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US20040000394A1 - Heat-dissipating device - Google Patents

Heat-dissipating device Download PDF

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Publication number
US20040000394A1
US20040000394A1 US10/242,108 US24210802A US2004000394A1 US 20040000394 A1 US20040000394 A1 US 20040000394A1 US 24210802 A US24210802 A US 24210802A US 2004000394 A1 US2004000394 A1 US 2004000394A1
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US
United States
Prior art keywords
heat
transfer body
heat transfer
dissipating device
generating component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/242,108
Other languages
English (en)
Inventor
Chin-Kuang Luo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of US20040000394A1 publication Critical patent/US20040000394A1/en
Abandoned legal-status Critical Current

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Classifications

    • H10W40/43—
    • H10W40/25—

Definitions

  • the invention relates to a heat-dissipating device, more particularly to a heat-dissipating device that can dissipate heat in a highly efficient manner.
  • FIG. 1 shows a conventional heat-dissipating device adapted to be mounted on top of a heat-generating component 12 that is disposed on a circuit board 11 of an electronic device.
  • the heat-generating component 12 can be a central processing unit, an integrated circuit, or the like.
  • the heat-dissipating device includes an aluminum heat-dissipating fin unit 13 disposed in thermal contact with the heat-generating component 12 , and a fan 14 oriented toward the fin unit 13 .
  • the fin unit 13 has a bottom portion provided with a heat-conducting plate 15 that is formed from copper and that facilitates the transfer of heat generated by the heat-generating component 12 to the fin unit 13 .
  • such a conventional heat-dissipating device has the following setbacks:
  • the heat-generating component 12 is a central processing unit disposed within a computer housing 2 and mounted in a processor socket 16 of a main board 17 , the currents of air produced by the fan 14 for dissipating the heat around the central processing unit will become hot and disperse within the computer housing 2 , thereby raising the temperature within the computer housing 2 .
  • a power supply 3 with an exhaust-type fan unit 31 is disposed for drawing the hot air from within the computer housing 2 , as well as dissipating the heat generated thereby, the heat dissipating effect is not ideal.
  • the main object of the present invention is to provide a heat-dissipating device which achieves an enhanced heat-dissipating effect using a single fan unit.
  • a heat-dissipating device of this invention includes:
  • a thermal superconducting body including a hollow heat transfer body adapted to be disposed on a heat-generating component of an electronic device, the heat transfer body being made of a heat-conducting material and being configured to confine at least one air channel;
  • a fan unit disposed to draw hot air away from the heat transfer body
  • a guide pipe having an inlet port in fluid communication with the heat transfer body for collecting hot air from the heat transfer body, an outlet port in fluid communication with the fan unit, and an intermediate pipe portion interconnecting the inlet and outlet ports for guiding the hot air from the inlet port to the outlet port for extraction by the fan unit.
  • FIG. 1 is a schematic exploded side view of a conventional heat-dissipating device
  • FIG. 2 is a fragmentary partly cut-away perspective view showing the conventional heat-dissipating device in a computer housing
  • FIG. 3 is a perspective view of a preferred embodiment of a heat-dissipating device according to the present invention in a state of use;
  • FIG. 4 is a sectional view illustrating a thermal superconducting body of the preferred embodiment.
  • FIG. 5 is a top view of the thermal superconducting body of the preferred embodiment.
  • FIGS. 3 to 5 the preferred embodiment of a heat-dissipating device according to the present invention is shown to include a thermal superconducting body 4 , a fan unit 7 , and a guide pipe 6 .
  • the thermal superconducting body 4 includes a hollow heat transfer body 40 adapted to be disposed on a heat-generating component 5 , such as a central processing unit, of an electronic device, and is made of a heat-conducting material, such as aluminum, copper metal, alloy metal, or other materials with good thermal conductivity.
  • the heat transfer body 40 has an inner surface confining a sealed vacuum chamber 41 , and a base portion 45 adapted to be disposed in thermal contact with the heat-generating component 5 so that heat generated by the heat-generating component 5 is transferred to the heat transfer body 40 .
  • the thermal superconducting body 4 further includes a heat transfer layer 42 that is formed from a superconductor material and that forms a superconductor lining on the inner surface of the heat transfer body 40 .
  • the superconductor material is injected into the heat transfer body 40 , which is then evacuated and sealed to form the sealed vacuum chamber 41 .
  • a plurality of equidistantly spaced-apart limiting blocks can be disposed on the inner surface of the heat transfer body 40 so as to prevent flattening or angular deformation of the heat transfer body 40 when air is exhausted from the heat transfer body 40 to form the sealed vacuum chamber 41 .
  • the superconductor material includes at least one compound selected from the group consisting of sodium peroxide, sodium oxide, beryllium oxide, manganese sesquioxide, aluminum dichromate, calcium dichromate, boron oxide, dichromate radical, and combinations thereof; at least one compound selected from the group consisting of cobaltous oxide, manganese sesquioxide, beryllium oxide, strontium chromate, strontium carbonate, rhodium oxide, cupric oxide, ⁇ -titanium, potassium dichromate, boron oxide, calcium dichromate, manganese dichromate, aluminum dichromate, dichromate radical, and combinations thereof; or at least one compound selected from the group consisting of denatured rhodium oxide, potassium dichromate, denatured radium oxide, sodium dichromate, silver dichromate, monocrystalline silicon, beryllium oxide, strontium chromate, boron oxide, sodium peroxide, ⁇ -titanium, a
  • the sealed vacuum chamber 41 is subjected to passivation and is then washed and dried.
  • the heat transfer body 40 is formed with a plurality of fins 43 extending uprightly from the base portion 45 opposite to the heat-generating component 5 .
  • An adjacent pair of the fins 43 defines an air channel 44 .
  • the fan unit 7 is disposed to draw hot air away from the heat transfer body 40 .
  • the guide pipe 6 is made from a heat-resistant metal or rubber material, and has an inlet port 61 in fluid communication with the heat transfer body 40 for collecting hot air from the heat transfer body 40 , an outlet port 63 connected to and in fluid communication with the fan unit 7 , and a flexible intermediate pipe portion 62 interconnecting the inlet and outlet ports 61 , 63 for guiding the hot air from the inlet port 61 to the outlet port 63 for extraction by the fan unit 7 .
  • the inlet port 61 of the guide pipe 6 is connected to the base portion 45 of the heat transfer body 40 , and has the fins 43 disposed therein so as to be in fluid communication with the air channels 44 defined by the fins 33 .
  • the intermediate pipe portion 62 is configured as a bellows pipe portion.
  • the heat generated by the heat-generating component 5 during operation thereof can be quickly transferred to the thermal superconducting body 4 .
  • the hot air around the heat-generating component 5 can be directed to flow along the air channels 44 through the guide pipe 6 for extraction via the fan unit 7 , thereby rapidly lowering the temperature around the heat-generating component 5 .
  • the fan unit 7 can be a fan member of a power supply (not shown) disposed in a computer housing (not shown) for supplying electric power to a computer. As such, when the computer is powered on, the fan unit 7 can suck hot air around the heat-generating component 5 and other heat-generating components, such as hard disk drives, optical disk drives, via the inlet port 61 of the guide pipe 6 for extraction to the exterior of the computer housing.
  • the heat-dissipating device of this invention further includes a heat collecting plate 8 adapted to be disposed between the thermal superconducting body 4 and the heat-generating component 5 .
  • the heat collecting plate 8 has two opposite surfaces, each of which is coated with a heat conducting paste 9 .
  • the heat collecting plate 8 is formed from a metal material of good heat conductivity, such as copper and aluminum.
  • the heat-dissipating device of this invention can achieve an excellent heat-dissipating effect with the use of only a single fan unit.

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
US10/242,108 2002-07-01 2002-09-12 Heat-dissipating device Abandoned US20040000394A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW91114537 2002-07-01
TW091114537 2002-07-01

Publications (1)

Publication Number Publication Date
US20040000394A1 true US20040000394A1 (en) 2004-01-01

Family

ID=21688314

Family Applications (1)

Application Number Title Priority Date Filing Date
US10/242,108 Abandoned US20040000394A1 (en) 2002-07-01 2002-09-12 Heat-dissipating device

Country Status (4)

Country Link
US (1) US20040000394A1 (de)
JP (1) JP2004040069A (de)
DE (1) DE10244625A1 (de)
GB (1) GB2390482A (de)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020182332A1 (en) * 1996-10-25 2002-12-05 Qu Yu Zhi Method for producing a heat transfer medium and device
US20060005947A1 (en) * 2004-07-09 2006-01-12 Gelcore, Llc Light emitting chip apparatuses with a thermally superconducting heat transfer medium for thermal management
KR101273359B1 (ko) * 2011-05-09 2013-06-11 강준수 버퍼영역을 구비하는 열풍기
US20130240196A1 (en) * 2012-03-16 2013-09-19 Hon Hai Precision Industry Co., Ltd. Container with cooling system
CN105308741A (zh) * 2013-06-20 2016-02-03 三菱电机株式会社 车辆用功率转换装置
WO2016116172A1 (en) * 2015-01-23 2016-07-28 Quantum Technologie (Deutschland) Gmbh Quantum medium formula and preparation process for heat transfer
CN107613732A (zh) * 2017-09-28 2018-01-19 深圳兴奇宏科技有限公司 机箱散热结构

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101087861B1 (ko) * 2004-03-15 2011-11-30 엘지전자 주식회사 컴퓨터의 열원냉각장치
CN106163154B (zh) * 2016-07-20 2019-04-09 广东网域科技有限公司 一种高强度交换机
CN108925107B (zh) * 2018-07-11 2020-04-10 佛山市众盈电子有限公司 一种负载和温度双控的电源装置
CN112197429A (zh) * 2020-10-10 2021-01-08 江苏九州电器有限公司 一种电热器的通风结构

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4520425A (en) * 1982-08-12 1985-05-28 Mitsubishi Denki Kabushiki Kaisha Control apparatus with improved structure for cooling circuit elements
WO1995025255A1 (en) * 1992-09-28 1995-09-21 Aavid Engineering, Inc. Apparatus and method for cooling heat generating electronic components in a cabinet
JP3516961B2 (ja) * 1996-10-25 2004-04-05 ク，ユズイ 超伝導熱伝達媒質および超伝導熱伝達デバイスならびにこれらの製造方法
US6062302A (en) * 1997-09-30 2000-05-16 Lucent Technologies Inc. Composite heat sink
US5917697A (en) * 1998-01-27 1999-06-29 Wang; Daniel CPU cooling arrangement
CA2310358A1 (en) * 1999-06-01 2000-12-01 Showa Aluminum Corporation Heat sinks for cpus for use in personal computers
US6410982B1 (en) * 1999-11-12 2002-06-25 Intel Corporation Heatpipesink having integrated heat pipe and heat sink
DE20010663U1 (de) * 2000-06-15 2000-10-26 Schlomka, Georg, 21640 Neuenkirchen Kühlelement und Kühleinrichtung
GB2364179A (en) * 2000-06-30 2002-01-16 Jern Ru Ind Co Ltd A heat dissipation device
US6408935B1 (en) * 2000-08-16 2002-06-25 Thermal Corp. Heat sink assembly with over-molded cooling fins

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020182332A1 (en) * 1996-10-25 2002-12-05 Qu Yu Zhi Method for producing a heat transfer medium and device
US6911231B2 (en) * 1996-10-25 2005-06-28 New Qu Energy Limited Method for producing a heat transfer medium and device
US20060005947A1 (en) * 2004-07-09 2006-01-12 Gelcore, Llc Light emitting chip apparatuses with a thermally superconducting heat transfer medium for thermal management
US7878232B2 (en) 2004-07-09 2011-02-01 GE Lighting Solutions, LLC Light emitting chip apparatuses with a thermally superconducting heat transfer medium for thermal management
KR101273359B1 (ko) * 2011-05-09 2013-06-11 강준수 버퍼영역을 구비하는 열풍기
US20130240196A1 (en) * 2012-03-16 2013-09-19 Hon Hai Precision Industry Co., Ltd. Container with cooling system
CN105308741A (zh) * 2013-06-20 2016-02-03 三菱电机株式会社 车辆用功率转换装置
CN105308741B (zh) * 2013-06-20 2018-01-23 三菱电机株式会社 车辆用功率转换装置
WO2016116172A1 (en) * 2015-01-23 2016-07-28 Quantum Technologie (Deutschland) Gmbh Quantum medium formula and preparation process for heat transfer
CN107613732A (zh) * 2017-09-28 2018-01-19 深圳兴奇宏科技有限公司 机箱散热结构

Also Published As

Publication number Publication date
JP2004040069A (ja) 2004-02-05
GB2390482A (en) 2004-01-07
DE10244625A1 (de) 2004-01-22
GB0221463D0 (en) 2002-10-23

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Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION