TWM651578U - Quick-release structure - Google Patents

Abstract

The quick release structure including a first component, and a first hook is provided. The first component has a first positioning seat and a clamping piece. The first positioning seat is disposed on a motherboard. The clamping piece is pivotally connected to the first positioning seat. The clamping piece is adapted to rotate relative to the first positioning seat to switch between a combined position and a released position. The first hook is disposed at a first groove of a heat dissipation element. When the heat dissipation element is installed on the motherboard, the first hook is engaged with the clamping piece and located at the combined position. When the clamping member receives an external force and rotates to the release position, the clamping member is separated from the first hook, and the heat dissipation element is separated from the motherboard.

Description

Quick release structure

This case relates to a quick-release structure, and in particular, to a quick-release structure that combines a heat dissipation component and a motherboard.

The components of an existing laptop or desktop computer include a casing, a motherboard, a central processing unit, a graphics chip, a flash memory, a storage device, and a variety of other electronic components. Each electronic component generates heat during operation. When the internal temperature of the casing is too high, the operating performance of the notebook or desktop computer will be affected. In order to improve the heat dissipation efficiency, the method currently used is to install cooling fins on the electronic components.

Taking the existing solid state drive or flash memory as an example, the heat dissipation fin is flatly contacted with the surface of the solid state drive or flash memory, and external screws are passed through the heat dissipation fin and locked to the screw hole of the motherboard.

However, when assembling and disassembling existing heat dissipation fins, users need to use screwdrivers or tools of specific specifications to remove or lock the screws, which results in complicated assembly or disassembly steps and is not conducive to the disassembly and assembly of the heat dissipation fins.

This case provides a quick-release structure suitable for connecting the heat dissipation component and the motherboard. Compared with the existing screw locking method, no external tools are required for disassembly or installation.

The quick-release structure of this case is used to fix a heat dissipation element to a motherboard. One end of the heat dissipation element has a first groove. The quick release structure includes a first component and a first hook. The first component has a first positioning base and a clamping member. The first positioning base is disposed on the motherboard. The clamping member is pivotally connected to the first positioning base. The clamping member is adapted to rotate relative to the first positioning base to rotate on a Switch between bound position or a released position. The first hook is arranged in the first groove of the heat dissipation component. When the heat dissipation component is installed on the motherboard, the first hook is engaged with the clamping member and is in the combined position. When the clamping member receives an external force and rotates to the release position, the clamping member is separated from the first hook, so that The cooling element is detached from the motherboard.

In the embodiment of the present case, a second component and a second hook are further included. The second component has a second positioning base, a positioning portion and a column. The second positioning base is arranged on the motherboard and is away from the second positioning base. A positioning seat, the positioning part is formed on the second positioning seat, the cylinder is located in the second positioning seat and is locked to the positioning part, and the second hook is arranged on a second recess of the heat dissipation element relative to the first groove. slot, and the second hook is suitable for engaging with the second positioning base.

To sum up, the quick-release structure of this case is used to fix a heat dissipation component to a motherboard, so that the heat dissipation component can contact an electronic component for heat dissipation. The first component and the second component are installed on the motherboard and are located at opposite sides of the electronic component. The first hook and the second hook are connected to the opposite ends of the heat dissipation component.

During the installation process, first engage the second hook in the heat dissipation element with the two second positioning seats, and then press down the other end of the heat dissipation element to make the first hook engage with the clamping parts and the heat dissipation element contacts the electronic component to complete the installation. During the disassembly process, the clamping member is pressed down to release the engagement state of the first hook, and then the heat dissipation element is manually grasped to pull out the second hook from the second positioning base to achieve the purpose of disassembling the heat dissipation element.

Therefore, the quick-release structure of this case eliminates the need for additional tools to disassemble and assemble the cooling components, thereby improving the efficiency of assembly and maintenance.

100, 100A, 100B: quick release structure

110, 110a: first component

111, 111a: first positioning seat

1111:Elastic arm

112, 112a: Clamping piece

1121, 1121a: Bump

113a: mandrel

114a: Torsion spring

120, 120a, 120b: Second component

121, 121a, 121b: second positioning seat

1211: hook part

122: Positioning Department

123:Cylinder

130, 130a, 130b: first hook

131, 131a, 131b: first clamping part

132, 132b: first fixed part

140: The second hook

141: The second clamping part

142:Second fixed part

200: Cooling element

210: first groove

220: Second groove

300: Motherboard

310:Slot

400: Electronic components

G: Groove

FIG. 1A is a schematic three-dimensional view of a quick-release structure combined with a heat dissipation component and a motherboard according to an embodiment of the present invention.

FIG. 1B is an exploded perspective view of the quick-release structure, heat dissipation components and motherboard of FIG. 1A .

FIG. 1C is an exploded perspective view of the quick-release structure, heat dissipation component and motherboard of FIG. 1A from another direction.

FIG. 2A is a schematic side plan view of the quick release structure of FIG. 1A connected to the motherboard.

FIG. 2B and FIG. 2C are schematic diagrams of the heat dissipation element in FIG. 2A being disassembled from the motherboard.

Figure 2D is a schematic side plan view of the quick release structure connected to the motherboard according to another embodiment of the present invention.

3A is a schematic side plan view of a quick-release structure connected to a motherboard according to another embodiment of the present invention.

Figure 3B is a schematic diagram of the unlocking action of the quick release structure of Figure 3A.

Figure 4 is a schematic plan view of the quick-release structure and heat dissipation element of another embodiment of the present invention.

Referring to FIGS. 1A to 1C , the present invention provides a quick-release structure 100 for fixing a heat dissipation component 200 to a motherboard 300 and contacting an electronic component 400. The surface of the heat dissipation component 200 contacts the electronic component 400 to achieve the purpose of heat conduction.

In one embodiment, one end of the heat dissipation element 200 has a first groove 210 . The quick release structure 100 of this case includes a first component 110 and a first hook 130 .

The first component 110 has a first positioning base 111 , a clamping member 112 and a spindle. The first positioning base 111 is disposed on the motherboard 300 and is locked by screws or buckles, for example. The clamping member 112 is pivotally connected to the first positioning base 111. When the clamping member 112 is pressed by an external force, it will pivot relative to the first positioning base 111. The clamping member 112 is adapted to rotate relative to the first positioning base 111 to achieve a combination. position or a release position.

In another embodiment, both ends of the heat dissipation element 200 may also have a first groove 210 and a second groove 220 respectively. The quick release structure 100 of this case includes a first component 110, a second component 120, a first hook 130 and a second hook 140.

The second component 120 has a second positioning base 121, a positioning portion 122 and a column 123. The second positioning base 121 is disposed on the motherboard 300 and is away from the first positioning base 111 . A space is formed between the second positioning base 121 and the first positioning base 111 to accommodate the heat dissipation component 200 . The positioning part 122 is formed on the second positioning seat 121 . The column 123 is located in the second positioning seat 121 and is locked to the positioning part 122 and used to limit the electronic component 400 .

Specifically, the electronic component 400 is plugged into a slot 310 of the motherboard 300 There is a groove G at one end of the electronic component 400 away from the slot 310. The groove G receives the column 123 to limit the electronic component 400, thereby preventing the electronic component 400 from being displaced or falling out of the slot 310 due to external force.

The first hook 130 is disposed in the first groove 210 of the heat dissipation element 200 . The second hook 140 is disposed in the second groove 220 of the heat dissipation element 200 and is adapted to engage with the second positioning base 121 . In addition, the first hook 130 and the second hook 140 are fixed to the heat dissipation element 200 by screw locking, for example.

Referring to FIG. 2A , when the heat dissipation element 200 is installed on the motherboard 300 , the second hook 140 is first engaged with the second positioning seat 121 , and then the other end of the heat dissipation element 200 is pressed down, so that the first hook 130 is engaged with the second positioning base 121 . When the clamping member 112 is in the combined position, the heat dissipation component 200 covers and contacts the electronic component 400 to complete the installation.

Referring to FIGS. 2A to 2C , when the clamping member 112 receives an external force and rotates to the release position, the clamping member 112 is separated from the first hook 130 , so that the heat dissipation component 200 is separated from the motherboard 300 . Specifically, when the heat dissipation component 200 is disassembled from the motherboard 300, the clamping member 112 is first pressed to unlock the first hook 130, and the clamping member 112 simultaneously pushes the first hook 130 to lift the heat dissipation component 200, and then manually Grasp the heat dissipation element 200 to drive the second hook 140 to be pulled out from the second positioning seat 121 to complete the disassembly.

Referring to FIG. 2A , the first positioning base 111 has an elastic arm 1111 that extends diagonally from the first positioning base 111 and abuts against the first hook 130 . In the initial state, the elastic arm 1111 pushes a protrusion 1121 of the clamping member 112 into a first engaging portion 131 of the first hook 130 so that the clamping member 112 and the first hook 130 engage with each other.

Referring to FIG. 2B , in the compressed state, the clamping member 112 is pressed by an external force. Rotate the first positioning base 111 to bend and remove the elastic arm 1111. The elastic arm 1111 will accumulate elastic force after being bent and removed. At the same time, the bump 1121 of the clamping member 112 is separated from the first engaging portion 131 of the first hook 130, so as to The clamping state of the clamping member 112 and the first hook 130 is released.

Referring to FIG. 1B and FIG. 2A , the first hook 130 has a first fixing part 132 that extends vertically from the first engaging part 131 and the first fixing part 132 is a stepped structure. The first fixing part 132 is fixed on the heat dissipation part. A first groove 210 of element 200 . The first fixing part 132 is fixed to the first groove 210 of the heat dissipation element 200 by screw locking, for example.

Referring to FIG. 1B and FIG. 2A , the second hook 140 has a plurality of second engaging parts 141 and a second fixing part 142 . The second positioning seat 121 has a plurality of hook portions 1211. The plurality of hook portions 1211 are respectively penetrated through the plurality of second clamping portions 141 to position the heat dissipation element 200 . The second fixing portion 142 extends vertically from the plurality of second clamping portions 141 and is fixed in a second groove 220 of the heat dissipation element 200 . The second fixing part 142 is fixed to the second groove 220 of the heat dissipation element 200 by screw locking, for example.

In short, when the quick release structure 100 of this case is installed, the second hook 140 located on the heat dissipation element 200 is engaged with the second positioning seat 121, and then the other end of the heat dissipation element 200 is pressed down to make the first lock The hook 130 pushes the clamping member 112 to rotate relative to the first positioning base 111, and then the first hook 130 and the clamping member 112 are locked with each other.

When the quick release structure 100 is disassembled, the clamping member 112 is pressed to rotate relative to the first positioning base 111, so that the clamping member 112 leaves the first hook 130 and simultaneously lifts the heat dissipation element 200. Finally, the second hook 140 is removed from the second hook 130. The positioning seat 121 is pulled out.

Referring to FIG. 2D, in another embodiment of the present case, the phase of the heat dissipation element 200 is The two ends have first grooves 210 respectively. The quick-release structure 100 includes two first components 110 and a first hook 130 . The two first components 110 are arranged on the motherboard 300 and are spaced apart from each other. The first hooks 130 are respectively arranged in the two first grooves 210 of the heat dissipation element 200, and the two first hooks 130 are respectively aligned with the two first components 110. The first grooves 210 respectively correspond to the two first components 110 and the two first hooks 130. The detailed structures of the first components 110 and the first hooks 130 are as described above and will not be repeated here.

When the heat dissipation element 200 is installed on the motherboard 300, the two first hooks 130 are respectively engaged with the corresponding clamping members 112 and are located in the combined position. When each clamping member 112 receives an external force and rotates to the release position, each clamp The holding member 112 is separated from the corresponding first hook 130, so that the heat dissipation element 200 is separated from the motherboard 300. Therefore, after the quick-release structure of this embodiment is applied to the heat dissipation component, the user only needs to combine the two first hooks 130 with the two first positioning seats 111 respectively, so that the two first hooks 130 are pressed down and locked at the same time. At the plurality of clamping members 112, the assembly is completed.

Referring to Figure 3A, the quick-release structure 100A of this embodiment is different from the quick-release structure 100 shown in Figure 1B. The difference is that the first component 110a has a spindle 113a and a torsion spring 114a. The spindle 113a penetrates the first positioning seat. 111a and the clamping member 112a, the torsion spring 114a is sleeved on the mandrel 113a and connected to the first positioning seat 111a and the clamping member 112a respectively. In addition, the first positioning seat 111a does not use an elastic arm.

Referring to Figure 3A, in the initial state, the elastic force of the torsion spring 114a pushes a bump 1121a of the clamping member 112a into the first engaging portion 131a of the first hook 130a, so that the clamping member 112a and the first hook 130a interact with each other. Card access.

Referring to FIG. 3B, in the compressed state, the clamping member 112a is pressed by an external force and moves relative to each other. Rotate the first positioning base 111a to bend the torsion spring 114a. The torsion spring 114a will accumulate elastic force after bending. At the same time, the protrusion 1121a of the clamping member 112a is separated from the first engaging portion 131 of the first hook 130a, so as to The clamping state of the clamping member 112a and the first hook 130a is released.

Referring to Figure 4, the quick release structure 100B of this embodiment is different from the quick release structure 100 shown in Figure 2A. The difference is that the first hook 130b has a first fixing portion 132b, which extends vertically from the first engaging portion 131b and has a first fixing portion 132b. A fixing part 132b is a flat plate structure, and the first fixing part 132b is in surface contact with and fixed on the first groove 210 of the heat dissipation element 200.

In this embodiment, adopting a flat plate structure for the first fixing part 132b will help simplify the manufacturing process, that is, the first groove 210 of the heat dissipation element 200 can be directly hollowed out to form a long groove.

To sum up, the quick-release structure of this case is used to fix a heat dissipation component to a motherboard, so that the heat dissipation component can contact an electronic component for heat dissipation. The first component and the second component are installed on the motherboard and are located at opposite sides of the electronic component. The first hook and the second hook are connected to the opposite ends of the heat dissipation component.

During the installation process, first engage the second hook in the heat dissipation element with the two second positioning seats, and then press down the other end of the heat dissipation element to engage the first hook with the clamping member, so that the heat dissipation element contacts the electronics. components to complete the installation. During the disassembly process, the clamping member is pressed down to release the engagement state of the first hook, and then the heat dissipation element is manually grasped to pull out the second hook from the second positioning base to achieve the purpose of disassembling the heat dissipation element.

Therefore, the quick-release structure of this case eliminates the need for additional tools to disassemble and assemble the cooling components, thereby improving the efficiency of assembly and maintenance.

100:Quick release structure

110:First component

120:Second component

130: First hook

140: The second hook

200: Cooling element

300: Motherboard

310:Slot

400: Electronic components

Claims (10)

A quick release structure for fixing a heat dissipation element to a motherboard. One end of the heat dissipation element has a first groove. The quick release structure includes: a first component with a first positioning base and a clamping base. component, the first positioning base is disposed on the motherboard, the clamping member is pivotally connected to the first positioning base, and the clamping member is adapted to rotate relative to the first positioning base to be between a combination position or a release position. Switch; and a first hook, configured in the first groove of the heat dissipation element, wherein when the heat dissipation element is installed on the motherboard, the first hook engages the clamping member and is located on the combination position, when the clamping member receives an external force and rotates to the release position, the clamping member is separated from the first hook, so that the heat dissipation element is separated from the motherboard. The quick-release structure as claimed in claim 1, further comprising a second component and a second hook. The second component has a second positioning base, a positioning portion and a cylinder. The second positioning base is configured On the motherboard and away from the first positioning seat, the positioning part is formed on the second positioning seat, the column is located in the second positioning seat and is locked to the positioning part, and the second hook is configured In a second groove of the heat dissipation element relative to the first groove, the second hook is adapted to engage with the second positioning base. The quick release structure of claim 1, wherein the first positioning base has an elastic arm that extends obliquely from the first positioning base and abuts against the first hook. The quick-release structure of claim 3, wherein in the initial state, the elastic arm pushes a bump of the clamping member into a first hook of the first hook. part, in a pressurized state, the clamping member rotates relative to the first positioning seat to bend the elastic arm, and at the same time, the protrusion of the clamping member is separated from the first engaging portion of the first hook. The quick release structure of claim 1, wherein the first component has a spindle and a torsion spring, the spindle passes through the first positioning seat and the clamping member, and the torsion spring is sleeved on the spindle And connect the first positioning seat and the clamping member respectively. The quick release structure of claim 5, wherein in the initial state, the torsion spring pushes a bump of the clamping member to engage with the first hook, and in the compressed state, the clamping member is relative to the first hook. The first positioning seat rotates to bend the torsion spring, so that the protrusion of the clamping member is separated from the first hook. The quick release structure of claim 4, wherein the first hook has a first fixing part extending vertically from the first engaging part and the first fixing part has a stepped structure, and the first fixing part A first groove fixed on the heat dissipation element. The quick release structure of claim 4, wherein the first hook has a first fixing part extending vertically from the first engaging part and the first fixing part is a flat plate structure, and the first fixing part faces Contacting and fixed on a first groove of the heat dissipation element. The quick-release structure of claim 2, wherein the second hook has a plurality of second latching parts and a second fixing part, the second positioning base has a plurality of hook parts, and the hook parts are respectively inserted through The second fixing part extends perpendicularly from the second clamping parts to position the heat dissipation element and is fixed to a second groove of the heat dissipation element. The quick release structure of claim 1 further includes another first component and another first hook, the two first components are arranged on the motherboard and are spaced apart from each other, and the two first hooks are respectively arranged In the first groove and the other first groove of the heat dissipation element, the two first hooks are respectively aligned with the two first components.

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