USD648290S1 - Semiconductor device - Google Patents
Semiconductor device Download PDFInfo
- Publication number
- USD648290S1 USD648290S1 US29/380,499 US38049910F USD648290S US D648290 S1 USD648290 S1 US D648290S1 US 38049910 F US38049910 F US 38049910F US D648290 S USD648290 S US D648290S
- Authority
- US
- United States
- Prior art keywords
- semiconductor device
- view
- showing
- ornamental design
- top plan
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Description
Claims (1)
- The ornamental design for a semiconductor device, as shown.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010014092 | 2010-06-08 | ||
| JP2010-014092 | 2010-06-08 | ||
| JP2010014090 | 2010-06-08 | ||
| JP2010-014090 | 2010-06-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD648290S1 true USD648290S1 (en) | 2011-11-08 |
Family
ID=44882823
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/380,499 Expired - Lifetime USD648290S1 (en) | 2010-06-08 | 2010-12-07 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD648290S1 (en) |
Cited By (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD675582S1 (en) * | 2011-06-27 | 2013-02-05 | Uninet Imaging, Inc. | Chip assembly |
| USD703625S1 (en) * | 2012-12-06 | 2014-04-29 | Samsung Electro-Mechanics Co., Ltd. | Power semiconductor module |
| USD704670S1 (en) * | 2013-01-24 | 2014-05-13 | Fuji Electric Co., Ltd. | Semiconductor device |
| USD704671S1 (en) * | 2013-01-24 | 2014-05-13 | Fuji Electric Co., Ltd. | Semiconductor device |
| USD710318S1 (en) * | 2013-01-24 | 2014-08-05 | Fuji Electric Co., Ltd. | Semiconductor device |
| USD710317S1 (en) * | 2013-01-24 | 2014-08-05 | Fuji Electric Co., Inc. | Semiconductor device |
| USD710319S1 (en) * | 2013-01-24 | 2014-08-05 | Fuji Electric Co., Ltd. | Semiconductor device |
| USD762185S1 (en) * | 2014-08-21 | 2016-07-26 | Infineon Technologies Ag | Power semiconductor module |
| USD762597S1 (en) * | 2014-08-07 | 2016-08-02 | Infineon Technologies Ag | Power semiconductor module |
| USD775091S1 (en) * | 2014-08-19 | 2016-12-27 | Infineon Technologies Ag | Power semiconductor module |
| USD775593S1 (en) * | 2014-08-19 | 2017-01-03 | Infineon Technologies Ag | Power semiconductor module |
| USD776071S1 (en) * | 2014-08-19 | 2017-01-10 | Infineon Technologies Ag | Power semiconductor module |
| USD796459S1 (en) * | 2016-04-11 | 2017-09-05 | Rohm Co., Ltd. | Packaged semiconductor circuit module |
| USD813182S1 (en) * | 2016-08-02 | 2018-03-20 | Panasonic Intellectual Property Management Co., Ltd. | Semiconductor device |
| USD822629S1 (en) * | 2017-01-26 | 2018-07-10 | Kyocera Corporation | Semiconductor package |
| USD822628S1 (en) * | 2017-01-31 | 2018-07-10 | Rohm Co., Ltd. | Semiconductor device |
| USD822627S1 (en) * | 2017-01-31 | 2018-07-10 | Rohm Co., Ltd. | Semiconductor device |
| USD823270S1 (en) * | 2016-09-30 | 2018-07-17 | Rohm Co., Ltd. | Semiconductor device |
| USD827591S1 (en) * | 2016-10-31 | 2018-09-04 | Fuji Electric Co., Ltd. | Semiconductor module |
| USD832228S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
| USD832227S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
| USD851612S1 (en) * | 2017-06-30 | 2019-06-18 | Microduino Inc. | Electrical module |
| USD853342S1 (en) * | 2017-02-28 | 2019-07-09 | Infineon Technologies Ag | High-performance semiconductor module |
| USD853978S1 (en) * | 2017-02-28 | 2019-07-16 | Infineon Technologies Ag | High-performance semiconductor module |
| USD864135S1 (en) * | 2017-10-26 | 2019-10-22 | Mitsubishi Electric Corporation | Semiconductor device |
| USD879729S1 (en) * | 2017-06-30 | 2020-03-31 | Microduino Inc. | Electrical module |
| USD893439S1 (en) * | 2018-05-07 | 2020-08-18 | Adura Led Solutions Llc | Circuit board having arrangements of light-emitting diodes |
| USD900759S1 (en) * | 2018-11-07 | 2020-11-03 | Rohm Co., Ltd. | Semiconductor device |
| USD902164S1 (en) * | 2019-01-24 | 2020-11-17 | Toshiba Memory Corporation | Integrated circuit card |
| USD906273S1 (en) * | 2018-11-07 | 2020-12-29 | Rohm Co., Ltd. | Semiconductor device |
| USD933618S1 (en) * | 2018-10-31 | 2021-10-19 | Asahi Kasei Microdevices Corporation | Semiconductor module |
| USD934821S1 (en) * | 2019-07-24 | 2021-11-02 | Nuvoton Technology Corporation Japan | Semiconductor device |
| USD973030S1 (en) * | 2021-02-23 | 2022-12-20 | Dong Woon Anatech Co., Ltd | Semiconductor device |
| USD1043595S1 (en) * | 2022-11-01 | 2024-09-24 | Rohm Co., Ltd. | Semiconductor device |
| USD1043594S1 (en) * | 2022-11-01 | 2024-09-24 | Rohm Co., Ltd. | Semiconductor device |
| USD1052545S1 (en) * | 2022-11-01 | 2024-11-26 | Rohm Co., Ltd. | Semiconductor device |
| USD1059315S1 (en) * | 2022-11-02 | 2025-01-28 | Ganrich Semiconductor Corporation | Package structure for a semiconductor element |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4047197A (en) * | 1975-04-19 | 1977-09-06 | Semikron Gesellschaft Fur Gleichrichterbau Und Elektronik M.B.H. | Housing and lead structure for a series connected semiconductor rectifier arrangement |
| USD288557S (en) * | 1984-09-10 | 1987-03-03 | Motorola, Inc. | Semiconductor housing |
| USD396847S (en) * | 1996-10-17 | 1998-08-11 | Matsushita Electronics Corporation | Semiconductor device |
| US6072211A (en) * | 1998-08-03 | 2000-06-06 | Motorola, Inc. | Semiconductor package |
| USD444132S1 (en) * | 2000-08-23 | 2001-06-26 | Kabushiki Kaisha Toshiba | Semiconductor element |
| US6433418B1 (en) * | 1998-07-24 | 2002-08-13 | Fujitsu Limited | Apparatus for a vertically accumulable semiconductor device with external leads secured by a positioning mechanism |
| USD475982S1 (en) * | 2002-03-11 | 2003-06-17 | Kabushiki Kaisha Toshiba | Semiconductor device |
| USD476962S1 (en) * | 2002-03-29 | 2003-07-08 | Kabushiki Kaisha Toshiba | Semiconductor device |
| US6731002B2 (en) * | 2001-05-04 | 2004-05-04 | Ixys Corporation | High frequency power device with a plastic molded package and direct bonded substrate |
| US6933593B2 (en) * | 2003-08-14 | 2005-08-23 | International Rectifier Corporation | Power module having a heat sink |
| US6992386B2 (en) * | 2003-07-31 | 2006-01-31 | Renesas Technology Corp. | Semiconductor device and a method of manufacturing the same |
-
2010
- 2010-12-07 US US29/380,499 patent/USD648290S1/en not_active Expired - Lifetime
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4047197A (en) * | 1975-04-19 | 1977-09-06 | Semikron Gesellschaft Fur Gleichrichterbau Und Elektronik M.B.H. | Housing and lead structure for a series connected semiconductor rectifier arrangement |
| US4047197B1 (en) * | 1975-04-19 | 1985-03-26 | ||
| USD288557S (en) * | 1984-09-10 | 1987-03-03 | Motorola, Inc. | Semiconductor housing |
| USD396847S (en) * | 1996-10-17 | 1998-08-11 | Matsushita Electronics Corporation | Semiconductor device |
| US6433418B1 (en) * | 1998-07-24 | 2002-08-13 | Fujitsu Limited | Apparatus for a vertically accumulable semiconductor device with external leads secured by a positioning mechanism |
| US6072211A (en) * | 1998-08-03 | 2000-06-06 | Motorola, Inc. | Semiconductor package |
| USD444132S1 (en) * | 2000-08-23 | 2001-06-26 | Kabushiki Kaisha Toshiba | Semiconductor element |
| US6731002B2 (en) * | 2001-05-04 | 2004-05-04 | Ixys Corporation | High frequency power device with a plastic molded package and direct bonded substrate |
| USD475982S1 (en) * | 2002-03-11 | 2003-06-17 | Kabushiki Kaisha Toshiba | Semiconductor device |
| USD476962S1 (en) * | 2002-03-29 | 2003-07-08 | Kabushiki Kaisha Toshiba | Semiconductor device |
| US6992386B2 (en) * | 2003-07-31 | 2006-01-31 | Renesas Technology Corp. | Semiconductor device and a method of manufacturing the same |
| US6933593B2 (en) * | 2003-08-14 | 2005-08-23 | International Rectifier Corporation | Power module having a heat sink |
Cited By (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD675582S1 (en) * | 2011-06-27 | 2013-02-05 | Uninet Imaging, Inc. | Chip assembly |
| USD703625S1 (en) * | 2012-12-06 | 2014-04-29 | Samsung Electro-Mechanics Co., Ltd. | Power semiconductor module |
| USD710319S1 (en) * | 2013-01-24 | 2014-08-05 | Fuji Electric Co., Ltd. | Semiconductor device |
| USD704671S1 (en) * | 2013-01-24 | 2014-05-13 | Fuji Electric Co., Ltd. | Semiconductor device |
| USD710318S1 (en) * | 2013-01-24 | 2014-08-05 | Fuji Electric Co., Ltd. | Semiconductor device |
| USD710317S1 (en) * | 2013-01-24 | 2014-08-05 | Fuji Electric Co., Inc. | Semiconductor device |
| USD704670S1 (en) * | 2013-01-24 | 2014-05-13 | Fuji Electric Co., Ltd. | Semiconductor device |
| USD762597S1 (en) * | 2014-08-07 | 2016-08-02 | Infineon Technologies Ag | Power semiconductor module |
| USD775091S1 (en) * | 2014-08-19 | 2016-12-27 | Infineon Technologies Ag | Power semiconductor module |
| USD775593S1 (en) * | 2014-08-19 | 2017-01-03 | Infineon Technologies Ag | Power semiconductor module |
| USD776071S1 (en) * | 2014-08-19 | 2017-01-10 | Infineon Technologies Ag | Power semiconductor module |
| USD762185S1 (en) * | 2014-08-21 | 2016-07-26 | Infineon Technologies Ag | Power semiconductor module |
| USD796459S1 (en) * | 2016-04-11 | 2017-09-05 | Rohm Co., Ltd. | Packaged semiconductor circuit module |
| USD813182S1 (en) * | 2016-08-02 | 2018-03-20 | Panasonic Intellectual Property Management Co., Ltd. | Semiconductor device |
| USD823270S1 (en) * | 2016-09-30 | 2018-07-17 | Rohm Co., Ltd. | Semiconductor device |
| USD827591S1 (en) * | 2016-10-31 | 2018-09-04 | Fuji Electric Co., Ltd. | Semiconductor module |
| USD832228S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
| USD832227S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
| USD822629S1 (en) * | 2017-01-26 | 2018-07-10 | Kyocera Corporation | Semiconductor package |
| USD822627S1 (en) * | 2017-01-31 | 2018-07-10 | Rohm Co., Ltd. | Semiconductor device |
| USD822628S1 (en) * | 2017-01-31 | 2018-07-10 | Rohm Co., Ltd. | Semiconductor device |
| USD853342S1 (en) * | 2017-02-28 | 2019-07-09 | Infineon Technologies Ag | High-performance semiconductor module |
| USD853978S1 (en) * | 2017-02-28 | 2019-07-16 | Infineon Technologies Ag | High-performance semiconductor module |
| USD851612S1 (en) * | 2017-06-30 | 2019-06-18 | Microduino Inc. | Electrical module |
| USD879729S1 (en) * | 2017-06-30 | 2020-03-31 | Microduino Inc. | Electrical module |
| USD864135S1 (en) * | 2017-10-26 | 2019-10-22 | Mitsubishi Electric Corporation | Semiconductor device |
| USD893439S1 (en) * | 2018-05-07 | 2020-08-18 | Adura Led Solutions Llc | Circuit board having arrangements of light-emitting diodes |
| USD933618S1 (en) * | 2018-10-31 | 2021-10-19 | Asahi Kasei Microdevices Corporation | Semiconductor module |
| USD1046799S1 (en) | 2018-10-31 | 2024-10-15 | Asahi Kasei Microdevices Corporation | Semiconductor module |
| USD900759S1 (en) * | 2018-11-07 | 2020-11-03 | Rohm Co., Ltd. | Semiconductor device |
| USD906273S1 (en) * | 2018-11-07 | 2020-12-29 | Rohm Co., Ltd. | Semiconductor device |
| USD902164S1 (en) * | 2019-01-24 | 2020-11-17 | Toshiba Memory Corporation | Integrated circuit card |
| USD934821S1 (en) * | 2019-07-24 | 2021-11-02 | Nuvoton Technology Corporation Japan | Semiconductor device |
| USD973030S1 (en) * | 2021-02-23 | 2022-12-20 | Dong Woon Anatech Co., Ltd | Semiconductor device |
| USD1043595S1 (en) * | 2022-11-01 | 2024-09-24 | Rohm Co., Ltd. | Semiconductor device |
| USD1043594S1 (en) * | 2022-11-01 | 2024-09-24 | Rohm Co., Ltd. | Semiconductor device |
| USD1052545S1 (en) * | 2022-11-01 | 2024-11-26 | Rohm Co., Ltd. | Semiconductor device |
| USD1059315S1 (en) * | 2022-11-02 | 2025-01-28 | Ganrich Semiconductor Corporation | Package structure for a semiconductor element |
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