp. 1-71. |
Cited By (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD689833S1 (en) * | 2011-05-19 | 2013-09-17 | Fuji Electric Co., Ltd. | Semiconductor device |
| USD693318S1 (en) * | 2011-10-27 | 2013-11-12 | Sumitomo Electric Industries, Ltd. | Semiconductor module for power conversion |
| USD719926S1 (en) * | 2012-09-20 | 2014-12-23 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD717256S1 (en) * | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD717255S1 (en) * | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD719113S1 (en) * | 2012-09-20 | 2014-12-09 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD717253S1 (en) * | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD717254S1 (en) * | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD703625S1 (en) * | 2012-12-06 | 2014-04-29 | Samsung Electro-Mechanics Co., Ltd. | Power semiconductor module |
| USD721340S1 (en) * | 2012-12-21 | 2015-01-20 | Fuji Electric Co., Ltd. | Semiconductor module |
| USD719537S1 (en) * | 2013-05-08 | 2014-12-16 | Mitsubishi Electric Corporation | Semiconductor device |
| USD769834S1 (en) | 2013-05-08 | 2016-10-25 | Mitsubishi Electric Corporation | Semiconductor device |
| USD721048S1 (en) * | 2013-06-17 | 2015-01-13 | Fuji Electric Co., Ltd. | Semiconductor module |
| USD705184S1 (en) * | 2013-07-11 | 2014-05-20 | Fuji Electric Co., Ltd. | Semiconductor module |
| USD785577S1 (en) | 2013-08-21 | 2017-05-02 | Mitsubishi Electric Corporation | Semiconductor device |
| USD805485S1 (en) | 2013-08-21 | 2017-12-19 | Mitsubishi Electric Corporation | Semiconductor device |
| USD754084S1 (en) * | 2013-08-21 | 2016-04-19 | Mitsubishi Electric Corporation | Semiconductor device |
| US9497570B2 (en) | 2014-02-06 | 2016-11-15 | Nimbelink Corp. | Embedded wireless modem |
| USD731491S1 (en) * | 2014-02-07 | 2015-06-09 | NimbeLink L.L.C. | Embedded cellular modem |
| USD777124S1 (en) * | 2014-04-02 | 2017-01-24 | Mitsubishi Electric Corporation | Power semiconductor device |
| USD783550S1 (en) * | 2014-04-02 | 2017-04-11 | Mitsubishi Electric Corporation | Power semiconductor device |
| USD770994S1 (en) * | 2014-04-02 | 2016-11-08 | Mitsubishi Electric Corporation | Power semiconductor device |
| USD772182S1 (en) * | 2014-04-02 | 2016-11-22 | Mitsubishi Electric Corporation | Power semiconductor device |
| USD762597S1 (en) | 2014-08-07 | 2016-08-02 | Infineon Technologies Ag | Power semiconductor module |
| USD761746S1 (en) * | 2014-11-04 | 2016-07-19 | Sumitomo Electric Industries, Ltd. | Semiconductor module for power conversion |
| USD748595S1 (en) * | 2015-02-03 | 2016-02-02 | Infineon Technologies Ag | Power semiconductor module |
| USD755741S1 (en) * | 2015-02-18 | 2016-05-10 | Semiconductor Components Industries, Llc | Power device package |
| USD755742S1 (en) * | 2015-02-18 | 2016-05-10 | Semiconductor Components Industries, Llc | Power device package |
| USD759604S1 (en) * | 2015-06-17 | 2016-06-21 | Mitsubishi Electric Corporation | Semiconductor device |
| USD845906S1 (en) * | 2017-03-09 | 2019-04-16 | Sendyne Corporation | Electrical shunt |
| USD856947S1 (en) * | 2017-10-19 | 2019-08-20 | Rohm Co., Ltd. | Semiconductor device |
| USD893439S1 (en) * | 2018-05-07 | 2020-08-18 | Adura Led Solutions Llc | Circuit board having arrangements of light-emitting diodes |
| USD913978S1 (en) * | 2018-06-26 | 2021-03-23 | Rohm Co., Ltd. | Semiconductor module |
| USD903613S1 (en) | 2018-06-26 | 2020-12-01 | Rohm Co., Ltd. | Semiconductor module |
| USD1046799S1 (en) | 2018-10-31 | 2024-10-15 | Asahi Kasei Microdevices Corporation | Semiconductor module |
| USD933618S1 (en) * | 2018-10-31 | 2021-10-19 | Asahi Kasei Microdevices Corporation | Semiconductor module |
| USD900759S1 (en) * | 2018-11-07 | 2020-11-03 | Rohm Co., Ltd. | Semiconductor device |
| USD906273S1 (en) * | 2018-11-07 | 2020-12-29 | Rohm Co., Ltd. | Semiconductor device |
| USD902164S1 (en) * | 2019-01-24 | 2020-11-17 | Toshiba Memory Corporation | Integrated circuit card |
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