[go: up one dir, main page]

USD755741S1 - Power device package - Google Patents

Power device package Download PDF

Info

Publication number
USD755741S1
USD755741S1 US29/517,863 US201529517863F USD755741S US D755741 S1 USD755741 S1 US D755741S1 US 201529517863 F US201529517863 F US 201529517863F US D755741 S USD755741 S US D755741S
Authority
US
United States
Prior art keywords
power device
device package
view
elevation view
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/517,863
Inventor
Atapol Prajuckamol
Chee Hiong Chew
Yushuang YAO
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Components Industries LLC
Original Assignee
Semiconductor Components Industries LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Components Industries LLC filed Critical Semiconductor Components Industries LLC
Priority to US29/517,863 priority Critical patent/USD755741S1/en
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC reassignment SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEW, CHEE HIONG, PRAJUCKAMOL, ATAPOL, YAO, YUSHUANG
Assigned to DEUTSCHE BANK AG NEW YORK BRANCH reassignment DEUTSCHE BANK AG NEW YORK BRANCH SECURITY INTEREST Assignors: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Application granted granted Critical
Publication of USD755741S1 publication Critical patent/USD755741S1/en
Assigned to DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT reassignment DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT PATENT NUMBER 5859768 AND TO RECITE COLLATERAL AGENT ROLE OF RECEIVING PARTY IN THE SECURITY INTEREST PREVIOUSLY RECORDED ON REEL 038620 FRAME 0087. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Assignors: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, FAIRCHILD SEMICONDUCTOR CORPORATION reassignment SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 038620, FRAME 0087 Assignors: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Description

FIG. 1 is a top perspective view of a power device package showing my new design;
FIG. 2 is another top perspective view thereof;
FIG. 3 is a bottom perspective view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a left side elevation view thereof;
FIG. 7 is a right side elevation view thereof;
FIG. 8 is a back elevation view thereof; and,
FIG. 9 is a front elevation view thereof.
The broken lines shown in the drawings represent portions of the power device package that form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a power device package, as shown and described.
US29/517,863 2015-02-18 2015-02-18 Power device package Active USD755741S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/517,863 USD755741S1 (en) 2015-02-18 2015-02-18 Power device package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/517,863 USD755741S1 (en) 2015-02-18 2015-02-18 Power device package

Publications (1)

Publication Number Publication Date
USD755741S1 true USD755741S1 (en) 2016-05-10

Family

ID=55860405

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/517,863 Active USD755741S1 (en) 2015-02-18 2015-02-18 Power device package

Country Status (1)

Country Link
US (1) USD755741S1 (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD795821S1 (en) * 2016-02-22 2017-08-29 Heatscape.Com, Inc. Liquid cooling cold plate with diamond cut pin fins
USD800675S1 (en) * 2016-05-24 2017-10-24 Asetek Danmark A/S Set of cooling plate rows for in-line memory
USD800674S1 (en) * 2016-05-24 2017-10-24 Asetek Danmark A/S Cooling plate row for in-line memory
USD803169S1 (en) * 2016-02-22 2017-11-21 Heatscape.Com, Inc. Combined liquid cooling cold plate and vapor chamber
US10021811B2 (en) 2016-05-24 2018-07-10 Asetek Danmark A/S Single ended cooling module rows and assemblies for thermal management of in-line memory modules
US10070176B2 (en) 2013-03-13 2018-09-04 Nagrastar, Llc Systems and methods for performing transport I/O
USD840404S1 (en) * 2013-03-13 2019-02-12 Nagrastar, Llc Smart card interface
USD864968S1 (en) 2015-04-30 2019-10-29 Echostar Technologies L.L.C. Smart card interface
USD873396S1 (en) * 2016-04-06 2020-01-21 Showa Denko K.K. Cooler
USD900029S1 (en) * 2017-03-06 2020-10-27 Wago Verwaltungsgesellschaft Mit Beschraenkter Haftung Electrical connector
US11924996B2 (en) 2020-09-30 2024-03-05 Coolit Systems, Inc. Liquid-cooling devices, and systems, to cool multi-chip modules
USD1094288S1 (en) * 2023-06-29 2025-09-23 Industrial Technology Research Institute Power module

Citations (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5408128A (en) * 1993-09-15 1995-04-18 International Rectifier Corporation High power semiconductor device module with low thermal resistance and simplified manufacturing
US5410450A (en) * 1991-12-10 1995-04-25 Fuji Electric Co., Ltd. Internal wiring structure of a semiconductor device
USD364383S (en) * 1994-05-11 1995-11-21 Fuji Electric Co., Ltd. Semi-conductor element with terminal casing
USD364385S (en) * 1994-05-11 1995-11-21 Fuji Electric Co., Ltd. Semi-conductor element with terminal casing
USD364384S (en) * 1994-05-23 1995-11-21 Fuji Electric Co., Ltd. Semi-conductor element with terminal casing
US6078501A (en) * 1997-12-22 2000-06-20 Omnirel Llc Power semiconductor module
USD441726S1 (en) * 1999-07-14 2001-05-08 Kabushiki Kaisha Toyoda Jidoshokki Seisakusho Semiconductor element
USD441727S1 (en) * 2000-10-04 2001-05-08 Sony Corporation Semiconductor element
US6521983B1 (en) * 2000-08-29 2003-02-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device for electric power
USD476959S1 (en) * 2002-07-31 2003-07-08 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD525215S1 (en) * 2004-01-27 2006-07-18 Yamaichi Electronics Co., Ltd. Base for a semiconductor carrier
USD539761S1 (en) * 2006-08-22 2007-04-03 Kabushiki Kaisha Toshiba Semiconductor
USD548203S1 (en) * 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD548202S1 (en) * 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD587662S1 (en) * 2007-12-20 2009-03-03 Fuji Electric Device Technology Co., Ltd. Semiconductor device
USD589012S1 (en) * 2008-03-17 2009-03-24 Fuji Electric Device Technology Co., Ltd. Semiconductor device
USD606951S1 (en) * 2008-11-14 2009-12-29 Fuji Electric Device Technology Co, Ltd. Semiconductor device
USD653634S1 (en) * 2010-10-28 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD653633S1 (en) * 2010-12-14 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD674760S1 (en) * 2011-04-01 2013-01-22 Fuji Electric Co., Ltd. Semiconductor device
USD686174S1 (en) * 2011-08-12 2013-07-16 Fuji Electric Co., Ltd Semiconductor device
US8526199B2 (en) * 2010-05-07 2013-09-03 Mitsubishi Electric Corporation Semiconductor device
USD689446S1 (en) * 2010-10-28 2013-09-10 Fuji Electric Co., Ltd. Semiconductor
USD699693S1 (en) * 2012-10-03 2014-02-18 Fuji Electric Co., Ltd. Semiconductor device
USD703625S1 (en) * 2012-12-06 2014-04-29 Samsung Electro-Mechanics Co., Ltd. Power semiconductor module
USD704670S1 (en) * 2013-01-24 2014-05-13 Fuji Electric Co., Ltd. Semiconductor device
USD704671S1 (en) * 2013-01-24 2014-05-13 Fuji Electric Co., Ltd. Semiconductor device
USD705184S1 (en) * 2013-07-11 2014-05-20 Fuji Electric Co., Ltd. Semiconductor module
USD706232S1 (en) * 2012-12-21 2014-06-03 Fuji Electric Co., Ltd. Semiconductor device
USD710317S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Inc. Semiconductor device
USD710318S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Ltd. Semiconductor device
USD710319S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Ltd. Semiconductor device

Patent Citations (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5410450A (en) * 1991-12-10 1995-04-25 Fuji Electric Co., Ltd. Internal wiring structure of a semiconductor device
US5408128A (en) * 1993-09-15 1995-04-18 International Rectifier Corporation High power semiconductor device module with low thermal resistance and simplified manufacturing
USD364383S (en) * 1994-05-11 1995-11-21 Fuji Electric Co., Ltd. Semi-conductor element with terminal casing
USD364385S (en) * 1994-05-11 1995-11-21 Fuji Electric Co., Ltd. Semi-conductor element with terminal casing
USD364384S (en) * 1994-05-23 1995-11-21 Fuji Electric Co., Ltd. Semi-conductor element with terminal casing
US6078501A (en) * 1997-12-22 2000-06-20 Omnirel Llc Power semiconductor module
USD441726S1 (en) * 1999-07-14 2001-05-08 Kabushiki Kaisha Toyoda Jidoshokki Seisakusho Semiconductor element
US6521983B1 (en) * 2000-08-29 2003-02-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device for electric power
USD441727S1 (en) * 2000-10-04 2001-05-08 Sony Corporation Semiconductor element
USD476959S1 (en) * 2002-07-31 2003-07-08 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD525215S1 (en) * 2004-01-27 2006-07-18 Yamaichi Electronics Co., Ltd. Base for a semiconductor carrier
USD548203S1 (en) * 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD548202S1 (en) * 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD539761S1 (en) * 2006-08-22 2007-04-03 Kabushiki Kaisha Toshiba Semiconductor
USD587662S1 (en) * 2007-12-20 2009-03-03 Fuji Electric Device Technology Co., Ltd. Semiconductor device
USD589012S1 (en) * 2008-03-17 2009-03-24 Fuji Electric Device Technology Co., Ltd. Semiconductor device
USD606951S1 (en) * 2008-11-14 2009-12-29 Fuji Electric Device Technology Co, Ltd. Semiconductor device
US8526199B2 (en) * 2010-05-07 2013-09-03 Mitsubishi Electric Corporation Semiconductor device
USD653634S1 (en) * 2010-10-28 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD689446S1 (en) * 2010-10-28 2013-09-10 Fuji Electric Co., Ltd. Semiconductor
USD653633S1 (en) * 2010-12-14 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD674760S1 (en) * 2011-04-01 2013-01-22 Fuji Electric Co., Ltd. Semiconductor device
USD686174S1 (en) * 2011-08-12 2013-07-16 Fuji Electric Co., Ltd Semiconductor device
USD699693S1 (en) * 2012-10-03 2014-02-18 Fuji Electric Co., Ltd. Semiconductor device
USD703625S1 (en) * 2012-12-06 2014-04-29 Samsung Electro-Mechanics Co., Ltd. Power semiconductor module
USD706232S1 (en) * 2012-12-21 2014-06-03 Fuji Electric Co., Ltd. Semiconductor device
USD704670S1 (en) * 2013-01-24 2014-05-13 Fuji Electric Co., Ltd. Semiconductor device
USD704671S1 (en) * 2013-01-24 2014-05-13 Fuji Electric Co., Ltd. Semiconductor device
USD710317S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Inc. Semiconductor device
USD710318S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Ltd. Semiconductor device
USD710319S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Ltd. Semiconductor device
USD705184S1 (en) * 2013-07-11 2014-05-20 Fuji Electric Co., Ltd. Semiconductor module

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10070176B2 (en) 2013-03-13 2018-09-04 Nagrastar, Llc Systems and methods for performing transport I/O
USD840404S1 (en) * 2013-03-13 2019-02-12 Nagrastar, Llc Smart card interface
US10382816B2 (en) 2013-03-13 2019-08-13 Nagrastar, Llc Systems and methods for performing transport I/O
USD864968S1 (en) 2015-04-30 2019-10-29 Echostar Technologies L.L.C. Smart card interface
USD803169S1 (en) * 2016-02-22 2017-11-21 Heatscape.Com, Inc. Combined liquid cooling cold plate and vapor chamber
USD795821S1 (en) * 2016-02-22 2017-08-29 Heatscape.Com, Inc. Liquid cooling cold plate with diamond cut pin fins
USD829673S1 (en) * 2016-02-22 2018-10-02 Heatscape.Com, Inc. Combined liquid cooling cold plate and vapor chamber
USD886967S1 (en) 2016-04-06 2020-06-09 Showa Denko K.K. Cooler
USD873396S1 (en) * 2016-04-06 2020-01-21 Showa Denko K.K. Cooler
US10021811B2 (en) 2016-05-24 2018-07-10 Asetek Danmark A/S Single ended cooling module rows and assemblies for thermal management of in-line memory modules
USD800674S1 (en) * 2016-05-24 2017-10-24 Asetek Danmark A/S Cooling plate row for in-line memory
USD800675S1 (en) * 2016-05-24 2017-10-24 Asetek Danmark A/S Set of cooling plate rows for in-line memory
USD900029S1 (en) * 2017-03-06 2020-10-27 Wago Verwaltungsgesellschaft Mit Beschraenkter Haftung Electrical connector
US11924996B2 (en) 2020-09-30 2024-03-05 Coolit Systems, Inc. Liquid-cooling devices, and systems, to cool multi-chip modules
US12363857B2 (en) 2020-09-30 2025-07-15 Coolit Systems, Inc. Liquid-cooling devices, and systems, to cool multi-chip modules
USD1094288S1 (en) * 2023-06-29 2025-09-23 Industrial Technology Research Institute Power module

Similar Documents

Publication Publication Date Title
USD968955S1 (en) Packaging
USD1060030S1 (en) Absorbent article package
USD833622S1 (en) Oral appliance
USD801073S1 (en) Display carton
USD754084S1 (en) Semiconductor device
USD829544S1 (en) Package
USD769569S1 (en) Kiosk
USD748902S1 (en) Shoe
USD806805S1 (en) Robot
USD704671S1 (en) Semiconductor device
USD704670S1 (en) Semiconductor device
USD741703S1 (en) Package
USD755741S1 (en) Power device package
USD715615S1 (en) Power tool
USD795679S1 (en) Tie down
USD793639S1 (en) Cleaning device
USD761154S1 (en) Planter
USD759604S1 (en) Semiconductor device
USD808904S1 (en) Charging device
USD721047S1 (en) Semiconductor device
USD778694S1 (en) Pruner
USD932316S1 (en) Package
USD759404S1 (en) Pillow
USD765520S1 (en) Blister package
USD761155S1 (en) Planter