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USD1046801S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD1046801S1
USD1046801S1 US29/865,151 US202229865151F USD1046801S US D1046801 S1 USD1046801 S1 US D1046801S1 US 202229865151 F US202229865151 F US 202229865151F US D1046801 S USD1046801 S US D1046801S
Authority
US
United States
Prior art keywords
semiconductor device
view
ornamental design
perspective
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/865,151
Inventor
Shuhei Yokoyama
Shogo Shibata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Assigned to MITSUBISHI ELECTRIC CORPORATION reassignment MITSUBISHI ELECTRIC CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SHIBATA, SHOGO, YOKOYAMA, SHUHEI
Application granted granted Critical
Publication of USD1046801S1 publication Critical patent/USD1046801S1/en
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Description

FIG. 1 is a first perspective view of a semiconductor device showing our new design;
FIG. 2 is a second perspective view thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a left side view thereof;
FIG. 6 is a right side view thereof;
FIG. 7 is a top plan view thereof; and,
FIG. 8 is a bottom plan view thereof.

Claims (1)

    CLAIM
  1. The ornamental design for a semiconductor device as shown and described.
US29/865,151 2022-01-28 2022-07-11 Semiconductor device Active USD1046801S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-001595D 2022-01-28
JP2022001595F JP1727398S (en) 2022-01-28 2022-01-28 semiconductor element

Publications (1)

Publication Number Publication Date
USD1046801S1 true USD1046801S1 (en) 2024-10-15

Family

ID=83544754

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/865,151 Active USD1046801S1 (en) 2022-01-28 2022-07-11 Semiconductor device

Country Status (2)

Country Link
US (1) USD1046801S1 (en)
JP (1) JP1727398S (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1099055S1 (en) * 2023-08-31 2025-10-21 Xpt Eds (Hefei) Co., Ltd. Power semiconductor module
USD1112117S1 (en) * 2023-09-11 2026-02-10 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device

Citations (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4028722A (en) * 1970-10-13 1977-06-07 Motorola, Inc. Contact bonded packaged integrated circuit
US5089929A (en) * 1990-03-08 1992-02-18 The United States Of America As Represented By The Secretary Of The Air Force Retrofit integrated circuit terminal protection device
USD394244S (en) * 1995-11-27 1998-05-12 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
US5834842A (en) * 1996-01-17 1998-11-10 Mitsubishi Denki Kabushiki Kaisha Semiconductor device, semiconductor module, and radiating fin
USD401912S (en) * 1995-11-27 1998-12-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD418485S (en) * 1998-09-29 2000-01-04 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD421969S (en) * 1998-09-29 2000-03-28 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD428859S (en) * 1999-01-28 2000-08-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD448739S1 (en) * 2000-09-12 2001-10-02 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD448740S1 (en) * 2000-11-30 2001-10-02 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD470463S1 (en) * 2001-11-30 2003-02-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD470824S1 (en) * 2001-11-30 2003-02-25 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD470825S1 (en) * 2001-12-28 2003-02-25 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD472530S1 (en) * 2001-11-30 2003-04-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD505400S1 (en) * 2004-03-26 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD505399S1 (en) * 2003-03-14 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD539761S1 (en) * 2006-08-22 2007-04-03 Kabushiki Kaisha Toshiba Semiconductor
USD548203S1 (en) * 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD548202S1 (en) * 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD717253S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717255S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717254S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717256S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719113S1 (en) * 2012-09-20 2014-12-09 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719926S1 (en) * 2012-09-20 2014-12-23 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD770994S1 (en) * 2014-04-02 2016-11-08 Mitsubishi Electric Corporation Power semiconductor device
USD888673S1 (en) * 2018-06-26 2020-06-30 Rohm Co., Ltd. Semiconductor module
USD906271S1 (en) * 2018-04-13 2020-12-29 Rohm Co., Ltd. Semiconductor module
US20200411404A1 (en) * 2019-06-27 2020-12-31 Mitsubishi Electric Corporation Semiconductor device
USD913978S1 (en) * 2018-06-26 2021-03-23 Rohm Co., Ltd. Semiconductor module
US20220223568A1 (en) * 2019-05-27 2022-07-14 Rohm Co., Ltd. Semiconductor device
US20220352049A1 (en) * 2019-08-29 2022-11-03 Mitsubishi Electric Corporation Power semiconductor apparatus and method for manufacturing the same
USD971863S1 (en) * 2020-01-28 2022-12-06 Rohm Co., Ltd. Semiconductor module
USD972516S1 (en) * 2020-01-28 2022-12-13 Rohm Co., Ltd. Semiconductor module

Patent Citations (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4028722A (en) * 1970-10-13 1977-06-07 Motorola, Inc. Contact bonded packaged integrated circuit
US5089929A (en) * 1990-03-08 1992-02-18 The United States Of America As Represented By The Secretary Of The Air Force Retrofit integrated circuit terminal protection device
USD394244S (en) * 1995-11-27 1998-05-12 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD401912S (en) * 1995-11-27 1998-12-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
US5834842A (en) * 1996-01-17 1998-11-10 Mitsubishi Denki Kabushiki Kaisha Semiconductor device, semiconductor module, and radiating fin
USD418485S (en) * 1998-09-29 2000-01-04 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD421969S (en) * 1998-09-29 2000-03-28 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD428859S (en) * 1999-01-28 2000-08-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD448739S1 (en) * 2000-09-12 2001-10-02 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD448740S1 (en) * 2000-11-30 2001-10-02 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD470463S1 (en) * 2001-11-30 2003-02-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD470824S1 (en) * 2001-11-30 2003-02-25 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD472530S1 (en) * 2001-11-30 2003-04-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD470825S1 (en) * 2001-12-28 2003-02-25 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD505399S1 (en) * 2003-03-14 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD505400S1 (en) * 2004-03-26 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD548202S1 (en) * 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD548203S1 (en) * 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD539761S1 (en) * 2006-08-22 2007-04-03 Kabushiki Kaisha Toshiba Semiconductor
USD717255S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717256S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719113S1 (en) * 2012-09-20 2014-12-09 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719926S1 (en) * 2012-09-20 2014-12-23 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717253S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717254S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD777124S1 (en) * 2014-04-02 2017-01-24 Mitsubishi Electric Corporation Power semiconductor device
USD772182S1 (en) * 2014-04-02 2016-11-22 Mitsubishi Electric Corporation Power semiconductor device
USD770994S1 (en) * 2014-04-02 2016-11-08 Mitsubishi Electric Corporation Power semiconductor device
USD783550S1 (en) * 2014-04-02 2017-04-11 Mitsubishi Electric Corporation Power semiconductor device
USD906271S1 (en) * 2018-04-13 2020-12-29 Rohm Co., Ltd. Semiconductor module
USD888673S1 (en) * 2018-06-26 2020-06-30 Rohm Co., Ltd. Semiconductor module
USD903613S1 (en) * 2018-06-26 2020-12-01 Rohm Co., Ltd. Semiconductor module
USD913978S1 (en) * 2018-06-26 2021-03-23 Rohm Co., Ltd. Semiconductor module
US20220223568A1 (en) * 2019-05-27 2022-07-14 Rohm Co., Ltd. Semiconductor device
US20200411404A1 (en) * 2019-06-27 2020-12-31 Mitsubishi Electric Corporation Semiconductor device
US20220352049A1 (en) * 2019-08-29 2022-11-03 Mitsubishi Electric Corporation Power semiconductor apparatus and method for manufacturing the same
USD971863S1 (en) * 2020-01-28 2022-12-06 Rohm Co., Ltd. Semiconductor module
USD972516S1 (en) * 2020-01-28 2022-12-13 Rohm Co., Ltd. Semiconductor module

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1099055S1 (en) * 2023-08-31 2025-10-21 Xpt Eds (Hefei) Co., Ltd. Power semiconductor module
USD1112117S1 (en) * 2023-09-11 2026-02-10 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device
USD1112118S1 (en) * 2023-09-11 2026-02-10 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device
USD1112116S1 (en) * 2023-09-11 2026-02-10 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device

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