CN105828569A - Heat radiation device and electronic equipment - Google Patents

Abstract

Embodiments of the present invention provide a heat dissipation device and electronic equipment, wherein the heat dissipation device specifically includes: a metal heat dissipation middle frame; wherein, the metal heat dissipation middle frame is a hollow and airtight structure, and the inner seal of the metal heat dissipation middle frame is easily Volatile liquid. The embodiment of the present invention can avoid the situation that the temperature of the local area of the electronic equipment is too high due to heat concentration, and achieve better heat dissipation effect.

Description

A cooling device and electronic equipment

technical field

The invention relates to the technical field of electronic equipment, in particular to a heat dissipation device and electronic equipment.

Background technique

With the continuous development of electronic technology, most of the CPUs of mobile phones and other electronic devices are developing towards multi-core. However, with the continuous improvement of mobile phone performance, the problem of heat generation is becoming more and more serious; , making the heat dissipation space of the mobile phone smaller and smaller, therefore, the heat dissipation of the mobile phone under the condition of limited heat dissipation space becomes particularly important.

Most of the existing solutions use metal or graphite film to dissipate heat from the mobile phone. However, since the thermal conductivity of common metals is up to about 300W/m·K, and the graphite film is up to about 1000W/m·K, when the CPU power consumption is getting higher and higher, metal or graphite films often cannot meet the heat dissipation requirements of mobile phones. requirements, the surface temperature of the mobile phone will exceed the comfortable temperature perceived by the human body when running a large program load, which will affect the user experience; at the same time, the service life of the mobile phone will also be affected if it is in a high temperature state for a long time.

Contents of the invention

In view of the above problems, embodiments of the present invention are proposed to provide a heat dissipation device and an electronic device that overcome the above problems or at least partially solve the above problems.

In order to solve the above problems, an embodiment of the present invention discloses a heat dissipation device, including:

Metal cooling frame;

Wherein, the metal heat dissipation middle frame is a hollow airtight structure, and the inside of the metal heat dissipation middle frame is sealed with a volatile liquid.

According to another aspect of the present invention, an embodiment of the present invention discloses an electronic device, comprising: the foregoing heat dissipation device.

Embodiments of the present invention include the following advantages:

The heat dissipation device of the embodiment of the present invention can transfer the heat generated during the operation of the electronic equipment to the metal heat dissipation middle frame, so that the volatile liquid sealed inside the metal heat dissipation middle frame is heated and gasified into gas, and the gas fills the entire metal heat dissipation middle frame , so that the temperature of the entire metal heat dissipation middle frame is relatively average, and avoid the situation where the temperature of the local area of the electronic device is too high due to heat concentration. In addition, due to the metal heat dissipation middle frame and the volatile liquid sealed inside, the thermal conductivity can reach more than 10,000W/m·K, so a better heat dissipation effect can be achieved.

Description of drawings

Fig. 1 shows a schematic structural view of a heat sink embodiment of the present invention; and

Fig. 2 shows a schematic structural diagram of an electronic device embodiment of the present invention.

detailed description

In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

The heat dissipation device provided by the present invention may specifically include a metal heat dissipation middle frame; wherein, the metal heat dissipation middle frame is a hollow airtight structure, and the inside of the metal heat dissipation middle frame may be sealed with a volatile liquid.

In the electronic equipment installed with the heat dissipation device of the present invention, when heat is transferred to the metal heat dissipation middle frame, the volatile liquid sealed inside the metal heat dissipation middle frame is heated and gasified into gas, and the gas fills the entire metal heat dissipation middle frame, making the The temperature of the entire metal heat dissipation middle frame is relatively average, which can avoid the local overheating of the surface of the electronic device; in addition, due to the metal heat dissipation middle frame and the volatile liquid sealed inside, the total of the metal heat dissipation middle frame and its internal volatile liquid The thermal conductivity can reach more than 10000W/m·K, therefore, compared with the metal or graphite film in the existing scheme, it can achieve better heat dissipation effect.

A heat dissipation device provided by the present invention will be described in detail below through specific embodiments. For ease of description, the mobile phone will be described below as a specific example of the electronic device of the present invention. Those skilled in the art will understand that, in addition to the mobile phone as an electronic device, other electronic devices with similar cooling devices, such as tablet computers, digital cameras, etc. All within the protection scope of the present invention.

Embodiment one

Referring to Fig. 1, it shows a schematic structural diagram of an embodiment of a heat dissipation device of the present invention, the heat dissipation device may specifically include: a metal heat dissipation middle frame 11; wherein, the metal heat dissipation middle frame 11 is a hollow airtight structure, the The interior of the metal heat dissipation middle frame 11 is sealed with a volatile liquid.

In practical applications, mobile phones include components such as LCM (LCDModule, liquid crystal module), PCB (Printed Circuit Board, printed circuit board), battery, etc. These components need to be fixed on a bracket (metal middle frame) to ensure that each component of stability. In the embodiment of the present invention, the metal middle frame is used to dissipate heat from the electronic equipment. Because the metal heat dissipation middle frame 11 of the present invention can be a hollow airtight structure, and a volatile liquid is sealed inside the metal heat dissipation middle frame. Therefore, in the electronic equipment installed with the heat dissipation device, when heat is transferred to the metal heat dissipation middle frame, the volatile liquid sealed inside the metal heat dissipation middle frame is heated and vaporized into gas, and the gas fills the entire metal heat dissipation middle frame. Make the temperature of the entire metal heat dissipation middle frame relatively average, so that the heat generated inside the electronic device can be evenly diffused, thereby avoiding the situation where the local temperature of the surface of the electronic device is too high; in addition, due to the metal heat dissipation middle frame and the ease of internal sealing The volatile liquid makes the total thermal conductivity of the metal heat dissipation middle frame and its internal volatile liquid reach more than 10000W/m·K. Therefore, compared with the metal or graphite film in the existing scheme, a better heat dissipation effect can be achieved.

In practical applications, the shape and size of the metal heat dissipation middle frame can be corresponding to the components that need to be fixed. For example, a corresponding metal heat dissipation middle frame can be set for heat generating components such as CPU and power management unit (PowerManagementUnit, PMU) to simultaneously Fix the CPU and power management unit so that the heat generated by the heat-generating components in the electronic equipment can be transferred to the metal heat dissipation middle frame as much as possible, and then dissipate heat through the large-area metal heat dissipation middle frame, so that the heat distribution of the electronic equipment is more uniform, avoiding A condition in which a heat concentration causes a localized area of an electronic device to become overheated. Of course, during specific implementation, the shape and size of the metal heat dissipation middle frame can be flexibly set. For example, it is also feasible to set corresponding metal heat dissipation middle frames for the CPU and the power management unit respectively. The present invention is for the shape and size of the metal heat dissipation middle frame Size is not limited.

In a preferred embodiment of the present invention, the device may further include: a first heat-conducting silica gel 12 pasted on the metal heat-dissipating middle frame 11, so as to transfer the heat of electronic equipment through the first heat-conducting silica gel 12 Evenly transmitted to the metal heat dissipation middle frame 11.

Wherein, the first heat-conducting silica gel 12 pasted on the metal heat-dissipating middle frame 11 can make the heat of the electronic equipment transfer to the metal heat-dissipating middle frame 11 more quickly and evenly. For example, the CPU and/or the power management unit can be pasted on the metal heat dissipation middle frame through the first heat-conducting silica gel 12, so that the heat generated by the CPU and/or the power management unit can pass through the first heat-conducting silica gel 12 more quickly and evenly. The heat is transferred to the metal heat dissipation middle frame 11, so as to produce better heat dissipation effect. In a specific application, the first heat-conducting silica gel 12 can be a jelly-like substance, which can be solid at low temperature and liquid when heated, and can well fill the gap between the contact surfaces, and it has Good thermal conductivity and adhesiveness to improve the heat dissipation effect of the heat sink and the bonding degree with the heat-generating components.

In another preferred embodiment of the present invention, the thickness of the first thermally conductive silica gel may be 0.15mm-0.35mm.

In practical applications, the thickness of the first heat-conducting silica gel can preferably be 0.15mm or 0.35mm, which can satisfy good thermal conductivity, and will not increase the thermal resistance of heat conduction due to being too thick, or cause Heat transfer is uneven. Of course, in specific applications, the thickness of the first thermally conductive silica gel can be flexibly set according to different structures of electronic devices, and the present invention does not limit the thickness of the first thermally conductive silica gel.

In yet another preferred embodiment of the present invention, the volatile liquid may specifically be water or alcohol. Since both water and alcohol are volatile liquids, they are volatile and turn into gas when heated, and the gas can be diffused to fill the entire metal heat dissipation middle frame, so that the temperature of the entire metal heat dissipation middle frame can be averaged to avoid CPU on the surface of the electronic device. And the local temperature of the power management unit is too high. In practical applications, the thermal conductivity of water is 0.58W/m.K, which does not have good thermal conductivity. However, the embodiment of the present invention utilizes the volatile nature of water to make the heat spread more evenly. Under the joint action, the total thermal conductivity of the metal heat dissipation middle frame and water can be greatly improved. For example, under the condition that the material of the metal heat dissipation middle frame is copper, the copper heat dissipation middle frame plus the water enclosed inside, the total thermal conductivity can reach more than 15000W/m·K. For another example, the copper heat dissipation middle frame and the alcohol sealed inside have a total thermal conductivity of over 12000W/m·K, which significantly improves the heat dissipation effect. Of course, in practical applications, other volatile liquids can also be selected, and the present invention does not limit the types of volatile liquids.

In yet another preferred embodiment of the present invention, the material of the metal heat dissipation middle frame 11 includes any one of copper, gold, silver, and aluminum. In specific applications, due to the relatively good ductility of copper, it can be made into a very thin copper heat dissipation middle frame, which can meet the increasingly thinner and lighter needs of mobile phones, and the copper heat dissipation middle frame plus the volatile liquid sealed inside it, The thermal conductivity can reach more than 10000W/m·K, which has a good thermal conductivity. Of course, in practical applications, the material of the metal heat dissipation middle frame 11 can also be other metals with better ductility, such as aluminum, etc. The present invention does not limit the material of the metal heat dissipation middle frame 11 .

In summary, the heat dissipation device of the embodiment of the present invention can transfer the heat generated during the operation of the electronic equipment to the metal heat dissipation middle frame, so that the volatile liquid sealed inside the metal heat dissipation middle frame is heated and vaporized into gas, and the gas fills the entire metal heat sink. The heat dissipation middle frame makes the temperature of the entire metal heat dissipation middle frame relatively average, and avoids the situation where the temperature of the local area of the electronic device is too high due to heat concentration. In addition, due to the metal heat dissipation middle frame and the volatile liquid sealed inside, the thermal conductivity can reach more than 10,000W/m·K, so a better heat dissipation effect can be achieved.

Embodiment two

Referring to FIG. 2 , it shows a schematic structural diagram of an embodiment of an electronic device according to the present invention, and the electronic device may specifically include: the heat dissipation device 21 and the heat generating component 22 mentioned above;

Wherein, the heating component 22 is fixed on the metal heat dissipation middle frame 211 in the heat dissipation device 21; the metal heat dissipation middle frame 211 is a hollow airtight structure, and a volatile liquid is sealed inside it.

In the embodiment of the present invention, the heat-generating components may specifically include components that easily generate heat in electronic equipment such as a CPU and a power management unit. Of course, in a specific application, the heat-generating component may be any component that can generate heat, and the present invention does not limit the specific form of the heat-generating component.

In practical applications, the core of electronic equipment is the CPU, and the CPU will generate a lot of heat when running large-scale applications; if the temperature of the CPU is too high, it will affect the processing performance of the CPU. The embodiment of the present invention can transfer the heat generated by the CPU to the metal heat dissipation middle frame, and then diffuse the heat through the gasification of the liquid inside the metal heat dissipation middle frame, thereby reducing the heat of the CPU and avoiding the processing performance of the CPU being affected by the high temperature of the CPU .

In addition, since the power management unit is also an important component that easily generates heat in electronic equipment, the electronic equipment in the embodiment of the present invention may further include a power management unit to dissipate heat from the power management unit through a heat sink, thereby further reducing the heat dissipation of the electronic equipment. surface temperature.

In specific applications, the first heat-conducting silica gel 23 can be pasted on the metal heat-dissipating middle frame 211. On the one hand, heat-generating components such as the CPU and/or power management unit can be fixed on the metal heat-dissipating middle frame 211 through the first heat-conducting silica gel 23 to achieve On the other hand, the good thermal conductivity of the first thermally conductive silica gel 23 can be used to transfer the heat generated by the CPU and/or the power management unit to the metal heat dissipation middle frame 211 more quickly and evenly through the first thermally conductive silica gel 23, thereby Can produce better cooling effect.

In yet another preferred embodiment of the present invention, the electronic device may further include a metal shielding cover 24 ; wherein the metal shielding cover 24 covers the heat generating component 22 .

In practical applications, the CPU and the power management unit can be fixed on the motherboard, and the motherboard can be fixed on the metal heat dissipation middle frame 211. Therefore, for the side of the metal heat dissipation middle frame 211 close to the CPU and the power management unit, the metal heat dissipation middle frame 211 can act as a radio frequency shield for the CPU and/or power management unit; and for the other side of the CPU and/or power management unit (the side that is not close to the metal heat dissipation middle frame), a metal shielding cover 24 can be additionally added. On the one hand, the metal shielding cover 24 can play the role of radio frequency shielding; on the other hand, it can control the heat within the range of the metal shielding cover, and uniformly guide the heat out through the metal heat dissipation cover 211, so as to prevent the heat from spreading around and affecting the operation of other components.

In yet another preferred embodiment of the present invention, the metal shielding cover 24 is a hollow airtight structure, and the inside of the metal shielding cover 24 is sealed with volatile liquid.

In the embodiment of the present invention, the metal shielding cover 24 is used as a hollow airtight structure, and a volatile liquid is sealed inside the metal shielding cover 24, so that the metal shielding cover 24 can not only play a radio frequency shielding role, but also The other side of the CPU and/or power management unit (the side that is not close to the metal heat dissipation middle frame) can also have the same heat dissipation effect as the metal heat dissipation middle frame.

In practical applications, the metal shielding cover 24 can be made of copper, aluminum and other materials with good shielding effect and high thermal conductivity. Of course, metal shielding covers of other materials may also be selected according to actual needs, and the present invention does not limit the material of the metal shielding covers. In addition, the present invention does not limit the shape and size of the metal shielding cover. For example, metal shielding covers of corresponding sizes can be installed on the CPU and the power management unit, or a metal shielding with a size sufficient to cover the CPU and the power management unit can be directly selected. Can be covered.

In yet another preferred embodiment of the present invention, the electronic device may further include: a second heat-conducting silicone gel 25 located between the heat-generating component 22 and the metal shielding cover 24 .

Wherein, the second heat-conducting silica gel 25 can be specifically selected from the same or similar colloidal substance as the above-mentioned first heat-conducting silica gel, and the second heat-conducting silica gel 25 can be pasted between heating components such as CPU and/or power management unit and the metal shielding cover 24, so as to The heat of the CPU and/or the power management unit is quickly and evenly transferred to the metal heat dissipation middle frame 211 through the second heat conduction silica gel 25 , so that the heat dissipation effect can be further enhanced.

To sum up, the electronic equipment of the embodiment of the present invention can enable the CPU to dissipate heat efficiently under the action of the above heat dissipation device, thereby reducing the temperature of the CPU, which in turn is conducive to the efficient performance of the CPU performance; in addition, the surface of the electronic equipment can be further reduced. temperature, thereby improving the user experience.

Each embodiment in this specification is described in a progressive manner, each embodiment focuses on the difference from other embodiments, and the same and similar parts of each embodiment can be referred to each other.

Having described preferred embodiments of embodiments of the present invention, additional changes and modifications to these embodiments can be made by those skilled in the art once the basic inventive concept is appreciated. Therefore, the appended claims are intended to be construed to cover the preferred embodiment and all changes and modifications which fall within the scope of the embodiments of the present invention.

Finally, it should also be noted that in this text, relational terms such as first and second etc. are only used to distinguish one entity or operation from another, and do not necessarily require or imply that these entities or operations, any such actual relationship or order exists. Furthermore, the term "comprises", "comprises" or any other variation thereof is intended to cover a non-exclusive inclusion such that a process, method, article, or terminal equipment comprising a set of elements includes not only those elements, but also includes elements not expressly listed. other elements identified, or also include elements inherent in such a process, method, article, or end-equipment. Without further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of additional identical elements in the process, method, article or terminal device comprising said element.

A heat dissipation device and an electronic device provided by the present invention have been introduced in detail above. In this paper, specific examples are used to illustrate the principle and implementation of the present invention. The description of the above embodiments is only used to help understand the present invention. The method of the invention and its core idea; at the same time, for those of ordinary skill in the art, according to the idea of the present invention, there will be changes in the specific implementation and scope of application. In summary, the content of this specification should not be understood To limit the present invention.

Claims (10)

1. a heat abstractor, it is characterised in that including: heat dissipation metal center；

Wherein, described heat dissipation metal center is hollow closed structure, and the inner sealing of described heat dissipation metal center has volatile liquid.

2. device as claimed in claim 1, it is characterised in that described device also includes: be affixed on the first heat conductive silica gel on described heat dissipation metal center.

3. device as claimed in claim 1, it is characterised in that described volatile liquid is water or ethanol.

4. device as claimed in claim 1, it is characterised in that the material of described heat dissipation metal center includes in copper, gold, silver, aluminum any one.

5. device as claimed in claim 2, it is characterised in that the thickness of described first heat conductive silica gel is 0.15mm-0.35mm.

6. an electronic equipment, it is characterised in that including: arbitrary described heat abstractor in aforementioned claim 1 to 5.

7. electronic equipment as claimed in claim 6, it is characterised in that described electronic equipment also includes: heat generating components；

Wherein, on the heat dissipation metal center during described heat generating components is fixed on described heat abstractor.

8. electronic equipment as claimed in claim 7, it is characterised in that described electronic equipment also includes metallic shield lid；

Wherein, described metallic shield blanketing covers on described heat generating components.

9. electronic equipment as claimed in claim 8, it is characterised in that described metallic shield lid is hollow closed structure, and the inner sealing of described metallic shield lid has volatile liquid.

10. electronic equipment as claimed in claim 8 or 9, it is characterised in that described electronic equipment also includes: the second heat conductive silica gel between described heat generating components and metallic shield lid.