USD1046800S1 - Semiconductor device - Google Patents
Semiconductor device Download PDFInfo
- Publication number
- USD1046800S1 USD1046800S1 US29/845,558 US202229845558F USD1046800S US D1046800 S1 USD1046800 S1 US D1046800S1 US 202229845558 F US202229845558 F US 202229845558F US D1046800 S USD1046800 S US D1046800S
- Authority
- US
- United States
- Prior art keywords
- semiconductor device
- view
- design
- perspective
- dash
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
The dash-dash broken lines showing of the semiconductor device are included for the purpose of illustrating portions of the semiconductor device and form no part of the claimed design.
The dot-dash broken lines show boundaries of the claimed design and form no part of the claimed design.
Claims (1)
- The ornamental design for a semiconductor device as shown and described.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022-001597D | 2022-01-28 | ||
| JP2022001597F JP1727400S (en) | 2022-01-28 | 2022-01-28 | semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD1046800S1 true USD1046800S1 (en) | 2024-10-15 |
Family
ID=83544743
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/845,558 Active USD1046800S1 (en) | 2022-01-28 | 2022-07-08 | Semiconductor device |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD1046800S1 (en) |
| JP (1) | JP1727400S (en) |
Citations (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4028722A (en) * | 1970-10-13 | 1977-06-07 | Motorola, Inc. | Contact bonded packaged integrated circuit |
| US5089929A (en) * | 1990-03-08 | 1992-02-18 | The United States Of America As Represented By The Secretary Of The Air Force | Retrofit integrated circuit terminal protection device |
| USD394244S (en) * | 1995-11-27 | 1998-05-12 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| US5834842A (en) * | 1996-01-17 | 1998-11-10 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device, semiconductor module, and radiating fin |
| USD401912S (en) * | 1995-11-27 | 1998-12-01 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD418485S (en) * | 1998-09-29 | 2000-01-04 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD421969S (en) * | 1998-09-29 | 2000-03-28 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD428859S (en) * | 1999-01-28 | 2000-08-01 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD448739S1 (en) * | 2000-09-12 | 2001-10-02 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD448740S1 (en) * | 2000-11-30 | 2001-10-02 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD470463S1 (en) * | 2001-11-30 | 2003-02-18 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD470824S1 (en) * | 2001-11-30 | 2003-02-25 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD470825S1 (en) * | 2001-12-28 | 2003-02-25 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD472530S1 (en) * | 2001-11-30 | 2003-04-01 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD505400S1 (en) * | 2004-03-26 | 2005-05-24 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD505399S1 (en) * | 2003-03-14 | 2005-05-24 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD539761S1 (en) * | 2006-08-22 | 2007-04-03 | Kabushiki Kaisha Toshiba | Semiconductor |
| USD548203S1 (en) * | 2006-04-17 | 2007-08-07 | Kabushiki Kaisha Toshiba | Semiconductor |
| USD548202S1 (en) * | 2006-04-17 | 2007-08-07 | Kabushiki Kaisha Toshiba | Semiconductor |
| USD717253S1 (en) * | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD717255S1 (en) * | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD717254S1 (en) * | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD717256S1 (en) * | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD719113S1 (en) * | 2012-09-20 | 2014-12-09 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD719926S1 (en) * | 2012-09-20 | 2014-12-23 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD770994S1 (en) * | 2014-04-02 | 2016-11-08 | Mitsubishi Electric Corporation | Power semiconductor device |
| USD888673S1 (en) * | 2018-06-26 | 2020-06-30 | Rohm Co., Ltd. | Semiconductor module |
| USD906271S1 (en) * | 2018-04-13 | 2020-12-29 | Rohm Co., Ltd. | Semiconductor module |
| US20200411404A1 (en) * | 2019-06-27 | 2020-12-31 | Mitsubishi Electric Corporation | Semiconductor device |
| USD913978S1 (en) * | 2018-06-26 | 2021-03-23 | Rohm Co., Ltd. | Semiconductor module |
| US20220223568A1 (en) * | 2019-05-27 | 2022-07-14 | Rohm Co., Ltd. | Semiconductor device |
| US20220352049A1 (en) * | 2019-08-29 | 2022-11-03 | Mitsubishi Electric Corporation | Power semiconductor apparatus and method for manufacturing the same |
| USD971863S1 (en) * | 2020-01-28 | 2022-12-06 | Rohm Co., Ltd. | Semiconductor module |
| USD972516S1 (en) * | 2020-01-28 | 2022-12-13 | Rohm Co., Ltd. | Semiconductor module |
-
2022
- 2022-01-28 JP JP2022001597F patent/JP1727400S/en active Active
- 2022-07-08 US US29/845,558 patent/USD1046800S1/en active Active
Patent Citations (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4028722A (en) * | 1970-10-13 | 1977-06-07 | Motorola, Inc. | Contact bonded packaged integrated circuit |
| US5089929A (en) * | 1990-03-08 | 1992-02-18 | The United States Of America As Represented By The Secretary Of The Air Force | Retrofit integrated circuit terminal protection device |
| USD394244S (en) * | 1995-11-27 | 1998-05-12 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD401912S (en) * | 1995-11-27 | 1998-12-01 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| US5834842A (en) * | 1996-01-17 | 1998-11-10 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device, semiconductor module, and radiating fin |
| USD418485S (en) * | 1998-09-29 | 2000-01-04 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD421969S (en) * | 1998-09-29 | 2000-03-28 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD428859S (en) * | 1999-01-28 | 2000-08-01 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD448739S1 (en) * | 2000-09-12 | 2001-10-02 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD448740S1 (en) * | 2000-11-30 | 2001-10-02 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD470463S1 (en) * | 2001-11-30 | 2003-02-18 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD470824S1 (en) * | 2001-11-30 | 2003-02-25 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD472530S1 (en) * | 2001-11-30 | 2003-04-01 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD470825S1 (en) * | 2001-12-28 | 2003-02-25 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD505399S1 (en) * | 2003-03-14 | 2005-05-24 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD505400S1 (en) * | 2004-03-26 | 2005-05-24 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD548202S1 (en) * | 2006-04-17 | 2007-08-07 | Kabushiki Kaisha Toshiba | Semiconductor |
| USD548203S1 (en) * | 2006-04-17 | 2007-08-07 | Kabushiki Kaisha Toshiba | Semiconductor |
| USD539761S1 (en) * | 2006-08-22 | 2007-04-03 | Kabushiki Kaisha Toshiba | Semiconductor |
| USD717255S1 (en) * | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD717256S1 (en) * | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD719113S1 (en) * | 2012-09-20 | 2014-12-09 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD719926S1 (en) * | 2012-09-20 | 2014-12-23 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD717253S1 (en) * | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD717254S1 (en) * | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD777124S1 (en) * | 2014-04-02 | 2017-01-24 | Mitsubishi Electric Corporation | Power semiconductor device |
| USD772182S1 (en) * | 2014-04-02 | 2016-11-22 | Mitsubishi Electric Corporation | Power semiconductor device |
| USD770994S1 (en) * | 2014-04-02 | 2016-11-08 | Mitsubishi Electric Corporation | Power semiconductor device |
| USD783550S1 (en) * | 2014-04-02 | 2017-04-11 | Mitsubishi Electric Corporation | Power semiconductor device |
| USD906271S1 (en) * | 2018-04-13 | 2020-12-29 | Rohm Co., Ltd. | Semiconductor module |
| USD888673S1 (en) * | 2018-06-26 | 2020-06-30 | Rohm Co., Ltd. | Semiconductor module |
| USD903613S1 (en) * | 2018-06-26 | 2020-12-01 | Rohm Co., Ltd. | Semiconductor module |
| USD913978S1 (en) * | 2018-06-26 | 2021-03-23 | Rohm Co., Ltd. | Semiconductor module |
| US20220223568A1 (en) * | 2019-05-27 | 2022-07-14 | Rohm Co., Ltd. | Semiconductor device |
| US20200411404A1 (en) * | 2019-06-27 | 2020-12-31 | Mitsubishi Electric Corporation | Semiconductor device |
| US20220352049A1 (en) * | 2019-08-29 | 2022-11-03 | Mitsubishi Electric Corporation | Power semiconductor apparatus and method for manufacturing the same |
| USD971863S1 (en) * | 2020-01-28 | 2022-12-06 | Rohm Co., Ltd. | Semiconductor module |
| USD972516S1 (en) * | 2020-01-28 | 2022-12-13 | Rohm Co., Ltd. | Semiconductor module |
Also Published As
| Publication number | Publication date |
|---|---|
| JP1727400S (en) | 2022-10-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |