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US20060042997A1 - Thin plate supporting container - Google Patents

Thin plate supporting container Download PDF

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Publication number
US20060042997A1
US20060042997A1 US11/185,710 US18571005A US2006042997A1 US 20060042997 A1 US20060042997 A1 US 20060042997A1 US 18571005 A US18571005 A US 18571005A US 2006042997 A1 US2006042997 A1 US 2006042997A1
Authority
US
United States
Prior art keywords
main body
container main
lid unit
protection film
container
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/185,710
Other languages
English (en)
Inventor
Tadahiro Obayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Miraial Co Ltd
Original Assignee
Miraial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Miraial Co Ltd filed Critical Miraial Co Ltd
Assigned to MIRAIAL CO., LTD. reassignment MIRAIAL CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: OBAYASHI, TADAHIRO
Publication of US20060042997A1 publication Critical patent/US20060042997A1/en
Abandoned legal-status Critical Current

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Classifications

    • H10P72/50—
    • H10P72/1916—

Definitions

  • the present invention relates to a thin plate supporting container used for storage, transport, and the like of thin plates such as semiconductor wafers, storage disks, and liquid crystal glass substrates while the inside of the container is kept clean.
  • the thin plate supporting container used for the storage and transport of the thin plates such as the semiconductor wafers is well known.
  • the thin plate supporting container mainly includes a container main body and a lid unit with which an upper opening of the container main body is covered.
  • a member which supports the thin plates such as the semiconductor wafer is provided inside the container main body.
  • the lid unit is fixed to the container main body to seal the container main body.
  • the lid unit When the thin plate is taken out from and put in the inside of the thin plate supporting container, the lid unit is detached from the container main body to release the inside, and the thin plate is automatically taken out and put in by a transfer machine.
  • an object of the invention is to provide a thin plate supporting container which reduces the particle adhesion to the gap between the container main body and the lid unit to prevent the particle intrusion.
  • a thin plate supporting container which stores thin-plates therein while the inside of the container is kept clean comprising a container main body in which the thin-plates are stored; and a lid unit which blocks the container main body, wherein a protection film is provided while a gap between the lid unit and the container main body is covered with the protection film.
  • the particles cannot intrude into the gap between the lid unit and the container main body. Therefore, the particles are prevented from intruding into the container main body along with the entrained air, when the lid unit is detached from the container main body.
  • the protection film is easy to attach and detach after the thin plates are stored in the container main body to attach the lid unit. Further, when the thin plates are taken out at the destination, the protection film can easily be peeled off.
  • the protection film is formed in a size in which the protection film covers the entire side surface of the lid unit in the container main body to which the lid unit is attached. Therefore, even when the lid unit has a complicated structure due to an attaching/detaching mechanism and the like, because the particle intrusion into the gap of such the complicated mechanism is eliminated, the particles which potentially intrude into the gap between the lid unit and the container main body from the surroundings are eliminated, and the particles which intrude into the container main body from the gap between the lid unit and the container main body can be largely reduced.
  • the protection film may be provided such that a perimeter of the gap between the lid unit and the container main body is covered with the protection film.
  • FIG. 1 is a perspective view showing a thin plate supporting container according to an embodiment of the invention.
  • FIG. 2 is a perspective view showing a modification.
  • the thin plate supporting container of the invention is one which is used for the storage, the transport, and the like while the thin plates such as the semiconductor wafers, the storage disks, and the liquid crystal glass substrates are stored in the thin plate supporting container.
  • the thin plate supporting container in which the semiconductor wafers are stored will be described by way of illustration.
  • a thin plate supporting container 1 includes a container main body 2 in which a plurality of semiconductor wafers (not shown) are stored and a lid unit 3 which blocks the container main body 2 .
  • the entire container main body 2 is formed in a substantial cube.
  • a lid unit holder 4 into which the lid unit 3 is fitted is provided in an upper end portion of the container main body 2 .
  • the lid unit holder 4 is formed while the upper end portion of the container main body 2 is enlarged to dimensions of the lid unit 3 . Therefore, the lid unit 3 is fitted in the lid unit holder 4 to seal the inside of container main body 2 .
  • a thin plate holder (not shown), which supports the semiconductor wafers stored inside the container main body 2 from both sides, is provided in the container main body 2 .
  • a top flange 5 which is grasped by an arm of a conveying apparatus (not shown) in a factory, a carrying handle 6 which an operator grasps when the operator manually carries the thin plate supporting container 1 , positioning means (not shown), and the like are provided in an outside surface of the container main body 2 .
  • the lid unit 3 is formed in a rectangle thick plate.
  • the lid unit 3 is fitted in the lid unit holder 4 of the container main body 2 to seal the inside of the container main body 2 .
  • a wafer retainer 8 is provided in a lower surface of the lid unit 3 .
  • the wafer retainer 8 supports the semiconductor wafers stored inside the container main body 2 from the upper side.
  • a simplified attaching/detaching mechanism 9 is provided in an upper surface of the lid unit 3 .
  • the simplified attaching/detaching mechanism 9 is a device which fixes the lid unit 3 to the container main body 3 side, and the simplified attaching/detaching mechanism 9 has a lid unit latch pawl which emerges from an outer peripheral surface of the lid unit 3 .
  • a sealing member (not shown) which is seals the inside of the container main body 2 is provided between the lid unit holder 4 and the lid unit 3 .
  • the inside of the container main body 2 is kept clean by sealing the container main body 2 with the sealing member, and the particles are prevented from intruding into the container main body 2 .
  • a protection film 11 is provided in the upper surface (surface on the lid unit 3 side) of the container main body 2 to which the lid unit 3 is attached.
  • the protection film 11 is one which prevents the particles from intruding into the gap between the container main body 2 and the lid unit 3 .
  • the protection film 11 is formed in a size in which the entire upper surface of the container main body 2 is covered with protection film 11 . The reason why the protection film 11 is formed in the above size is that the particles intrusion from the simplified attaching/detaching mechanism 9 side is considered.
  • the protection film 11 is formed in the size in which the entire upper surface of the container main body 2 is covered with the protection film 11 .
  • the protection film 11 is formed by an air-impermeable transparent plastic film.
  • Adhesion properties are imparted to a backside of the protection film 11 such that the protection film 11 is attachable to and detachable from the container main body 2 and the lid unit 3 .
  • Adhesion strength of the backside of the protection film 11 is set such that the gap between the container main body 2 and the lid unit 3 can be sealed by bonding the protection film 11 easily, and the protection film 11 can easily be peeled off.
  • the thin plate supporting container 1 having the above configuration is used in the following way.
  • the lid unit 3 of the thin plate supporting container 1 is detached from the container main body 2 , and the plurality of semiconductor wafers are stored in the container main body 2 . Then, the lid unit 3 is attached to the lid unit holder 4 of the container main body 2 to fix the container main body 2 and the lid unit 3 each other with the simplified attaching/detaching mechanism 9 . Then, the protection film 11 is adhered to cover the container main body 2 and the entire upper surface of the lid unit 3 .
  • the thin plate supporting container 1 is conveyed.
  • the particles adhere to the outer periphery of the thin plate supporting container 1 .
  • the entire upper surface of the container main body 2 is covered with the protection film 11 while the lid unit 3 is completely covered with the protection film 11 . Therefore, the particles can be prevented from intruding into the gap between the container main body 2 and the lid unit 3 and the simplified attaching/detaching mechanism 9 .
  • the protection film 11 is peeled off, the lid unit 3 is detached from the container main body 2 , and the semiconductor wafers are taken out from the inside of the container main body 2 .
  • the particles do not intrude into the gap between the container main body 2 and the lid unit 3 , and the particles are not entrained inside the container main body 2 along with the air when the lid unit 3 is detached from the container main body 2 . Accordingly, when the lid unit 3 is detached, the inside of the container main body 2 can also be kept clean, and the semiconductor wafers stored in the container main body 2 can be prevented from contaminating the surface.
  • the protection film 11 Since the adhesion properties are imparted to the protection film 11 , the protection film 11 can easily be adhered and peeled off, which improves workability in conveying the thin plate supporting container 1 .
  • protection film 11 is formed in the size in which the entire surface on the lid unit 3 side of the container main body 2 to which the lid unit 3 is attached is covered with protection film 11 , the particles can be prevented from intruding into the gap between the container main body 2 and the lid unit 3 and the gap of the simplified attaching/detaching mechanism 9 in the lid unit 3 .
  • the particles which intrude into the gap between the container main body 2 and the lid unit 3 from the emerging hole of the lid unit latch pawl of the simplified attaching/detaching mechanism 9 can be eliminated while the particles which directly intrude into the gap between the container main body 2 and the lid unit 3 can be eliminated, which allows the particles to be prevented from intruding into the container main body 2 from the gap between the container main body 2 and the lid unit 3 in opening the thin plate supporting container 1 . Accordingly, when the lid unit 3 is detached, the inside of the container main body 2 can also be kept clean, and the semiconductor wafers stored in the container main body 2 can be prevented from contaminating.
  • the protection film 11 is formed in the size in which the entire surface of the container main body 2 to which the lid unit 3 is attached is covered with the protection film 11 .
  • a protection film 12 may be formed in a rectangular annular shape such that only a perimeter of the gap between the container main body 2 and the lid unit 3 is covered with the protection film 12 .
  • the protection film 11 may be formed such that only the perimeter of the gap between the container main body 2 and the lid unit 3 is covered with the protection film 11 .
  • the inside of the container main body 2 can be kept clean with the simple structure, and the semiconductor wafers stored in the container main body 2 can be prevented from contaminating.
  • the adhesion properties are imparted to the entire backside of the protection film 11 .
  • the adhesion properties may be imparted to only the peripheral portion of the rectangle protection film 11 .
  • the adhesion properties may not be imparted to the surface facing to the gap between the container main body 2 and the lid unit 3 , but the surface may be charged to absorb the particles.
  • a sheet having an electrostatic property is bonded to the surface facing to the gap between the container main body 2 and the lid unit 3 in the protection film 11 .
  • the entire lower surface of the protection film 11 may be charged.
  • the sheet having an electrostatic property may be bonded to the entire lower surface of the protection film 11 . In this case, needless to say, the upper surface of the protection film 11 is not charged.
  • the thin plate supporting container 1 of FIG. 1 is shown by way of illustration in the above embodiment.
  • the invention is not limited to the thin plate supporting container 1 , but the invention can also be applied to all the thin plate supporting containers having the structure in which the gap is formed between the container main body 2 and the lid unit 3 . Even if this case, the same operations and effects as for the embodiment can be achieved.

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
  • Closures For Containers (AREA)
US11/185,710 2004-08-26 2005-07-21 Thin plate supporting container Abandoned US20060042997A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004-247161 2004-08-26
JP2004247161A JP2006062704A (ja) 2004-08-26 2004-08-26 薄板支持容器

Publications (1)

Publication Number Publication Date
US20060042997A1 true US20060042997A1 (en) 2006-03-02

Family

ID=35519786

Family Applications (1)

Application Number Title Priority Date Filing Date
US11/185,710 Abandoned US20060042997A1 (en) 2004-08-26 2005-07-21 Thin plate supporting container

Country Status (6)

Country Link
US (1) US20060042997A1 (zh)
EP (1) EP1638134A3 (zh)
JP (1) JP2006062704A (zh)
KR (1) KR20060048939A (zh)
CN (1) CN1740062A (zh)
TW (1) TW200607721A (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070095703A1 (en) * 2005-10-28 2007-05-03 Innolux Display Corp. Packing apparatus with internal partition layer
US20080006559A1 (en) * 2006-07-07 2008-01-10 Entegris, Inc. Substrate carrier and handle

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4812660B2 (ja) * 2007-03-09 2011-11-09 信越ポリマー株式会社 基板等の取扱装置及び基板等の取扱方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4160504A (en) * 1977-01-21 1979-07-10 Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoffe Mbh Packaging unit for semiconductor discs
US4793488A (en) * 1987-07-07 1988-12-27 Empak, Inc. Package for semiconductor wafers
US5709065A (en) * 1996-07-31 1998-01-20 Empak, Inc. Desiccant substrate package
US5992638A (en) * 1998-11-11 1999-11-30 Empak, Inc. Advanced wafer shipper
US6467626B1 (en) * 1999-07-28 2002-10-22 Shin-Etsu Handotai Co, Ltd. Wafer storing method and storing container therefor and wafer transferring method for transferring wafer to the storing container
US20030106831A1 (en) * 2001-11-14 2003-06-12 Entegris, Inc. Wafer enclosure sealing arrangement for wafer containers

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0343762A3 (en) * 1988-05-24 1991-05-08 Empak Inc. Substrate package
JPH06293364A (ja) * 1993-04-01 1994-10-21 Dainippon Printing Co Ltd 無塵容器
JP3476052B2 (ja) * 1997-09-01 2003-12-10 信越ポリマー株式会社 輸送容器
AU3695599A (en) * 1998-05-06 1999-11-23 Alcan International Limited Aluminum container system for magnetic disks
JP4223715B2 (ja) * 2001-12-04 2009-02-12 ミライアル株式会社 薄板用収納・保管容器

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4160504A (en) * 1977-01-21 1979-07-10 Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoffe Mbh Packaging unit for semiconductor discs
US4793488A (en) * 1987-07-07 1988-12-27 Empak, Inc. Package for semiconductor wafers
US5709065A (en) * 1996-07-31 1998-01-20 Empak, Inc. Desiccant substrate package
US5992638A (en) * 1998-11-11 1999-11-30 Empak, Inc. Advanced wafer shipper
US6467626B1 (en) * 1999-07-28 2002-10-22 Shin-Etsu Handotai Co, Ltd. Wafer storing method and storing container therefor and wafer transferring method for transferring wafer to the storing container
US20030106831A1 (en) * 2001-11-14 2003-06-12 Entegris, Inc. Wafer enclosure sealing arrangement for wafer containers

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070095703A1 (en) * 2005-10-28 2007-05-03 Innolux Display Corp. Packing apparatus with internal partition layer
US20080006559A1 (en) * 2006-07-07 2008-01-10 Entegris, Inc. Substrate carrier and handle

Also Published As

Publication number Publication date
CN1740062A (zh) 2006-03-01
KR20060048939A (ko) 2006-05-18
EP1638134A2 (en) 2006-03-22
TW200607721A (en) 2006-03-01
EP1638134A3 (en) 2007-11-14
JP2006062704A (ja) 2006-03-09

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Legal Events

Date Code Title Description
AS Assignment

Owner name: MIRAIAL CO., LTD., JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:OBAYASHI, TADAHIRO;REEL/FRAME:016371/0060

Effective date: 20050613

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION