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JP2004040069A - 熱放散装置 - Google Patents

熱放散装置 Download PDF

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Publication number
JP2004040069A
JP2004040069A JP2002266350A JP2002266350A JP2004040069A JP 2004040069 A JP2004040069 A JP 2004040069A JP 2002266350 A JP2002266350 A JP 2002266350A JP 2002266350 A JP2002266350 A JP 2002266350A JP 2004040069 A JP2004040069 A JP 2004040069A
Authority
JP
Japan
Prior art keywords
heat
conduit
fan unit
dissipation device
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002266350A
Other languages
English (en)
Japanese (ja)
Inventor
Chin Kuang Luo
ルオ　チン　コアン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of JP2004040069A publication Critical patent/JP2004040069A/ja
Pending legal-status Critical Current

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Classifications

    • H10W40/43—
    • H10W40/25—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2002266350A 2002-07-01 2002-09-12 熱放散装置 Pending JP2004040069A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW91114537 2002-07-01

Publications (1)

Publication Number Publication Date
JP2004040069A true JP2004040069A (ja) 2004-02-05

Family

ID=21688314

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002266350A Pending JP2004040069A (ja) 2002-07-01 2002-09-12 熱放散装置

Country Status (4)

Country Link
US (1) US20040000394A1 (de)
JP (1) JP2004040069A (de)
DE (1) DE10244625A1 (de)
GB (1) GB2390482A (de)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101087861B1 (ko) * 2004-03-15 2011-11-30 엘지전자 주식회사 컴퓨터의 열원냉각장치
CN106163154A (zh) * 2016-07-20 2016-11-23 广东网域科技有限公司 一种高强度交换机
CN108925107A (zh) * 2018-07-11 2018-11-30 佛山市众盈电子有限公司 一种负载和温度双控的电源装置
CN112197429A (zh) * 2020-10-10 2021-01-08 江苏九州电器有限公司 一种电热器的通风结构

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6911231B2 (en) * 1996-10-25 2005-06-28 New Qu Energy Limited Method for producing a heat transfer medium and device
US7878232B2 (en) * 2004-07-09 2011-02-01 GE Lighting Solutions, LLC Light emitting chip apparatuses with a thermally superconducting heat transfer medium for thermal management
KR101273359B1 (ko) * 2011-05-09 2013-06-11 강준수 버퍼영역을 구비하는 열풍기
TW201339513A (zh) * 2012-03-16 2013-10-01 Hon Hai Prec Ind Co Ltd 貨櫃冷卻系統
WO2014203374A1 (ja) * 2013-06-20 2014-12-24 三菱電機株式会社 車両用の電力変換装置
WO2016116172A1 (en) * 2015-01-23 2016-07-28 Quantum Technologie (Deutschland) Gmbh Quantum medium formula and preparation process for heat transfer
CN107613732B (zh) * 2017-09-28 2024-06-07 深圳兴奇宏科技有限公司 机箱散热结构

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4520425A (en) * 1982-08-12 1985-05-28 Mitsubishi Denki Kabushiki Kaisha Control apparatus with improved structure for cooling circuit elements
WO1995025255A1 (en) * 1992-09-28 1995-09-21 Aavid Engineering, Inc. Apparatus and method for cooling heat generating electronic components in a cabinet
JP3516961B2 (ja) * 1996-10-25 2004-04-05 ク，ユズイ 超伝導熱伝達媒質および超伝導熱伝達デバイスならびにこれらの製造方法
US6062302A (en) * 1997-09-30 2000-05-16 Lucent Technologies Inc. Composite heat sink
US5917697A (en) * 1998-01-27 1999-06-29 Wang; Daniel CPU cooling arrangement
CA2310358A1 (en) * 1999-06-01 2000-12-01 Showa Aluminum Corporation Heat sinks for cpus for use in personal computers
US6410982B1 (en) * 1999-11-12 2002-06-25 Intel Corporation Heatpipesink having integrated heat pipe and heat sink
DE20010663U1 (de) * 2000-06-15 2000-10-26 Schlomka, Georg, 21640 Neuenkirchen Kühlelement und Kühleinrichtung
GB2364179A (en) * 2000-06-30 2002-01-16 Jern Ru Ind Co Ltd A heat dissipation device
US6408935B1 (en) * 2000-08-16 2002-06-25 Thermal Corp. Heat sink assembly with over-molded cooling fins

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101087861B1 (ko) * 2004-03-15 2011-11-30 엘지전자 주식회사 컴퓨터의 열원냉각장치
CN106163154A (zh) * 2016-07-20 2016-11-23 广东网域科技有限公司 一种高强度交换机
CN106163154B (zh) * 2016-07-20 2019-04-09 广东网域科技有限公司 一种高强度交换机
CN108925107A (zh) * 2018-07-11 2018-11-30 佛山市众盈电子有限公司 一种负载和温度双控的电源装置
CN112197429A (zh) * 2020-10-10 2021-01-08 江苏九州电器有限公司 一种电热器的通风结构

Also Published As

Publication number Publication date
GB2390482A (en) 2004-01-07
DE10244625A1 (de) 2004-01-22
GB0221463D0 (en) 2002-10-23
US20040000394A1 (en) 2004-01-01

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