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US20040033735A1 - Surface protective film for transparent conductive film and method for manufacturing the same, and transparent conductive film with surface protective film - Google Patents

Surface protective film for transparent conductive film and method for manufacturing the same, and transparent conductive film with surface protective film Download PDF

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Publication number
US20040033735A1
US20040033735A1 US10/619,516 US61951603A US2004033735A1 US 20040033735 A1 US20040033735 A1 US 20040033735A1 US 61951603 A US61951603 A US 61951603A US 2004033735 A1 US2004033735 A1 US 2004033735A1
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Prior art keywords
film
surface protective
transparent conductive
protective film
base material
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Abandoned
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US10/619,516
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English (en)
Inventor
Shinichi Takada
Kazuhito Okumura
Mitsushi Yamamoto
Masaki Hayashi
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Nitto Denko Corp
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Nitto Denko Corp
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Assigned to NITTO DENKO CORPORATION reassignment NITTO DENKO CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HAYASHI, MASAKI, OKUMURA, KAZUHITO, TAKADA, SHINICHI, YAMAMOTO, MITSUSHI
Publication of US20040033735A1 publication Critical patent/US20040033735A1/en
Priority to US11/189,523 priority Critical patent/US7408604B2/en
Abandoned legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2848—Three or more layers

Definitions

  • the present invention relates to a surface protective film used for transparent conductive films and transparent conductive films with a surface protective film that are widely used in a field of a transparent electrode and the like, such as liquid crystal displays, touch panels, sensors, and solar cells.
  • thin films having transparency in visible radiation region and conductivity are used in transparent electrodes in new displays for liquid crystal displays, electroluminescence displays, etc., in touch panels, etc. and further in electrification prevention and electromagnetic wave interception, etc. for transparent goods.
  • manufacturing process for touch panels by electric conductive film contact type where transparent electrodes of transparent substrat s having transparent ele trode with transparent onductivity are arranged facing ea h other on on side, various kinds of complicated and long treating processes and assembling pro esses, su h as cutting of the transparent ondu tive film, printing of resists, etching, printing of silver ink, and further delivery after arranging transparent electrodes of two sheets of conductive films facing each other are usually carried out.
  • An object of the present invention is to provide a solution for the above-mentioned conventional problems, and to provide a surface protective film for transparent conductive films that prevents large curling for the transparent conductive films with the surface protective film attached thereon in heating process at about 150° C., and a method for manufacturing the same. Besides, this inv ntion aims at providing a transparent onductive film with th surface prote tive film.
  • a surface protective film for transparent conductive films of this invention is a film that protects a surface of a side opposite to a conductive thin film or a surface on a side of the conductive thin film of the transparent conductive film, and it is characterized in that an adhesive layer is formed on one side of a base material film, and that a rate of thermal shrinkage after being heated at 150° C. for 1 hour shows no more than 0.9% in both MD (machine direction) and TD (width direction).
  • the rate of thermal shrinkage is a value specifically measured by a measuring method described in Example.
  • a rate of thermal shrinkage of a surface protective film after being heated at 150° C. for 1 hour is preferably no more than 0.6% in an MD dire tion and no more than 0.1% in a TD direction, and most preferably 0% in both of MD and TD dire tions.
  • a transparent onductive film with a surface protective film of this invention comprises a conductive thin film on one side of a surface of a base material film, and a hard coat layer or an anti-glare layer on the other side, and at the same time, an adhesive layer of the above-mentioned surface protective film for the transparent conductive film is attached on a surface of the above-mentioned hard coat layer, anti-glare layer, or on a surface of the conductive thin film.
  • another transparent conductive film with a surface protective film of this invention comprises a conductive thin film on one side of a base material film, and at the same time, an adhesive layer of the above-mentioned surface protective film for a transparent conductive films is attached on the other side of the base material film, or on a surface of the conductive thin film.
  • the transparent conductive film with the surface protective film attached thereon does not provide large curling after heating process. Accordingly, it may be subjected to a subsequent heating process in a state where the surface protective film is attached to an adherend (a surface opposite to a conductive thin film of a transparent conductive film, or a surface on a side of conductive thin film), whi h can protect the adh rend from scrat h or soil during the heating pro ss.
  • an adherend a surface opposite to a conductive thin film of a transparent conductive film, or a surface on a side of conductive thin film
  • the surface protective film may be subjected to the following heating process in a state being attached on adherends. Thereby, time and effort for attaching and exchanging the surface protective film may be saved, leading to remarkable improvement in workability, and suppression of manufacturing cost.
  • a treatment for removing a residual stress to the above-mentioned base material film is performed.
  • the treatment for removing a residual stress performed to the base material film of a surface protective film reduces a rate of thermal shrinkage, controlling occurrence of the curling.
  • a rate of thermal shrinkage of a surface protective film in which a residual stress of the above-mentioned base material film has been completely removed theoretically shows 0%, and does not provide large curling as a result.
  • Pra tical method for removing a residual stress from a base material film in manufacturing a surfa e protectiv film may be roughly divided into two methods: a m thod in whi h heat-treatment is given to a base material film before oat d by a adhesive without applying a drawing tension as much as possible; and a method in which heat-treatment is given to a base material film after coated by a adhesive without applying drawing tension as much as possible in a drying process of the adhesive.
  • Latter method is preferable in consideration of point of excelling in cost reduction by simplification of a manufacturing method, and an anchoring property of the adhesive into the base material film.
  • the base material films for the surface protective film are films including polyethylene terephthalates and/or polyethylene naphthalates. Practically sufficient transparency and practically sufficient strength may be obtained using the polymers.
  • this invention relates to a method for manufacturing a surface protective film for transparent conductive films, wherein after a adhesive being applied to one side of a base material film, a drawing tension of no more than 80 N per width of lm of the base material film is applied under conditions of a temperature of 100 through 150° C., and a residence time of 20 through 120 seconds, and thereby a treatment for removing a residual stress and simultaneous drying of the adhesive is performed.
  • FIG. 1 is a se tional view showing an example of used ndition of a surface protective film for transparent conductive film of the present invention.
  • FIG. 2 is a sectional view showing another example of used condition of a surface protective film for transparent conductive film of this invention.
  • FIG. 1 is a sectional view showing an example of used condition of a surface protective film of this invention
  • FIG. 2 is a sectional view showing an another example of used condition.
  • an adhesive layer 1 b is formed on one side of a base material film 1 a .
  • the surface protective film of this invention protects a surface opposite to a conductive thin film of a transparent conductive film, or a surface on a side of the conductive thin film.
  • An embodiment shown in FIG. 1 shows an example in which a surface protective film 1 is attached on a surface of a hard coat layer 2 c (or the above-mentioned anti-glare layer) of a transparent conductive film 2
  • an embodiment shown in FIG. 2 shows an example in which a surface protective film 1 is attached on a surfac of a substrat film 2 a of a transparent conductive film 2 .
  • Base material films 1 a are not esp ially limited as long as they have transparency practically requir d for intended uses for optics, and as long as a surface protective film obtained by being given an adhesive layer on one side of the base material films has a rate of thermal shrinkage satisfying the above-mentioned range.
  • polyesters such as polyethylene terephthalates (PET) and polyethylene naphthalates (PEN); polyphenylene sulfides (PPS), polycarbonates, polyetheretherketones (PEEK), polymethylmethacrylates, polystyrenes, polyvinyl chlorides, polyethylenes, polypropylenes, blended material of polyethylenes/polypropylenes, polyamides, polyimides, cellulose propionates (CP), cellulose acetates, polysulfones, polyethersulfones, etc.
  • PET polyethylene terephthalates
  • PEN polyethylene naphthalates
  • PPS polyphenylene sulfides
  • PES polycarbonates
  • PEEK polyetheretherketones
  • polymethylmethacrylates polystyrenes
  • polyvinyl chlorides polyethylenes
  • polypropylenes blended material of polyethylenes/polypropylenes
  • polyamides polyamides
  • polyimides cellulose propionat
  • a drawing tension is set no more than 80 N, preferably no more than 60 N, more preferably no more than 30 N, most preferably 0 N per base material film width of 1 m
  • a temperature is set 100 through 150 ° C., and preferably 120 through 150° C.
  • a residence time is set 20 through 120 seconds, and preferably 40 through 120 seconds, and more preferably 60 through 120 seconds.
  • a thickness of a base material film 1 a is not esp ially limited, and it is preferably about 10 through 70 ⁇ m, more preferably about 15 through 50 ⁇ m, and still more preferably about 20 through 40 ⁇ m. Ex essively small thickness gives tendency for strength to be inadequate at a time of separation of a surface protective film 1 and for surface protection function to be inferior. And on the other hand, excessively large thickness gives a tendency to be disadvantageous in respect of handling property or cost.
  • treatments by corona discharge, electron beam irradiation, sputtering methods, etc. and an adhesion-enhancing treatment are preferably performed on the surface of the base material film.
  • adhesives forming the adhesive layer 1 b usually used adhesives for re-peeling (acrylics based, rubber materials based, synthetic rubbers based, etc.) may be used without particular restriction. Acrylic based adhesives whose adhesive power may be easily controlled based on compositions are preferable.
  • a weight average molecular weight of base polymers of acrylic based adhesives is preferably approximately 300,000 through 2,500,000.
  • Various alkyl (meth)acrylates may be used as monomers used for acrylic based polymers as base polymers of the acrylic based adhesives.
  • alkyl (meth)acrylates methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylatel, and 2-ethylhexyl (meth)acrylate etc. may be mentioned, and moreover they may be used independently or may be used in ombination.
  • a opolymer in whi h monomers including fun tional groups is opolymerized to the above-mentioned acrylic based polymer is used as base polymers, and preferably cross-linking agents for cross-linking with the functional groups of the monomers including functional groups may be blended.
  • monomers having functional groups monomers including carboxyl groups, hydroxyl groups, epoxy groups, amino groups etc. may be mentioned.
  • monomers having hydroxyl groups there may be mentioned: 2-hydroxyethyl (meth)acrylate, hydroxybutyl (meth)acrylate, hydroxyhexyl (meth)acrylate, and N-methylol (meth) acrylamide etc. and as monomers including epoxy groups there may be mentioned glycidyl (meth)acrylate etc.
  • monomers including N element may be copolymerized with the above-mentioned acrylic based polymers.
  • monomers including N element there may be mentioned: (meth)acrylamide, N,N-dimethyl (meth) acrylamide, N,N-diethyl (meth)acrylamide, (meth)acryloyl morpholine, (meth)acetonitrile, vinyl pyrrolidone, N-cyclohexyl maleimide, itaconimide, N,N-dimethylaminoethyl (meth) acrylamide etc.
  • Th se monom rs may be used indep nd ntly, and two or more of them may be used in combination.
  • a percentage of the above-mentioned copolymerizable monomer in acrylic based polymers is not especially limited, it is preferably approximately 0.1 through 12 parts by weight, and more preferably 0.5 through 10 parts by weight to alkyl (meth)acrylate 100 parts by weight.
  • cross-linking agents epoxy based cross-linking agents, isocyanate based cross-linking agents, imine based cross-linking agents, metal chelate based cross-linking agents, etc. may be mentioned.
  • cross-linking agents polyamine compounds, melamine resins, urea resins, epoxy resins, etc. may be mentioned.
  • epoxy based cross-linking agents are preferred.
  • an amount of the cross-linking agent (solid content) is preferably approximately 0.01 through 10 parts by weight to the acrylic based polymer (solid content) 100 parts by weight.
  • tackiflers plasticizers, fillers, antioxidants, UV absorbents, silane coupling agents, etc. may also be suitably used for the above-mentioned adhesives, if needed.
  • Methods for forming th adh sive layer 1 b is not especially limited, and following methods may be mentioned:
  • a thickness of the adhesive layer 1 b is not especially limited, and it is preferably about 1 through 50 ⁇ m, more preferably about 2 through 40 ⁇ m, and still more preferably about 3 through 30 ⁇ m.
  • An excessively thin thickness of the adhesive layer 1 b makes formation of applied layers difficult, and also tends to make adhesive powers inadequate. On the contrary, an excessively large thickness tends to generate paste remainder, and there is tendency of causing disadvantage in cost.
  • the above-mentioned adhesive layer 1 b of the surface protective film 1 of this invention may be protected with separator, and the surface protective film 1 of this invention may be given a treatment for separation on a surface opposite to a surface on which a adhesive layer 1 b is formed of the base material film 1 a using silicone based releasing agents or long chain alkyl based releasing agents, and then it may be rolled up.
  • a treatment for rough-surfacing by buffing, sandblasting, etc. may be provided to a surface opposite to a surface on which the adhesive layer 1 b is formed of the bas material film 1 a in order to raise sliding property etc.
  • antistatic treatment may b provided to the surface protective film 1 by usual way for prevention f dust ontamination t.
  • a transparent conductive film 2 protected by a surface protective film 1 of this invention is shown in FIG. 1 or 2 . That is, as shown in FIG. 1, a transparent conductive film with a surface protective film of this invention comprises a conductive thin film 2 b on one side, and a hard coat layer 2 c (or an anti-glare layer) on the other side of a substrate film 2 a , and at the same time an adhesive layer 1 b of a surface protective film 1 attached on a surface of the hard coat layer 2 c for the anti-glare layer).
  • a transparent conductive film with a surface protective film of this invention comprises a conductive thin film 2 b on one side, and a hard coat layer 2 c (or an anti-glare layer) on the other side of a substrate film 2 a , and at the same time an adhesive layer 1 b of a surface protective film 1 attached on a surface of the hard coat layer 2 c for the anti-glare layer).
  • a transparent conductive film with a surface protective film of this invention comprises a conductive thin film 2 b on one side of a substrate film 2 a , and at the same time an adhesive layer 1 b of a surface protective film 1 attached on a surface on the other side of the substrate film 2 a .
  • a transparent conductive film with a surface protective film of this invention may comprise a adhesive layer 1 b of the above-mentioned surface protective film 1 attached on a surface on a side of the conductive thin film 2 b.
  • the conductive thin film 2 b is formed with thin film of metal oxides, such as ITO (oxide of indium and tin) oxide of tin-antimony, zinc, tin and the like, and ultra-thin film of metals, such as gold, silver, palladium, and aluminum. These are formed by a vacuum deposition method, an ion b am deposition method, a sputtering method, an ion plating method, etc.
  • a thi kn ss of the conductive thin film 2 b is not espe ially limited, it is in general no less than 50 A, and preferably 100 through 2,000 ⁇ .
  • the substrate film 2 a a film or a glass comprising transparent materials is usually used.
  • the film for example, polyesters, such as polyethylene terephthalates and polyethylene naphthalates; polymethylmethacrylates; styrene based polymers, such as polystyrenes and acrylonitrile styrene copolymers (AS resins); polycarbonates etc. may be mentioned.
  • polyethylenes polypropylenes, polyolefins having cyclo based or norbornene structure; polyolefins like ethylene propylene copolymers; vinyl chloride based polymers; amide based polymers, such as nylons and aromatic polyamides; imide based polymers;
  • sulfone based polymers polyethersulfone based polymers; polyetheretherketone based polymers; polyphenylene sulfide based polymers; vinyl alcohol based polymers; vinylidene chloride based polymers; vinyl butyral based polymers; allylate based polymers; polyoxymethylene based polymers; epoxy based polymers; and blended materials of the above-mentioned polymers.
  • a thickness of the substrate film 2 a is not especially limited, it is in general approximately 20 through 300 ⁇ m, and preferably 30 through 200 ⁇ m.
  • a layer simultaneously having anti-glare function a layer in whi h an anti-glare layer may be formed on the surfa e of a hard oat layer 2 .
  • UV curing type As hard coat agents used, usual coating materials of ultraviolet radiation (UV) and electron rays curing type, silicone based hard coat agents, and phosphazene resin based hard coat agents etc. may be used, and in view of material cost, easiness in process, free selection of composition, etc. coating materials of UV curing type are preferable.
  • the coating materials of UV curing type include vinyl polymerizable type, polythiol-polyene type, epoxy type, and amino-alkyd type, and they also may be classified into type of alkyd, polyester, polyether, acrylic, urethane, and epoxy according to types of prepolymer, any types of which may be usable.
  • an anti-glare layer represents a layer having functions, such as prevention of dazzling, and antireflection.
  • a layer using a refractive index difference between layers a layer using a refractive index difference between fine-grains included and a polymer forming the layer, a layer that has detailed valleys and peaks form on a surface thereof may be mentioned.
  • a transparent conductive film 2 of this invention may be used for new display methods, such as liquid crystal displays, plasma display panels, and electroluminescence displays, for transparent ele trode in touch panels, sensors, solar cells, etc., and further for ele trification prevention of transparent arti l s, electromagneti wave inter eption, et.
  • the above-mentioned acrylic based adhesive composition was applied to a corona treated surface of a polyethylene terephthalate (PET) film (Diafoil T100C, manufactured by Mitsubishi Chemical Polyester Film Co., Ltd., surface treatment: corona treatment, density: 1.4 g/cm 3 (based on JIS 7112)) with a thickness of 38 ⁇ m. Then a drawing tension per PET film width of lm was set to 30 N, and the film was kept for 1 minute under 145° C. conditions to perform a treatment for removing a residual str ss of the PET film with simultaneous drying of the adhesive.
  • PET polyethylene terephthalate
  • the film was winded to a shape of a roll, and a surface protective film with a thickness of the adhesive layer of 20 ⁇ m was obtained. Furthermore, aging treatment was performed for the surface protective film obtained under 50° C. conditions for 48 hours.
  • the above-mentioned acrylic based adhesive composition was applied onto one side of a polyethylene naphthalate (PEN) film (manufactured by Teijin Du Pont Films Japan Limited, Kaladex 2000, no surface treatment given, density: 1.36 g/cm 3 (based on JIS 7112)) with a thickness of 25 ⁇ m. Then a drawing tension per PEN film width of 1 m was set to 30 N, and the film was kept for 3 minute under 80° C. conditions to perform a treatment for removing a residual stress of the PEN film with simultaneous drying of the adhesive.
  • PEN polyethylene naphthalate
  • the film was winded to a shape of a roll, and a surface protective film with a thickness of the adhesive layer of 20 ⁇ m was obtained. Furthermore, aging treatment was performed for the surface protective film obtained under 50° C. conditions for 48 hours.
  • the above-mentioned acrylic based adhesive composition was applied to a corona treated surface of the PET film given in Exampl 1, and the film was kept to stand for 3 minutes und r 80° C. conditions. Subsequ ntly, the film was winded to a shape of a roll, and a surface protective film with a thi kness of the adhesiv layer of 20 ⁇ m was obtained. Furthermore, aging treatment was performed for the surface protective film obtained under 50° C. conditions for 48 hours.
  • the above-mentioned acrylic based adhesive composition was applied to one side of a PET film (manufactured by Teijin Du Pont Films Japan Limited, Tetoron film S-25, no surface treatment given, density: 1.4 g/cm 3 (based on JIS 7112)) with a thickness of 25 ⁇ m, and the film was kept to stand for 3 minutes under 80° C. conditions. Subsequently, the film was winded to a shape of a roll, and a surface protective film with a thickness of the adhesive layer of 20 ⁇ m was obtained. Furthermore, aging treatment was performed for the surface protective film obtained under 50° C. conditions for 48 hours.
  • a surface protective film was cut into a square of 50 ⁇ 50 mm, to whi h straight lines with a length of 40 mm were given in a machine dire tion (MD) and a width dire tion (TD) to form a shape of a cross mark.
  • Lengths (mm) of the above-mentioned cross mark b for and after of heating preservation test (150° C., 1 hour) were measured, using Olympus digital type small quantitative microscope STM 5 (manufactured by Olympus Optical Industry Co., Ltd.). Measured values were substituted in a following equation, and rates of thermal shrinkage were obtained. Table 1 shows results.
  • Rate ⁇ ⁇ of ⁇ ⁇ thermal ⁇ ⁇ shrinkage ⁇ ( % ) ⁇ ( length ⁇ ⁇ before ⁇ ⁇ heating ⁇ ⁇ preservation ) - ( length ⁇ ⁇ after ⁇ ⁇ heating ⁇ ⁇ preservation ) / ( length ⁇ ⁇ before ⁇ ⁇ heating ⁇ ⁇ preservation ) ⁇ ⁇ 100
  • a surface protective film was attached with a hand roller on a side of a base material film of a transparent conductive film (base material film: PET, conductive thin film: indium-tin metal oxide, trade name: Elecrysta G400LTMP, manufactured by NITTO DENKO Corporation)
  • base material film PET
  • conductive thin film indium-tin metal oxide
  • trade name: Elecrysta G400LTMP Elecrysta G400LTMP

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Materials Engineering (AREA)
  • Laminated Bodies (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesive Tapes (AREA)
  • Surface Treatment Of Optical Elements (AREA)
  • Electroluminescent Light Sources (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Adhesives Or Adhesive Processes (AREA)
US10/619,516 2002-07-31 2003-07-14 Surface protective film for transparent conductive film and method for manufacturing the same, and transparent conductive film with surface protective film Abandoned US20040033735A1 (en)

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JP2002223356A JP4342775B2 (ja) 2002-07-31 2002-07-31 透明導電性フィルム用表面保護フィルム及びその製造方法並びに表面保護フィルム付き透明導電性フィルム
JP2002-223356 2002-07-31

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US20040028919A1 (en) * 2002-08-09 2004-02-12 Mitsushi Yamamoto Surface protective film for transparent conductive substrate, and transparent conductive substrate with surface protective film
US20060008665A1 (en) * 2003-02-03 2006-01-12 Bridgestone Corporation Transparent conductive film, transparent conductive plate, and touch panel
US20080038551A1 (en) * 2006-08-10 2008-02-14 Nitto-Denko Corporation Warpage-inhibitive pressure-sensitive adhesive sheets for wafer grinding
US20100151237A1 (en) * 2008-12-12 2010-06-17 Nitto Denko Corporation Paint film-protecting sheet and method of manufacture
US20110033662A1 (en) * 2009-07-23 2011-02-10 Nitto Denko Corporation Laminated film and pressure-sensitive adhesive tape
FR2969312A1 (fr) * 2010-12-20 2012-06-22 Rhodia Acetow Gmbh Module photovoltaique
CN103374308A (zh) * 2012-04-24 2013-10-30 藤森工业株式会社 透明导电性膜用表面保护膜以及使用其的透明导电性膜
JP2015030213A (ja) * 2013-08-05 2015-02-16 リンテック株式会社 プロテクトフィルム付き透明導電性フィルム
JP2015203073A (ja) * 2014-04-15 2015-11-16 日東電工株式会社 積層体及び透明導電性フィルム用キャリアフィルム

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KR101081524B1 (ko) * 2004-04-07 2011-11-08 나노캠텍주식회사 도전성 필름 및 시트, 및 이의 제조 방법
JP5194695B2 (ja) * 2007-10-10 2013-05-08 大日本印刷株式会社 セパレータレス型保護フィルム
JP5620644B2 (ja) * 2009-02-09 2014-11-05 住友化学株式会社 タッチパネル用積層押出樹脂板およびタッチパネル用表面塗工板
TWI416173B (zh) * 2009-10-09 2013-11-21 Innolux Corp 光學膜
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CN1477488A (zh) 2004-02-25

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