|
US4028722A
(en)
*
|
1970-10-13 |
1977-06-07 |
Motorola, Inc. |
Contact bonded packaged integrated circuit
|
|
US5089929A
(en)
*
|
1990-03-08 |
1992-02-18 |
The United States Of America As Represented By The Secretary Of The Air Force |
Retrofit integrated circuit terminal protection device
|
|
USD401912S
(en)
*
|
1995-11-27 |
1998-12-01 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device
|
|
USD394244S
(en)
*
|
1995-11-27 |
1998-05-12 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device
|
|
JPH09199645A
(en)
*
|
1996-01-17 |
1997-07-31 |
Mitsubishi Electric Corp |
Semiconductor device and semiconductor module
|
|
USD421969S
(en)
*
|
1998-09-29 |
2000-03-28 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device
|
|
USD418485S
(en)
*
|
1998-09-29 |
2000-01-04 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device
|
|
USD428859S
(en)
*
|
1999-01-28 |
2000-08-01 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device
|
|
USD448739S1
(en)
*
|
2000-09-12 |
2001-10-02 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device
|
|
USD448740S1
(en)
*
|
2000-11-30 |
2001-10-02 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device
|
|
USD470824S1
(en)
*
|
2001-11-30 |
2003-02-25 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device
|
|
USD470463S1
(en)
*
|
2001-11-30 |
2003-02-18 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device
|
|
USD472530S1
(en)
*
|
2001-11-30 |
2003-04-01 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device
|
|
USD470825S1
(en)
*
|
2001-12-28 |
2003-02-25 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device
|
|
USD505399S1
(en)
*
|
2003-03-14 |
2005-05-24 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device
|
|
USD505400S1
(en)
*
|
2004-03-26 |
2005-05-24 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device
|
|
USD548203S1
(en)
*
|
2006-04-17 |
2007-08-07 |
Kabushiki Kaisha Toshiba |
Semiconductor
|
|
USD548202S1
(en)
*
|
2006-04-17 |
2007-08-07 |
Kabushiki Kaisha Toshiba |
Semiconductor
|
|
USD539761S1
(en)
*
|
2006-08-22 |
2007-04-03 |
Kabushiki Kaisha Toshiba |
Semiconductor
|
|
USD717255S1
(en)
*
|
2012-09-20 |
2014-11-11 |
Samsung Electro-Mechanics Co., Ltd. |
Semiconductor device
|
|
USD719926S1
(en)
*
|
2012-09-20 |
2014-12-23 |
Samsung Electro-Mechanics Co., Ltd. |
Semiconductor device
|
|
USD719113S1
(en)
*
|
2012-09-20 |
2014-12-09 |
Samsung Electro-Mechanics Co., Ltd. |
Semiconductor device
|
|
USD717256S1
(en)
*
|
2012-09-20 |
2014-11-11 |
Samsung Electro-Mechanics Co., Ltd. |
Semiconductor device
|
|
USD717253S1
(en)
*
|
2012-10-11 |
2014-11-11 |
Samsung Electro-Mechanics Co., Ltd. |
Semiconductor device
|
|
USD717254S1
(en)
*
|
2012-10-11 |
2014-11-11 |
Samsung Electro-Mechanics Co., Ltd. |
Semiconductor device
|
|
USD772182S1
(en)
*
|
2014-04-02 |
2016-11-22 |
Mitsubishi Electric Corporation |
Power semiconductor device
|
|
USD906271S1
(en)
*
|
2018-04-13 |
2020-12-29 |
Rohm Co., Ltd. |
Semiconductor module
|
|
USD888673S1
(en)
*
|
2018-06-26 |
2020-06-30 |
Rohm Co., Ltd. |
Semiconductor module
|
|
JP1641098S
(en)
*
|
2018-06-26 |
2019-09-09 |
|
|
|
JP7391957B2
(en)
*
|
2019-05-27 |
2023-12-05 |
ローム株式会社 |
semiconductor equipment
|
|
JP7088129B2
(en)
*
|
2019-06-27 |
2022-06-21 |
三菱電機株式会社 |
Semiconductor device
|
|
US11600546B2
(en)
*
|
2019-08-29 |
2023-03-07 |
Mitsubishi Electric Corporation |
Power semiconductor apparatus and method for manufacturing the same
|
|
USD972516S1
(en)
*
|
2020-01-28 |
2022-12-13 |
Rohm Co., Ltd. |
Semiconductor module
|
|
USD971863S1
(en)
*
|
2020-01-28 |
2022-12-06 |
Rohm Co., Ltd. |
Semiconductor module
|