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USD1043595S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD1043595S1
USD1043595S1 US29/874,880 US202329874880F USD1043595S US D1043595 S1 USD1043595 S1 US D1043595S1 US 202329874880 F US202329874880 F US 202329874880F US D1043595 S USD1043595 S US D1043595S
Authority
US
United States
Prior art keywords
semiconductor device
view
design
dash
dotted lines
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/874,880
Inventor
Aiko Miyazaki
Takahiro Arakawa
Tomoyuki Kawakami
Satoshi Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Assigned to ROHM CO., LTD. reassignment ROHM CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ARAKAWA, TAKAHIRO, KAWAKAMI, TOMOYUKI, KOBAYASHI, SATOSHI, MIYAZAKI, AIKO
Application granted granted Critical
Publication of USD1043595S1 publication Critical patent/USD1043595S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a perspective view of a semiconductor device showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a right side view thereof; and,
FIG. 6 is a left side view thereof.
The broken lines illustrate portions of the semiconductor device that form no part of the claimed design. The dash-dotted lines denote the boundary of the claim and form no part of the claimed design. Only the shaded areas denoted by the dash-dotted lines and the solid lines are claimed.

Claims (1)

    CLAIM
  1. The ornamental design for a semiconductor device, as shown and described.
US29/874,880 2022-11-01 2023-04-26 Semiconductor device Active USD1043595S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022023716F JP1741186S (en) 2022-11-01 2022-11-01 semiconductor element
JP2022-023716D 2022-11-01

Publications (1)

Publication Number Publication Date
USD1043595S1 true USD1043595S1 (en) 2024-09-24

Family

ID=85777490

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/874,880 Active USD1043595S1 (en) 2022-11-01 2023-04-26 Semiconductor device

Country Status (2)

Country Link
US (1) USD1043595S1 (en)
JP (1) JP1741186S (en)

Citations (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5401910A (en) * 1992-12-03 1995-03-28 Murata Manufacturing Co. Ltd. Electronic component
USD406822S (en) * 1997-03-06 1999-03-16 Siemens Aktiengesellschaft Carrier element for a semiconductor chip for integration into a chipcard, or a chipcard module
US6330165B1 (en) * 1998-07-06 2001-12-11 Hitachi, Ltd. Semiconductor device
USD456367S1 (en) * 2000-12-15 2002-04-30 Protek Devices, Lp Semiconductor chip
US6433418B1 (en) * 1998-07-24 2002-08-13 Fujitsu Limited Apparatus for a vertically accumulable semiconductor device with external leads secured by a positioning mechanism
USD475028S1 (en) * 2002-03-11 2003-05-27 Kabushiki Kaisha Toshiba Semiconductor device
USD475355S1 (en) * 2002-03-11 2003-06-03 Kabushiki Kaisha Toshiba Semiconductor device
USD475982S1 (en) * 2002-03-11 2003-06-17 Kabushiki Kaisha Toshiba Semiconductor device
USD480371S1 (en) * 2001-11-30 2003-10-07 Kabushiki Kaisha Toshiba Semiconductor device
USD489338S1 (en) * 2003-07-28 2004-05-04 Semiconductor Components Industries, L.L.C. Packaged semiconductor device
USD504874S1 (en) * 2004-08-11 2005-05-10 Semiconductor Components Industries, Llc Semiconductor device package
USD509810S1 (en) * 2003-07-30 2005-09-20 Delta Electronics Inc. Molding structure of electric element
USD510728S1 (en) * 2004-08-11 2005-10-18 Semiconductor Components Industries Llc Semiconductor device package
US6992386B2 (en) * 2003-07-31 2006-01-31 Renesas Technology Corp. Semiconductor device and a method of manufacturing the same
USD648290S1 (en) * 2010-06-08 2011-11-08 Miyoshi Electronics Corporation Semiconductor device
USD756317S1 (en) * 2014-08-26 2016-05-17 Féinics Amatech Teoranta Layout for contact pads and connection bridges of a transponder chip module
USD768115S1 (en) * 2015-02-05 2016-10-04 Armen E. Kazanchian Module
USD822628S1 (en) * 2017-01-31 2018-07-10 Rohm Co., Ltd. Semiconductor device
USD822627S1 (en) * 2017-01-31 2018-07-10 Rohm Co., Ltd. Semiconductor device
USD823270S1 (en) * 2016-09-30 2018-07-17 Rohm Co., Ltd. Semiconductor device
USD832227S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD832228S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD853978S1 (en) * 2017-02-28 2019-07-16 Infineon Technologies Ag High-performance semiconductor module
USD887998S1 (en) * 2017-02-17 2020-06-23 Stat Peel Ag Chip
USD993201S1 (en) * 2021-03-09 2023-07-25 Rohm Co., Ltd. Semiconductor module

Patent Citations (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5401910A (en) * 1992-12-03 1995-03-28 Murata Manufacturing Co. Ltd. Electronic component
USD406822S (en) * 1997-03-06 1999-03-16 Siemens Aktiengesellschaft Carrier element for a semiconductor chip for integration into a chipcard, or a chipcard module
US6330165B1 (en) * 1998-07-06 2001-12-11 Hitachi, Ltd. Semiconductor device
US6433418B1 (en) * 1998-07-24 2002-08-13 Fujitsu Limited Apparatus for a vertically accumulable semiconductor device with external leads secured by a positioning mechanism
USD456367S1 (en) * 2000-12-15 2002-04-30 Protek Devices, Lp Semiconductor chip
USD480371S1 (en) * 2001-11-30 2003-10-07 Kabushiki Kaisha Toshiba Semiconductor device
USD475028S1 (en) * 2002-03-11 2003-05-27 Kabushiki Kaisha Toshiba Semiconductor device
USD475355S1 (en) * 2002-03-11 2003-06-03 Kabushiki Kaisha Toshiba Semiconductor device
USD475982S1 (en) * 2002-03-11 2003-06-17 Kabushiki Kaisha Toshiba Semiconductor device
USD489338S1 (en) * 2003-07-28 2004-05-04 Semiconductor Components Industries, L.L.C. Packaged semiconductor device
USD509810S1 (en) * 2003-07-30 2005-09-20 Delta Electronics Inc. Molding structure of electric element
US6992386B2 (en) * 2003-07-31 2006-01-31 Renesas Technology Corp. Semiconductor device and a method of manufacturing the same
USD510728S1 (en) * 2004-08-11 2005-10-18 Semiconductor Components Industries Llc Semiconductor device package
USD504874S1 (en) * 2004-08-11 2005-05-10 Semiconductor Components Industries, Llc Semiconductor device package
USD648290S1 (en) * 2010-06-08 2011-11-08 Miyoshi Electronics Corporation Semiconductor device
USD756317S1 (en) * 2014-08-26 2016-05-17 Féinics Amatech Teoranta Layout for contact pads and connection bridges of a transponder chip module
USD768115S1 (en) * 2015-02-05 2016-10-04 Armen E. Kazanchian Module
USD823270S1 (en) * 2016-09-30 2018-07-17 Rohm Co., Ltd. Semiconductor device
USD832227S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD832228S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD822628S1 (en) * 2017-01-31 2018-07-10 Rohm Co., Ltd. Semiconductor device
USD822627S1 (en) * 2017-01-31 2018-07-10 Rohm Co., Ltd. Semiconductor device
USD887998S1 (en) * 2017-02-17 2020-06-23 Stat Peel Ag Chip
USD853978S1 (en) * 2017-02-28 2019-07-16 Infineon Technologies Ag High-performance semiconductor module
USD993201S1 (en) * 2021-03-09 2023-07-25 Rohm Co., Ltd. Semiconductor module

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
MP2672AGD-0000-Z,https://www.digikey.com/en/products/detail/monolithic-power-systems-inc/MP2672AGD-0000-Z/13572801, 2024. (Year: 2024). *
MP8904DD-LF-Z,https://www.digikey.com/en/products/detail/monolithic-power-systems-inc/MP8904DD-LF-Z/5292888, 2024. (Year: 2024). *

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