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USD598380S1 - Conductive sheet - Google Patents

Conductive sheet Download PDF

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Publication number
USD598380S1
USD598380S1 US29/327,598 US32759808F USD598380S US D598380 S1 USD598380 S1 US D598380S1 US 32759808 F US32759808 F US 32759808F US D598380 S USD598380 S US D598380S
Authority
US
United States
Prior art keywords
conductive sheet
conductive
ornamental design
sheet
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/327,598
Inventor
Tadashi Kuriki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Assigned to FUJIFILM CORPORATION reassignment FUJIFILM CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KURIKI, TADASHI
Assigned to FUJIFILM CORPORATION reassignment FUJIFILM CORPORATION CORRECTIVE ASSIGNMENT TO CORRECT THE ADDRESS OF THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 021809 FRAME 0217. ASSIGNOR(S) HEREBY CONFIRMS THE THE STREET NUMBER SHOULD HAVE BEEN 26-30 RATHER THAN 23-30. Assignors: KURIKI, TADASHI
Application granted granted Critical
Publication of USD598380S1 publication Critical patent/USD598380S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front view of a conductive sheet showing my new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a bottom plan view thereof; and,
FIG. 4 is a right side view thereof.

Claims (1)

    CLAIM
  1. The ornamental design for a conductive sheet, as shown.
US29/327,598 2008-05-09 2008-11-10 Conductive sheet Expired - Lifetime USD598380S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008011618 2008-05-09
JP2008-011618 2008-05-09

Publications (1)

Publication Number Publication Date
USD598380S1 true USD598380S1 (en) 2009-08-18

Family

ID=40942995

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/327,598 Expired - Lifetime USD598380S1 (en) 2008-05-09 2008-11-10 Conductive sheet

Country Status (1)

Country Link
US (1) USD598380S1 (en)

Cited By (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD613690S1 (en) * 2008-12-09 2010-04-13 Fujifilm Corporation Conductive sheet
USD615378S1 (en) * 2008-05-28 2010-05-11 The Procter & Gamble Company Pattern for a sheet
USD615927S1 (en) * 2008-05-09 2010-05-18 Fujifilm Corporation Conductive sheet
USD621803S1 (en) * 2008-07-16 2010-08-17 The Furukawa Electric Co., Ltd. Semiconductor wafer processing tape
USD628170S1 (en) * 2008-07-16 2010-11-30 The Furukawa Electric Company Semiconductor wafer processing tape
USD650993S1 (en) 2010-09-22 2011-12-27 The Procter & Gamble Company Sheet with pattern
USD680505S1 (en) * 2010-10-15 2013-04-23 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD716241S1 (en) * 2013-07-11 2014-10-28 Sumitomo Electric Printed Circuits, Inc. Wiring board
USD716741S1 (en) * 2013-07-11 2014-11-04 Sumitomo Electric Printed Circuits, Inc. Wiring board
USD734732S1 (en) * 2013-07-10 2015-07-21 Sumitomo Electric Fine Polymer, Inc. Circuit board material
USD743356S1 (en) * 2011-06-17 2015-11-17 Soraa, Inc. Diamond-shaped semiconductor die
USD774477S1 (en) * 2014-03-28 2016-12-20 Osram Sylvania Inc. Conductor pads
USD784937S1 (en) 2014-11-13 2017-04-25 Tokyo Electron Limited Dummy wafer
USD785576S1 (en) * 2014-11-13 2017-05-02 Tokyo Electron Limited Dummy wafer
USD786810S1 (en) 2014-11-13 2017-05-16 Tokyo Electron Limited Dummy wafer
USD813182S1 (en) * 2016-08-02 2018-03-20 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device
USD822229S1 (en) * 2014-11-26 2018-07-03 Durlum Group Gmbh Ceiling tile or panel
USD822628S1 (en) * 2017-01-31 2018-07-10 Rohm Co., Ltd. Semiconductor device
USD822627S1 (en) * 2017-01-31 2018-07-10 Rohm Co., Ltd. Semiconductor device
USD823270S1 (en) * 2016-09-30 2018-07-17 Rohm Co., Ltd. Semiconductor device
USD846513S1 (en) * 2016-04-27 2019-04-23 Ngk Insulators, Ltd. Sheet heater for electrostatic chuck
USD934821S1 (en) * 2019-07-24 2021-11-02 Nuvoton Technology Corporation Japan Semiconductor device
USD934820S1 (en) * 2019-10-24 2021-11-02 Nuvoton Technology Corporation Japan Semiconductor device
USD937232S1 (en) 2019-10-24 2021-11-30 Nuvoton Technology Corporation Japan Semiconductor device
USD951214S1 (en) * 2019-12-11 2022-05-10 Panasonic Semiconductor Solutions Co., Ltd. Semiconductor device
USD951213S1 (en) * 2019-12-11 2022-05-10 Panasonic Semiconductor Solutions Co., Ltd. Semiconductor device
USD951212S1 (en) * 2019-12-11 2022-05-10 Panasonic Semiconductor Solutions Co., Ltd. Semiconductor device
USD951215S1 (en) * 2019-12-11 2022-05-10 Panasonic Semiconductor Solutions Co., Ltd. Semiconductor device
USD1106985S1 (en) * 2022-11-12 2025-12-23 Mxw Device (Shenzhen) Co., Ltd. Multilayer integrated circuit carrier board

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD319629S (en) * 1988-04-13 1991-09-03 Ibiden Co., Ltd. Semiconductor substrate with conducting pattern
US5084958A (en) * 1989-05-30 1992-02-04 General Electric Company Method of making conductive film magnetic components
USD353135S (en) * 1991-11-27 1994-12-06 Gemplus Card International Connecting terminal for chip cards
USD393458S (en) * 1995-06-19 1998-04-14 Gemplus Connecting terminal for chip cards
USD406822S (en) * 1997-03-06 1999-03-16 Siemens Aktiengesellschaft Carrier element for a semiconductor chip for integration into a chipcard, or a chipcard module
USD419959S (en) * 1998-11-25 2000-02-01 Amoroso Eugene C Conductive ink traces pattern on a medium
US20010052595A1 (en) * 2000-03-15 2001-12-20 Hulett John K. Reflective fencing with light elements
USD487430S1 (en) * 2002-07-10 2004-03-09 Matsushita Electric Industrial Co., Ltd. Semiconductor memory element
US20070159285A1 (en) * 2003-11-28 2007-07-12 Freescale Semiconductor, Inc High frequency thin film electrical circuit element
USD577691S1 (en) * 2005-04-13 2008-09-30 Nitto Denko Corporation Grooves formed around a semiconductor device on a circuit board

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD319629S (en) * 1988-04-13 1991-09-03 Ibiden Co., Ltd. Semiconductor substrate with conducting pattern
US5084958A (en) * 1989-05-30 1992-02-04 General Electric Company Method of making conductive film magnetic components
USD353135S (en) * 1991-11-27 1994-12-06 Gemplus Card International Connecting terminal for chip cards
USD393458S (en) * 1995-06-19 1998-04-14 Gemplus Connecting terminal for chip cards
USD406822S (en) * 1997-03-06 1999-03-16 Siemens Aktiengesellschaft Carrier element for a semiconductor chip for integration into a chipcard, or a chipcard module
USD419959S (en) * 1998-11-25 2000-02-01 Amoroso Eugene C Conductive ink traces pattern on a medium
US20010052595A1 (en) * 2000-03-15 2001-12-20 Hulett John K. Reflective fencing with light elements
USD487430S1 (en) * 2002-07-10 2004-03-09 Matsushita Electric Industrial Co., Ltd. Semiconductor memory element
US20070159285A1 (en) * 2003-11-28 2007-07-12 Freescale Semiconductor, Inc High frequency thin film electrical circuit element
USD577691S1 (en) * 2005-04-13 2008-09-30 Nitto Denko Corporation Grooves formed around a semiconductor device on a circuit board
USD577692S1 (en) * 2005-04-13 2008-09-30 Nitto Denko Corporation Grooves formed around a semiconductor device on a circuit board

Cited By (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD615927S1 (en) * 2008-05-09 2010-05-18 Fujifilm Corporation Conductive sheet
USD615378S1 (en) * 2008-05-28 2010-05-11 The Procter & Gamble Company Pattern for a sheet
USD625110S1 (en) 2008-05-28 2010-10-12 The Procter & Gamble Company Sheet with pattern
USD630859S1 (en) 2008-05-28 2011-01-18 The Procter & Gamble Company Sheet material with pattern
USD621803S1 (en) * 2008-07-16 2010-08-17 The Furukawa Electric Co., Ltd. Semiconductor wafer processing tape
USD628170S1 (en) * 2008-07-16 2010-11-30 The Furukawa Electric Company Semiconductor wafer processing tape
USD613690S1 (en) * 2008-12-09 2010-04-13 Fujifilm Corporation Conductive sheet
USD650993S1 (en) 2010-09-22 2011-12-27 The Procter & Gamble Company Sheet with pattern
USD662325S1 (en) 2010-09-22 2012-06-26 The Procter & Gamble Company Sheet with pattern
USD680505S1 (en) * 2010-10-15 2013-04-23 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD743356S1 (en) * 2011-06-17 2015-11-17 Soraa, Inc. Diamond-shaped semiconductor die
USD734732S1 (en) * 2013-07-10 2015-07-21 Sumitomo Electric Fine Polymer, Inc. Circuit board material
USD716241S1 (en) * 2013-07-11 2014-10-28 Sumitomo Electric Printed Circuits, Inc. Wiring board
USD716741S1 (en) * 2013-07-11 2014-11-04 Sumitomo Electric Printed Circuits, Inc. Wiring board
USD774477S1 (en) * 2014-03-28 2016-12-20 Osram Sylvania Inc. Conductor pads
USD844577S1 (en) * 2014-03-28 2019-04-02 Osram Sylvania Inc. Conductor pad
USD877103S1 (en) * 2014-03-28 2020-03-03 Osram Sylvania Inc. Conductor pad
USD784937S1 (en) 2014-11-13 2017-04-25 Tokyo Electron Limited Dummy wafer
USD785576S1 (en) * 2014-11-13 2017-05-02 Tokyo Electron Limited Dummy wafer
USD786810S1 (en) 2014-11-13 2017-05-16 Tokyo Electron Limited Dummy wafer
USD822229S1 (en) * 2014-11-26 2018-07-03 Durlum Group Gmbh Ceiling tile or panel
USD846513S1 (en) * 2016-04-27 2019-04-23 Ngk Insulators, Ltd. Sheet heater for electrostatic chuck
USD813182S1 (en) * 2016-08-02 2018-03-20 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device
USD823270S1 (en) * 2016-09-30 2018-07-17 Rohm Co., Ltd. Semiconductor device
USD822627S1 (en) * 2017-01-31 2018-07-10 Rohm Co., Ltd. Semiconductor device
USD822628S1 (en) * 2017-01-31 2018-07-10 Rohm Co., Ltd. Semiconductor device
USD934821S1 (en) * 2019-07-24 2021-11-02 Nuvoton Technology Corporation Japan Semiconductor device
USD934820S1 (en) * 2019-10-24 2021-11-02 Nuvoton Technology Corporation Japan Semiconductor device
USD937233S1 (en) 2019-10-24 2021-11-30 Nuvoton Technology Corporation Japan Semiconductor device
USD937232S1 (en) 2019-10-24 2021-11-30 Nuvoton Technology Corporation Japan Semiconductor device
USD938925S1 (en) * 2019-10-24 2021-12-21 Nuvoton Technology Corporation Japan Semiconductor device
USD951214S1 (en) * 2019-12-11 2022-05-10 Panasonic Semiconductor Solutions Co., Ltd. Semiconductor device
USD951213S1 (en) * 2019-12-11 2022-05-10 Panasonic Semiconductor Solutions Co., Ltd. Semiconductor device
USD951212S1 (en) * 2019-12-11 2022-05-10 Panasonic Semiconductor Solutions Co., Ltd. Semiconductor device
USD951215S1 (en) * 2019-12-11 2022-05-10 Panasonic Semiconductor Solutions Co., Ltd. Semiconductor device
USD1106985S1 (en) * 2022-11-12 2025-12-23 Mxw Device (Shenzhen) Co., Ltd. Multilayer integrated circuit carrier board

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