TWM649268U - Heat dissipation apparatus - Google Patents

Abstract

The heat dissipation device of this invention includes a substrate, a heat source, a heat dissipation module and a thermal conductive layer. The heat source is connected to the substrate. The thermal conductive layer connects the heat dissipation module and the heat source, and includes a phase change thermal conductive unit and a surrounding wall structure. Phase change thermal conduction units are distributed on the heat source. The enclosure structure extends outward from the phase change heat conduction unit to cover the phase change heat conduction unit, and the enclosure wall structure is located between the substrate and the heat dissipation module.

Description

Cooling device

This creation relates to heat dissipation devices, specifically a heat dissipation device using phase change materials.

The heat energy generated by the operation of the processor or electronic components of electronic devices will increase with the increase in computing speed and performance. The accumulation of heat energy will cause the temperature of the processor or electronic components to rise. This will not only affect the processing capabilities of the processor or electronic components, but also affect the processing power of the processor or electronic components. service life.

Furthermore, as electronic devices move towards lighter, thinner, shorter and smaller sizes, efficient heat dissipation methods have become an important issue at present. The thermal conductivity of liquid metal thermal paste is better than that of traditional thermal paste. In order to improve heat dissipation efficiency, liquid metal thermal paste has been used in heat dissipation environments. However, liquid metal thermal paste is not easy to restrict its flow when it is liquid, and it is easy to overflow to the processor or In the environment around electronic components, short circuits occur in the surrounding circuits. Alternatively, Taiwan Patent No. I698287 increases the uniformity of the liquid metal heat dissipation paste by first forming a roughened surface on the surface of the electronic component within the limited range of the component and then applying the liquid metal heat dissipation paste. Although this method can improve the uniformity of the liquid metal heat dissipation paste. However, during the heat conduction (dissipation) process, the liquid metal will still flow outward and overflow to the outside, causing short circuit problems in the surrounding circuits.

In view of the above deficiencies, the thermal conductive layer of the heat dissipation device of the present invention can effectively restrict the flow of the phase change conductive material to avoid the problem of circuit short circuit caused by overflow of the conductive material.

In order to achieve the above purpose, the heat dissipation device of the present invention includes a substrate, a heat source, a heat dissipation module and a thermal conductive layer. The heat source is connected to the substrate. The thermal conductive layer connects the heat dissipation module and the heat source, and includes a phase change thermal conductive unit and a surrounding wall structure. Phase change thermal conduction units are distributed on the heat source. The enclosure structure extends outward from the phase change heat conduction unit to cover the phase change heat conduction unit, and the enclosure wall structure is located between the substrate and the heat dissipation module.

In this way, the heat dissipation device of this invention can cover the phase change thermal conductive unit through the wall structure of the thermal conductive layer to limit the overflow of the liquid conductive material to the outside of the wall structure and improve the short circuit problem of the circuit.

The detailed structure or features of the heat dissipation device provided by the present invention will be described in the subsequent detailed description of the implementation. However, those skilled in the art should understand that the detailed description and the specific examples listed for implementing the present invention are only suitable for illustrating the present invention and are not intended to limit the patentable scope of the present invention.

10: Cooling device

20:Substrate

30: Heat source

40: Cooling module

50:Thermal conductive layer

51: Phase change thermal conduction unit

511: Phase change conductive materials

513: Insulating and thermally conductive materials

53:Wall structure

531: First contact surface

533: Second contact surface

535:Inner retaining wall

537:Exterior retaining wall

Figure 1 is a schematic diagram of an embodiment of the heat dissipation device of the present invention.

FIG. 2 is a side view of the heat dissipation module and the heat source in FIG. 1 that are pressed together, and a schematic diagram of the embodiment in which the thermal conductive layer is presented in cross-section.

FIG. 3 is a side view of the heat dissipation module and the heat source in FIG. 1 that are pressed together, and a schematic diagram of another embodiment in which the thermal conductive layer is presented in cross-section.

The applicant would like to first explain that in the entire description, including the embodiments introduced below and the claims in the patent application scope, terms related to directionality are based on the direction in the drawings. Secondly, in the embodiments and drawings to be introduced below, the same component numbers represent the same or similar components or structural features.

As shown in FIGS. 1 and 2 , the heat dissipation device 10 of the present invention includes a substrate 20 , a heat source 30 , a heat dissipation module 40 and a thermal conductive layer 50 . The heat source 30 is connected to the substrate 20. The substrate 20 may have other electronic components, such as passive components or active components, and the heat source 30 may be a chip. The heat dissipation module 40 may be in the form of heat dissipation fins, heat dissipation covers, heat dissipation plates, heat dissipation pipes, etc. or may be combined with an active heat dissipation device, such as water-cooling or air-cooling heat dissipation. The thermal conductive cover covers the heat source 30, and another heat dissipation module can be combined with the thermal conductive cover. The thermal conductive layer 50 connects the heat dissipation module 40 and the heat source 30 . The thermal conductive layer 50 includes a phase change thermal conductive unit 51 and a surrounding wall structure 53 . The phase change thermal conductive unit 51 includes phase change conductive material 511 and insulating thermal conductive material 513 mixed together.

The raw material of the thermal conductive layer 50 can be in the form of paste, mud, gel, sheet, liquid, etc. The raw material of the thermal conductive layer 50 is also called caulking agent, heat dissipation material or thermal conductive material, etc., and can be coated, Fill the heat source 30 by dispensing, printing, placing, etc., or attach the heat dissipation film to the heat source 30, then press the heat dissipation module 40 and the heat source 30, and squeeze out the heat dissipation paste or heat dissipation film. Press, so that the heat dissipation paste or heat dissipation film conforms to the surface fluctuations of the heat dissipation module 40 and the heat source 30 and combines with each other.

Thermal paste, heat dissipation glue or heat dissipation material includes low-density insulating and thermally conductive material 513 and high-density phase change conductive material 511 . Therefore, the low-density insulating and thermally conductive material 513 can surround the phase change conductive material 511 no matter how it is extruded. Subsequently, the low-density insulating and thermally conductive material on the periphery of the thermally conductive layer 50 513 can form an enclosure structure 53 to surround the internal mixed materials (ie, the insulating and thermally conductive material 513 and the phase change conductive material 511).

Since the thermal conductive layer 50 is extruded by the heat dissipation module 40 and the surrounding wall structure 53 is formed on the periphery, the surrounding wall structure 53 has an irregular pattern. In other embodiments, the thermal conductive layer 50 is limited to a specific frame, and the wall structure 53 is limited to the pattern of the frame. For example, if the thermal conductive layer 50 is within a hollow rectangular frame, the pattern of the extruded thermal conductive layer 50 will be approximately rectangular. frame.

The density of the insulating and thermally conductive material 513 is lower than the density of the phase change conductive material 511 . The phase change conductive material 511 has better cohesion. The insulating and thermally conductive material 513 includes base oil and additives. The base oil can be synthetic oil, semi-synthetic oil, mineral oil and other greases, such as dimethyl silicone oil, phenyl silicone oil, ethyl silicone oil, hydroxyl silicone oil, amino silicone oil, hydrogenated silicone oil, etc. At least one of silicone oil, vinyl silicone oil, modified silicone oil, cyclic dimethyl silicone oil or benzyl silicone oil. Additives such as dimethyldichlorosilane, propylene silane, phenyltrichlorosilane, methacrylsilane, phenyltrimethoxysilane, epoxysilane, decyltrimethoxysilane, trimethoxysilane, trifluoropropyl Trimethoxysilane, vinyltrichlorosilane, hexamethyldisilazane, methyldiethoxysilane, tetraethoxysilane, styryltrimethoxysilane, methyltrichlorosilane, 3-methyl Acryloxypropyl, N-vinylbenzyl-2-aminoethyl-3-aminopropyltrimethoxysilane hydrochloride, 3-ureidopropyltriethoxysilane, 3-mercaptopropyl At least one of trimethoxysilane, 3-isocyanatepropyltriethoxysilane, etc. The phase change conductive material 511 includes at least one metal or alloy component such as gold, silver, copper, magnesium, platinum, gallium, indium, manganese, tin, lead, zinc, bismuth, and palladium. Because the density of the insulating and thermally conductive material 513 is lower than that of the phase change conductive material 511 , the phase change conductive material 511 will be covered by the insulating and thermally conductive material 513 during the extrusion process and push the insulating and thermally conductive material 513 .

The phase change thermal conductive units 51 are distributed on the heat source 30. The phase change conductive material 511 is a component or substance with high melting heat, so that a phase change occurs when heated at a specific temperature parameter (such as melting). (transformation or solidification). In this embodiment, the phase change is to change the solid state into a liquid state after being heated. In this way, the state change of the phase change is used to absorb or release thermal energy.

The composition of the enclosure structure 53 is the result of solidification of part of the insulating and thermally conductive material 513 in the phase change thermally conductive unit 51 . The enclosure structure 53 extends outward from the phase change heat conduction unit 51 to cover the phase change heat conduction unit 51. In this way, the phase change heat conduction unit 51 is limited within the enclosure structure 53 to improve the phase change conductive material 511 in the phase change heat conduction unit 51. In the liquid state, it overflows outside the enclosure structure 53 .

As shown in FIG. 2 , the enclosure structure 53 includes a first contact surface 531 , a second contact surface 533 , an inner retaining wall 535 and an outer retaining wall 537 . The first contact surface 531 contacts the heat dissipation module 40 and conforms to the surface undulations of the heat dissipation module 40 . The second contact surface 533 contacts the substrate 20 and conforms to the surface undulations of the substrate 20 and the heat source 30 . Among them, the first contact surface 531 and the second contact surface 533 are generally not exposed to the environment. The inner retaining wall 535 connects the first contact surface 531 and the second contact surface 533 and surrounds the phase change thermal conduction unit 51 to prevent the phase change conductive material 511 of the liquid phase change thermal conduction unit 51 from leaking out. The outer retaining wall 537 connects the first contact surface 531 and the second contact surface 533 and surrounds the inner retaining wall 535 .

In this embodiment, the wall structure 53 is double-layered, namely an outer retaining wall 537 and an inner retaining wall 535 . The outer retaining wall 537 is exposed in the gap between the heat dissipation module 40 and the substrate 20 and forms a wall that is approximately a thin film due to contact with air in a normal temperature environment. The inner retaining wall 535 is solidified and formed after receiving thermal energy (that is, being heated). The thermal energy can be external heating, such as through a heating cavity or the thermal energy generated when the heat source 30 operates, so that the thermal conductive layer 50 forms the enclosure structure 53 . After the wall structure 53 is formed, the phase change thermal conductive unit 51 inside the wall structure can maintain the paste-like and thermal conductive functions to allow the phase change conductive material 511 to undergo phase change.

As shown in FIG. 3 , the heat source 30 includes a heating surface 31 , and the heating surface 31 faces away from the substrate 20 . The surrounding wall structure 53 connects the heating surface 31 of the heat source 30 and the heat dissipation module 40 . The second contact surface 533 is in contact with the heating surface 31 of the heat source 30 and conforms to the surface undulations of the heating surface 31 .

In this way, the double-layered wall structure 53 can make the structure of the thermal conductive layer 50 more stable to prevent the liquid phase change conductive material 511 of the phase change thermal conductive unit 51 from leaking or overflowing outside the wall structure 53 . Furthermore, the heat source 30 and the heat dissipation module 40 are in close contact with the thermal conductive layer 50, and the thermal conductivity of the phase change conductive material 511 in the phase change thermal conduction unit 51 is better than that of the insulating thermal conductive material 513. Therefore, when the phase change conductive material 511 accepts After the thermal energy is transformed into phases, the thermal conductive layer 50 can conduct the thermal energy of the heat source 30 to the heat dissipation module 40 more efficiently.

The heat dissipation device of this invention can conduct heat energy from the heat source to the heat dissipation module through the formation of a thermal conductive layer, and optimize the thermal conductivity through phase change conductive materials with better thermal conductivity in the thermal conductive layer, and use the wall structure formed by the thermal conductive layer itself Surround the phase change conductive material, so that when the phase change conductive material changes to a liquid state, the liquid phase change conductive material is restricted by the wall structure and will not leak outside the wall structure.

Finally, the structural elements disclosed in the foregoing embodiments of this invention are only examples and are not intended to limit the scope of this invention. Substitutions or changes of other equivalent elements should also be covered by the patentable scope of this invention. .

10: Cooling device

20:Substrate

30: Heat source

40: Cooling module

50:Thermal conductive layer

Claims (8)

A heat dissipation device including: a substrate; A heat source is connected to the substrate; a heat dissipation module; and A heat conductive layer connects the heat dissipation module and the heat source, and includes a phase change heat conduction unit and a wall structure. The phase change heat conduction unit is distributed on the heat source. The wall structure extends outward from the phase change heat conduction unit. , to cover the phase change thermal conduction unit, and the enclosure structure is located between the substrate and the heat dissipation module. The heat dissipation device of claim 1, wherein the enclosure structure includes a first contact surface, a second contact surface, an outer retaining wall and an inner retaining wall, the first contact surface contacts the heat dissipation module, and the The second contact surface contacts the substrate, the inner retaining wall connects the first contact surface and the second contact surface, and surrounds the phase change thermal conduction unit, and the outer retaining wall connects the first contact surface and the second contact surface around the surface and surrounding the internal retaining wall. The heat dissipation device as claimed in claim 1, wherein the heat source includes a heating surface facing away from the substrate, and the surrounding wall structure includes a first contact surface, a second contact surface, an outer retaining wall and an Inner retaining wall, the first contact surface contacts the heat dissipation module, the second contact surface contacts the heating surface, the inner retaining wall connects the first contact surface and the periphery of the second contact surface, and surrounds the phase change heat conduction unit, the outer retaining wall connects the periphery of the first contact surface and the second contact surface, and surrounds the inner retaining wall. The heat dissipation device as claimed in claim 2 or 3, wherein the inner retaining wall of the enclosure structure is formed by the transmission of thermal energy, and the formation of the outer retaining wall is related to contact with ambient air. The heat dissipation device as claimed in claim 1, wherein the inner retaining wall of the enclosure structure is shaped to transmit heat energy. The heat dissipation device according to claim 1, wherein the shapes of the inner retaining wall and the outer retaining wall of the enclosure structure are irregular patterns. The heat dissipation device of claim 1, wherein the phase change thermally conductive unit includes a phase change conductive material and an insulating thermally conductive material mixed together, and the phase change conductive material is heated to convert a solid state into a liquid state. The heat dissipation device as claimed in claim 7, wherein the wall structure is a result of partial curing of the insulating and thermally conductive material.

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