CN100464620C

CN100464620C - Heat radiator

Info

Publication number: CN100464620C
Application number: CNB2006100335674A
Authority: CN
Inventors: 徐晓; 陈永东; 余光; 翁世勋; 陈俊吉
Original assignee: Fuzhun Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Current assignee: Fuzhun Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Priority date: 2006-02-10
Filing date: 2006-02-10
Publication date: 2009-02-25
Anticipated expiration: 2026-02-10
Also published as: CN101018464A

Abstract

The heat radiation device comprises: two heat radiators every with a bottom plate and some fins on the plate, and two fasteners to elastic connect two radiators and let the second one move vertical to the bottom plate of the first. This invention makes full use of narrow room in electronic element to maximize the heat radiation area, and fixes all radiators on relative elements.

Description

Heat abstractor

[technical field]

The present invention relates to a kind of heat abstractor, particularly a kind of heat abstractor that is used for cooling electronic components.

[background technology]

Along with the develop rapidly of electronic industry, the continuous lifting of electronic component (as the central processing unit) speed of service produces a large amount of heats during operation, and itself and system temperature are raise, and influences the stability of its system then.For guaranteeing that electronic component can normally move, heat abstractor is installed usually thereon, discharge the heat that it produces.

The traditional solution of electronic element radiating problem is normally installed a radiator on each heat-generating electronic elements, this radiator comprises the base plate that closely contacts with electronic component, is located at the some radiating fins on the base plate.But along with the arrival in digital code information epoch, the compact main trend that becomes current electronic product, its manufacturing process be also constantly towards the development of high-density packages and multifunctional direction, and the distance of each electronic component such as chip is more and more littler and caloric value is increasing.Therefore in actual applications, very little and when highly not waiting when distance between a plurality of heat-generating electronic elements, if adopting independently respectively, heat abstractor dispels the heat to keep the normal operation of system to it, not only can make the radiator structure of system disperse complexity to cause the system space waste, and because the very little size that also can limit independent heat abstractor of spacing between electronic component, thereby the heat dispersion of system is very restricted.

[summary of the invention]

In view of this, be necessary to provide a kind of heat abstractor of adaptive two or more electronic components simultaneously.

A kind of heat abstractor, comprise one first radiator and one second radiator, this first and second radiator all has a base plate and is located at radiating fin on the base plate, other has the above-mentioned second radiator of the flexible connection of two fasteners, thus second radiator can be relative first radiator along direction activity perpendicular to first base plate of radiator.

Compared to prior art, since second radiator of above-mentioned heat abstractor can relative first radiator resilient movement up and down, so very little and heat-generating electronic elements that highly do not wait dispels the heat to a plurality of mutual spacings to adopt above-mentioned heat abstractor, not only can make full use of the small space between electronic component, make the maximization of heat abstractor area of dissipation, first radiator can both be affixed on each corresponding electronic component admittedly with all second radiators.

With reference to the accompanying drawings, the invention will be further described in conjunction with specific embodiments.

[description of drawings]

Fig. 1 is the three-dimensional combination figure of an embodiment of heat abstractor of the present invention.

Fig. 2 is the unit assembly drawing on another visual angle of heat abstractor of the present invention.

Fig. 3 is the three-dimensional exploded view of heat abstractor among Fig. 1.

[embodiment]

Heat abstractor of the present invention is to be used for a plurality of chips electronic components such as (figure do not show) is dispelled the heat.See also Fig. 1 to Fig. 3, an embodiment of heat abstractor of the present invention comprises first radiator 10, second radiator 20 and second radiator 20 is fixed to fastener 27 on first radiator 10.First and

second radiator

10,20 all is to adopt good material such as the punching presses such as copper, aluminium of heat conductivility to make, and its bottom surface contacts to absorb the heat that electronics unit is produced with electronic component (figure does not show).

First radiator 10 comprises one first base plate 11 and goes up first radiating fin 13 of integrally formed some mutual equidistant parallels.These first base plate, 11 edges are concaved with a rectangular indentation 17, on first base plate 11 on the relative both sides of this breach 17, respectively be provided with a smooth rectangle continuing surface 15, put in the right position of this continuing surface 15 and to offer a perforation 152, this perforation 152 connects the ladder platform 154 of an indent, and this ladder platform 154 is formed on the bottom surface of first base plate 11.Offer a blind hole 112 on the appropriate location at four diagonal angles of first base plate 11 respectively from bottom to top, establish screw thread in this blind hole 112, first radiator 10 closely is attached on first chip (figure does not show) admittedly thereby match with fixture 19.

Second radiator 20 comprise second base plate 21 that the breach 17 of shape size and first base plate 11 is consistent and on second radiating fin 23 of integrally formed some mutual equidistant parallels.Upper end, the both sides of this second radiating bottom plate 21 extends outward a rectangle corresponding with first base plate, 11 carriers 15 respectively and takes on face 25, offer a through hole 252 on the suitable position on this shoulder face 25, this through hole 252 is 152 corresponding with perforation, be used to wear fastener 27 with 20 flexible fastenings of second radiator in the continuing surface 15 of first radiator 10.

This fastener 27 has a rounded nose 271, extend downwards a girth diameter from this rounded nose and bore a hole 152 and the smaller column stock 273 of through hole 252, two bottom sides from this stock 273 is respectively gone out a lamellar body, form a pair of barb 275, a sheathed spring 277 on the stock 273 between head 271 and the barb 275.

During use, first radiator 10 is installed on the higher electronic component of end face, and second radiator 20 then places on the relatively low electronic component of end face.Utilize fastener 27 shoulder 25 elasticity of second radiator 20 to be connected carrier 15 tops of first radiator 10, the clasp 275 of this fastener 27 passes through hole 252 and bores a hole 152, barb on the clasp 275 is compressed on the ladder platform 154 of first base plate, 11 bottom surfaces, spring 277 1 ends that are sheathed on simultaneously above the stock 273 press on head 271, other end elasticity is suppressed shoulder 25 upper surfaces of second radiator 20, and the length under the spring nature is greater than head 271 distance to shoulder face 25, so the time spring 277 be in compressive state.In addition, because of stock 273 diameters of fastener 27 less than through

hole

252 and 152 the diameter of boring a hole, so second radiator 20 can be along stock 273 vertical moving about stock 273 scopes of fastener 27, but because spring 277 1 ends on the fastener 27 are compressed on the shoulder 25 of second radiator 20, the other end is compressed on the head 271, and the bucking ladder 154 below clasp 275 clips first base plate 11 of fastener 27, so along with the spring 277 that moves up relatively of second radiator 20 produces further elastic deformation in same direction, thereby second radiator 20 is applied downward restoring force, make second radiator 20 compress electronic component downwards, and then closely solid the subsides thereon.

Can according to circumstances use a plurality of second radiators 20 during practical application, and on first radiator 10, offer and the suitable breach 17 of second radiator, 20 quantity.The shape of second radiator 20, size also can be done respective change as required.

Very little and when highly inconsistent when a plurality of heat-generating electronic elements spacings, adopt above-mentioned heat abstractor that they are dispelled the heat, not only can make full use of the small space between electronic component, make the maximization of heat abstractor area of dissipation, simultaneously since second radiator of above-mentioned heat abstractor can relative first radiator resilient movement up and down, thereby first radiator can both be affixed on each corresponding electronic component admittedly with all second radiators, and then guarantee the heat dispersion of heat abstractor.

Claims

1. heat abstractor, comprise one first radiator and one second radiator, this first and second radiator all has a base plate and is located at radiating fin on the base plate, it is characterized in that: other has the above-mentioned second radiator of the flexible connection of two fasteners, thereby second radiator can be relative first radiator along direction activity perpendicular to first base plate of radiator, base plate one lateral margin of above-mentioned first radiator breach that sets to the concave, the second radiator correspondence places this breach, its base plate shape and size and this breach are suitable, the relative both sides of above-mentioned breach on base plate respectively are provided with a smooth continuing surface, offer the shoulder hole that wears base plate for fastener on this continuing surface.

2. heat abstractor as claimed in claim 1 is characterized in that: above-mentioned shoulder hole relies on that the aperture of first radiator fin, one side is little, and the opposite side aperture is big, and this shoulder hole has the single order halfpace.

3. heat abstractor as claimed in claim 1 is characterized in that: above-mentioned first base plate of radiator is bottom-up respectively offers some blind holes, establishes screw thread in this blind hole, and the corresponding fixture of each blind hole.

4. heat abstractor as claimed in claim 1 is characterized in that: the upper end, both sides of above-mentioned second base plate of radiator extends outward a shoulder face respectively, offers the through hole that wears for fastener on this shoulder face.

5. heat abstractor, comprise one first radiator and one second radiator, this first and second radiator all has a base plate and is located at radiating fin on the base plate, it is characterized in that: other has the above-mentioned second radiator of the flexible connection of two fasteners, thereby second radiator can be relative first radiator along direction activity perpendicular to first base plate of radiator, above-mentioned fastener has a head, extend a column stock downwards from this head, two bottom sides from this stock respectively forms a barb, a sheathed spring part on the stock between head and the barb.

6. heat abstractor as claimed in claim 5 is characterized in that: the clasp clip of this fastener is in a side of the first base plate of radiator bottom surface, and spring one end that is sheathed on simultaneously above the stock presses on head, and other end elasticity is replaced the second radiator upper plate surface.

7. heat abstractor as claimed in claim 6 is characterized in that: the length under the described spring nature is greater than the distance of fastener head to second base plate of radiator.