TWM655301U - Quick-release structure - Google Patents

Abstract

The quick release structure including a first component, and a knob is provided. The first component has a first positioning seat and a plurality of buckles. A center of the first positioning seat is defined as a central axis, and the plurality of buckles are spaced around the central axis. A center of the knob has a limit shaft corresponding to the central axis. The knob is rotatably disposed at one end of a heat dissipation element along the limit shaft to switch between a combined position or a released position. When a heat dissipation element is installed on a motherboard, the knob is engaged with the buckles and located at the combined position.

Description

Quick disassembly structure

This novel invention is related to a quick-release structure, and in particular to a quick-release structure combining a heat dissipation element and a motherboard.

The components of existing laptops or desktop computers include a case, motherboard, central processing unit, graphics chip, flash memory, storage device and other electronic components. Various electronic components will generate heat during operation. When the internal temperature is too high, it will affect the computer's operating performance. In order to improve the heat dissipation efficiency and maintain the operating performance, the current method is to install heat sink fins on the electronic components. The waste heat generated by the electronic components is transferred to the heat sink fins through thermal conduction, and the heat sink fins then dissipate the waste heat into the air.

Taking an existing solid state drive or flash memory as an example, the heat sink fin plane contacts the surface of the solid state drive or flash memory, and is fastened to the screw hole of the motherboard through an external screw that passes through the heat sink fin.

However, when assembling and disassembling existing heat sink fins, users need to use a screwdriver or a tool of specific specifications to remove or lock the screws, which makes the assembly and disassembly steps complicated, which is not conducive to users' replacement or repair.

This case provides a quick-release structure suitable for connecting heat sink components and motherboards. Compared with the existing screw locking method, it does not require external tools for disassembly or installation.

The quick-release structure of the present invention is used to fix a heat sink component to a motherboard, and one end of the heat sink component has a first groove. The quick-release structure includes a first component and a knob. The first component has a first positioning seat and a plurality of snap fasteners. The first positioning seat is arranged on the motherboard, and the center of the first positioning seat is defined as a central axis, and a plurality of snap fasteners are spaced around the central axis. The knob has a limit axis at its center, and the limit axis corresponds to the central axis. The knob is rotatably arranged in the groove along the limit axis to switch between a coupling position or a release position. When the heat sink is installed on the motherboard, the knob is engaged with multiple latches and is located at the engagement position. When the knob receives an external force and rotates to the release position, the knob separates from the multiple latches, so that the heat sink is separated from the motherboard.

In the embodiment of the present case, a second component is further included. The second component has a second positioning seat, a positioning portion and a column. The second positioning seat is arranged on the motherboard and is far away from the first positioning seat. The positioning portion is formed on the second positioning seat. The column is passed through the second positioning seat and locked to the positioning portion.

In the embodiment of the present case, a hook is further included, which is arranged in a second groove of the heat dissipation element opposite to the first groove, and the hook is suitable for engaging with the second positioning seat.

Based on the above, the quick-release structure of this case is used to fix a heat sink to a motherboard so that the heat sink can contact an electronic component for heat dissipation. The first component and the second component are installed on the motherboard and located on the opposite sides of the electronic component, and the knob and the hook are respectively connected to the opposite ends of the heat sink.

During the installation process, the hook at one end of the heat sink is first engaged with the two second positioning seats, and then the other end of the heat sink is pressed down so that the knob pushes multiple fasteners to engage with multiple fasteners, and the knob is fixed in the first positioning seat. At this time, the heat sink contacts the electronic component.

During the disassembly process, rotate the knob to unlock the multiple fasteners. At this time, the heat sink can be driven by the knob to be removed from the first positioning seat. Then manually grab the heat sink element and pull the hook out from the second positioning seat to achieve the purpose of disassembling the heat sink element.

100: Quick-disassembly structure

110: First component

111: First positioning seat

112: Fasteners

113:Center axis

114: Elastic parts

115: Bolts

116: Torsion spring

120: Second component

121: Second positioning seat

1211: Hook

122: Positioning unit

123: Column

130: Knob

131: Fastening part

132: Rotating part

133: Limit axis

140: Hook

141: Snap-on part

142:Fixed part

200: Heat dissipation element

210: First groove

220: Second groove

300: Motherboard

310: Slot

400: Electronic components

G: Groove

AS: Accommodation space

IS:Inner space

OP: concave hole

OS: Outer wall

SG: Chute

Figure 1A is a three-dimensional schematic diagram of a quick-release structure combined with a heat sink and a motherboard in an embodiment of the present invention.

FIG. 1B is a schematic three-dimensional diagram of the quick-release structure, heat dissipation component, and motherboard components of FIG. 1A .

Figure 1C is a three-dimensional schematic diagram of the quick-release structure, heat dissipation component, and motherboard components in another direction of Figure 1A.

Figure 2A is a side plan view of the quick-release structure of Figure 1A connected to the motherboard.

Figures 2B to 2D are schematic diagrams of the heat sink component of Figure 2A being removed from the motherboard.

Figures 3A and 3B are rotational motion diagrams of the first component of the quick-release structure of Figure 2A.

Figure 4 is a three-dimensional schematic diagram of another embodiment of the quick-release structure combined with the heat dissipation element and the motherboard.

Referring to Figures 1A to 1C, the quick-release structure 100 of this case is used to fix a heat sink 200 on a motherboard 300 and contact an electronic component 400. The heat sink 200 surface contacts the electronic component 400 to achieve the purpose of heat conduction. One end of the heat sink has a first groove 210. The quick-release structure of this case includes a first component 110 and a knob 130.

The first component 110 has a first positioning seat 111 and a plurality of fasteners 112. The first positioning seat 111 is configured on the motherboard 300 by screw locking or fastening, for example. The center of the first positioning seat 111 is defined as a central axis 113. The plurality of fasteners 112 are spaced around the central axis 113.

In one embodiment, a plurality of latches 112 are formed vertically on the first positioning seat 111 and the plurality of latches 112 surround the edge of the first positioning seat 111 to form a receiving space AS.

Referring to FIG. 1B or FIG. 2A, the center of the knob 130 has a limit axis 133, the limit axis 133 corresponds to the central axis 113, and the knob 130 is rotatably disposed along the limit axis 133 in the first groove 210 of the heat sink 200 to switch between a combined position or a released position.

When the heat sink 200 is mounted on the motherboard 300, the knob 130 is engaged with the latches 112 and is located at the engagement position. When the knob 130 receives an external force and rotates to the release position, the knob 130 separates from the latches 112, and the heat sink 200 is separated from the motherboard 300.

Referring to FIG. 1A to FIG. 1C , in one embodiment of the present invention, the other end of the heat dissipation element 200 has a second groove 220 , and the quick-release structure of the present invention includes a first component 110 , a second component 120 , and a knob 130 .

The second component 120 has a second positioning seat 121, a positioning portion 122 and a column 123. The second positioning seat 121 is disposed on the motherboard 300 and is far away from the first positioning seat 111. The positioning portion 122 is formed on the second positioning seat 121. The column 123 is locked to the second positioning seat 121 through the positioning portion 122 to limit the electronic component 400.

In detail, the electronic component 400 is inserted into a slot 310 of the motherboard 300 and the end of the electronic component 400 away from the slot 310 has a groove G. The groove G accommodates the column 123 to limit the electronic component 400, thereby preventing the electronic component 400 from being offset or falling off the slot 310 due to external force.

Referring to FIG. 1B or FIG. 2A, a hook 140 is disposed in the second groove 220 of the heat sink 200, and the hook 140 is suitable for engaging with the second positioning seat 121. In this embodiment, the hook 140 is fixed to the heat sink 200 by screw locking.

Referring to FIG. 1A, FIG. 1B and FIG. 2A, when the heat sink 200 is installed on the motherboard 300, the hook 140 is first engaged with the second positioning seat 121, and then the other end of the heat sink 200 is pressed down, so that the knob 130 squeezes the multiple fasteners 112 and produces elastic deformation, and the knob 130 will pass through the multiple fasteners 112 and enter the accommodating space AS. After the knob 130 enters the second positioning seat 121, the multiple fasteners 112 elastically recover to engage with the knob 130. At this time, the heat sink 200 covers and contacts the electronic component 400 to complete the installation.

Referring to FIG. 2B to FIG. 2D , when the heat sink 200 is disassembled from the motherboard 300, the knob 130 is rotated to unlock the multiple latches 112 of the first assembly 110, and the first assembly 110 is adapted to push the knob 130 to lift the heat sink 200, thereby allowing the knob 130 to be disengaged from the first positioning seat 111, and then the heat sink 200 is manually grasped to drive the hook 140 to be pulled out from the second positioning seat 121 to complete the disassembly.

In detail, referring to FIG. 1B and FIG. 1C , the first component 110 has an elastic member 114. The elastic member 114 is sleeved on the central axis 113 and the two ends of the elastic member 114 abut against the first positioning seat 111 and the knob 130 respectively.

Referring to FIG. 1A and FIG. 2A , when the heat sink 200 is mounted on the motherboard 300 , the knob 130 compresses the elastic member 114 to accumulate elastic force, and the multiple buckling portions 131 of the knob 130 squeeze and pass through the multiple buckling members 112 , and finally the multiple buckling portions 131 are respectively engaged with the multiple buckling members 112 and the rotatable sleeve center axis 113 of the knob 130 , so as to fix the knob 130 in the first positioning seat 111 .

Referring to FIG. 2B to FIG. 2D , when the heat sink 200 is removed from the motherboard 300, force is applied to the knob 130 to rotate along the central axis 113 relative to the first positioning seat 111, so that the multiple locking portions 131 are separated from the multiple locking members 112 to release the locking relationship. Since the locking portions 131 are no longer limited by the locking members 112, the compressed elastic member 114 will recover elasticity to push the knob 130 upward away from the first positioning seat 111. At the same time, the heat sink 200 is lifted along with the knob 130, and then the heat sink 200 is pulled to drive the hook 140 to be pulled out from the second positioning seat 121.

Accordingly, the first component 110 can achieve the effect of automatically lifting the knob 130 and the plurality of buckles 112 after unlocking through the elastic member 114, which is conducive to improving the efficiency of disassembling the heat dissipation element 200.

Figures 3A and 3B are rotational motion diagrams of the first component of the quick-release structure of Figure 2A.

Referring to FIG. 1B and FIG. 3A , the knob 130 has a rotating portion 132, an internal space IS, and a plurality of slide grooves SG. The rotating portion 132 is disposed on an outer wall surface OS of the knob 130 and partially protrudes outside the heat dissipation element 200. The internal space IS is formed on a side of the knob 130 away from the first positioning seat 111. A plurality of slide grooves SG are formed through the rotating portion 132 and are located at the periphery of the internal space IS, wherein the plurality of slide grooves SG are coaxially arranged. The limit shaft 133 is disposed in the internal space IS of the knob 130 as the rotation center.

Referring to FIG. 1B, FIG. 1C and FIG. 3A, the first component 110 has a plurality of bolts 115 and a torsion spring 116. The plurality of bolts 115 are respectively inserted into the plurality of slide grooves SG and locked in a first groove 210 of the heat sink 200. The torsion spring 116 is sleeved on the limit shaft 133 and respectively engaged with the concave hole OP and the knob 130 of the heat sink 200.

Referring to FIG. 2A and FIG. 3A, when the multiple locking portions 131 of the knob 130 are locked with the multiple fasteners 112, the torsion spring 116 applies elastic force to the knob 130 and the heat dissipation element 200 to ensure that each locking portion 131 will not deviate from the corresponding fastener 112, thereby achieving the effect of elastic limiting.

Referring to FIG. 2B and FIG. 3B , when the knob 130 rotates relative to the first positioning seat 111, the rotating portion 132 drives the multiple slide grooves SG to slide along the multiple bolts 115 respectively, so that the multiple buckling portions 131 of the knob 130 are misaligned with the multiple buckling parts 112 of the first assembly 110, and at the same time, the knob 130 drives the torsion spring 116 to bend to accumulate elastic force.

Referring to FIG. 1B and FIG. 2A , the second hook 140 has a plurality of clamping portions 141 and a fixing portion 142. The second positioning seat 121 has a plurality of hook portions 1211. The plurality of hook portions 1211 are respectively inserted into the plurality of second clamping portions 141 to position the heat dissipation element 200. The fixing portion 142 extends vertically from the plurality of clamping portions 141 and is fixed to a second groove 220 of the heat dissipation element 200. The second fixing portion 142 is fixed to the second groove 220 of the heat dissipation element 200 by, for example, screw locking.

In short, when installing the quick-release structure 100 of this case, the hook 140 located on the heat sink 200 is engaged with the second positioning seat 121, and then the other end of the heat sink 200 is pressed down, so that the knob 130 pushes the multiple buckle members 112 to enter the first positioning seat 111 and engage with each other, and the elastic member 114 is pressed down during the engagement process of the knob 130.

Referring to FIG. 4 , in an embodiment of the present invention, the two opposite ends of the heat sink 200 respectively have first grooves 210, and the quick-release structure 100 includes two first components 110 and two knobs 130. The two first components 110 are disposed on the motherboard 300 and are spaced apart from each other. The two knobs 130 are respectively disposed in the two first grooves 210 of the heat sink 200, and the two knobs 130 are respectively located in the two first components 110. The two first grooves 210 respectively correspond to the two first components 110 and the two knobs 130. The detailed structures of the first components 110 and the knobs 130 are as described above, and will not be repeated here.

When the heat sink 200 is installed on the motherboard 300, the two knobs 130 are respectively engaged with the corresponding buckles 112 and are located at the engagement position. When the two knobs 130 receive an external force and rotate to the release position, the two knobs 130 separate from the buckles 112, and the heat sink 200 is separated from the motherboard 300. Therefore, after the quick-release structure of this embodiment is applied to the heat sink, the user only needs to simultaneously engage the two knobs with the two first positioning seats, and press the two knobs down to engage with multiple buckles to complete the assembly.

When the quick-release structure 100 is disassembled, force is applied to the rotating portion 132 of the knob 130, thereby driving the knob 130 to rotate relative to the first positioning seat 111 and the heat dissipation element 200 to release the locking relationship, and then the knob 130 and the heat dissipation element 200 are lifted by the elastic member 114, and finally the hook 140 is pulled out from the second positioning seat 121.

In summary, the quick-release structure of this case is used to fix a heat sink to a motherboard so that the heat sink can contact an electronic component for heat dissipation. The first component and the second component are installed on the motherboard and located on opposite sides of the electronic component, and the knob and the hook are respectively connected to the opposite ends of the heat sink.

During the installation process, the hook at one end of the heat sink is first engaged with the two second positioning seats, and then the other end of the heat sink is pressed down so that the knob pushes multiple fasteners to engage with multiple fasteners, and the knob is fixed in the first positioning seat. At this time, the heat sink contacts the electronic component.

During the disassembly process, rotate the knob to unlock the multiple fasteners. At this time, the heat sink can be driven by the knob to be removed from the first positioning seat. Then manually grab the heat sink element and pull the hook out from the second positioning seat to achieve the purpose of disassembling the heat sink element.

Therefore, after the quick-release structure of this case is applied to the heat dissipation element, the user only needs to snap the corresponding hook into the second positioning seat, and the knob on the other side can be directly pressed down to snap into multiple snap fasteners to complete the assembly without the need for additional hand tools for installation.

100: Quick-disassembly structure

110: First component

120: Second component

130: Knob

140: Hook

200: Heat dissipation element

300: Motherboard

310: Slot

400: Electronic components

Claims (10)

A quick-release structure is used to fix a heat sink to a motherboard. One end of the heat sink has a first groove. The quick-release structure includes: A first component, having a first positioning seat and a plurality of snap fasteners. The first positioning seat is arranged on the motherboard, and the center of the first positioning seat is defined as a central axis. The snap fasteners are spaced around the central axis; and A knob, having a limit axis at the center, the limit axis corresponds to the central axis, and the knob is rotatably arranged in the first groove along the limit axis to switch between a coupling position or a release position; When the heat sink is mounted on the motherboard, the knob is engaged with the buckles and located at the engaging position. When the knob receives an external force and rotates to the releasing position, the knob separates from the buckles, so that the heat sink is separated from the motherboard. The quick-release structure as described in claim 1 further includes a second component, which has a second positioning seat, a positioning portion and a column. The second positioning seat is configured on the motherboard and is far away from the first positioning seat. The positioning portion is formed on the second positioning seat. The column passes through the second positioning seat and is locked to the positioning portion. The quick-release structure as described in claim 2 further includes a hook disposed in a second groove of the heat dissipation element opposite to the first groove, and the hook is suitable for engaging with the second positioning seat. A quick-release structure as described in claim 2, wherein the first component has an elastic member, which is sleeved on the central axis and abuts against the first positioning seat and the knob respectively. A quick-release structure as described in claim 2, wherein the knob has a rotating portion, an internal space and a plurality of slide grooves, the rotating portion is disposed on an outer wall surface of the knob and partially protrudes outside the heat dissipation element, the internal space is formed on a side of the knob away from the first positioning seat, the slide grooves are formed through the rotating portion and are located on the outer periphery of the internal space, and the limit shaft is disposed in the internal space. A quick-release structure as described in claim 5, wherein the first component has a plurality of bolts and a torsion spring, the bolts are respectively passed through the slide grooves and locked in a first groove of the heat dissipation element, and the torsion spring is sleeved on the limit shaft and respectively engaged with the heat dissipation element and the knob. A quick-release structure as described in claim 6, wherein when the knob is engaged with the fasteners, the torsion spring applies elastic force to the knob and the heat dissipation element, and when the knob rotates relative to the first positioning seat, the rotating portion drives the slide grooves to slide along the bolts respectively, and the knob drives the torsion spring to bend to accumulate elastic force. As described in claim 3, the quick-release structure, wherein the hook has a plurality of clamping parts, the second positioning seat has a plurality of hook parts, and the hook parts are respectively inserted into the clamping parts to position the heat dissipation element. A quick-release structure as described in claim 8, wherein the hook has a fixing portion extending vertically from the clamping portion and fixedly disposed in a second groove of the heat dissipation element. The quick-release structure as described in claim 1 further includes another first component and another knob, the two first components are arranged on the motherboard and spaced apart from each other, the two knobs are respectively arranged in the first groove and another first groove of the heat dissipation element, and the two knobs are respectively positioned opposite to the two first components.

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