CN1232288A - Probe end cleaning sheet - Google Patents

Abstract

Remove foreign matter without deforming the probe tip and preventing new foreign matter from adhering to the probe tip. A sheet for surface-treating the tip of a probe to remove foreign matter stuck to the tip of a probe 211, comprising a surface-treated thin film 110 having fine abrasive sand attached to the surface. The lower layer of the thin film 110 is provided with an elastic sheet 120, and the elastic sheet 120 has elasticity. The lower layer of the elastic sheet 120 is provided with a board 130 . In this thin film 110, when the tip of the probe 211 is pressed with a certain load, the material constituting the surface-treated thin film 110 forms a concave portion, but is not torn by the tip of the probe 211. When the tip of the probe 211 applies pressure to the surface-treated thin film 110 with a specific load, the material constituting the elastic sheet 120 produces a concave shape corresponding to the shape of the tip of the probe 211 at its pressed portion.

Description

Sheet for surface treatment of probe tip

The present invention relates to a sheet material for surface treatment of the tip of a probe to remove foreign matter adhering to the tip of the probe.

Probes of a probe mechanism for testing various electrical characteristics of a semiconductor wafer composed of semiconductor wafers are tightly (overweight) pressed against the wafer of semiconductor wafers. As a result, the aluminum powder on the flakes is scraped off, making it stick to the tip of the probe as a foreign substance. Such foreign matter is particularly prone to sticking to the probe tip when the plate is composed of an alloy of aluminum and copper. Unless this foreign matter is removed from the probe tip, poor working conditions will develop between the probe and the wafer, making electrical contact poor and accurate characterization results impossible. If the probe is left for a long time, the contact resistance tends to increase.

So far, in order to solve the above-mentioned problems, the method adopted is to perform surface treatment on the tip of the probe after a certain number of tests to remove foreign substances from the tip of the probe.

For surface treatment, a method of surface treatment of a ceramic plate is used, and a method of making a surface-treated element hit the tip of a probe is known.

In the former method, that is, the method using a ceramic plate, the shape of the ceramic plate used is the same as that of the semiconductor wafer. While the test is being performed, the probe tip is pressed too heavily against the ceramic plate, thereby removing aluminum powder or other foreign matter from the probe tip.

In the latter method, ie, using the element for surface treatment of the probe tip, the surface treatment is carried out by clicking on the probe tip by means of the element for surface treatment of the probe tip.

However, in the former method, that is, the method of surface treatment using a ceramic plate has the following problems:

Scratches on the probe tip after multiple surface treatments. Normally, the probe tip is spherical so that it contacts the plate smoothly, however, this probe tip is ground by a ceramic plate, and finally, the probe tip is formed flat. Probes with flat ends, the resistance of the connection changes, or the blade is damaged. Probes with flat ends cannot be repaired by the user himself, or by the manufacturer of the semiconductor device, but only by the manufacturer of the probe mechanism. Therefore, the user must discard the probe with the flat end, or ask the manufacturer of the probe mechanism to repair the probe.

In the latter method, i.e., the method of using a surface-treated element on the probe tip, although the surface-treated element can be surface-treated while maintaining the shape of the probe tip, i.e., the probe tip has a spherical shape , Surface treatment of the probe tip The base material of the component, such as silicone rubber or urethane rubber, may bond to the probe tip. In other words, by surface treatment, the foreign matter stuck from the sheet can be removed, but new foreign matter sticks to the probe tip again. In addition, on the inside of the element where the probe tip is surface-treated, foreign substances removed from the probe tip, such as aluminum powder, are left behind, so that the ability to remove foreign substances is reduced, and therefore, the surface treatment operation cannot be done at the same position every time. conduct. Therefore, it is necessary to change the position of the surface-treating element on the probe tip each time the surface-treating operation is performed.

The present invention is based on the background of the above-mentioned prior art. The purpose of the present invention is to provide a sheet material for surface treatment of the probe tip, which can remove foreign matter while keeping the probe tip from deforming, and does not allow new foreign matter. The substance sticks to the probe tip.

The present invention provides a sheet material for surface treatment on the tip of a probe to remove foreign matter adhering to the tip of the probe. The sheet material for surface treatment includes a thin film for surface treatment. The surface of the thin film is Attached with fine abrasive sand, or having a metal film made of a metal material having a hardness substantially equal to or greater than that of the material constituting the probe, the metal film having a rough surface, the lower layer of the thin film , or the lower layer of the metal film is provided with an elastic sheet, the elastic sheet has elasticity, and a plate is arranged on the lower layer of the elastic sheet.

When the probe tip is pressed with a specific load, the material constituting the surface-treated thin film, or the metal thin film material forms a concave part, but will not be torn by the probe tip. When pressure is applied to the surface-treated thin film or metal film, the material constituting the elastic sheet produces a concave shape corresponding to the shape of the tip of the probe at its pressed portion.

Example

Fig. 1 is a diagrammatic view showing surface treatment of a probe tip with a surface treatment sheet according to an embodiment of the present invention. Fig. 2 is a schematic diagram of a sheet material for surface treatment of a probe end according to an embodiment of the present invention, wherein (A) is an enlarged side sectional view; (B) is a schematic plan view. Fig. 3 is a schematic diagram of an apparatus configuration showing surface treatment of a probe tip with a surface treatment sheet in an embodiment of the present invention. Fig. 4 is a schematic diagram of a sheet for surface-treating a probe tip according to another embodiment of the present invention, wherein (A) is an enlarged side sectional view; (B) is a schematic plan view. Fig. 5 is a schematic diagram of an apparatus configuration showing surface treatment of a probe tip with a surface treatment sheet in an embodiment of the present invention. Fig. 6 is a schematic view showing a probe tip surface-treated with a surface-treated sheet in an example of the present invention. Meanwhile, in the drawings, the proportions of the dimensions of components are determined for the convenience of drawing, which are completely different from the proportions of actual dimensions.

As shown in FIG. 1 , in the embodiment of the present invention, the surface-treated sheet 100 for the probe end is used to remove foreign matter stuck to the probe 211 end. The sheet 100 includes a surface-treated thin film 110 having fine abrasive grit 111 attached to the surface of the thin film 110 . The elastic sheet 120 is provided under the surface-treated thin film 110 and has elasticity. The board 130 is disposed on the lower layer of the elastic sheet 120 .

As shown in FIG. 2, on the surface-treated thin film 110, fine abrasive sand 111 attached to the surface of the thin film 112 by means of an adhesive or the like is provided.

Alumina sand, silicon carbide sand, corundum or the like can be used as the fine abrasive sand 111, and the material and size of the abrasive depends on the material and size of the probe 211.

The important point of the surface treated thin film 110 is that the material should be sufficiently rigid so that when the probe 211 is pressed against the thin film 110 with a specified load, the probe tip cannot penetrate the surface treated thin film 110 . This is closely related to the characteristics of the elastic sheet 120 described below. If the end of the probe 211 penetrates the thin film 110 for surface treatment, the end of the probe 211 reaches the elastic sheet arranged on the lower layer of the thin film 110 for surface treatment. The material 120, therefore, in the case of the conventional sheet member for surface-treating the tip of the probe, new foreign matter will stick to the tip of the probe 211.

The surface-treated thin film 110 preferably has a thickness dimension of 100 micrometers. or smaller.

On the other hand, the elastic sheet 120 is made of silicone rubber or urethane rubber having a uniform thickness dimension. The rationale for using the elastic sheet 120 with a uniform thickness will be described below. If the thickness of the elastic sheet 120 is not uniform, when the probe 211 is surface treated, the contact between the end of the probe 211 and the surface treated sheet 100 is not normal. It will be applied to the area that first comes into contact with the probe 211. Therefore, the thickness dimension of the elastic sheet 120 is preferably 1 mm or less.

As mentioned above, the hardness required by the elastic sheet 120 is closely related to the characteristics of the surface-treated thin film 110. Preferably, this hardness is the thickness of the thin film 110 under the load of several grams or tens of grams for each probe 211. Depression may occur.

That is, the material for making the elastic sheet 120 can have such a hardness that when the end of the probe 211 is pressed against the surface-treated thin film with a specific load, the elastic sheet 120 can be used as the end of the probe 211 to apply pressure. part. For example, silicone rubber or urethane rubber may be used as the elastic sheet 120 .

Furthermore, when silicon rubber or urethane rubber is used to form the elastic sheet 120, there is an advantage in that it is not necessary to bond the surface-treated thin film 110 with an adhesive or the like. That is, only the surface-treated thin film 110 is placed closely on the elastic sheet 120 made of silicone rubber or polyurethane rubber, and the surface-treated thin film 110 is attracted and fixed on the elastic sheet 120. The way is very easy. If the surface-treated thin film 110 is bonded to the elastic sheet 120 using an adhesive or the like, if the adhesive is applied unevenly, although the elastic sheet 120 has a uniform thickness dimension, due to the uneven application of the adhesive, Fluctuations in the thickness of the surface-treated thin film 110 impair the normal surface treatment, but since no adhesive is used, such defects do not occur.

The specific load for applying to each probe 211 is several grams or tens of grams. When the surface-treated thin film 110 is made of silicon carbide, the elastic sheet 120 is made of silicon rubber, and the probe 211 is tungsten, its specific The load is preferably 3 to 10 grams.

In another aspect, the plate 130 may be made of a metal plate, a ceramic plate, or a silicon wafer. The plate 130 needs to be sufficiently rigid so as to avoid deformation of the plate 130 due to the deformation of the elastic sheet 120 , that is, when pressure is applied to the end of the probe 211 .

Therefore, the surface-treated sheet 100 for the probe tip is composed of a laminated surface-treated thin film 110, an elastic sheet 120, and a plate 130 in order from top to bottom, the sheets having the same size and shape. , making it a semiconductor wafer, on the surface of the sheet 100, use a probe to measure the semiconductor wafer. Therefore, the thickness dimension of the sheet 100 for surface-treating the probe tip is set to be 0.8 to 2.0 mm.

Here, when the surface-treated sheet 100 is the same size and shape as a semiconductor wafer formed of a semiconductor wafer to be measured, the following advantageous effects can be produced.

First, a semiconductor wafer formed from a thin semiconductor wafer is set on the probing device 200, with a plurality of semiconductor wafers held in a storage box, and each semiconductor wafer is taken out from the storage box, and its electrical characteristics are measured, and the surface The processed sheets 100 are mixed with semiconductor wafers in a specific ratio, for example, one sheet 100 for surface treatment is placed for every 20 semiconductor wafers, and the probe 211 can automatically perform surface treatment. However, in this case, when the surface-treated sheet 100 is taken out, unlike ordinary measurement, the probe 211 needs to be reciprocated several times up and down, but it may be necessary to continuously take out the surface-treated sheet 100, Or only in the case of probing the surface-treated sheet 100 by the same apparatus, the probe 211 is reciprocated up and down.

Thus, the surface treatment of the probe 211 using the surface-treated sheet 100 will be described below.

The surface treatment of the probe 211 used in the detection device 200 using the surface-treated sheet 100 will first be described below.

As shown in FIG. 3 , the probing device 200 is roughly divided into a probe mechanism 210, a base 220, the probe mechanism 210 is fixed on the base 220, and a suction table 230 is used to fix the semiconductor wafer to be measured. formed semiconductor wafers.

The probe mechanism 210 includes a plurality of probes 211 disposed corresponding to the disk contour of the semiconductor wafer, the probes 211 are mounted on the plate mechanism 212 , and the probe support 213 is mounted on the plate mechanism 212 to support the probes 211 . In this probe mechanism 210, the probe 211 is installed vertically on the plate mechanism 212, and the end of the probe 211 touches the sheet vertically. Therefore, this mechanism is called a vertical operation type probe mechanism. At the same time, in the probe 211, a substantially transverse U-shaped bending portion 211A is provided, so that when the end of the probe is pressed against the sheet, the deformation of the U-shaped bending portion keeps the sheet and the probe 211 between the sheet and the probe 211. specific contact pressure. The end of the probe 211 is provided in a spherical shape, as shown in FIG. 6(A). The probe 211 is made of tungsten.

The board mechanism 212 of the probe mechanism 210 is provided with a circuit structure 212A connected to the probe 211, and the probe 211 is connected to test equipment, and the test equipment connected through the circuit structure 212A is not shown in the drawings.

When the probes 211 exert pressure on the sheet, the probe support 213 is required to avoid contact with adjacent probes 211 , and each probe 211 is inserted into an independent through hole (not shown).

The suction table 230 provided below the probe mechanism 211 attracts and holds not only a semiconductor wafer formed of a semiconductor wafer to be measured but also a sheet 100 subjected to surface treatment.

With the probing apparatus 200 having the above-described configuration, the end portion of the probe 211 is surface-treated with the surface-treated sheet 100 in the procedure described below. First, the surface-treated sheet 100 is positioned at a specific position, instead of the semiconductor wafer, that is, positioned on the suction table 210 below the probe mechanism 210 . For this arrangement, in addition to mixing the surface-treated sheet 100 with the semiconductor wafer at a certain ratio as described above, the surface-treated sheet 100 can be placed on the surface of the semiconductor wafer formed from the semiconductor wafer to be tested. Next, when the testing of a certain number of semiconductor wafers is completed, the arrangement of the surface-treated sheet 100 can be set.

When the surface-treated sheet 100 is placed on the suction table 230 , one or both of the probe mechanism 210 and the suction table 230 on which the surface-treated sheet 100 is placed reciprocates up and down. The tip of the probe 211 repeatedly applies pressure to the surface of the surface-treated sheet 100 .

At this time, the load pushing the probe 211 to the surface-treated sheet 100 is selected as an appropriate value according to the materials of the surface-treated thin film 110, the elastic sheet 120, and the probe 211.

In this way, as shown in FIG. 1, when the tip of the probe 211 applies pressure to the surface-treated sheet 100, since the concave portion is repeatedly formed in the elastic sheet 120, the probe 211 is pressed against the surface-treated thin film. 120 is in a wrapped state without tearing the thin film 110 for surface treatment.

After the fine abrasive sand 111 is attached on the surface-treated thin film 110, a rough surface is formed, whereby the rough surface removes foreign matter stuck to the end of the probe 211. Moreover, when the elastic sheet 120 presses the probe 211, a concave portion corresponding to the shape of the end of the probe 211 is formed on the elastic sheet 120, therefore, if the fine abrasive sand 111 is attached to the surface of the surface-treated thin film 110 , unlike a common ceramic plate, no scratches are generated at the tip of the probe 211.

When the surface treatment of the probe 211 is completed, the surface-treated sheet 100 is separated from the suction table 230, and then in a subsequent operation, a new semiconductor wafer to be tested is placed, and a new semiconductor wafer formed from the semiconductor wafer is placed. The electrical characteristics of the chip are tested.

In this surface-treated sheet 100, the surface-treated thin film 110 is formed by attaching the fine abrasive sand 111 to the thin film 112, but, as shown in FIG. 4, the thin film can be replaced by a surface-treated metal film 140. 110. In the surface-treated metal film 140, the surface of the metal film 141, such as tungsten, is formed with a rough surface 142 by a suitable method, such as sandblasting or etching. This treatment can be effectively performed on surfaces with rhodium plating or the like.

The formation structure of the metal thin film 140 surface-treated on the probe end is the same as described above, that is, the elastic sheet 120 is stacked on the lower layer of the surface-treated metal thin film 140, and the plate material is stacked on the lower layer of the elastic sheet 120. 130, moreover, the elastic sheet 120 and the plate 130 have the same characteristics as those described above.

This surface-treated thin film 140 is similar to the surface-treated thin film 110 described above and must be rigid enough so that when the probe 211 applies pressure to the metal film 140, the tip of the probe 211 does not penetrate the surface-treated thin film 140. Metal film 140 . If, the end portion of probe 211 penetrates the metal film 140 that carries out surface treatment, the end portion of probe 211 reaches the elastic sheet material 120 that is arranged on the lower floor of the metal film 140 that carries out surface treatment, therefore, as adopting conventional to probe end portion In the case of a component subjected to surface treatment, new foreign matter will be stuck to the tip of the probe 211 .

When the material of the metal film 140 carrying out the surface treatment is tungsten, the thickness dimension of the metal film 140 carrying out the surface treatment is preferably 5～50 microns, or, if the material of the metal film 140 carrying out the surface treatment is palladium, the thickness is the most Preferably it is 20-100 microns.

For example, when the surface-treated sheet material 100 is used to process the probe tip, when the contact resistance of the probe 211 tip is 10 ohms, the probe 211 moves up and down by pressing the tip of the probe 211. The tip of the probe 211 was processed about 10 times, and the contact resistance was changed to 0.5 ohms or less. According to this test result, there was no problem in the test of the semiconductor wafer formed from the semiconductor wafer.

The manner in which the probe mechanism 210 is operated vertically has been described above, in which the probe 211 is in vertical contact with the sheet, but, as shown in FIG. , and contact the sheet obliquely. In addition, as shown in FIG. 6(B) and (C), in the cantilever beam type probe mechanism, the end of the probe 211 may be a flat end surface.

The surface-treated sheet material of the probe end of the present invention can remove foreign substances bonded to the probe end, and the surface-treated sheet includes a surface-treated thin film, where the surface of the thin film is in contact with the attached The fine abrasive sand, under this thin film, is provided with an elastic sheet, which has elasticity. A lower layer of the elastic sheet is provided with a plate in which the material of the thin film for surface treatment can form a concave portion when the probe tip is pressed with a specific load, but is not torn by the probe tip. When the probe tip applies pressure to the thin film with a specific load, the material constituting the elastic sheet can create a concave portion corresponding to the probe tip.

Therefore, when the probe applies pressure to the surface-treated sheet, the probe tip is wrapped in the surface-treated thin film, and the foreign matter at the probe tip is removed by the fine abrasive sand attached to the surface-treated thin film. . Since the surface-treated thin film sheet and the elastic sheet have recessed portions corresponding to the shape of the probe tip, no scratches are generated on the probe tip, unlike the case of conventional ceramic plates. In addition, since the probe tip does not penetrate the surface-treated thin film, the material constituting the elastic sheet does not adhere to the probe tip to form new foreign substances. In addition, the removal of foreign substances does not deform the probe tip, thereby obtaining a surface-treated sheet that avoids generation of new foreign substances at the probe tip.

Another kind of sheet material of the present invention is carried out surface treatment to probe end, and can remove the extraneous substance that sticks on probe end, and it comprises the metal thin film that is used for surface treatment, and the metal material that this is used to manufacture metal thin film The hardness is substantially equal to or greater than that of the material constituting the probe. The metal film has a rough surface, and an elastic sheet is provided on the lower layer of the surface-treated metal film, and the elastic sheet has elasticity. A plate is provided on the lower layer of the elastic sheet. In this surface-treated metal film, the material for the surface-treated metal film can form a concave portion when the probe tip is pressed with a specific load, but is not torn by the probe tip. When the probe tip applies pressure to the surface-treated metal thin film with a specific load, the material constituting the elastic sheet produces a concave portion corresponding to the shape of the probe tip.

Also, in this surface-treated sheet for the probe tip, as in the above-mentioned surface-treated sheet, when the probe applies pressure to the surface-treated sheet, the probe tip is wrapped by the surface-treated thin film , The foreign substances are removed by the fine abrasive sand attached to the thin film for surface treatment. Also, since the thin film sheet and the elastic sheet subjected to surface treatment have recessed portions corresponding to the shape of the probe tip, scratches are not generated on the probe tip, unlike the case of conventional ceramic plates. In addition, since the probe tip does not penetrate the surface-treated thin film, the material constituting the elastic sheet does not adhere to the probe tip to form new foreign substances. In addition, the removal of foreign substances does not deform the probe tip, thereby obtaining a surface-treated sheet that avoids generation of new foreign substances at the probe tip.

The specific load range is several grams to tens of grams, and the appropriate load value can be selected according to the surface-treated thin film, surface-treated metal film, elastic sheet, and probe material.

Fig. 1 is a diagrammatic view showing surface treatment of a probe tip with a surface treatment sheet according to an embodiment of the present invention.

Fig. 2 is a schematic diagram of a sheet material for surface treatment of a probe end according to an embodiment of the present invention, wherein (A) is an enlarged side sectional view; (B) is a schematic plan view.

Fig. 3 is a schematic diagram of an apparatus configuration showing surface treatment of a probe tip with a surface treatment sheet in an embodiment of the present invention.

Fig. 4 is a schematic diagram of a sheet for surface-treating a probe tip according to another embodiment of the present invention, wherein (A) is an enlarged side sectional view; (B) is a schematic plan view.

Fig. 5 is a schematic diagram of an apparatus configuration showing surface treatment of a probe tip with a surface treatment sheet in an embodiment of the present invention.

Fig. 6 is a schematic view showing a probe tip surface-treated with a surface-treated sheet in an example of the present invention.

Reference code

100 sheets for surface treatment of probe tips

110 Thin film with surface treatment

111 fine abrasive sand

120 elastic sheet

130 sheets

211 probe

Claims (3)

1. A sheet for surface-treating the tip of a probe to remove foreign matter adhering to the tip of the probe, the surface-treated sheet includes a surface-treated thin film in which a Fine abrasive sand, under this thin film is provided with elastic sheet, said elastic sheet has elasticity, under this elastic sheet is provided with plate, wherein, when pressure is applied by the tip of the probe with a specific load, the composition is carried out The material of the surface-treated thin film forms the concave portion, but will not be torn by the probe tip, and when the probe tip applies pressure to the surface-treated thin film with a specific load, the material constituting the elastic sheet is subjected to pressure. The pressed portion produces a concave shape corresponding to the shape of the probe tip. 2. A sheet for surface-treating the tip of a probe to remove foreign matter adhering to the tip of the probe, comprising a surface-treated metal film whose hardness is substantially equal to or greater than Constitute the hardness of the probe material, the metal film has a rough surface, the lower layer of the metal film is provided with an elastic sheet, the elastic sheet has elasticity, and the lower layer of this elastic sheet is provided with a plate, wherein, when the probe end When pressure is applied to the surface-treated metal film by a specific load, the material constituting the surface-treated metal film forms a concave part, but it will not be torn by the probe tip. When the probe tip applies pressure to the surface-treated metal film with a specific load , the material constituting the elastic sheet produces a concave shape corresponding to the shape of the probe tip at its pressed portion. 3. The surface-treated sheet material for the tip of a probe according to claim 1 or 2, wherein the specific load range is several grams to several tens of grams.

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