US20050183824A1 - Apparatus for manufacturing flat-panel display - Google Patents
Apparatus for manufacturing flat-panel display Download PDFInfo
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- US20050183824A1 US20050183824A1 US11/064,270 US6427005A US2005183824A1 US 20050183824 A1 US20050183824 A1 US 20050183824A1 US 6427005 A US6427005 A US 6427005A US 2005183824 A1 US2005183824 A1 US 2005183824A1
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- chamber
- feeding
- cover
- substrate
- manufacturing apparatus
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- H10P72/0441—
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/861—Repairing
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- H10P72/0464—
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- H10P72/0466—
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- H10P72/0478—
Definitions
- the present invention relates to an apparatus for manufacturing a flat-panel display, and, more particularly, to a flat-panel display manufacturing apparatus which has an arrangement suitable to perform desired processes for large-size substrates.
- a general flat-panel display (FPD) manufacturing apparatus is illustrated, which is used to manufacture FPDs such as liquid crystal displays and plasma display panels (PDPs).
- the FPD manufacturing apparatus which is designated by reference numeral 1 , includes a load lock chamber 100 , a feeding chamber 200 , and a processing chamber 300 , which are connected in series.
- a gate valve G is arranged between adjacent ones of the chambers, in order to independently maintain a vacuum atmosphere in each chamber.
- the load lock chamber 100 is connected to an external station, in order to receive a substrate to be processed in the FPD manufacturing apparatus for loading of the substrate or to discharge a substrate completely processed in the FPD manufacturing apparatus for unloading of the substrate.
- the load lock chamber 100 is repeatedly switched between a vacuum state and an atmospheric state, so that the load lock chamber 100 is selectively communicated with the external station.
- a loading die 102 is arranged in the load lock chamber 100 , in order to load one or more substrates on the loading die 102 .
- Aligners 106 are arranged around the loading die 102 , in order to correct the position of a substrate S load on the loading die 102 , as shown in FIG. 1 .
- the aligners 106 correct the position of the substrate S by diagonally pushing the sides of the substrate S loaded on the loading die 102 .
- An exhausting device (not shown) and a gas supplier (not shown) are also installed in the load lock chamber 100 , in order to change the atmosphere of the load lock chamber 100 between a vacuum state and an atmospheric state.
- the feeding chamber 200 is connected between the load lock chamber 100 and the processing chamber 300 .
- the feeding chamber 200 is provided with a feeding robot 202 arranged in the interior of the feeding chamber 200 , so that the feeding chamber 200 serves as an intermediate passage for feeding a substrate between the load lock chamber 100 and the processing chamber 300 for loading/unloading of the substrate.
- the feeding chamber 200 is maintained in a vacuum atmosphere, so that the processing chamber 300 is maintained in a vacuum atmosphere.
- the processing chamber 300 is equipped with a loading die 302 to load a substrate in the processing chamber 300 , and a processing device (not shown) to perform a desired process for the substrate loaded in the processing chamber 300 .
- a processing device not shown
- an etch process is carried out in a vacuum atmosphere established in the processing chamber 300 .
- Such an FPD manufacturing apparatus may be of a cluster type in which a plurality of processing chambers 300 are connected to a single feeding chamber 200 , as shown in FIG. 2 .
- the feeding chamber 200 may have a circular or polygonal shape such that a plurality of processing chambers 300 are arranged around the feeding chamber 200 .
- FPD manufacturing apparatuses include vacuum chambers having an extremely large size, for example, a width of 3 m or more, in order to process substrates having a large size of 2 m or more. For this reason, there is a problem in transporting such vacuum chambers from a manufacturing place thereof to an installation place thereof. In other words, such a vacuum chamber, which has a width of 3 m or more, cannot be transported by land, taking into consideration the road conditions of Korea and other foreign countries.
- the top of the vacuum chamber must be opened.
- the vacuum chamber is manufactured in the form of a single body, however, it is difficult to open the top of the vacuum chamber. Furthermore, much labor is required. For this reason, it is impossible to easily repair the vacuum chamber.
- the present invention provides a separable vacuum chamber of a flat-panel display manufacturing apparatus comprising: a top plate forming a top of the chamber; a bottom plate facing the top plate and forming a bottom of the chamber; a peripheral wall plate coupled, at upper and lower ends thereof, to the top plate and the bottom plate, respectively, to define a closed space, the peripheral wall plate having, at an end thereof connected to the bottom plate, an extension extending in a peripheral direction of the chamber inside the chamber to form a step on the bottom plate; a cover member arranged on the bottom plate to extend in the peripheral direction of the chamber inside the chamber such that the cover member covers the extension of the peripheral wall plate; and seal members interposed between the extension and the cover member and between the bottom plate and the cover member to shield the closed space from an outside of the chamber.
- the present invention provides a separable vacuum chamber of a flat-panel display manufacturing apparatus comprising: a top plate forming a top of the chamber; a bottom plate facing the top plate and forming a bottom of the chamber; a peripheral wall plate coupled, at upper and lower ends thereof, to the top plate and the bottom plate, respectively, to define a closed space, the peripheral wall plate having, at an end thereof connected to the top plate, an extension extending in a peripheral direction of the chamber inside the chamber to form a step on the top plate; a cover member arranged on the top plate to extend in the peripheral direction of the chamber inside the chamber such that the cover member covers the extension of the peripheral wall plate; and seal members interposed between the extension and the cover member and between the top plate and the cover member to shield the closed space from an outside of the chamber.
- the present invention provides a separable vacuum chamber used in manufacturing flat-panel displays, comprising: a chamber housing divided into at least two sections, wherein the vacuum chamber is formed by assembling the chamber housing sections, together with elements to be arranged in the vacuum chamber.
- the present invention provides a flat-panel display manufacturing apparatus comprising a plurality of chambers each adapted to perform a required process for a substrate, wherein at least one of the chambers comprises: a chamber housing having a gateway formed at a top of the chamber housing; a top cover mounted to the top of the chamber housing to open/close the gateway, and provided with one or more openings formed through the top cover in a thickness direction of the top cover; one or more auxiliary covers each mounted to the top cover to open/close an associated one of the one or more openings; and one or more seal members each interposed between the top cover and an associated one of the one or more auxiliary covers to provide a sealing effect between the top cover and the associated auxiliary cover.
- the present invention provides a flat-panel display manufacturing apparatus comprising a load lock chamber, a feeding chamber, and a processing chamber, to manufacture flat-panel displays
- the load lock chamber comprises: a vacuum chamber housing, in which vacuum can be established; an opening formed through a peripheral wall of the vacuum chamber housing to allow a substrate to pass through the opening for loading of the substrate into the vacuum chamber housing and unloading of the substrate from the vacuum chamber housing; a gate valve adapted to open/close the opening; and end effecter receiving grooves formed at a bottom wall of the vacuum chamber housing to receive end effectors of a substrate feeding robot installed outside the load lock chamber, respectively, each of the end effecter receiving grooves having a predetermined depth to allow an associated one of the end effectors to move vertically in the end effecter receiving groove.
- the present invention provides a method for loading a substrate in a load lock chamber, comprising the steps of: A) opening an opening of the load lock chamber, and inserting a substrate into the load lock chamber by use of a substrate feeding robot while inserting end effecters of the feeding robot into end effecter receiving grooves of the load lock chamber; B) lowering the end effecters of the feeding robot in the end effecter receiving grooves, thereby loading the substrate in the load lock chamber; C) horizontally moving the feeding robot, thereby ejecting the feeding robot from the load lock chamber; and D) closing the opening, and establishing a vacuum atmosphere in the load lock chamber.
- the present invention provides a flat-panel display manufacturing apparatus comprising a load lock chamber, a feeding chamber, and a processing chamber, wherein the feeding chamber comprises: a feeding robot comprising a feeding arm arranged at a lower portion of the feeding chamber, and a driver coupled to a lower end of the feeding arm, and seated on a bottom of the feeding chamber; a vertical driver arranged beneath the feeding chamber, and adapted to lift the feeding robot to a level of a door; a driver gateway formed at one side of the feeding chamber to allow the driver to pass through the driver gateway; and the door mounted to the feeding chamber to open/close the driver gateway.
- the feeding chamber comprises: a feeding robot comprising a feeding arm arranged at a lower portion of the feeding chamber, and a driver coupled to a lower end of the feeding arm, and seated on a bottom of the feeding chamber; a vertical driver arranged beneath the feeding chamber, and adapted to lift the feeding robot to a level of a door; a driver gateway formed at one side of the feeding chamber to allow the driver
- the present invention provides a flat-panel display manufacturing apparatus comprising an electric field generating system, a processing gas supplying system, and an exhausting system, which are arranged in a vacuum chamber, to perform a required process for a substrate loaded in the vacuum chamber
- the vacuum chamber comprises: a chamber body forming a side wall of the vacuum chamber; a top cover coupled to a top portion of the chamber body to form a top wall of the vacuum chamber; and a bottom cover coupled to a bottom portion of the chamber body to form a bottom wall of the vacuum chamber, wherein the chamber body is provided, at a lower end thereof, with an engagement rim horizontally inwardly protruded from the lower end of the chamber body to be engaged with the bottom cover, wherein the lower cover is provided, at a peripheral edge thereof, with an engagement groove having a shape conforming to the engagement rim.
- the present invention provides a method for repairing a flat-panel display manufacturing apparatus, comprising the steps of: A) separating a top cover from a chamber body by a feeding device; B) separating a bottom cover from the chamber body by the feeding device, and laying the bottom cover on a working die; C) repairing the bottom cover; D) coupling the bottom cover to the chamber body by the feeding device; and E) coupling the top cover to the chamber body by the feeding device.
- FIG. 1 is a schematic view illustrating a layout of a general FPD manufacturing apparatus
- FIG. 2 is a schematic view illustrating a layout of another general FPD manufacturing apparatus
- FIG. 3 is a front view illustrating a separable vacuum chamber according to a first embodiment of the present invention
- FIGS. 4 a and 4 b are enlarged views corresponding to a portion “A” of FIG. 3 , respectively;
- FIG. 5 is a front view illustrating a structure of a stacked chamber included in an FPD manufacturing apparatus according to a second embodiment of the present invention
- FIGS. 6 a to 6 d are schematic views respectively illustrating various protrusion/groove type engagement structures applied to the stacked chamber of FIG. 5 ;
- FIG. 7 is a plan view illustrating a coupled state of a separable vacuum chamber according to a third embodiment of the present invention.
- FIG. 8 is a plan view illustrating an exploded state of the separable vacuum chamber according to the third embodiment of the present invention.
- FIG. 9 is an elevation view illustrating structures of coupling surfaces of vacuum chamber sections according to the third embodiment of the present invention.
- FIG. 10 is a perspective view illustrating the structures of the coupling surfaces of the vacuum chamber sections according to the third embodiment of the present invention.
- FIG. 11 is a plan view schematically illustrating a coupled state of a top cover and auxiliary covers to a feeding chamber included in an FPD manufacturing apparatus according to a fourth embodiment of the present invention.
- FIG. 12 is a transversal sectional view corresponding to FIG. 3 ;
- FIG. 13 is an exploded perspective view illustrating the top cover and auxiliary covers arranged at the top of the feeding chamber included in the FPD manufacturing apparatus according to the fourth embodiment of the present invention.
- FIG. 14 is a transversal sectional view illustrating a structure of a load lock chamber according to a fifth embodiment of the present invention.
- FIG. 15 is a longitudinal sectional view illustrating the structure of the load lock chamber according to the fifth embodiment of the present invention.
- FIG. 16 is a flow chart illustrating a method for loading a substrate in the load lock chamber according to the fifth embodiment of the present invention.
- FIGS. 17 a and 17 b are sectional views illustrating a procedure for unloading a feeding robot from a feeding chamber included in an FPD manufacturing apparatus according to a sixth embodiment of the present invention, respectively;
- FIG. 18 is a plan view illustrating the feeding chamber of FIGS. 17 a and 17 b;
- FIG. 19 is an elevation view illustrating a state in which the feeding robot is unloaded from the feeding chamber in the FPD manufacturing apparatus according to the sixth embodiment of the present invention.
- FIG. 20 is an exploded perspective view illustrating a structure of a vacuum chamber according to a seventh embodiment of the present invention.
- FIG. 21 is a schematic view illustrating a process for assembling and repairing a bottom cover in accordance with the seventh embodiment of the present invention.
- FIG. 22 is a flow chart illustrating a method for manufacturing and assembling a vacuum chamber according to the seventh embodiment of the present invention.
- FIG. 23 is a flow chart illustrating a method for repairing the vacuum chamber according to the seventh embodiment of the present invention.
- FIG. 3 is a front view illustrating a separable vacuum chamber included in an FPD manufacturing apparatus according to a first embodiment of the present invention.
- FIGS. 4 a and 4 b are enlarged views corresponding to a portion “A” in FIG. 3 , respectively.
- the illustrated vacuum chamber is applicable to any one of a load lock chamber, a feeding chamber, and a processing chamber, the following description will be given only in conjunction with the case in which the vacuum chamber is applied to a load lock chamber, for convenience of description.
- the separate vacuum chamber which is designated by reference numeral 100 , includes a top plate 110 and a bottom plate 120 , which face each other to define the top and bottom of the chamber 100 , respectively, and a peripheral wall plate 130 coupled, at upper and lower ends thereof, to the top plate 110 and bottom plate 120 , respectively.
- Extensions 135 are formed at the upper and lower ends of the peripheral wall plate 130 such that the extensions 135 extend along the top plate 110 and bottom plate 120 inside the vacuum chamber 100 , thereby forming steps on the top plate 110 and bottom plate 120 , respectively, as shown in FIGS. 3, 4 a and 4 b .
- two extensions 135 are arranged at both ends of the peripheral wall plate 130 , respectively, in the illustrated case, a single extension 135 may be formed only at one end of the peripheral wall plate 130 .
- each of the extensions 135 extends from one end or each end of the peripheral wall plate 130 along an inner surface of the vacuum chamber 100 to form a step at the top plate 110 , bottom plate 120 , or each of the top and bottom plates 110 and 120 , as shown in FIG. 4 a .
- Each extension 135 has three surfaces, that is, an outer surface or contact surface 135 a contacting the top plate 110 or bottom plate 120 , an inner surface 135 b , and an end surface 135 c.
- seal members 140 are arranged at the steps of the top plate 110 , bottom plate 120 , or both the top and bottom plates 110 and 120 , respectively, as shown in FIG. 3 .
- Cover members 150 are also arranged at the steps of the top plate 110 , bottom plate 120 , or both the top and bottom plates 110 and 120 , respectively, to cover the extensions 135 under the condition in which each seal member 140 is interposed between an associated one of the steps and an associated one of the cover members 150 .
- Each cover member 150 is in contact with surfaces defining the associated step, that is, the surface portion of the associated extension 135 , the surface portion of the peripheral wall plate 130 formed with the extension 135 , and the surface portion of the top plate 110 or bottom plate 120 contacting the extension 135 .
- Each cover member 150 minimizes exposure of an associated one of the seal members 140 to plasma gas present in the chamber 100 , and thus, protects the associated seal member 140 .
- each cover member 150 is in close contact with the peripheral wall plate 130 and the associated top plate 110 or bottom plate 120 while covering the associated seal member 140 .
- this coupling may be simply achieved, using the weight of the cover member 150 , as shown in FIG. 4 a .
- the coupling of the cover member 150 to the bottom plate 120 be achieved, using fastening members such as screws or bolts, in order to obtain a higher coupling force.
- each seal member 140 may comprise O-rings, which may be typically used in a general vacuum chamber.
- each seal member 140 comprises a pair of O-rings 140 a respectively arranged on the associated extension 135 and the top plate 110 or bottom plate 120 where the extension 135 is arranged.
- each seal member 140 may be separate from each other or integral with each other.
- the O-rings 140 a of each seal member 140 are arranged on the associated extension 135 and a portion of the top plate 110 or bottom plate 120 positioned near the end surface 135 c of the extension 135 , respectively, while being separate from each other.
- each seal member 140 comprises a pair of O-rings 140 b respectively arranged on the associated extension 135 and the portion of the top plate 110 or bottom plate 120 positioned near the end surface 135 c of the extension 135 , respectively, while being integral with each other.
- the seal members 140 each of which comprises the O-rings 140 b having an integral structure as shown in FIG. 4 b , are used, it is possible to more effectively maintain the chamber 100 in a vacuum state.
- each seal member 140 has been described as comprising a pair of O-rings 140 a or 140 b respectively arranged on the inner surface 135 b of the associated extension 135 and the top plate 110 or bottom plate 120 , where the extension 135 is arranged, while being separate from each other or integral with each other, as shown in FIG. 4 a or 4 b
- the seal member 140 may have a structure in which the O-ring 140 a or 140 b , which is adapted to be arranged on the extension 135 , is not arranged on the inner surface 135 b of the extension 135 , but is arranged at the end surface 135 c of the extension 135 , if necessary.
- the bottom plate 120 which constitutes the bottom of the chamber 100 , is first installed at a desired place.
- the following description will be given only in conjunction with an assembly process carried out at one side of the chamber 100 where seal members 140 each having a separate O-ring structure are used.
- one O-ring 140 a of one seal member (lower seal member) 140 is laid on the bottom plate 120 .
- a seat which is adapted to receive a portion of the O-ring 140 a , be formed at a portion of the bottom plate 120 where the O-ring 140 a will be placed.
- the peripheral wall plate 130 is installed on the bottom plate 120 such that the outer surface 135 a of the lower extension 135 , which is formed at the lower end of the peripheral wall plate 130 , comes into contact with the bottom plate 120 , as shown in FIG. 4 a .
- a lower step is formed on the bottom plate 120 . Since no O-ring is interposed between the bottom plate 120 and the lower end surface of the peripheral wall plate 130 , contrary to conventional cases, it is unnecessary to form a seat adapted to receive a portion of the O-ring, at the lower end surface of the peripheral wall plate 130 contacting the bottom plate 120 .
- the other O-ring 140 a of the lower seal member 140 is laid on the inner surface 135 b of the lower extension 135 formed at the lower end of the peripheral wall plate 130 , as shown in FIG. 4 a .
- a seat which is adapted to receive a portion of the other O-ring 140 a , is formed at the inner surface 135 b of the lower extension 135 . Accordingly, the other O-ring 140 a is laid on the seat formed at the inner surface 135 b of the lower extension 135 .
- one cover member 150 (lower cover member) is arranged at the lower step such that the lower cover member 150 comes into contact with the peripheral wall plate 130 and bottom plate 120 under the condition in which the lower cover member 150 covers the O-rings 140 of the lower seal member 140 respectively laid on the upper surface of the bottom plate 120 and the inner surface 135 b of the lower extension 135 .
- the lower surface of the lower cover member 150 has a particular shape such that the lower surface comes into contact with the extension 135 forming the lower step, and thus, engages with the extension 135 .
- the lower surface of the lower cover member 150 is also formed with seats to partially receive the O-ring 140 a arranged on the inner surface 135 b of the extension 135 and the O-ring 140 a arranged on the upper surface of the bottom plate 120 , respectively. Thereafter, the lower cover member 150 is fastened to the bottom plate 120 by means of fastening members such as bolts or screws, in order to firmly couple the lower cover member 150 to the bottom plate 120 , and thus, to prevent movement of the lower cover member 150 , and to protect the O-rings 140 a.
- fastening members such as bolts or screws
- the lower structure of the chamber 100 is completely formed in accordance with the above-described assembly process.
- the upper structure of the chamber 100 is then formed. That is, the assembly process is carried out in the order of laying the top plate 110 on the peripheral wall plate 130 , arranging the upper seal member 140 , and then coupling the upper cover member 150 .
- At least one of the load lock chamber, feeding chamber, and processing chamber, which constitute an FPD manufacturing apparatus has a vertically-stacked chamber structure including at least two sub chambers each coupled to one another, using various protrusion/groove type structures.
- an FPD manufacturing apparatus capable of achieving an optimal space efficiency, and thus, achieving a cost reduction and an increase in productivity, while obtaining a desired rigidity of the stacked chamber. Accordingly, this embodiment meets recent requirements to develop an FPD manufacturing apparatus capable of manufacturing large-size FPDs while exhibiting an increased productivity without an increase in the installation area caused by an increase in FPD manufacturing apparatus size.
- the stacked chamber according to this embodiment is applicable to any one of the load lock chamber, feeding chamber, and processing chamber, the following description will be given only in conjunction with the case in which the stacked chamber is applied to the processing chamber, for convenience of description.
- FIG. 5 is a front view illustrating a structure of the stacked chamber included in the FPD manufacturing apparatus according to the second embodiment of the present invention.
- the processing chamber 300 included in the FPD manufacturing apparatus includes at least two vertically-stacked sub chambers.
- the processing chamber 300 includes two vertically-stacked sub chambers 310 and 320 .
- the FPD manufacturing apparatus generally includes a load lock chamber, a feeding chamber, and a processing chamber. Taking into consideration process and space efficiencies, the chambers of the FPD manufacturing apparatus may have a stacked structure. That is, one, two or all of the three chambers, which constitute the FPD manufacturing apparatus, may have a stacked structure.
- the substrate processing time taken in the processing chamber is longest, as compared to the substrate processing times taken in the remaining chambers. Also, the processing chamber performs a great number of functions. For this reason, it is preferred that the processing chamber include a certain number of vertically-stacked sub chambers, in order to achieve an enhancement in substrate processing efficiency.
- the processing chamber may include two vertically-stacked sub chambers.
- the load lock chamber and feeding chamber are driven to externally unload a substrate completely processed in one sub processing chamber and to load another substrate, to be processed, in the sub processing chamber while a certain process is carried out for another substrate in the other sub processing chamber.
- processes for substrates in both the sub processing chambers can be efficiently carried out.
- the number of vertically-stacked sub chambers may be two or more. Where two sub chambers are used, they may perform the same function or different functions, respectively.
- the processing chamber 300 of the FPD manufacturing apparatus includes two vertically-stacked sub chambers 310 and 320 , which are coupled to each other, using protrusion/groove type engagement structures respectively formed at contact portions 330 of the sub chambers 310 and 320 .
- the sub chambers 310 and 320 are coupled to each other, using the protrusion/groove type engagement structures respectively formed at the contact portions 330 of the sub chambers 310 and 320 , there is an advantage in that the overall height of the processing chamber 300 is reduced, as compared to the case in which the coupling of the sub chambers 310 and 320 is achieved without using the protrusion/groove type engagement structures respectively formed at the contact portions 330 .
- the sub chambers 310 and 320 may move with respect to each other.
- such movement may be prevented by coupling the contact portions of the sub chambers 310 and 320 by means of a soldering process.
- FIGS. 6 a to 6 d are schematic views respectively illustrating various protrusion/groove type engagement structures formed at the contact portions 330 of the sub chambers 310 and 320 in order to firmly couple the sub chambers 310 and 320 and to optimize the overall height of the processing chamber 300 .
- FIG. 6 a shows rectangular protrusion/groove type engagement structures
- FIG. 6 b shows right-angled triangular protrusion/groove type engagement structures
- FIG. 6 c shows semicircular protrusion/groove type engagement structures
- FIG. 6 d shows polygonal protrusion/groove type engagement structures.
- the contact portions 320 of the sub chambers 310 and 320 are firmly engaged with each other, so that the sub chambers 310 and 320 are firmly coupled to each other to be prevented from moving with respect to each other.
- this separation can be easily achieved by simply vertically moving the upper sub chamber 320 away from the lower sub chamber 310 .
- the protrusion/groove type engagement structure may have various shapes to achieve easy coupling of the sub chambers 310 and 320 , and to reduce the overall height of the chamber 300 .
- the protrusions and grooves of the protrusion/groove type engagement structure may have one selected from a rectangular shape, a right-angled triangular shape, a semicircular shape, and a polygonal shape.
- the sub chambers 310 and 320 of the chamber 300 having the above-described vertically-stacked structure may perform the same function or may perform different functions, respectively. Accordingly, it is possible to achieve an optimal space efficiency, and thus, an enhancement in productivity, and to obtain an enhanced process efficiency.
- the FPD manufacturing apparatus As described above, it is possible to achieve an enhancement in process efficiency by constituting at least one of the load lock chamber, feeding chamber, and processing chamber of the FPD manufacturing apparatus by at least two sub chambers, which are vertically stacked. Also, the sub chambers are engaged with each other, using the protrusion/groove type engagement structures formed at respective contact portions of the sub chambers, so that the sub chambers have firmness and easy separablility.
- the processing chamber has a reduced overall height, thereby achieving an optimal space efficiency.
- a vacuum chamber having a separable structure to achieve easy manufacturing, transporting, and repair processes is provided, which is used to manufacture FPDs.
- the vacuum chamber includes a chamber housing divided into at least two sections.
- the separable vacuum chamber is formed by assembling the chamber housing sections, together with elements to be arranged in the vacuum chamber.
- the separable vacuum chamber according to this embodiment is applicable to any one of the load lock chamber, feeding chamber, and processing chamber, the following description will be given only in conjunction with the case in which the separable vacuum chamber is applied to the feeding chamber, for convenience of description.
- the separable vacuum chamber according to this embodiment is applied to the feeding chamber 200 , which functions to feed a substrate between the load lock chamber 100 and the processing chamber 300 , as shown in FIG. 7 .
- the feeding chamber 200 requires an inner space wider than those of the load lock chamber and processing chamber, in order to allow free movements of elements arranged in the feeding chamber 200 , such as a feeding robot.
- the feeding chamber 200 may more severely encounter problems incurred in the case in which it is required to process large-size substrates.
- the size of the feeding chamber 200 must be sufficiently increased in such a case, it may be impossible to transport the feeding chamber having such a size.
- the separable vacuum chamber 200 have a circular shape when viewing from the top of the separable vacuum chamber 200 , as shown in FIG. 7 .
- the feeding chamber In order to arrange a large number of processing chambers around the feeding chamber, it is desirable for the feeding chamber to have a circular shape, as compared to a rectangular shape or a polygonal shape such as a hexagonal shape. Where the feeding chamber has a circular shape, it is possible to freely form a desired number of processing chambers.
- the cross-sectional shape of the separable vacuum chamber 200 parallel to the ground have a circular shape.
- the separable vacuum chamber 200 be divided into three sections A, B, and C, as shown in FIG. 7 or 8 .
- the chamber sections B and C have an arc shape having a central angle of 90° ⁇ 10°, while facing each other.
- the arc length of each chamber sections B or C is similar to the width of the intermediate section A.
- a seal member receiving groove 212 is formed at the coupling surface of each chamber section.
- a damper 211 also extends radially outwardly from each coupling end of each chamber section, in order to firmly couple adjacent ones of the chamber sections.
- Each seal member receiving groove 212 has a desired depth, and extends along the coupling surfaces of the associated chamber sections. Adjacent ones of the chamber sections are coupled to each other under the condition in which one seal member 213 is interposed between the seal member receiving grooves 212 of the adjacent chamber sections.
- a vacuum chamber is formed by coupling the above-described chamber sections under the condition in which each seal member 213 is interposed between the seal member receiving grooves 212 formed at the facing coupling surfaces of adjacent chamber sections, it is possible to prevent ambient air from entering the vacuum chamber along the coupling surfaces and to prevent gas present in the vacuum chamber from leaking outwardly from the vacuum chamber.
- the seal members 213 function to seal the vacuum chamber.
- each seal member 213 extends continuously along the coupling surfaces of the associated chamber sections, and is made of an elastic material such that the seal member 213 is slightly elastically compressed by the chamber sections when the chamber sections are coupled to each other.
- the dampers 211 function to firmly fasten the chamber sections of the vacuum chamber.
- the slight elastic compression of the seal members 213 can be achieved only when the chamber sections of the vacuum chamber are fastened by the dampers 211 .
- the coupling surfaces of the adjacent chamber sections can be completely sealed by the function of the dampers 211 .
- each damper 211 is radially outwardly protruded from an associated lateral end of the associated chamber section.
- a plurality of uniformly-spaced clamping holes 214 are formed through each damper 211 . That is, each damper 211 extends radially outwardly from the associated lateral end of the associated chamber section such that the damper 211 forms an extension surface connected to the associated coupling surface of the associated chamber section.
- Each damper 211 has a desired thickness.
- the clamping holes 214 of each damper 211 extend throughout the thickness of the damper 211 while being uniformly spaced apart from one another along the damper 211 .
- Each clamping hole 214 is formed, at an inner surface thereof, with female threads adapted to be threadedly coupled with a clamping bolt 215 .
- the clamping bolts 215 are threadedly coupled with the clamping holes 214 of the adjacent chamber sections, thereby firmly coupling the chamber sections.
- This embodiment provides an FPD manufacturing apparatus in which at least one of the vacuum chambers included in the FPD manufacturing apparatus includes a top cover having a divided structure, that is, including a detachable auxiliary cover, in order to achieve easy transportation of the vacuum chamber.
- vacuum chamber according to this embodiment is applicable to any one of the load lock chamber, feeding chamber, and processing chamber, the following description will be given only in conjunction with the case in which the vacuum chamber is applied to the feeding chamber, for convenience of description.
- the feeding chamber 200 of the FPD manufacturing apparatus includes a feeding robot gateway 232 formed at the top of the feeding chamber 200 to allow a feeding robot 220 arranged in the feeding chamber 200 to move outwardly from the interior of the feeding chamber 200 , for repair or replacement of the feeding robot 220 .
- the feeding chamber 200 also includes a top cover 240 to open and close the feeding robot gateway 232 .
- the top cover 240 has a circular plate structure having cut-out portions at opposite sides thereof.
- the top cover 240 has a plurality of openings 244 , and reinforcing rims 242 upwardly protruded from the top cover 240 around the openings 244 .
- a seal member O which may be an O-ring, is arranged on the top cover 240 inside each opening 244 .
- the top cover 240 has two or three openings 244 , and each opening 244 has a rectangular shape. Of course, other numbers and shapes of the openings 244 may be used.
- a seat 246 is provided on the top cover 240 around each opening 244 inside the associated reinforcing rim 242 .
- An auxiliary cover 248 is seated on each seat 246 under the condition in which one O-ring, that is, seal member O, is interposed between the seat 246 and the auxiliary cover 248 , in order to generate a sealing effect between the seat 246 and the auxiliary cover 248 .
- Wire connecting rings 250 are fixed to the top cover 240 and auxiliary covers 248 , in order to connect the top cover 240 and auxiliary covers 248 , using wires, to a crane mounted to the ceiling of a clean room, in which the FPD manufacturing apparatus installed, and thus, to enable the top cover 240 and auxiliary covers 248 to be moved by the crane.
- the wire connecting rings 250 are fixed to respective corners of the top cover 240 , to respective opposite sides of each reinforcing rim 242 , and to respective opposite sides of each auxiliary cover 248 .
- Transverse reinforcing members (not shown), each of which has a length identical to the width of each opening 244 , may be arranged at the top cover 240 along desired sides of the associated opening 244 , in order to prevent the top cover 240 from being twisted due to heat applied thereto.
- the top cover 240 may be made of stainless steel in order to obtain a desired rigidity and a desired durability, and thus, to prevent the top cover 240 from generating an excessive strain.
- Each auxiliary cover 248 may have a rectangular parallelepiped box structure.
- the rectangular parallelepiped box structure of each auxiliary cover 240 may be upwardly opened, in order to reduce the weight of the auxiliary cover 240 .
- a pair of wire connecting rings 250 are fixed to the upper end of each auxiliary cover 248 at opposite sides of the auxiliary cover 248 , respectively, to enable the auxiliary cover 248 to be moved by the crane.
- Each auxiliary cover 248 is made of aluminum so that the auxiliary cover 248 has a reduced weight.
- the feeding robot 220 includes a feeding arm 224 .
- the feeding robot 220 also includes a driver 222 to supply a drive force to the feeding arm 224 .
- the feeding robot 220 further includes a robot housing, and an end effecter, on which a substrate to be fed is seated.
- the removal of the feeding robot 220 is carried out under the condition in which the feeding arm 224 and driver 222 of the feeding robot 220 are separated from each other, because the feeding chamber 200 has a limited height.
- the top cover 240 has a large size, and thus, a large weight, because the feeding chamber 200 has a large size so as to feed a large-size substrate. Accordingly, the top cover 240 must be divided into several sections to distribute the weight of the top cover 240 to those sections, and thus, to enable the top cover 240 to be moved by a crane adapted to move a limited weight. To this end, the top cover 240 according to this embodiment has the above-described divided structure, which includes a plurality of auxiliary covers 248 .
- the divided structure of the top cover 240 according to this embodiment has been described as being applied to the feeding chamber 200 , this structure may also be applicable to the processing chamber, which may be a plasma processing device, for example, a chemical vapor deposition (CVD) device, an etcher, or an asher.
- the processing chamber which may be a plasma processing device, for example, a chemical vapor deposition (CVD) device, an etcher, or an asher.
- CVD chemical vapor deposition
- the auxiliary covers 248 which constitute the divided structure of the top cover 240 , are sequentially moved by the crane mounted to the clean room under the condition in which the wire connecting rings 250 of each auxiliary cover 248 are connected to a hook included in the crane.
- the top cover 240 which has a reduced weight in accordance with separation of the auxiliary covers 248 from the top cover 240 , is moved to a desired place by the crane under the condition in which the wire connecting rings 250 of each auxiliary cover 248 are connected to the hook of the crane.
- the feeding robot 220 is then outwardly moved from the feeding chamber 200 , for maintenance and repair. After completion of the maintenance and repair, the feeding robot 220 is again positioned in the feeding chamber 200 in accordance with a procedure carried out in the order reverse to the above-described procedure.
- the top cover 240 may be separated when it is necessary to perform maintenance and repair for the feeding robot 220 or other large-size inner structures arranged in the feeding chamber 200 .
- the auxiliary covers 248 may be separated when it is necessary to perform simple maintenance and repair for the feeding chamber 200 .
- the top cover 240 has the divided structure including a plurality of detachable auxiliary covers 248 to distribute the weight of the top cover 240 to the auxiliary covers 248 , and thus, to enable the top cover 240 to be easily separated from the large-size feeding chamber 200 , using a crane having a limited capacity. After separation of the auxiliary covers 248 , the weight of the top cover 240 is correspondingly reduced, so that it is possible to move the top cover 240 by the crane without any overload applied to the crane.
- This embodiment provides a load lock chamber having a simple structure, and thus, exhibiting a reduction in manufacturing costs and a reduction in the time taken to load/unload a substrate.
- the load lock chamber 100 includes a chamber housing 140 , openings (not shown), gate valves (not shown), and end effecter receiving grooves 150 .
- the chamber housing 140 defines, therein, a chamber in which vacuum can be established. Since the load lock chamber repeatedly and alternately establishes an atmospheric state and a vacuum state, the load lock chamber 100 includes a pumping device to establish the vacuum state in the load lock chamber, and a venting device to establish the atmospheric state in the load lock chamber.
- Two openings are formed at opposite side walls of the chamber housing 140 such that the openings face each other.
- One opening which is formed at the side wall of the chamber housing 140 arranged adjacent to the feeding chamber 200 , is used as a gateway to load a substrate into the feeding chamber 200 and to unload the substrate from the feeding chamber 200 .
- the other opening which is formed at the opposite side wall, is used as a gateway to load a substrate from the outside of the load lock chamber 100 into the load lock chamber 100 and to unload the substrate from the load lock chamber 100 to the outside of the load lock chamber 100 .
- Each opening is opened and closed by a gate valve.
- the gate valve has a structure capable of preventing a gap from being formed between the gate valve and the opening in a closed state of the opening, thereby maintaining the chamber to be in a sealed state.
- Each end effect receiving groove 150 defines a path, along which an associated end effecter E of the feeding robot moves to enter the load lock chamber 100 .
- each end effecter receiving groove 150 is formed at the bottom wall of the chamber housing 140 in the form of a groove having a predetermined depth capable of allowing the end effecter E to move vertically in the end effecter receiving groove 150 .
- each end effecter E can move vertically in a state of being received in the associated end effecter receiving groove 150 .
- the substrate is laid on the bottom wall of the chamber housing 140 , so that the substrate is separated from the end effecters E. Under this condition, the end effecters E are outwardly retracted.
- substrate protection members 160 are arranged on the bottom wall of the chamber housing 140 at regions where the substrate laid on the bottom wall come into contact with the bottom wall, as shown in FIG. 14 . Where the substrate comes into direct contact with the bottom wall of the chamber housing 140 , the substrate may be damaged because the bottom wall of the chamber housing 140 has a hardness higher than that of the substrate. Accordingly, the substrate protection members, which are made of a material causing no damage to the substrate, are arranged on the bottom wall of the chamber housing 140 .
- a substrate guide 170 is also provided in the load lock chamber 100 according to this embodiment.
- the substrate guide 170 functions to guide a substrate to be loaded at an accurate position in the load lock chamber 100 .
- the substrate guide 170 is arranged along the edge of the bottom wall of the chamber housing 140 .
- the substrate guide 170 has a structure inclined toward a central portion of the load lock chamber 100 . Accordingly, when a substrate is loaded in the load lock chamber 100 , the substrate is moved to an accurate position in the load lock chamber 100 as the edges of the substrate slide along the substrate guide 170 .
- the substrate guide 170 has a rectangular shape opened at one side to allow the end effecters E to access the load lock chamber 100 through the opened side. That is, the substrate guide 170 has a U-shaped structure having, at one side thereof, an opening to allow the end effectors to pass through the substrate guide 170 .
- At least one loading die 180 is also arranged in the load lock chamber 100 according to this embodiment, as shown in FIG. 14 .
- the loading die 180 functions to load a substrate S thereon.
- At least two loading dies 180 may be arranged in the load lock chamber 100 , in order to simultaneously load at least two substrates.
- a plurality of uniformly-spaced substrate support members 182 are arranged on each loading die 180 such that the substrate support members 182 are upwardly protruded from the loading die 180 .
- the substrate support members 182 are made of a material exhibiting a hardness lower than that of the substrate, in order to prevent the substrate support members 182 from damaging the substrate.
- the substrate support members 182 have a sufficient length to allow the end effecters E to move vertically in a state of being inserted into a gap defined between the associated loading die 180 and a substrate supported by the substrate support members 182 .
- Another substrate guide 170 is provided to perform a position correction for a substrate loaded on each loading die 180 . As shown in FIG. 14 , this substrate guide 170 is arranged around the associated loading die 180 , and has an inclined structure having a lower end extending to a level lower than the upper end of each support member 182 . Of course, a separate aligner may be arranged in the load lock chamber 100 to simultaneously align a plurality of substrates loaded on respective loading dies 180 .
- step S 110 of introducing a substrate S into the load lock chamber 100 is executed.
- one gate valve is driven to open one opening of the load lock chamber 100 .
- a substrate is introduced into the load lock chamber 100 through the opened opening, using the substrate feeding robot arranged outside the load lock chamber 100 .
- the end effecters E of the substrate feeding robot are inserted into the end effecter receiving grooves formed at the bottom wall of the load lock chamber 100 .
- step S 120 of loading the substrate S in the load lock chamber 100 is executed.
- the substrate feeding robot is driven to downwardly move the end effecters E in respective end effecter receiving grooves 212 until the substrate S on the end effecters E is laid on the bottom wall of the load lock chamber 100 .
- the substrate S is completely loaded in the load lock chamber 100 .
- step S 130 of ejecting the substrate feeding robot from the load lock chamber 100 is executed.
- the substrate feeding robot is horizontally moved until the end effecters E are completely removed from the load lock chamber 100 .
- step S 140 of aligning the substrate S loaded in the load lock chamber 100 to accurately position the substrate S is executed.
- step S 140 is executed simultaneously with step S 120 because, when the substrate S is loaded on the bottom wall of the load lock chamber 100 at the substrate loading step S 120 , the substrate S slides along the substrate guide 170 arranged along the edge of the bottom wall of the load lock chamber 100 , and thus, moves to an accurate position.
- the substrate aligning step S 140 is executed independently of the substrate loading step S 120 .
- step S 150 of establishing a vacuum atmosphere in the load lock chamber 100 is executed.
- the gate valve is driven to close the opened opening.
- the vacuum pump is then driven to vent gas present in the load lock chamber 100 .
- steps S 110 , S 120 , and S 130 are repeatedly executed until all substrates are loaded in the load lock chamber 100 . Thereafter, steps S 140 and S 150 are executed.
- This embodiment provides a feeding chamber having a structure capable of allowing the feeding robot to pass through one side wall of the feeding chamber.
- the feeding chamber functions to load a substrate into a selected one of the chambers, for example, a load lock chamber or a processing chamber, and to unload the substrate from the selected chamber.
- the feeding chamber 200 which is configured in accordance with this embodiment, is provided, at opposite side walls thereof, with gateways, and gate valves to open/close the gateways, respectively.
- the top cover 240 is mounted on the feeding chamber 200 .
- the driver 222 of the feeding robot 220 adapted to feed a substrate is seated, at an upper end thereof, on the bottom wall of the feeding chamber 200 while extending downwardly through an opening formed at the bottom wall of the feeding chamber 200 .
- a seal member O such as an O-ring is interposed between contact surfaces of the bottom wall of the feeding chamber 200 and the upper end of the driver 222 .
- the feeding robot 220 mainly includes the robot housing, the feeding arm 224 mounted to an upper end of the robot housing and foldable within a predetermined length range, the driver 222 , which is mounted to a lower end of the robot housing, and the end effecters E, on which a substrate will be seated.
- the removal of the feeding robot 220 is carried out under the condition in which the feeding arm 224 and driver 222 of the feeding robot 220 are separated from each other, because the feeding chamber 200 has a limited height.
- a driver gateway 266 is provided at one side wall of the feeding chamber 200 , in order to allow the driver 222 of the feeding robot 220 to pass through the driver gateway 266 for installation of the driver 222 in the feeding chamber 200 and separation of the driver 222 from the feeding chamber 200 .
- a door 264 is also provided at the side wall of the feeding chamber 200 , in order to allow the feeding robot 220 to be removed from the feeding chamber 200 when it is desired to perform maintenance and repair for the feeding robot 220 .
- the door 264 is hingably mounted to the side wall of the feeding chamber 200 where the driver gateway 266 is formed.
- Extensions having a certain thickness extend inwardly from an inner surface of the driver gateway 266 , in order to enable a seal member O to be installed between the driver gateway 266 and a rear surface edge of the door 264 , and thus, to provide a sealing effect between the driver gateway 266 and the door 284 .
- the seal member O which is interposed between the contact surfaces of the bottom wall of the feeding chamber 200 and the upper end of the driver 222 , provides a sealing effect between the feeding chamber 200 and the driver 222 .
- a vertical driver 270 is also arranged beneath the driver 222 of the feeding robot 220 .
- the vertical driver 270 functions to upwardly move the driver 222 to a desired level when the driver 222 is removed from the feeding chamber 200 , and thus, to prevent the seal member O from being damaged during the removal of the driver 222 .
- the vertical driver 270 also downwardly moves the driver 222 to an original position when the driver 222 is loaded into the feeding chamber 200 .
- the vertical driver 270 comprises a cylinder.
- the feeding chamber 200 also includes guide members 272 arranged between the driver gateway 266 and the driver 222 of the feeding robot 220 .
- Each guide member 272 has the form of a rail.
- Auxiliary guide members 273 are hingably mounted to outer ends of the guide members 272 , respectively, such that the auxiliary guide members 273 extend and retract through the driver gateway 266 in accordance with hinging operations thereof.
- a sliding plate 274 is slidably arranged on the guide members 272 .
- the auxiliary guide members 273 may be slidably mounted to the guide members 272 , respectively, such that the auxiliary guide members 273 extend and retract through the driver gateway 266 .
- the driver 222 When it is desired to remove the driver 222 of the feeding robot 220 from the feeding chamber 200 , the driver 222 is first lifted and then laid on the sliding plate 274 slidably mounted on the guide members 272 .
- the auxiliary guide members 273 are then hinged such that they extend outwardly from the feeding chamber 200 . Under this condition, the sliding plate 274 is then moved along the guide members 272 and the auxiliary guide members 273 , as shown in FIG. 19 .
- the driver 222 can be easily removed from the feeding chamber 200 .
- the loading of the driver 222 into the feeding chamber 200 can also be easily achieved in accordance with a procedure reverse to the above-described procedure.
- the auxiliary guide members 273 are maintained in a folded state.
- the auxiliary guide members 273 are unfolded in accordance with hinging operations thereof, only when the driver 222 of the feeding robot 220 is to be removed.
- a transfer means (not shown) may be arranged in rear of the driver 222 of the feeding robot 220 in the feeding chamber 200 , in order to transfer the driver 222 to the sliding plate 274 .
- FIGS. 17 a , 17 b , and 18 the procedure for loading the feeding robot 220 into the feeding chamber 200 and unloading the feeding robot 220 from the feeding chamber 200 in the FPD manufacturing apparatus according to this embodiment will be described with reference to FIGS. 17 a , 17 b , and 18 .
- the vacuum state of the feeding chamber 200 is first released. Thereafter, the door 264 is hinged to open the driver gateway 266 .
- the top cover 240 is then removed from the feeding chamber 200 , using the crane. Subsequently, the feeding arm 224 is manually separated from the driver 222 , and then moved to the outside of the feeding chamber 100 , using the crane.
- the vertical driver 270 which is arranged beneath the driver 222 while being in contact with the driver 222 , is driven to upwardly move the driver 222 to a level where the driver 222 can pass through the driver gateway 264 without any interference, while preventing the seal member O adapted to provide a sealing effect between the bottom wall of the feeding chamber 100 and the driver 222 .
- the driver 222 is transferred to the sliding plate 274 by the transferring means.
- the transferring means also outwardly slides the auxiliary guide members 273 from the feeding chamber 200 along the guide members 272 , as shown in FIG. 19 .
- the driver 222 is removed from the feeding chamber 200 .
- the feeding robot 220 can be loaded and unloaded through the driver gateway 264 formed at one side wall of the feeding chamber 200 under the condition in which the driver gateway 264 is opened by the door 266 . Accordingly, it is possible to achieve the loading and unloading of the driver 222 , even in the case in which the space defined between the feeding chamber 200 and the clean room is reduced due to the increased size of the feeding chamber 200 .
- This embodiment provides a vacuum chamber, which includes a separable bottom wall, in order to achieve an easy installation of structures to be arranged at a lower portion of the vacuum chamber, an easy function test for the structures, and easy maintenance and repair for the structures, and a repairing method for the structures.
- the vacuum chamber according to this embodiment is applied to the processing chamber 300 of the FPD manufacturing apparatus.
- the vacuum chamber 300 includes three sections, that is, a chamber body 330 , a top cover 340 , and a bottom cover 350 , which are independently manufactured.
- the chamber body 330 has a rectangular box structure including four side walls.
- the chamber body 330 forms a side wall section of the vacuum chamber 300 , and defines the overall appearance of the vacuum chamber 300 .
- the chamber body 330 is provided, at desired portions thereof, with an opening 332 to allow a substrate to pass through the opening 332 for loading of the substrate into the vacuum chamber 300 and unloading of the substrate from the vacuum chamber 300 , and view ports 334 to allow the operator to observe a substrate processing procedure carried out in the vacuum chamber, using plasma, and the results exhibited in the substrate processing procedure.
- the top cover 340 is coupled to an upper end of the chamber body 330 while being in contact with the upper end of the chamber body 330 , thereby forming a top wall section of the vacuum chamber 300 , as shown in FIG. 20 .
- An upper electrode and a process gas supplying system are arranged at the top cover 340 .
- Seal member receiving grooves are formed at respective coupling surfaces of the top cover 340 and chamber body 330 .
- a seal member O is interposed between the seal member receiving grooves.
- the seal member O provides a sealing effect between the coupling surfaces of the top cover 340 and chamber body 330 so that vacuum can be established in the vacuum chamber 300 . At least two seal members may be arranged to obtain an enhanced sealing effect.
- the bottom cover 350 is coupled to a lower end of the chamber body 330 while being in contact with the lower end of the chamber body 330 , thereby forming a bottom wall section of the vacuum chamber 300 .
- the bottom cover 350 is formed with various holes, for example, a driving hole 352 for a lower electrode, a driving hole 354 for an inner vertical reciprocation pin, a driving hole 356 for an outer vertical reciprocation bar, and a vacuum pump connecting hole 358 . These holes correspond to positions where various elements to extend through the bottom cover 350 are arranged, respectively. That is, a drive shaft of a lower electrode driving module extends through the lower electrode driving hole 352 .
- An inner vertical reciprocation pin driving module which is adapted to vertically reciprocate the inner vertical reciprocation pin near the lower electrode, passes through the inner vertical reciprocation pin driving hole 354 .
- An outer reciprocation bar driving module passes through the outer vertical reciprocation pin driving hole 356 .
- an engagement rim 336 is horizontally protruded to a desired length from the inner side wall surface of the chamber body 330 along a region where the lower end of the chamber body 330 is coupled with the bottom cover 350 .
- the bottom cover 350 is engaged, at a peripheral edge thereof, with the engagement rim 336 in the chamber body 330 , so that the bottom cover 350 is coupled to the chamber body 330 .
- the bottom cover 350 is provided, at the peripheral edge thereof, with an engagement groove 359 having a stepped shape conforming to the engagement rim 336 . Since the engagement groove 359 has a shape conforming to the engagement rim 336 , no gap is formed between the engagement surfaces of the engagement rim 336 and engagement groove 359 when the bottom cover 250 is coupled to the chamber body 330 .
- the engagement surfaces of the engagement rim 336 and engagement groove 359 have a stepped shape, so that plasma generated in the vacuum chamber 300 cannot easily leak from the vacuum chamber 300 between the engagement surfaces because the plasma exhibits straightness. It is more preferable that the horizontal surface portion of each engagement surface be inclinedly formed. In this case, when the bottom cover 350 is coupled to the chamber body 330 , the bottom cover 350 can be positioned at an accurate position without any position correction.
- seal member receiving grooves are formed at the engagement surfaces of the engagement rim 336 and engagement groove 359 , respectively, as shown in FIG. 20 .
- a seal member O is fitted between the seal member receiving grooves.
- the seal member O provides a sealing effect between the coupling surfaces of the lower cover 350 and chamber body 330 so that vacuum can be established in the vacuum chamber 300 .
- At least two seal members may be arranged to obtain an enhanced sealing effect.
- a plurality of feeding device coupling holes 357 are formed at an upper surface of the bottom cover 50 along the peripheral edge of the bottom cover 50 , as shown in FIG. 20 .
- the feeding device coupling holes 357 function to enable a feeding device, for example, the crane, to easily carry out an operation for lifting the bottom cover 350 when the bottom cover 350 is to be coupled to the chamber body 330 or to be separated from the chamber body 330 .
- Each feeding device coupling hole 357 has female threads to be threadedly coupled with male threads formed on an end of a feeding wire connected to the crane. Accordingly, the bottom cover 350 can be firmly connected to the crane, so that it is possible to easily raise the bottom cover 350 , using the crane.
- coupling blocks 355 are preferably provided at the bottom cover 350 .
- the coupling blocks 355 are fitted in respective feeding device coupling holes 357 to block the feeding device coupling holes 357 after completion of a bottom cover assembling or repair process.
- the feeding device coupling holes 357 are maintained in an opened state in the substrate treating process using plasma, diverse particles may be deposited in the feeding device coupling holes 357 , or arc may be generated at the feeding device coupling holes 357 due to plasma.
- the coupling blocks 355 be fitted in respective feeding device coupling holes 357 such that the upper end of each coupling block 355 is flush with the upper surface of the bottom cover 350 .
- step S 210 is executed to manufacture the vacuum chamber 300 , which includes the chamber body 330 , top cover 340 , and bottom cover 350 .
- the manufacture of the vacuum chamber 300 is achieved by independently manufacturing the chamber body 330 forming the side wall portion of the vacuum chamber 300 , the top cover 340 forming the top wall portion of the vacuum chamber 300 , and the bottom cover 350 forming the bottom wall portion of the vacuum chamber 300 .
- step S 220 of installing the chamber body 330 on a main frame is executed.
- the chamber body 330 is first laid on the main frame, and is then fixed to the main frame.
- the chamber body 330 is lifted, using the feeding device, and is then laid on a portion of the main frame corresponding to a position where the chamber body 330 is coupled with the main frame.
- the position of the chamber body 330 on the main frame is adjusted so that the chamber body 330 is accurately positioned.
- the chamber body 330 is firmly fixed to the main frame so that the chamber body 330 cannot move.
- step S 230 of installing structures on the top and bottom covers 340 and 350 is executed.
- the bottom cover 350 is first positioned on a working die spaced apart from the bottom of the chamber body 330 by a long distance to allow the structure installing process to be easily carried out.
- processes for installing structures such as the lower electrode driving module, inner vertical reciprocation pin driving module, outer vertical reciprocation bar driving module, and vacuum chamber.
- step S 240 of coupling the bottom cover 350 to the chamber body 330 , using the feeding device is executed.
- the bottom cover 350 for which the installation of the structures and the functional test for the structures have been completed, is coupled to the chamber body 330 .
- step S 240 is executed, using a method of lifting the bottom cover 350 above the chamber body 330 , lowering the bottom cover 350 into the chamber body 330 , and coupling the bottom cover 350 to the chamber body 330 .
- step S 240 comprise steps of: a) lifting the bottom cover 350 to a level higher than the chamber body 330 ; b) moving the bottom cover 350 to a position where the bottom cover 350 is positioned just over the chamber body 330 , and lowering the bottom cover 350 into the chamber body 330 such that the bottom cover 350 is mounted to the chamber body 330 .
- step S 240 further comprise the step of c) firmly fixing the bottom cover 350 to the chamber body 330 .
- the fixing step be further executed, in order to more firmly couple the bottom cover 350 to the chamber body 330 , taking into consideration the fact that large parts of the structures installed on the bottom cover 350 are driven.
- step S 250 of coupling the top cover 340 to the chamber body 330 , using the feeding device is executed.
- the top cover 340 on which desired structures have been installed, is coupled to the upper end of the chamber body 330 .
- Step S 250 is executed by lifting the top cover 340 above the chamber body 330 , lowering the top cover 340 such that the top cover 340 is positioned on the chamber body 330 , and firmly coupling the top cover 340 to the chamber body 330 .
- step S 310 of separating the top cover 340 is executed.
- the top cover 340 is separated from the chamber body 330 , using a top cover opening device included in the plasma-using substrate processing device or a separate feeding device, thereby opening the top wall section of the vacuum chamber 300 .
- step S 320 of separating the bottom cover 350 , and laying the bottom cover 350 on the working die is executed.
- the feeding device is first coupled with the feeding device coupling holes 357 of the bottom cover 350 .
- the feeding device lifts the bottom cover 350 , and feeds the bottom cover 350 to a place where the working die is located, and then lays the bottom cover 350 on the working die.
- the working die is configured to maintain the bottom cover 350 at a level spaced apart from the ground by a considerable vertical distance so that the operator can easily perform the repair process in a state of entering a space beneath the working die.
- Step S 330 of repairing the bottom cover 350 and the structures installed on the bottom cover 350 is then executed.
- a repair process is executed for parts of the structures to be repaired.
- step S 340 of coupling the bottom cover 350 to the chamber body 330 is executed.
- the bottom cover 350 which has been completely repaired, is moved to an original position in the chamber body 330 , using the feeding device. This step is executed in the order reverse to that of the bottom cover separating step S 320 .
- step S 350 of coupling the top cover 340 to the chamber body 330 is executed.
- Step S 350 is executed in the order reverse to that of the top cover separating step S 310 .
- top and bottom covers 340 and 350 are positioned at respective original positions thereof, so that the repair process for the vacuum chamber 300 is completed.
- one seal member is arranged on the extension formed at each end of the peripheral wall plate of a chamber to maintain the chamber in a vacuum state, and one cover member is arranged on the seal member to cover the seal member. Accordingly, there is an advantage in that the life span of the seal member increases.
- At least one of the load lock chamber, feeding chamber, and processing chamber, which constitute an FPD manufacturing apparatus has a vertically-stacked chamber structure including at least two sub chambers. Accordingly, there is an advantage of an enhancement in process efficiency, and thus, an increase in productivity. That is, where the processing chamber includes two sub chambers, there is an effect capable of simultaneously performing two identical processes or two different processes.
- the coupling between the sub chambers is achieved, using the protrusion/groove type structures. Accordingly, it is possible to minimize the overall height of the chamber, and to obtain an increased coupling force of the sub chambers, and thus, to obtain an optimal space efficiency.
- the vacuum chamber is not manufactured in the form of a singe body, but manufactured in the form of a plurality of chamber sections, which will be assembled to form the vacuum chamber. Accordingly, there is an advantage in that it is possible to easily transport the vacuum chamber, manufactured to have a large size, to an installation place. That is, where such a large-size vacuum chamber is manufactured in the form of a single body, it is impossible to transport the vacuum chamber, using a vehicle.
- the vacuum chamber is manufactured in the form of a plurality of chamber sections, it is possible to easily achieve transportation of the vacuum chamber by transporting the chamber sections, each of which has a reduced width, as compared to the vacuum chamber.
- the vacuum chamber is completely formed by assembling the chamber sections after the transportation thereof to an installation plate. Also, there is no problem in establishing a vacuum atmosphere in the assembled vacuum chamber.
- the top cover arranged on the vacuum chamber has a divided structure including one or more detachable auxiliary covers, in order to distribute the weight of the top cover to the auxiliary covers in the procedure of separating the top cover from the vacuum chamber to allow the feeding robot to pass through the vacuum chamber upon loading or unloading the feeding robot, for maintenance and repair of the feeding robot.
- the auxiliary covers are individually separated from the top cover by the crane. Accordingly, the separation and assembly of the top cover can be achieved within a weight range allowable by the crane. Thus, the separation and assembly of the top cover can be easily achieved.
- the process for loading a substrate into the load lock chamber is simple. Accordingly, the time taken to load a substrate is reduced, so that the overall substrate processing time is reduced.
- the driver of the feeding robot can be loaded or unloaded through the driver gateway provided at one side of the feeding chamber, in the procedure of loading or unloading the feeding robot, for assembly, maintenance or repair of the feeding robot. Accordingly, it is possible to achieve the loading and unloading of the driver without using the crane. As a result, the time taken to load or unload the driver is reduced.
- the unloading of the driver is carried out in a state of being lifted to a desired level by the vertical driver, which is arranged beneath the feeding robot in order to move the driver of the feeding robot to the level of the driver gateway while preventing damage of the seal member adapted to provide a seal effect between the feeding chamber and the feeding robot.
- the unloading and loading of the feeding robot driver can also be easily achieved by the guide members and the auxiliary guide members hingably or slidably mounted to the guide members such that the auxiliary guide members extend and retract through the driver gateway.
- the working die J having a sufficient height t to enable the operator to perform a repair process in a state of entering a space beneath the working die J. Accordingly, the operator can easily perform an assembling process for structures to be installed on the bottom cover, and a repair process for the installed structures under the condition in which the bottom cover is laid on the working die J. Thus, it is possible to completely eliminate the difficulty encountered in executing the structure assembling process and the bottom cover repair process in conventional cases in which the height of the main frame from the ground is short. Since the operator can perform the structure assembling process and the bottom cover repair process in an upright state, the time taken to perform the structure assembling process and the bottom cover repair process is greatly reduced. In addition, there is an advantage in that it is possible to prevent accidents from occurring during the execution of the processes.
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/358,752 US8506711B2 (en) | 2004-02-25 | 2009-01-23 | Apparatus for manufacturing flat-panel display |
Applications Claiming Priority (14)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2004-0012675 | 2004-02-25 | ||
| KR1020040012675A KR20050086265A (ko) | 2004-02-25 | 2004-02-25 | 분리형 진공챔버 |
| KR1020040046667A KR100635227B1 (ko) | 2004-06-22 | 2004-06-22 | 평판표시소자 제조장치 |
| KR10-2004-0046667 | 2004-06-22 | ||
| KR1020040047243A KR100710599B1 (ko) | 2004-06-23 | 2004-06-23 | 분리형 진공 챔버 |
| KR10-2004-0047243 | 2004-06-23 | ||
| KR10-2004-0066006 | 2004-08-20 | ||
| KR1020040066006A KR100585022B1 (ko) | 2004-08-20 | 2004-08-20 | 플라즈마 처리장치 및 그 보수방법 |
| KR1020040069166A KR100643507B1 (ko) | 2004-08-31 | 2004-08-31 | 평판표시소자 제조장치 |
| KR10-2004-0069166 | 2004-08-31 | ||
| KR1020040108225A KR100691214B1 (ko) | 2004-12-17 | 2004-12-17 | 평판표시소자 제조장치 |
| KR10-2004-0108225 | 2004-12-17 | ||
| KR1020040111695A KR100773265B1 (ko) | 2004-12-24 | 2004-12-24 | 평판표시소자 제조장치 |
| KR10-2004-0111695 | 2004-12-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US12/358,752 Continuation US8506711B2 (en) | 2004-02-25 | 2009-01-23 | Apparatus for manufacturing flat-panel display |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US20050183824A1 true US20050183824A1 (en) | 2005-08-25 |
Family
ID=34865570
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US11/064,270 Abandoned US20050183824A1 (en) | 2004-02-25 | 2005-02-23 | Apparatus for manufacturing flat-panel display |
| US12/358,752 Expired - Fee Related US8506711B2 (en) | 2004-02-25 | 2009-01-23 | Apparatus for manufacturing flat-panel display |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US12/358,752 Expired - Fee Related US8506711B2 (en) | 2004-02-25 | 2009-01-23 | Apparatus for manufacturing flat-panel display |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US20050183824A1 (zh) |
| CN (1) | CN100401338C (zh) |
| TW (1) | TWI274978B (zh) |
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| US20040187781A1 (en) * | 2003-03-26 | 2004-09-30 | Nobuyuki Takahashi | Vacuum chamber assembly |
| US20040257494A1 (en) * | 2003-06-19 | 2004-12-23 | Park Jae Woo | Liquid crystal display module |
| US20050253339A1 (en) * | 2002-10-11 | 2005-11-17 | Hitachi Construction Machinery Co., Ltd. | Rotating apparatus for construction machine |
| US20060091773A1 (en) * | 2004-11-03 | 2006-05-04 | Sok-San Kim | Plasma display device |
| US20080292431A1 (en) * | 2003-11-04 | 2008-11-27 | Gwang Ho Hur | Transfer chamber for flat display device manufacturing apparatus |
| US20090133837A1 (en) * | 2004-02-25 | 2009-05-28 | Advanced Display Process Engineering Co., Ltd. | Apparatus for manufacturing flat-panel display |
| US20090183832A1 (en) * | 2008-01-22 | 2009-07-23 | Tokyo Electron Limited | Seal mechanism, seal trench, seal member, and substrate processing apparatus |
| US20100086381A1 (en) * | 2005-02-04 | 2010-04-08 | Advanced Display Process Engineering Co., Ltd. | Vacuum processing apparatus |
| WO2010094724A1 (en) * | 2009-02-22 | 2010-08-26 | Mapper Lithography Ip B.V. | Charged particle lithography apparatus and method of generating vacuum in a vacuum chamber |
| US20120031335A1 (en) * | 2010-04-30 | 2012-02-09 | Applied Materials, Inc. | Vertical inline cvd system |
| EP2280410A3 (en) * | 2009-07-31 | 2013-12-11 | Tokyo Electron Limited | Assembly method of transfer mechanism and transfer chamber |
| US20150218693A1 (en) * | 2012-07-19 | 2015-08-06 | Herakles | Chemical Vapour Infiltration Apparatus Having a High Loading Capacity |
| US20160216032A1 (en) * | 2015-01-23 | 2016-07-28 | Tokyo Electron Limited | Connection structure, magnetic annealing device using same, and connecting method |
| US20170372910A1 (en) * | 2016-06-22 | 2017-12-28 | Tokyo Electron Limited | Reinforcing structure, vacuum chamber and plasma processing apparatus |
| WO2020249626A1 (de) * | 2019-06-11 | 2020-12-17 | Christof Diener | Erweiterbare vakuumkammer und verfahren zur herstellung einer erweiterbaren vakuumkammer |
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| DE102020213803A1 (de) | 2020-11-03 | 2022-06-23 | Christof-Herbert Diener | Vakuumkammer und Plasmaanlage mit Großrohr |
| WO2024019902A1 (en) * | 2022-07-18 | 2024-01-25 | Lam Research Corporation | Wedge seal for efem frame and panel seams |
| WO2024171806A1 (ja) * | 2023-02-13 | 2024-08-22 | 東京エレクトロン株式会社 | 基板処理システム及び台車 |
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| US8525948B2 (en) | 2003-06-19 | 2013-09-03 | Lg Display Co., Ltd. | Liquid crystal display module having a semi-spherical shape protrusion formed in a light guide disposed within a semi-spherical shape hole formed within a support main |
| US20100128197A1 (en) * | 2003-06-19 | 2010-05-27 | Jae Woo Park | Liquid crystal display module |
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| US10473399B2 (en) * | 2015-01-23 | 2019-11-12 | Tokyo Electron Limited | Connection structure, magnetic annealing device using same, and connecting method |
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| JP2017228633A (ja) * | 2016-06-22 | 2017-12-28 | 東京エレクトロン株式会社 | 補強構造体、真空チャンバー、およびプラズマ処理装置 |
| US12162081B2 (en) | 2019-06-11 | 2024-12-10 | Christof-Herbert Diener | Expandable vacuum chamber and method for producing an expandable vacuum chamber |
| WO2020249626A1 (de) * | 2019-06-11 | 2020-12-17 | Christof Diener | Erweiterbare vakuumkammer und verfahren zur herstellung einer erweiterbaren vakuumkammer |
| WO2021122654A1 (en) * | 2019-12-18 | 2021-06-24 | Brooks Automation (Germany) Gmbh | Core module for semiconductor production facility machinery |
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| DE102020213803B4 (de) | 2020-11-03 | 2023-01-26 | Christof-Herbert Diener | Vakuumkammer und Plasmaanlage mit Großrohr |
| DE102020213803A1 (de) | 2020-11-03 | 2022-06-23 | Christof-Herbert Diener | Vakuumkammer und Plasmaanlage mit Großrohr |
| WO2024019902A1 (en) * | 2022-07-18 | 2024-01-25 | Lam Research Corporation | Wedge seal for efem frame and panel seams |
| WO2024171806A1 (ja) * | 2023-02-13 | 2024-08-22 | 東京エレクトロン株式会社 | 基板処理システム及び台車 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1661650A (zh) | 2005-08-31 |
| US20090133837A1 (en) | 2009-05-28 |
| CN100401338C (zh) | 2008-07-09 |
| TW200528957A (en) | 2005-09-01 |
| TWI274978B (en) | 2007-03-01 |
| US8506711B2 (en) | 2013-08-13 |
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| AS | Assignment |
Owner name: ADVANCED DISPLAY PROCESS ENGINEERING CO. LTD., KOR Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LEE, YOUNG JONG;CHOI, JUN YOUNG;JO, SAENG HYUN;AND OTHERS;REEL/FRAME:016319/0227 Effective date: 20050218 |
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| STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |