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USD648290S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD648290S1
USD648290S1 US29/380,499 US38049910F USD648290S US D648290 S1 USD648290 S1 US D648290S1 US 38049910 F US38049910 F US 38049910F US D648290 S USD648290 S US D648290S
Authority
US
United States
Prior art keywords
semiconductor device
view
showing
ornamental design
top plan
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/380,499
Inventor
Kazuhito Mori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Miyoshi Electronics Corp
Original Assignee
Miyoshi Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Miyoshi Electronics Corp filed Critical Miyoshi Electronics Corp
Assigned to MIYOSHI ELECTRONICS CORPORATION reassignment MIYOSHI ELECTRONICS CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MORI, KAZUHITO
Application granted granted Critical
Publication of USD648290S1 publication Critical patent/USD648290S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front view of a semiconductor device of a first embodiment showing my new design;
FIG. 2 is a rear view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof,
FIG. 5 is a right side view thereof;
FIG. 6 is a left side view thereof;
FIG. 7 is a view showing front, left side and top plan thereof;
FIG. 8 is a view showing front, right side and bottom plan thereof;
FIG. 9 is a front view of a semiconductor device of a second embodiment showing my new design;
FIG. 10 is a rear view thereof;
FIG. 11 is a top plan view thereof;
FIG. 12 is a bottom plan view thereof;
FIG. 13 is a right side view thereof;
FIG. 14 is a left side view thereof;
FIG. 15 is a view showing front, left side and top plan thereof; and,
FIG. 16 is a view showing front, right side and bottom plan thereof.

Claims (1)

  1. The ornamental design for a semiconductor device, as shown.
US29/380,499 2010-06-08 2010-12-07 Semiconductor device Expired - Lifetime USD648290S1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2010014092 2010-06-08
JP2010-014092 2010-06-08
JP2010014090 2010-06-08
JP2010-014090 2010-06-08

Publications (1)

Publication Number Publication Date
USD648290S1 true USD648290S1 (en) 2011-11-08

Family

ID=44882823

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/380,499 Expired - Lifetime USD648290S1 (en) 2010-06-08 2010-12-07 Semiconductor device

Country Status (1)

Country Link
US (1) USD648290S1 (en)

Cited By (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD675582S1 (en) * 2011-06-27 2013-02-05 Uninet Imaging, Inc. Chip assembly
USD703625S1 (en) * 2012-12-06 2014-04-29 Samsung Electro-Mechanics Co., Ltd. Power semiconductor module
USD704670S1 (en) * 2013-01-24 2014-05-13 Fuji Electric Co., Ltd. Semiconductor device
USD704671S1 (en) * 2013-01-24 2014-05-13 Fuji Electric Co., Ltd. Semiconductor device
USD710318S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Ltd. Semiconductor device
USD710317S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Inc. Semiconductor device
USD710319S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Ltd. Semiconductor device
USD762185S1 (en) * 2014-08-21 2016-07-26 Infineon Technologies Ag Power semiconductor module
USD762597S1 (en) * 2014-08-07 2016-08-02 Infineon Technologies Ag Power semiconductor module
USD775091S1 (en) * 2014-08-19 2016-12-27 Infineon Technologies Ag Power semiconductor module
USD775593S1 (en) * 2014-08-19 2017-01-03 Infineon Technologies Ag Power semiconductor module
USD776071S1 (en) * 2014-08-19 2017-01-10 Infineon Technologies Ag Power semiconductor module
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module
USD813182S1 (en) * 2016-08-02 2018-03-20 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device
USD822629S1 (en) * 2017-01-26 2018-07-10 Kyocera Corporation Semiconductor package
USD822628S1 (en) * 2017-01-31 2018-07-10 Rohm Co., Ltd. Semiconductor device
USD822627S1 (en) * 2017-01-31 2018-07-10 Rohm Co., Ltd. Semiconductor device
USD823270S1 (en) * 2016-09-30 2018-07-17 Rohm Co., Ltd. Semiconductor device
USD827591S1 (en) * 2016-10-31 2018-09-04 Fuji Electric Co., Ltd. Semiconductor module
USD832228S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD832227S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD851612S1 (en) * 2017-06-30 2019-06-18 Microduino Inc. Electrical module
USD853342S1 (en) * 2017-02-28 2019-07-09 Infineon Technologies Ag High-performance semiconductor module
USD853978S1 (en) * 2017-02-28 2019-07-16 Infineon Technologies Ag High-performance semiconductor module
USD864135S1 (en) * 2017-10-26 2019-10-22 Mitsubishi Electric Corporation Semiconductor device
USD879729S1 (en) * 2017-06-30 2020-03-31 Microduino Inc. Electrical module
USD893439S1 (en) * 2018-05-07 2020-08-18 Adura Led Solutions Llc Circuit board having arrangements of light-emitting diodes
USD900759S1 (en) * 2018-11-07 2020-11-03 Rohm Co., Ltd. Semiconductor device
USD902164S1 (en) * 2019-01-24 2020-11-17 Toshiba Memory Corporation Integrated circuit card
USD906273S1 (en) * 2018-11-07 2020-12-29 Rohm Co., Ltd. Semiconductor device
USD933618S1 (en) * 2018-10-31 2021-10-19 Asahi Kasei Microdevices Corporation Semiconductor module
USD934821S1 (en) * 2019-07-24 2021-11-02 Nuvoton Technology Corporation Japan Semiconductor device
USD973030S1 (en) * 2021-02-23 2022-12-20 Dong Woon Anatech Co., Ltd Semiconductor device
USD1043595S1 (en) * 2022-11-01 2024-09-24 Rohm Co., Ltd. Semiconductor device
USD1043594S1 (en) * 2022-11-01 2024-09-24 Rohm Co., Ltd. Semiconductor device
USD1052545S1 (en) * 2022-11-01 2024-11-26 Rohm Co., Ltd. Semiconductor device
USD1059315S1 (en) * 2022-11-02 2025-01-28 Ganrich Semiconductor Corporation Package structure for a semiconductor element

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4047197A (en) * 1975-04-19 1977-09-06 Semikron Gesellschaft Fur Gleichrichterbau Und Elektronik M.B.H. Housing and lead structure for a series connected semiconductor rectifier arrangement
USD288557S (en) * 1984-09-10 1987-03-03 Motorola, Inc. Semiconductor housing
USD396847S (en) * 1996-10-17 1998-08-11 Matsushita Electronics Corporation Semiconductor device
US6072211A (en) * 1998-08-03 2000-06-06 Motorola, Inc. Semiconductor package
USD444132S1 (en) * 2000-08-23 2001-06-26 Kabushiki Kaisha Toshiba Semiconductor element
US6433418B1 (en) * 1998-07-24 2002-08-13 Fujitsu Limited Apparatus for a vertically accumulable semiconductor device with external leads secured by a positioning mechanism
USD475982S1 (en) * 2002-03-11 2003-06-17 Kabushiki Kaisha Toshiba Semiconductor device
USD476962S1 (en) * 2002-03-29 2003-07-08 Kabushiki Kaisha Toshiba Semiconductor device
US6731002B2 (en) * 2001-05-04 2004-05-04 Ixys Corporation High frequency power device with a plastic molded package and direct bonded substrate
US6933593B2 (en) * 2003-08-14 2005-08-23 International Rectifier Corporation Power module having a heat sink
US6992386B2 (en) * 2003-07-31 2006-01-31 Renesas Technology Corp. Semiconductor device and a method of manufacturing the same

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4047197A (en) * 1975-04-19 1977-09-06 Semikron Gesellschaft Fur Gleichrichterbau Und Elektronik M.B.H. Housing and lead structure for a series connected semiconductor rectifier arrangement
US4047197B1 (en) * 1975-04-19 1985-03-26
USD288557S (en) * 1984-09-10 1987-03-03 Motorola, Inc. Semiconductor housing
USD396847S (en) * 1996-10-17 1998-08-11 Matsushita Electronics Corporation Semiconductor device
US6433418B1 (en) * 1998-07-24 2002-08-13 Fujitsu Limited Apparatus for a vertically accumulable semiconductor device with external leads secured by a positioning mechanism
US6072211A (en) * 1998-08-03 2000-06-06 Motorola, Inc. Semiconductor package
USD444132S1 (en) * 2000-08-23 2001-06-26 Kabushiki Kaisha Toshiba Semiconductor element
US6731002B2 (en) * 2001-05-04 2004-05-04 Ixys Corporation High frequency power device with a plastic molded package and direct bonded substrate
USD475982S1 (en) * 2002-03-11 2003-06-17 Kabushiki Kaisha Toshiba Semiconductor device
USD476962S1 (en) * 2002-03-29 2003-07-08 Kabushiki Kaisha Toshiba Semiconductor device
US6992386B2 (en) * 2003-07-31 2006-01-31 Renesas Technology Corp. Semiconductor device and a method of manufacturing the same
US6933593B2 (en) * 2003-08-14 2005-08-23 International Rectifier Corporation Power module having a heat sink

Cited By (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD675582S1 (en) * 2011-06-27 2013-02-05 Uninet Imaging, Inc. Chip assembly
USD703625S1 (en) * 2012-12-06 2014-04-29 Samsung Electro-Mechanics Co., Ltd. Power semiconductor module
USD710319S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Ltd. Semiconductor device
USD704671S1 (en) * 2013-01-24 2014-05-13 Fuji Electric Co., Ltd. Semiconductor device
USD710318S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Ltd. Semiconductor device
USD710317S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Inc. Semiconductor device
USD704670S1 (en) * 2013-01-24 2014-05-13 Fuji Electric Co., Ltd. Semiconductor device
USD762597S1 (en) * 2014-08-07 2016-08-02 Infineon Technologies Ag Power semiconductor module
USD775091S1 (en) * 2014-08-19 2016-12-27 Infineon Technologies Ag Power semiconductor module
USD775593S1 (en) * 2014-08-19 2017-01-03 Infineon Technologies Ag Power semiconductor module
USD776071S1 (en) * 2014-08-19 2017-01-10 Infineon Technologies Ag Power semiconductor module
USD762185S1 (en) * 2014-08-21 2016-07-26 Infineon Technologies Ag Power semiconductor module
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module
USD813182S1 (en) * 2016-08-02 2018-03-20 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device
USD823270S1 (en) * 2016-09-30 2018-07-17 Rohm Co., Ltd. Semiconductor device
USD827591S1 (en) * 2016-10-31 2018-09-04 Fuji Electric Co., Ltd. Semiconductor module
USD832228S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD832227S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD822629S1 (en) * 2017-01-26 2018-07-10 Kyocera Corporation Semiconductor package
USD822627S1 (en) * 2017-01-31 2018-07-10 Rohm Co., Ltd. Semiconductor device
USD822628S1 (en) * 2017-01-31 2018-07-10 Rohm Co., Ltd. Semiconductor device
USD853342S1 (en) * 2017-02-28 2019-07-09 Infineon Technologies Ag High-performance semiconductor module
USD853978S1 (en) * 2017-02-28 2019-07-16 Infineon Technologies Ag High-performance semiconductor module
USD851612S1 (en) * 2017-06-30 2019-06-18 Microduino Inc. Electrical module
USD879729S1 (en) * 2017-06-30 2020-03-31 Microduino Inc. Electrical module
USD864135S1 (en) * 2017-10-26 2019-10-22 Mitsubishi Electric Corporation Semiconductor device
USD893439S1 (en) * 2018-05-07 2020-08-18 Adura Led Solutions Llc Circuit board having arrangements of light-emitting diodes
USD933618S1 (en) * 2018-10-31 2021-10-19 Asahi Kasei Microdevices Corporation Semiconductor module
USD1046799S1 (en) 2018-10-31 2024-10-15 Asahi Kasei Microdevices Corporation Semiconductor module
USD900759S1 (en) * 2018-11-07 2020-11-03 Rohm Co., Ltd. Semiconductor device
USD906273S1 (en) * 2018-11-07 2020-12-29 Rohm Co., Ltd. Semiconductor device
USD902164S1 (en) * 2019-01-24 2020-11-17 Toshiba Memory Corporation Integrated circuit card
USD934821S1 (en) * 2019-07-24 2021-11-02 Nuvoton Technology Corporation Japan Semiconductor device
USD973030S1 (en) * 2021-02-23 2022-12-20 Dong Woon Anatech Co., Ltd Semiconductor device
USD1043595S1 (en) * 2022-11-01 2024-09-24 Rohm Co., Ltd. Semiconductor device
USD1043594S1 (en) * 2022-11-01 2024-09-24 Rohm Co., Ltd. Semiconductor device
USD1052545S1 (en) * 2022-11-01 2024-11-26 Rohm Co., Ltd. Semiconductor device
USD1059315S1 (en) * 2022-11-02 2025-01-28 Ganrich Semiconductor Corporation Package structure for a semiconductor element

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