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USD1046800S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD1046800S1
USD1046800S1 US29/845,558 US202229845558F USD1046800S US D1046800 S1 USD1046800 S1 US D1046800S1 US 202229845558 F US202229845558 F US 202229845558F US D1046800 S USD1046800 S US D1046800S
Authority
US
United States
Prior art keywords
semiconductor device
view
design
perspective
dash
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/845,558
Inventor
Shuhei Yokoyama
Shogo Shibata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Assigned to MITSUBISHI ELECTRIC CORPORATION reassignment MITSUBISHI ELECTRIC CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SHIBATA, SHOGO, YOKOYAMA, SHUHEI
Application granted granted Critical
Publication of USD1046800S1 publication Critical patent/USD1046800S1/en
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Description

FIG. 1 is a first perspective view of a semiconductor device showing our new design;
FIG. 2 is a second perspective view thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a left side view thereof;
FIG. 6 is a right side view thereof;
FIG. 7 is a top plan view thereof; and,
FIG. 8 is a bottom plan view thereof.
The dash-dash broken lines showing of the semiconductor device are included for the purpose of illustrating portions of the semiconductor device and form no part of the claimed design.
The dot-dash broken lines show boundaries of the claimed design and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a semiconductor device as shown and described.
US29/845,558 2022-01-28 2022-07-08 Semiconductor device Active USD1046800S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-001597D 2022-01-28
JP2022001597F JP1727400S (en) 2022-01-28 2022-01-28 semiconductor device

Publications (1)

Publication Number Publication Date
USD1046800S1 true USD1046800S1 (en) 2024-10-15

Family

ID=83544743

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/845,558 Active USD1046800S1 (en) 2022-01-28 2022-07-08 Semiconductor device

Country Status (2)

Country Link
US (1) USD1046800S1 (en)
JP (1) JP1727400S (en)

Citations (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4028722A (en) * 1970-10-13 1977-06-07 Motorola, Inc. Contact bonded packaged integrated circuit
US5089929A (en) * 1990-03-08 1992-02-18 The United States Of America As Represented By The Secretary Of The Air Force Retrofit integrated circuit terminal protection device
USD394244S (en) * 1995-11-27 1998-05-12 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
US5834842A (en) * 1996-01-17 1998-11-10 Mitsubishi Denki Kabushiki Kaisha Semiconductor device, semiconductor module, and radiating fin
USD401912S (en) * 1995-11-27 1998-12-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD418485S (en) * 1998-09-29 2000-01-04 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD421969S (en) * 1998-09-29 2000-03-28 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD428859S (en) * 1999-01-28 2000-08-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD448739S1 (en) * 2000-09-12 2001-10-02 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD448740S1 (en) * 2000-11-30 2001-10-02 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD470463S1 (en) * 2001-11-30 2003-02-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD470824S1 (en) * 2001-11-30 2003-02-25 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD470825S1 (en) * 2001-12-28 2003-02-25 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD472530S1 (en) * 2001-11-30 2003-04-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD505400S1 (en) * 2004-03-26 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD505399S1 (en) * 2003-03-14 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD539761S1 (en) * 2006-08-22 2007-04-03 Kabushiki Kaisha Toshiba Semiconductor
USD548203S1 (en) * 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD548202S1 (en) * 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD717253S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717255S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717254S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717256S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719113S1 (en) * 2012-09-20 2014-12-09 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719926S1 (en) * 2012-09-20 2014-12-23 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD770994S1 (en) * 2014-04-02 2016-11-08 Mitsubishi Electric Corporation Power semiconductor device
USD888673S1 (en) * 2018-06-26 2020-06-30 Rohm Co., Ltd. Semiconductor module
USD906271S1 (en) * 2018-04-13 2020-12-29 Rohm Co., Ltd. Semiconductor module
US20200411404A1 (en) * 2019-06-27 2020-12-31 Mitsubishi Electric Corporation Semiconductor device
USD913978S1 (en) * 2018-06-26 2021-03-23 Rohm Co., Ltd. Semiconductor module
US20220223568A1 (en) * 2019-05-27 2022-07-14 Rohm Co., Ltd. Semiconductor device
US20220352049A1 (en) * 2019-08-29 2022-11-03 Mitsubishi Electric Corporation Power semiconductor apparatus and method for manufacturing the same
USD971863S1 (en) * 2020-01-28 2022-12-06 Rohm Co., Ltd. Semiconductor module
USD972516S1 (en) * 2020-01-28 2022-12-13 Rohm Co., Ltd. Semiconductor module

Patent Citations (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4028722A (en) * 1970-10-13 1977-06-07 Motorola, Inc. Contact bonded packaged integrated circuit
US5089929A (en) * 1990-03-08 1992-02-18 The United States Of America As Represented By The Secretary Of The Air Force Retrofit integrated circuit terminal protection device
USD394244S (en) * 1995-11-27 1998-05-12 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD401912S (en) * 1995-11-27 1998-12-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
US5834842A (en) * 1996-01-17 1998-11-10 Mitsubishi Denki Kabushiki Kaisha Semiconductor device, semiconductor module, and radiating fin
USD418485S (en) * 1998-09-29 2000-01-04 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD421969S (en) * 1998-09-29 2000-03-28 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD428859S (en) * 1999-01-28 2000-08-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD448739S1 (en) * 2000-09-12 2001-10-02 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD448740S1 (en) * 2000-11-30 2001-10-02 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD470463S1 (en) * 2001-11-30 2003-02-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD470824S1 (en) * 2001-11-30 2003-02-25 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD472530S1 (en) * 2001-11-30 2003-04-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD470825S1 (en) * 2001-12-28 2003-02-25 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD505399S1 (en) * 2003-03-14 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD505400S1 (en) * 2004-03-26 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD548202S1 (en) * 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD548203S1 (en) * 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD539761S1 (en) * 2006-08-22 2007-04-03 Kabushiki Kaisha Toshiba Semiconductor
USD717255S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717256S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719113S1 (en) * 2012-09-20 2014-12-09 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719926S1 (en) * 2012-09-20 2014-12-23 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717253S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717254S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD777124S1 (en) * 2014-04-02 2017-01-24 Mitsubishi Electric Corporation Power semiconductor device
USD772182S1 (en) * 2014-04-02 2016-11-22 Mitsubishi Electric Corporation Power semiconductor device
USD770994S1 (en) * 2014-04-02 2016-11-08 Mitsubishi Electric Corporation Power semiconductor device
USD783550S1 (en) * 2014-04-02 2017-04-11 Mitsubishi Electric Corporation Power semiconductor device
USD906271S1 (en) * 2018-04-13 2020-12-29 Rohm Co., Ltd. Semiconductor module
USD888673S1 (en) * 2018-06-26 2020-06-30 Rohm Co., Ltd. Semiconductor module
USD903613S1 (en) * 2018-06-26 2020-12-01 Rohm Co., Ltd. Semiconductor module
USD913978S1 (en) * 2018-06-26 2021-03-23 Rohm Co., Ltd. Semiconductor module
US20220223568A1 (en) * 2019-05-27 2022-07-14 Rohm Co., Ltd. Semiconductor device
US20200411404A1 (en) * 2019-06-27 2020-12-31 Mitsubishi Electric Corporation Semiconductor device
US20220352049A1 (en) * 2019-08-29 2022-11-03 Mitsubishi Electric Corporation Power semiconductor apparatus and method for manufacturing the same
USD971863S1 (en) * 2020-01-28 2022-12-06 Rohm Co., Ltd. Semiconductor module
USD972516S1 (en) * 2020-01-28 2022-12-13 Rohm Co., Ltd. Semiconductor module

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