USD1043595S1 - Semiconductor device - Google Patents
Semiconductor device Download PDFInfo
- Publication number
- USD1043595S1 USD1043595S1 US29/874,880 US202329874880F USD1043595S US D1043595 S1 USD1043595 S1 US D1043595S1 US 202329874880 F US202329874880 F US 202329874880F US D1043595 S USD1043595 S US D1043595S
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- US
- United States
- Prior art keywords
- semiconductor device
- view
- design
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
The broken lines illustrate portions of the semiconductor device that form no part of the claimed design. The dash-dotted lines denote the boundary of the claim and form no part of the claimed design. Only the shaded areas denoted by the dash-dotted lines and the solid lines are claimed.
Claims (1)
- The ornamental design for a semiconductor device, as shown and described.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022023716F JP1741186S (en) | 2022-11-01 | 2022-11-01 | semiconductor element |
| JP2022-023716D | 2022-11-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD1043595S1 true USD1043595S1 (en) | 2024-09-24 |
Family
ID=85777490
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/874,880 Active USD1043595S1 (en) | 2022-11-01 | 2023-04-26 | Semiconductor device |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD1043595S1 (en) |
| JP (1) | JP1741186S (en) |
Citations (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5401910A (en) * | 1992-12-03 | 1995-03-28 | Murata Manufacturing Co. Ltd. | Electronic component |
| USD406822S (en) * | 1997-03-06 | 1999-03-16 | Siemens Aktiengesellschaft | Carrier element for a semiconductor chip for integration into a chipcard, or a chipcard module |
| US6330165B1 (en) * | 1998-07-06 | 2001-12-11 | Hitachi, Ltd. | Semiconductor device |
| USD456367S1 (en) * | 2000-12-15 | 2002-04-30 | Protek Devices, Lp | Semiconductor chip |
| US6433418B1 (en) * | 1998-07-24 | 2002-08-13 | Fujitsu Limited | Apparatus for a vertically accumulable semiconductor device with external leads secured by a positioning mechanism |
| USD475028S1 (en) * | 2002-03-11 | 2003-05-27 | Kabushiki Kaisha Toshiba | Semiconductor device |
| USD475355S1 (en) * | 2002-03-11 | 2003-06-03 | Kabushiki Kaisha Toshiba | Semiconductor device |
| USD475982S1 (en) * | 2002-03-11 | 2003-06-17 | Kabushiki Kaisha Toshiba | Semiconductor device |
| USD480371S1 (en) * | 2001-11-30 | 2003-10-07 | Kabushiki Kaisha Toshiba | Semiconductor device |
| USD489338S1 (en) * | 2003-07-28 | 2004-05-04 | Semiconductor Components Industries, L.L.C. | Packaged semiconductor device |
| USD504874S1 (en) * | 2004-08-11 | 2005-05-10 | Semiconductor Components Industries, Llc | Semiconductor device package |
| USD509810S1 (en) * | 2003-07-30 | 2005-09-20 | Delta Electronics Inc. | Molding structure of electric element |
| USD510728S1 (en) * | 2004-08-11 | 2005-10-18 | Semiconductor Components Industries Llc | Semiconductor device package |
| US6992386B2 (en) * | 2003-07-31 | 2006-01-31 | Renesas Technology Corp. | Semiconductor device and a method of manufacturing the same |
| USD648290S1 (en) * | 2010-06-08 | 2011-11-08 | Miyoshi Electronics Corporation | Semiconductor device |
| USD756317S1 (en) * | 2014-08-26 | 2016-05-17 | Féinics Amatech Teoranta | Layout for contact pads and connection bridges of a transponder chip module |
| USD768115S1 (en) * | 2015-02-05 | 2016-10-04 | Armen E. Kazanchian | Module |
| USD822628S1 (en) * | 2017-01-31 | 2018-07-10 | Rohm Co., Ltd. | Semiconductor device |
| USD822627S1 (en) * | 2017-01-31 | 2018-07-10 | Rohm Co., Ltd. | Semiconductor device |
| USD823270S1 (en) * | 2016-09-30 | 2018-07-17 | Rohm Co., Ltd. | Semiconductor device |
| USD832227S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
| USD832228S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
| USD853978S1 (en) * | 2017-02-28 | 2019-07-16 | Infineon Technologies Ag | High-performance semiconductor module |
| USD887998S1 (en) * | 2017-02-17 | 2020-06-23 | Stat Peel Ag | Chip |
| USD993201S1 (en) * | 2021-03-09 | 2023-07-25 | Rohm Co., Ltd. | Semiconductor module |
-
2022
- 2022-11-01 JP JP2022023716F patent/JP1741186S/en active Active
-
2023
- 2023-04-26 US US29/874,880 patent/USD1043595S1/en active Active
Patent Citations (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5401910A (en) * | 1992-12-03 | 1995-03-28 | Murata Manufacturing Co. Ltd. | Electronic component |
| USD406822S (en) * | 1997-03-06 | 1999-03-16 | Siemens Aktiengesellschaft | Carrier element for a semiconductor chip for integration into a chipcard, or a chipcard module |
| US6330165B1 (en) * | 1998-07-06 | 2001-12-11 | Hitachi, Ltd. | Semiconductor device |
| US6433418B1 (en) * | 1998-07-24 | 2002-08-13 | Fujitsu Limited | Apparatus for a vertically accumulable semiconductor device with external leads secured by a positioning mechanism |
| USD456367S1 (en) * | 2000-12-15 | 2002-04-30 | Protek Devices, Lp | Semiconductor chip |
| USD480371S1 (en) * | 2001-11-30 | 2003-10-07 | Kabushiki Kaisha Toshiba | Semiconductor device |
| USD475028S1 (en) * | 2002-03-11 | 2003-05-27 | Kabushiki Kaisha Toshiba | Semiconductor device |
| USD475355S1 (en) * | 2002-03-11 | 2003-06-03 | Kabushiki Kaisha Toshiba | Semiconductor device |
| USD475982S1 (en) * | 2002-03-11 | 2003-06-17 | Kabushiki Kaisha Toshiba | Semiconductor device |
| USD489338S1 (en) * | 2003-07-28 | 2004-05-04 | Semiconductor Components Industries, L.L.C. | Packaged semiconductor device |
| USD509810S1 (en) * | 2003-07-30 | 2005-09-20 | Delta Electronics Inc. | Molding structure of electric element |
| US6992386B2 (en) * | 2003-07-31 | 2006-01-31 | Renesas Technology Corp. | Semiconductor device and a method of manufacturing the same |
| USD510728S1 (en) * | 2004-08-11 | 2005-10-18 | Semiconductor Components Industries Llc | Semiconductor device package |
| USD504874S1 (en) * | 2004-08-11 | 2005-05-10 | Semiconductor Components Industries, Llc | Semiconductor device package |
| USD648290S1 (en) * | 2010-06-08 | 2011-11-08 | Miyoshi Electronics Corporation | Semiconductor device |
| USD756317S1 (en) * | 2014-08-26 | 2016-05-17 | Féinics Amatech Teoranta | Layout for contact pads and connection bridges of a transponder chip module |
| USD768115S1 (en) * | 2015-02-05 | 2016-10-04 | Armen E. Kazanchian | Module |
| USD823270S1 (en) * | 2016-09-30 | 2018-07-17 | Rohm Co., Ltd. | Semiconductor device |
| USD832227S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
| USD832228S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
| USD822628S1 (en) * | 2017-01-31 | 2018-07-10 | Rohm Co., Ltd. | Semiconductor device |
| USD822627S1 (en) * | 2017-01-31 | 2018-07-10 | Rohm Co., Ltd. | Semiconductor device |
| USD887998S1 (en) * | 2017-02-17 | 2020-06-23 | Stat Peel Ag | Chip |
| USD853978S1 (en) * | 2017-02-28 | 2019-07-16 | Infineon Technologies Ag | High-performance semiconductor module |
| USD993201S1 (en) * | 2021-03-09 | 2023-07-25 | Rohm Co., Ltd. | Semiconductor module |
Non-Patent Citations (2)
| Title |
|---|
| MP2672AGD-0000-Z,https://www.digikey.com/en/products/detail/monolithic-power-systems-inc/MP2672AGD-0000-Z/13572801, 2024. (Year: 2024). * |
| MP8904DD-LF-Z,https://www.digikey.com/en/products/detail/monolithic-power-systems-inc/MP8904DD-LF-Z/5292888, 2024. (Year: 2024). * |
Also Published As
| Publication number | Publication date |
|---|---|
| JP1741186S (en) | 2023-04-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |