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US10876647B2 - Quick release purge valve and substrate container using same - Google Patents

Quick release purge valve and substrate container using same Download PDF

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Publication number
US10876647B2
US10876647B2 US16/237,818 US201916237818A US10876647B2 US 10876647 B2 US10876647 B2 US 10876647B2 US 201916237818 A US201916237818 A US 201916237818A US 10876647 B2 US10876647 B2 US 10876647B2
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US
United States
Prior art keywords
bottom plate
plate
quick release
purge valve
gasket fitting
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Application number
US16/237,818
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English (en)
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US20190211942A1 (en
Inventor
Ming-Chien Chiu
Chia-Ho CHUANG
Hsin-Min Hsueh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gudeng Precision Industrial Co Ltd
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Gudeng Precision Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority to US16/237,818 priority Critical patent/US10876647B2/en
Assigned to Gudeng Precision Industrial Co., Ltd reassignment Gudeng Precision Industrial Co., Ltd ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHIU, MING-CHIEN, CHUANG, CHIA-HO, HSUEH, HSIN-MIN
Publication of US20190211942A1 publication Critical patent/US20190211942A1/en
Priority to US17/102,920 priority patent/US11306841B2/en
Application granted granted Critical
Publication of US10876647B2 publication Critical patent/US10876647B2/en
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K24/00—Devices, e.g. valves, for venting or aerating enclosures
    • F16K24/04—Devices, e.g. valves, for venting or aerating enclosures for venting only
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D46/00—Filters or filtering processes specially modified for separating dispersed particles from gases or vapours
    • B01D46/10—Particle separators, e.g. dust precipitators, using filter plates, sheets or pads having plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D46/00—Filters or filtering processes specially modified for separating dispersed particles from gases or vapours
    • B01D46/42—Auxiliary equipment or operation thereof
    • B01D46/4272—Special valve constructions adapted to filters or filter elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K27/00—Construction of housing; Use of materials therefor
    • F16K27/02—Construction of housing; Use of materials therefor of lift valves
    • F16K27/0209—Check valves or pivoted valves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67793—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with orientating and positioning by means of a vibratory bowl or track
    • H10P72/37—

Definitions

  • the present invention relates to a quick release purge valve. More particularly, the present invention relates a quick release purge valve applied in a substrate container.
  • Photolithography involves patterning the light permeable reticle with predefined pattern, projecting the pattern on the reticle onto a wafer by exposing to a light source. As a result, the pattern can be transferred and developed on the wafer. During the photolithography process, any particle attached on the reticle would deteriorate the image quality projected onto the wafer. Especially, with the development trend of miniaturizing the linewidth in recent years, the industry tends to develop smaller, higher logic density chips. The wavelength of the light source used by the photolithography equipment has been narrowed down to the range of extreme ultraviolet light (EUV). As a result, the manufacturers must set stricter standards for the number of particles, the size of particles, and the cleanliness inside the reticle pod.
  • EUV extreme ultraviolet light
  • One known method of maintaining the cleanliness is to install one or more purge valves on the reticle pod and to provide gas flowing through the purge valves. Practically, the gas is provided at a certain flow rate to flow through the purge valve to maintain the replacement rate of the gas in the reticle pod, and to optimize the storage environment for the reticle.
  • the filtration sheet used for filtering out the particles in the gas is disposed at the purge valves of the reticle pod. After several times of use, the filtration sheet must be replaced to maintain the filtration effect.
  • the filtration sheet, the purge valve, or other related components are assembled and fixed to the base of the reticle pod through one or more screws.
  • the screws need to be removed first and then the bottom plate of the base must be entirely removed as well. After removing all these components, the filtration sheet can then be replaced. After the filtration sheet is replaced, the bottom plate must be reinstalled, and the screws must be driven back into the base. The work of screwing, removing, and reinstalling is quite time consuming, making the component replacement process very inefficient.
  • the present invention is to provide a quick release purge valve and a substrate container using the same, which use a detachable snap plate to increase the convenience of replacing the components.
  • a quick release purge valve configured to allow a gas entering or leaving a substrate container.
  • the substrate container has a cover plate and a bottom plate.
  • the quick release purge valve includes a snap plate, a gasket fitting, and a valve element.
  • the snap plate is detachably engaged to a first opening of the bottom plate and is at most evenly aligned with the bottom plate.
  • the gasket fitting is disposed between the cover plate and the bottom plate and has an airflow conduit communicating the cover plate and the bottom plate.
  • the valve element is disposed in the airflow conduit for limiting a flow direction of the gas.
  • the gasket fitting is configured to be fixed in the base when the snap plate and the bottom plate are in an engaged state and to be removable from the base when the snap plate and the bottom plate are in a disengaged state.
  • the snap plate includes a main body and an elastic arm.
  • the main body is used for fixing to one side of the gasket fitting, and one end of the elastic arm is connected to the main body and the other end of the elastic arm is used for engaging with the bottom plate.
  • the main body has a circular structure, and the circular structure is configured to surround the gasket fitting and to avoid the airflow conduit.
  • the gasket fitting has a protruded ring situated on an outer wall of the gasket fitting, and an outer diameter of the protruded ring is larger than an inner diameter of the main body.
  • the bottom plate has a protruded edge and an engaging recess.
  • the protruded edge is used for fixing a location of the main body in the first opening, and the engaging recess is used for engaging with the elastic arm thereby engaging the snap plate with the bottom plate.
  • the other side of the gasket fitting is used for pressing against the cover plate in proximity to a second opening of the cover plate, and the gas enters or leaves the substrate container through the first opening, the airflow conduit, and the second opening.
  • the cover plate has a fitting sleeve surrounding the second opening
  • the gasket fitting is used for slidably fitting with or removing from the fitting sleeve.
  • a substrate container includes an inner box assembly for accommodating a substrate and an outer box assembly for accommodating the inner box assembly.
  • the outer box assembly includes a base and an outer cover.
  • the base includes a bottom plate having a first opening, a cover plate, and a quick release purge valve configured to allow a gas entering or leaving the substrate container.
  • the quick release purge valve includes a snap plate, a gasket fitting, and a valve element.
  • the snap plate is detachably engaged to the first opening and is at most evenly aligned with the bottom plate.
  • the gasket fitting is disposed between the cover plate and the bottom plate and has an airflow conduit communicating the cover plate and the bottom plate.
  • the valve element is disposed in the airflow conduit for limiting a flow direction of the gas.
  • the outer cover is used for engaging with the base to form a sealed state therebetween.
  • the gasket fitting is configured to be fixed in the base when the snap plate and the bottom plate are in an engaged state and to be removable from the base when the snap plate and the bottom plate are in a disengaged state.
  • the base further includes a filtration element disposed between the cover plate and the gasket fitting for filtering the gas.
  • the quick release purge valve and the substrate container using the same use the detachable snap plate to fix the gasket fitting.
  • the gasket fitting is removable from the base, which facilitates component replacement by the user, and thus the work time can be saved and the work efficiency can be increased.
  • the snap plate is at most evenly aligned with the bottom plate to keep the bottom of the substrate container a flat surface, which is advantageous to the transportation of the substrate container and beneficial for keeping the cleanliness as well.
  • FIG. 1 is a perspective view of a substrate container according to one embodiment of the invention.
  • FIG. 2 is a perspective view of the base of FIG. 1 from another view angle;
  • FIG. 3 is an enlarged view of one quick release purge valve of the base of FIG. 2 ;
  • FIG. 4 is a cross-sectional view of the base taken along plane A in FIG. 1 ;
  • FIG. 5 a is a perspective view of the quick release purge valve according to one embodiment of the invention.
  • FIG. 5 b is an exploded view of the quick release purge valve of FIG. 5 a ;
  • FIG. 6 is a perspective view of the bottom plate near one of the first openings.
  • the quick release purge valve allows the gas entering or leaving the substrate container.
  • the substrate container includes a base having a cover plate and a bottom plate.
  • the quick release purge valve includes a snap plate, a gasket fitting, and a valve element.
  • the snap plate is detachably engaged to a first opening of the bottom plate and is at most evenly aligned with the bottom plate.
  • the gasket fitting is disposed between the cover plate and the bottom plate and has an airflow conduit communicating the cover plate and the bottom plate.
  • the valve element is disposed in the airflow conduit for limiting the flow direction of the gas.
  • the gasket fitting is configured to be fixed in the base when the snap plate and the bottom plate are in an engaged state, so that the gasket fitting can be prevented from moving out of the base.
  • the gasket fitting is configured to be removable from the base when the snap plate and the bottom plate are in a disengaged state.
  • the snap plate is used such that the convenience of replacing the component can be increased.
  • the complicated process of known method including removing the screws and the bottom plate can be eliminated.
  • the efficiency can therefore be increased, and the time that the substrate container stays off the manufacturing line due to component replacement can be shortened.
  • the snap plate is at most evenly aligned with the bottom plate, the bottom of the substrate container can be kept flat, which is advantageous to the transportation of the substrate container and beneficial for keeping the cleanliness as well.
  • FIG. 1 is a perspective view of a substrate container according to one embodiment of the invention.
  • the substrate container 10 includes an outer box assembly 15 and an inner box assembly 16 .
  • the outer box assembly 15 is used for accommodating the inner box assembly 16
  • the inner box assembly 16 is used for accommodating a substrate 20 .
  • the outer box assembly 15 includes a base 11 and an outer cover 13 .
  • the outer cover 13 is used for engaging with the base 11 so that a sealed state is formed between them to separate the inside of the outer box assembly 15 from the outside.
  • the required level of cleanliness inside the outer box assembly 15 can be achieved accordingly.
  • the inner box assembly 16 includes a first part 12 and a second part 14 which matches with the first part 12 .
  • the substrate 20 can be exemplified by an EUV reticle implemented in the patterning process of high-density, high-precision semiconductor.
  • the substrate 20 can be exemplified by other types of slate components that has a high demand for cleanliness and can be implemented in the semiconductor manufacturing process.
  • FIG. 2 is a perspective view of the base of FIG. 1 from another view angle.
  • the base 11 includes a cover plate 120 , a bottom plate 110 , and a quick release purge valve 130 .
  • the cover plate 120 and the bottom plate 110 are configured to be put together and assembled with each other.
  • the base 11 can further include a locking element 150 and a driving mechanism 160 for driving the locking element 150 , so as to firmly lock the outer cover 13 with the base 11 .
  • the quick release purge valve 130 allows a gas entering or leaving the substrate container 10 .
  • the base 11 is exemplified by including four quick release purge valves 130 , as shown in FIG. 2 .
  • Two of the quick release purge valves 130 allow the gas entering the substrate container 10 and the other two allow the gas leaving the substrate container 10 .
  • the number and disposition of the quick release purge valves 130 are not limited hereto, other amount and disposition can also be used in the present invention.
  • FIG. 3 is an enlarged view of one quick release purge valve of the base of FIG. 2 .
  • FIG. 4 is a cross-sectional view of the base taken along plane A in FIG. 1 .
  • the quick release purge valve 130 of the present embodiment includes a snap plate 131 , a gasket fitting 132 , and a valve element 133 .
  • the bottom plate 110 has a first opening 110 a to which the snap plate 131 is detachably engaged. When the snap plate 131 is engaged with the bottom plate 110 , the snap plate 131 is at most evenly aligned with the bottom plate 110 . In other words, the snap plate 131 is not protruded from the bottom plate 110 .
  • the gasket fitting 132 is disposed between the cover plate 120 and the bottom plate 110 and has an airflow conduit 132 a communicating the cover plate 120 and the bottom plate 110 .
  • the valve element 133 is disposed in the airflow conduit 132 a for limiting a flow direction of the gas.
  • FIG. 5 a is a perspective view of the quick release purge valve according to one embodiment of the invention.
  • FIG. 5 b is an exploded view of the quick release purge valve of FIG. 5 a .
  • the snap plate 131 includes a main body 1311 and an elastic arm 1312 .
  • the main body 1311 is used to hold and fix to one side of the gasket fitting 132 ; in other words, the gasket fitting 132 abuts against the main body 1311 and therefore can be fixed.
  • the main body 1311 of the present embodiment has a circular structure configured to surround the gasket fitting 132 .
  • the circular structure is also configured to avoid the airflow conduit 132 a , so as not to interfere with the airflow of the gas.
  • the snap plate 131 is exemplified by having two elastic arms 1312 connecting to two opposite sides of the main body 1311 .
  • the snap plate 131 can therefore be firmly engaged with the bottom plate 110 .
  • the elastic arm 1312 has a curved section which is used to be elastically deformed to achieve snapping or elastically engaging with the bottom plate 110 .
  • the curved section recesses into the base 11 , so the structure of the elastic arm 1312 is at most evenly aligned with the bottom of the bottom plate 110 (i.e.
  • the elastic arm 1312 is not protruded from the bottom plate 110 ).
  • the bottom of the substrate container 10 can be kept flat (as the substrate container 10 shown in FIG. 1 ) to facilitate the transportation of the substrate container 10 , and the flat bottom of the base 11 can also help maintain the cleanliness.
  • the gasket fitting 132 has a protruded ring 1321 situating on an outer wall of the gasket fitting 132 .
  • An outer diameter d 2 of the protruded ring 1321 is larger than an inner diameter d 1 of the main body 1311 of the snap plate 131 , so the gasket fitting 132 can be prevented from going through the circular structure of the main body 1311 and can be effectively held and fixed by the main body 1311 .
  • the valve element 133 is a check valve that can prevent reverse flow of the gas.
  • the valve element 133 allows the gas flows into the substrate container 10 (the substrate container 10 is shown in FIG. 1 ) only in the direction from bottom to top.
  • FIG. 6 is a perspective view of the bottom plate near one of the first openings.
  • the snap plate 131 and the bottom plate 110 shown in FIG. 6 are in the disengaged state; that is, the snap plate 131 is not engaged with the bottom plate 110 .
  • the bottom plate 110 has a protruded edge 111 and an engaging recess 112 at the first opening 110 a .
  • the protruded edge 111 is used for fixing the location of the main body 1311 in the first opening 110 a .
  • the engaging recess 112 is used for engaging with the elastic arm 1312 , thereby engaging the snap plate 131 with the bottom plate 110 .
  • the bottom plate 110 has several protruded edges 111 distributing along the first opening 110 a to contact and fix the main body 1311 from multiple directions.
  • the number of the engaging recess 112 corresponds to the elastic arm 1312 , so each elastic arm 1312 could be engaged with one engaging recess 112 .
  • one side of the gasket fitting 132 abuts against the main body 1311 of the snap plate 131 .
  • the other side of the gasket fitting 132 is used for pressing against the cover plate 120 in proximity to a second opening 120 a of the cover plate 120 .
  • the gas enters or leaves the substrate container 10 through the first opening 110 a , the airflow conduit 132 a , and the second opening 120 a , or vice versa.
  • the cover plate 120 has a fitting sleeve 121 surrounding the second opening 120 a .
  • the gasket fitting 132 is used for slidably fitting with or removing from the fitting sleeve 121 .
  • an air-tight state is formed between the fitting sleeve 121 and the outer wall of the gasket fitting 132 .
  • the gas leakage resulted from gas flowing into the space between the cover plate 120 and the bottom plate 110 can be prevented.
  • the base 11 further includes a filtration element 140 disposed between the cover plate 120 and the gasket fitting 132 for filtering the gas.
  • a filtration element 140 disposed between the cover plate 120 and the gasket fitting 132 for filtering the gas.
  • the gasket fitting 132 is slidable and removable from the fitting sleeve 121 , and the gasket fitting 132 can be completely removed from the base 11 .
  • the filtration element 140 can be replaced accordingly. By using a newly replaced or clean filtration element 140 , the cleanliness of the gas can be kept.
  • the filtration element 140 can be exemplified by filter paper, or other woven or non-woven fabric. Other porous material capable of filtering out particles can also be implemented in the present invention.
  • the gasket fitting 132 can be removed easily, and the filtration element 140 or other related components can be replaced easily.
  • the convenience of component replacement is increased, the work efficiency is improved, and the substrate container 10 (shown in FIG. 1 ) can return to the manufacturing line in a shorter time to carry on the function of containing, supporting, or transporting the substrate 20 (shown in FIG. 1 ).
  • the quick release purge valve allows the gas entering or leaving the substrate container.
  • the substrate container includes the base, and the base includes the cover plate and the bottom plate.
  • the quick release purge valve includes the snap plate, the gasket fitting, and the valve element.
  • the snap plate is detachably engaged to the first opening of the bottom plate and is at most evenly aligned with the bottom plate.
  • the gasket fitting is disposed between the cover plate and the bottom plate and has the airflow conduit communicating the cover plate and the bottom plate.
  • the valve element is disposed in the airflow conduit for limiting the flow direction of the gas.
  • the gasket fitting is fixed by the snap plate and is prevented from moving out of the base.
  • the gasket fitting is removable from the base.
  • the snap plate is used to increase the convenience of component replacement, to save work time, and to improve the work efficiency. Further, because the snap plate is at most evenly aligned with the bottom plate, the bottom of the substrate container can be kept flat, which facilitates the transporting of the substrate container and maintains the cleanliness as well.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Valve Housings (AREA)
US16/237,818 2018-01-11 2019-01-02 Quick release purge valve and substrate container using same Active 2039-03-13 US10876647B2 (en)

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Application Number Priority Date Filing Date Title
US16/237,818 US10876647B2 (en) 2018-01-11 2019-01-02 Quick release purge valve and substrate container using same
US17/102,920 US11306841B2 (en) 2018-01-11 2020-11-24 Quick release purge valve and substrate container using same

Applications Claiming Priority (2)

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US201862615986P 2018-01-11 2018-01-11
US16/237,818 US10876647B2 (en) 2018-01-11 2019-01-02 Quick release purge valve and substrate container using same

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US10876647B2 true US10876647B2 (en) 2020-12-29

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Cited By (5)

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US20200283204A1 (en) * 2019-03-05 2020-09-10 Bedford Systems Llc Spring Biased Box Clip
US11104496B2 (en) * 2019-08-16 2021-08-31 Gudeng Precision Industrial Co., Ltd. Non-sealed reticle storage device
US20220104365A1 (en) * 2020-09-30 2022-03-31 Gudeng Precision Industrial Co., Ltd. Substrate storage apparatus provided with storage environment detection
TWI782689B (zh) * 2021-09-02 2022-11-01 家登精密工業股份有限公司 快拆式氣閥、具有快拆式氣閥的基板容器及快拆式氣閥的安裝和拆卸方法
US20230317484A1 (en) * 2022-04-05 2023-10-05 3S Korea Co., Ltd. Wafer storage container and cap assembly used therefor

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TWI698608B (zh) * 2018-01-11 2020-07-11 家登精密工業股份有限公司 快拆式氣閥及應用其之基板容器
CN110910765B (zh) * 2019-11-13 2021-02-02 武汉华星光电半导体显示技术有限公司 显示面板、其制造方法及制造用的掩模版
TWD223988S (zh) * 2022-03-03 2023-03-01 家登精密工業股份有限公司 氣匣
JP2025518008A (ja) * 2022-05-27 2025-06-12 インテグリス・インコーポレーテッド フィルタモジュール

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