TWM648064U - Electronic component and electronic device - Google Patents
Electronic component and electronic device Download PDFInfo
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- TWM648064U TWM648064U TW111214267U TW111214267U TWM648064U TW M648064 U TWM648064 U TW M648064U TW 111214267 U TW111214267 U TW 111214267U TW 111214267 U TW111214267 U TW 111214267U TW M648064 U TWM648064 U TW M648064U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
- H01F27/26—Fastening parts of the core together; Fastening or mounting the core on casing or support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/30—Fastening or clamping coils, windings, or parts thereof together; Fastening or mounting coils or windings on core, casing, or other support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
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Abstract
Description
本申請實施例涉及電力電子技術領域,特別涉及一種電子器件和電子設備。The embodiments of the present application relate to the field of power electronics technology, and in particular to an electronic device and electronic equipment.
網路變壓器又名網路隔離變壓器、乙太網變壓器、網路濾波器,主要應用於:RJ45網卡、乙太網交換機、網路路由器、非對稱數位使用者環路(Asymmetric Digital Subscriber Line ,ADSL)、超高速數位用戶線路(Very-high-bit-rate Digital Subscriber loop,VDSL)的數位設備、基於有線電視同軸電纜網使用乙太網協定的接入技術(Ethernet Over Cable,EOC)終端、網路機上盒、智慧電視、網路攝像機、PC主機板、電腦周邊、工業主機板、網路伺服器、電信通訊基站等設備。Network transformers are also known as network isolation transformers, Ethernet transformers, and network filters. They are mainly used in: RJ45 network cards, Ethernet switches, network routers, Asymmetric Digital Subscriber Line (ADSL) ), digital equipment of Very-high-bit-rate Digital Subscriber loop (VDSL), access technology based on cable TV coaxial cable network using Ethernet protocol (Ethernet Over Cable, EOC) terminals, network Router set-top boxes, smart TVs, network cameras, PC motherboards, computer peripherals, industrial motherboards, network servers, telecommunications base stations and other equipment.
現有技術中的網路變壓器包括磁芯和繞組,磁芯包括第一磁芯本體和第二磁芯本體,其中,第一磁芯本體和第二磁芯本體之間透過連接膠水固定連接。但是由於膠水的存在導致第一磁芯本體和第二磁芯本體之間存在一定的間隙空間,此間隙的存在會影響磁芯的磁通回路,導致存在弱磁,漏磁等不良現象。最終導致產品的電感量無法做高,以至於不能滿足產品電感量的規格。為了解決上述問題,現有技術中,一般採用在膠水中加入導磁材料,比如:鐵粉、鐵氧體等,以使膠水具有磁性,進而改善漏磁現象,提高產品的電感量。The network transformer in the prior art includes a magnetic core and a winding. The magnetic core includes a first magnetic core body and a second magnetic core body. The first magnetic core body and the second magnetic core body are fixedly connected through connecting glue. However, due to the presence of glue, there is a certain gap space between the first magnetic core body and the second magnetic core body. The existence of this gap will affect the magnetic flux circuit of the magnetic core, resulting in weak magnetism, magnetic flux leakage and other undesirable phenomena. Ultimately, the inductance of the product cannot be made high, so that it cannot meet the product inductance specifications. In order to solve the above problems, in the prior art, magnetic conductive materials, such as iron powder, ferrite, etc., are generally added to the glue to make the glue magnetic, thereby improving the magnetic leakage phenomenon and increasing the inductance of the product.
然而,在膠水中添加導磁材料之後,膠水的磁導率也只有10左右,而磁芯材料磁導率大於1000,兩者相差比較大,所以在膠水中添加導磁材料的效果並不好,另外膠水中調節導磁材料還會降低膠水的黏性,導致第一磁芯本體和第二磁芯本體之間連接不穩定。However, after adding magnetic permeable materials to the glue, the magnetic permeability of the glue is only about 10, while the magnetic permeability of the magnetic core material is greater than 1000. The difference between the two is relatively large, so the effect of adding magnetic permeable materials to the glue is not good. , In addition, adjusting the magnetically conductive material in the glue will also reduce the viscosity of the glue, causing the connection between the first magnetic core body and the second magnetic core body to be unstable.
本申請實施例提供了一種電子器件和電子設備,該電子器件能夠有效解決兩個磁芯之間由於間隙的存在而導致的漏磁問題,進而提升電子器件的電感量。Embodiments of the present application provide an electronic device and electronic equipment. The electronic device can effectively solve the magnetic leakage problem caused by the existence of a gap between two magnetic cores, thereby increasing the inductance of the electronic device.
本申請實施例第一方面提供一種電子器件,包括:第一磁芯和第二磁芯,其中,所述第一磁芯的底面與所述第二磁芯的頂面貼合連接,且所述第一磁芯的底面上設置有與所述第二磁芯的頂面貼合的第一鏡面,所述第二磁芯的頂面上設置有與所述第一鏡面相對的第二鏡面;所述第一磁芯上設置有第一連接面,所述第二磁芯上設置有第二連接面,所述第一連接面和所述第二連接面之間透過黏合物連接;所述第一連接面和所述第二連接面中的至少一個與所述第一鏡面或所述第二鏡面相互垂直。A first aspect of the embodiment of the present application provides an electronic device, including: a first magnetic core and a second magnetic core, wherein the bottom surface of the first magnetic core is closely connected to the top surface of the second magnetic core, and the The bottom surface of the first magnetic core is provided with a first mirror surface that is in contact with the top surface of the second magnetic core. The top surface of the second magnetic core is provided with a second mirror surface opposite to the first mirror surface. ; The first magnetic core is provided with a first connection surface, the second magnetic core is provided with a second connection surface, and the first connection surface and the second connection surface are connected through an adhesive; so At least one of the first connecting surface and the second connecting surface is perpendicular to the first mirror surface or the second mirror surface.
本申請實施例中的電子器件透過將第一磁芯的底面和第二磁芯的頂面貼合連接,並在第一磁芯的底面上設置有與第二磁芯的頂面貼合的第一鏡面,第二磁芯的頂面上設置有與第一鏡面相對的第二鏡面,由於鏡面的表面比較光滑,粗糙度小,所以可以使第一磁芯和第二磁芯緊密貼合,這樣可以減少甚至消除第一磁芯和第二磁芯之間的間隙,從而使第一磁芯和第二磁芯之間的磁通回路連通,進而減少漏磁、弱磁導致的電感量偏低的問題,進而加強訊號傳輸能力,減少電子器件磁芯之間的干擾,減少網路訊號的損耗。另外,透過在第一磁芯上設置第一連接面,透過在第二磁芯上設置第二連接面,然後將第一連接面和第二連接面透過黏合物連接,可以使第一磁芯和第二磁芯固定連接,另外,由於第一連接面和第二連接面中的至少一個與第一鏡面或第二鏡面相互垂直,所以第一連接面和第二連接面不會同時位於第一鏡面和第二鏡面上,這樣第一連接面和第二連接面就不會占用第一磁芯和第二磁芯的連接空間,從而保證第一磁芯和第二磁芯的電感量。The electronic device in the embodiment of the present application is connected by bonding the bottom surface of the first magnetic core and the top surface of the second magnetic core, and is provided with a bottom surface of the first magnetic core that is bonded to the top surface of the second magnetic core. A second mirror surface opposite to the first mirror surface is provided on the top surface of the first mirror surface and the second magnetic core. Since the surface of the mirror surface is relatively smooth and has small roughness, the first magnetic core and the second magnetic core can be closely adhered to each other. , this can reduce or even eliminate the gap between the first magnetic core and the second magnetic core, thereby connecting the magnetic flux loop between the first magnetic core and the second magnetic core, thereby reducing the inductance caused by magnetic leakage and magnetic field weakening. The problem is that it is too low, thereby enhancing the signal transmission capability, reducing the interference between the magnetic cores of electronic devices, and reducing the loss of network signals. In addition, by arranging a first connecting surface on the first magnetic core, by arranging a second connecting surface on the second magnetic core, and then connecting the first connecting surface and the second connecting surface through adhesive, the first magnetic core can be is fixedly connected to the second magnetic core. In addition, since at least one of the first connection surface and the second connection surface is perpendicular to the first mirror surface or the second mirror surface, the first connection surface and the second connection surface will not be located on the third side at the same time. A mirror surface and a second mirror surface, so that the first connection surface and the second connection surface will not occupy the connection space of the first magnetic core and the second magnetic core, thereby ensuring the inductance of the first magnetic core and the second magnetic core.
在一種可選的實現方式中,所述第二磁芯包括第一端部、第二端部和繞線部;其中,所述第一端部和所述第二端部分別位於所述繞線部的兩端,以使所述第二磁芯呈工字型結構;所述第一端部和所述第二端部的頂面上均設置有所述第二鏡面。In an optional implementation, the second magnetic core includes a first end, a second end and a winding part; wherein the first end and the second end are respectively located on the winding. Both ends of the wire portion are arranged so that the second magnetic core has an I-shaped structure; the second mirror surface is provided on the top surfaces of the first end portion and the second end portion.
本申請實施例中,透過將第一端部和第二端部的頂面上均設置有第二鏡面,可以使第二磁芯的兩端均與第一磁芯貼合連接,從而保證第一磁芯和第二磁芯之間的磁通量閉合,進而避免漏磁、弱磁等不良現象,提高電子器件的電感量。In the embodiment of the present application, by arranging second mirror surfaces on the top surfaces of the first end and the second end, both ends of the second magnetic core can be closely connected to the first magnetic core, thereby ensuring that the The magnetic flux between the first magnetic core and the second magnetic core is closed, thereby avoiding undesirable phenomena such as magnetic flux leakage and weak magnetic field, and increasing the inductance of the electronic device.
在一種可選的實現方式中,所述第一磁芯為板狀結構,且所述第一磁芯包括:前側壁、後側壁、左側壁和右側壁;其中,所述前側壁和所述後側壁相對設置;所述左側壁和所述右側壁相對設置。In an optional implementation, the first magnetic core has a plate-like structure, and the first magnetic core includes: a front side wall, a rear side wall, a left side wall and a right side wall; wherein the front side wall and the The rear side walls are arranged oppositely; the left side wall and the right side wall are arranged oppositely.
在一種可選的實現方式中,所述前側壁的兩端分別設有一個所述第一連接面,所述後側壁的兩端分別設有一個所述第一連接面;其中,所述前側壁上的所述第一連接面和所述後側壁上的所述第一連接面相對設置;所述第一連接面與所述第一鏡面或所述第二鏡面相互垂直。In an optional implementation, the first connection surface is provided at both ends of the front side wall, and the first connection surface is provided at both ends of the rear side wall; wherein, the front side wall is provided with a first connection surface at both ends of the rear side wall. The first connection surface on the side wall and the first connection surface on the rear side wall are arranged oppositely; the first connection surface and the first mirror surface or the second mirror surface are perpendicular to each other.
本申請實施例中,透過將第一連接面設置在前側壁和後側壁上,可以使第一連接面與第一鏡面或第二鏡面相互垂直,進而防止第一連接面占用第一磁芯和第二磁芯之間的連接空間,保證第一鏡面和第二鏡面的尺寸較大,進而提高電子器件的電感量,進而加強訊號傳輸能力。In the embodiment of the present application, by arranging the first connection surface on the front side wall and the rear side wall, the first connection surface and the first mirror surface or the second mirror surface can be made perpendicular to each other, thereby preventing the first connection surface from occupying the first magnetic core and the second mirror surface. The connection space between the second magnetic cores ensures that the first mirror surface and the second mirror surface are larger in size, thereby increasing the inductance of the electronic device and thereby enhancing the signal transmission capability.
在一種可選的實現方式中,所述第一磁芯在所述繞線部徑向方向上的寬度小於所述第二磁芯,以使所述第一連接面與所述第二磁芯的外側邊緣之間形成所述第二連接面;所述第二連接面位於所述第二磁芯的頂面上,所述第二連接面與所述第一連接面相互垂直。In an optional implementation, the width of the first magnetic core in the radial direction of the winding portion is smaller than that of the second magnetic core, so that the first connecting surface and the second magnetic core The second connection surface is formed between the outer edges of the magnetic core; the second connection surface is located on the top surface of the second magnetic core, and the second connection surface and the first connection surface are perpendicular to each other.
透過將第一磁芯的寬度設置的小於第二磁芯,可以給第二連接面的設置提供空間,進而方便將第一磁芯和第二磁芯固定連接。By setting the width of the first magnetic core smaller than the second magnetic core, space can be provided for the arrangement of the second connection surface, thereby facilitating the fixed connection of the first magnetic core and the second magnetic core.
在一種可選的實現方式中,所述第一磁芯在所述繞線部徑向方向上的寬度小於所述第二磁芯;所述第一端部上設有至少一個向上延伸的第一凸壁,所述第二端部上設有至少一個所述第一凸壁,且所述第一凸壁與所述第一連接面相對設置;所述第一凸壁上設置有所述第二連接面,所述第二連接面與所述第一連接面相對設置;所述第二連接面與所述第一鏡面或所述第二鏡面相互垂直。In an optional implementation, the width of the first magnetic core in the radial direction of the winding portion is smaller than that of the second magnetic core; at least one upwardly extending third core is provided on the first end. A convex wall, at least one first convex wall is provided on the second end, and the first convex wall is arranged opposite to the first connecting surface; the first convex wall is provided with the The second connection surface is arranged opposite to the first connection surface; the second connection surface and the first mirror surface or the second mirror surface are perpendicular to each other.
這樣透過在第二磁芯上設置向上延伸的第一凸壁,可以使第二連接面設置在第一凸壁上,這樣可以將第一連接面和第二連接面均設置在第一磁芯的外側,這樣第一連接面和第二連接面均不會占用第一鏡面和第二鏡面的空間,從而保證第一鏡面和第二鏡面的接觸面積足夠大,進而提高磁芯的磁導率,提高電子器件的訊號傳輸能力。另外,透過設置第一凸壁,可以增大第二連接面的面積,從而增加第一磁芯和第二磁芯之間的連接可靠性。In this way, by arranging the first convex wall extending upward on the second magnetic core, the second connecting surface can be disposed on the first convex wall, so that both the first connecting surface and the second connecting surface can be disposed on the first magnetic core. outside, so that neither the first connection surface nor the second connection surface takes up the space of the first mirror surface and the second mirror surface, thereby ensuring that the contact area between the first mirror surface and the second mirror surface is large enough, thereby improving the magnetic permeability of the magnetic core. , improve the signal transmission capability of electronic devices. In addition, by providing the first convex wall, the area of the second connection surface can be increased, thereby increasing the connection reliability between the first magnetic core and the second magnetic core.
在一種可選的實現方式中,所述左側壁上設有所述第一連接面,所述右側壁上設有所述第一連接面,所述左側壁上的所述第一連接面和所述右側壁上的所述第一連接面相對設置;所述第一連接面與所述第一鏡面或所述第二鏡面相互垂直。In an optional implementation, the first connection surface is provided on the left side wall, the first connection surface is provided on the right side wall, and the first connection surface on the left side wall and The first connection surfaces on the right side wall are arranged oppositely; the first connection surface and the first mirror surface or the second mirror surface are perpendicular to each other.
透過將第一連接面設置在第一磁芯的左側壁和右側壁,可以使第一連接面與第一鏡面或第二鏡面相互垂直,進而防止第一連接面占用第一磁芯和第二磁芯之間的連接空間,保證第一鏡面和第二鏡面的尺寸較大,進而提高電子器件的電感量,進而加強訊號傳輸能力。By arranging the first connection surface on the left and right walls of the first magnetic core, the first connection surface and the first mirror surface or the second mirror surface can be made perpendicular to each other, thereby preventing the first connection surface from occupying the first magnetic core and the second mirror surface. The connection space between the magnetic cores ensures that the first mirror surface and the second mirror surface are larger in size, thereby increasing the inductance of the electronic device and thereby enhancing the signal transmission capability.
在一種可選的實現方式中,所述第一磁芯在所述繞線部軸向方向上的長度小於所述第二磁芯,以使所述左側壁和所述右側壁與所述第二磁芯的外側邊緣之間形成所述第二連接面;所述第二連接面位於所述第二磁芯的頂面上,所述第二連接面與所述第一連接面相互垂直。In an optional implementation, the length of the first magnetic core in the axial direction of the winding portion is smaller than that of the second magnetic core, so that the left side wall and the right side wall are aligned with the third The second connection surface is formed between the outer edges of the two magnetic cores; the second connection surface is located on the top surface of the second magnetic core, and the second connection surface and the first connection surface are perpendicular to each other.
透過將第一磁芯的長度設置的小於第二磁芯,可以給第二連接面的設置提供空間,進而方便將第一磁芯和第二磁芯固定連接。By setting the length of the first magnetic core to be shorter than the second magnetic core, space can be provided for the arrangement of the second connection surface, thereby facilitating the fixed connection of the first magnetic core and the second magnetic core.
在一種可選的實現方式中,所述第一磁芯在所述繞線部軸向方向上的長度小於所述第二磁芯;所述第一端部上設置有向上延伸的第二凸壁,且所述第二凸壁與所述左側壁上的所述第一連接面相對設置;所述第二端部上設置有所述第二凸壁,且所述第二凸壁與所述右側壁上的所述第一連接面相對設置;所述第二凸壁上設置有所述第二連接面,所述第二連接面與所述第一連接面相對設置;所述第二連接面與所述第一鏡面或所述第二鏡面相互垂直。In an optional implementation, the length of the first magnetic core in the axial direction of the winding portion is smaller than that of the second magnetic core; the first end is provided with a second protrusion extending upward. wall, and the second convex wall is arranged opposite to the first connection surface on the left side wall; the second convex wall is provided on the second end, and the second convex wall is connected to the first connection surface on the left side wall. The first connecting surface on the right side wall is arranged oppositely; the second connecting surface is arranged on the second convex wall, and the second connecting surface is arranged opposite to the first connecting surface; the second connecting surface is arranged oppositely; The connection surface and the first mirror surface or the second mirror surface are perpendicular to each other.
這樣透過在第二磁芯上設置向上延伸的第二凸壁,可以使第二連接面設置在第二凸壁上,進而為第二連接面提供空間,另外,這樣可以將第一連接面和第二連接面均設置在第一磁芯的外側,以使第一連接面和第二連接面均不會占用第一鏡面和第二鏡面的空間,從而保證第一鏡面和第二鏡面的接觸面積足夠大,進而提高磁芯的磁導率,提高電子器件的訊號傳輸能力。另外,透過設置第二凸壁,可以增大第二連接面的面積,從而增加第一磁芯和第二磁芯之間的連接可靠性。In this way, by arranging the second convex wall extending upward on the second magnetic core, the second connection surface can be provided on the second convex wall, thereby providing space for the second connection surface. In addition, the first connection surface and the second convex wall can be connected to each other. The second connection surfaces are arranged outside the first magnetic core, so that neither the first connection surface nor the second connection surface takes up the space of the first mirror surface and the second mirror surface, thereby ensuring the contact between the first mirror surface and the second mirror surface. The area is large enough to increase the magnetic permeability of the magnetic core and improve the signal transmission capability of electronic devices. In addition, by providing the second convex wall, the area of the second connection surface can be increased, thereby increasing the connection reliability between the first magnetic core and the second magnetic core.
在一種可選的實現方式中,所述第一磁芯的底面的外側邊緣設置有向下延伸的凸沿;所述凸沿位於所述第二磁芯的外側,且所述凸沿的內壁與所述第二磁芯的外壁相對設置;所述凸沿的內壁上設置有第一連接面,所述第二磁芯的外壁上設置有第二連接面;所述第一連接面和所述第二連接面相對設置;所述第一連接面和所述第二連接面均與所述第一鏡面或所述第二鏡面相互垂直。In an optional implementation, the outer edge of the bottom surface of the first magnetic core is provided with a downwardly extending convex edge; the convex edge is located on the outer side of the second magnetic core, and the inner edge of the convex edge The wall is arranged opposite to the outer wall of the second magnetic core; the inner wall of the convex edge is provided with a first connection surface, and the outer wall of the second magnetic core is provided with a second connection surface; the first connection surface It is arranged opposite to the second connecting surface; the first connecting surface and the second connecting surface are both perpendicular to the first mirror surface or the second mirror surface.
透過在第一磁芯的底面的外側設置向下延伸的凸沿,並且,凸沿位於第二磁芯的外側,這樣可以使第二磁芯和第一磁芯之間的第一鏡面和第二鏡面的尺寸達到最大,進而提高電子器件的電感量。另外,透過設置凸沿,可以給第一連接面的設置提供空間,並且將第一連接面設置在凸沿上可以增加第一連接面和第二連接面的接觸面積,進而提高第一磁芯和第二磁芯的連接穩固性。By arranging a downwardly extending convex edge on the outside of the bottom surface of the first magnetic core, and the convex edge is located on the outside of the second magnetic core, the first mirror surface and the third mirror surface between the second magnetic core and the first magnetic core can be The size of the second mirror reaches the maximum, thereby increasing the inductance of the electronic device. In addition, by arranging the convex edge, space can be provided for the arrangement of the first connection surface, and arranging the first connection surface on the convex edge can increase the contact area between the first connection surface and the second connection surface, thereby increasing the size of the first magnetic core. and the stability of the connection to the second magnetic core.
在一種可選的實現方式中,所述第一磁芯的所述前側壁和所述後側壁的底端均設置有一個所述凸沿;每個所述凸沿與所述第二磁芯相對的位置均設置有所述第一連接面;所述第二磁芯上與所述第一連接面相對的位置為所述第二連接面。In an optional implementation, the bottom ends of the front side wall and the rear side wall of the first magnetic core are each provided with one of the convex edges; each of the convex edges is in contact with the second magnetic core The first connection surface is provided at opposite positions; the position on the second magnetic core opposite to the first connection surface is the second connection surface.
在一種可選的實現方式中,所述第一磁芯的所述左側壁和所述右側壁的底端均設置有一個所述凸沿;每個所述凸沿與所述第二磁芯相對的位置均設置有所述第一連接面;所述第二磁芯上與所述第一連接面相對的位置為所述第二連接面。In an optional implementation, the bottom ends of the left side wall and the right side wall of the first magnetic core are each provided with one of the convex edges; each of the convex edges is in contact with the second magnetic core The first connection surface is provided at opposite positions; the position on the second magnetic core opposite to the first connection surface is the second connection surface.
在一種可選的實現方式中,所述第一鏡面和所述第二鏡面在所述繞線部軸向方向上的長度大於所述繞線部的長度。In an optional implementation, the lengths of the first mirror surface and the second mirror surface in the axial direction of the winding part are greater than the length of the winding part.
這樣可以增大第一鏡面和第二鏡面的面積,進而提高第一磁芯和第二磁芯的接觸面積,從而提高磁導率,進而提高電子器件的電感量。In this way, the areas of the first mirror surface and the second mirror surface can be increased, thereby increasing the contact area between the first magnetic core and the second magnetic core, thereby increasing the magnetic permeability and thereby increasing the inductance of the electronic device.
在一種可選的實現方式中,所述第一磁芯和所述第二磁芯相對所述繞線部的中心軸線呈軸對稱結構。In an optional implementation, the first magnetic core and the second magnetic core have an axially symmetrical structure relative to the central axis of the winding portion.
在一種可選的實現方式中,所述黏合物為耐回流溫度超過270℃的膠水。In an optional implementation, the adhesive is glue that can withstand a reflow temperature exceeding 270°C.
這樣在將電子器件焊接到電路板上時,黏合物不會應為焊接溫度過高而融化,從而避免第一磁芯從第二磁芯上脫離,進而減少電子器件的報廢率。In this way, when the electronic device is welded to the circuit board, the adhesive will not melt due to excessive welding temperature, thereby preventing the first magnetic core from detaching from the second magnetic core, thus reducing the scrap rate of the electronic device.
需要說明的是,電路板的焊接溫度一般在270℃左右。It should be noted that the soldering temperature of circuit boards is generally around 270°C.
在一種可選的實現方式中,所述黏合物為環氧膠水。In an optional implementation, the adhesive is epoxy glue.
透過將黏合物設置成環氧膠水,相對於現有技術中採用添加導磁材料的膠水,本申請實施例中的環氧膠水的黏結性能更好,因為在膠水中摻入顆粒狀的導磁材料會破壞膠水內部的分子之間的作用力,導致膠水的黏結性能變差。另外,環氧膠水能夠耐高溫,這樣在將該電子器件焊接到電路板上時,可以保證黏合物在受熱情況下不會融化變軟,最後導致第一磁芯和第二磁芯之間出現脫落、偏移,最終導致產品報廢等問題。By configuring the adhesive as epoxy glue, compared to the glue with magnetically conductive materials added in the prior art, the epoxy glue in the embodiment of the present application has better bonding performance because granular magnetically conductive materials are mixed into the glue. It will destroy the interaction between the molecules inside the glue, resulting in the deterioration of the adhesive properties of the glue. In addition, epoxy glue can withstand high temperatures, so that when the electronic device is welded to the circuit board, it can ensure that the adhesive will not melt and soften under heat, which will eventually lead to a gap between the first magnetic core and the second magnetic core. Falling off, shifting, eventually leading to product scrapping and other problems.
在一種可選的實現方式中,所述第一鏡面和所述第二鏡面的粗糙度Ra的取值範圍均為0.05~0.2um。In an optional implementation manner, the roughness Ra of the first mirror surface and the second mirror surface both ranges from 0.05 to 0.2um.
本申請實施例第二方面提供一種電子設備,該電子設備包括電路板以及上述電子器件。A second aspect of the embodiment of the present application provides an electronic device, which includes a circuit board and the above-mentioned electronic device.
本申請實施例中的電子設備透過設置上述電子器件,由於電子器件的第一磁芯的底面和第二磁芯的頂面貼合連接,並且第一磁芯的底面上設置有與第二磁芯的頂面貼合的第一鏡面,第二磁芯的頂面上設置有與第一鏡面相對的第二鏡面,這樣可以減少甚至消除第一磁芯和第二磁芯之間的間隙,從而使第一磁芯和第二磁芯之間的磁通回路連通,進而減少漏磁、弱磁導致的電感量偏低的問題,進而加強訊號傳輸能力,減少電子器件磁芯之間的干擾,減少網路訊號的損耗,從而可以提高電子設備的電子性能。The electronic device in the embodiment of the present application is provided with the above-mentioned electronic device, because the bottom surface of the first magnetic core and the top surface of the second magnetic core of the electronic device are closely connected, and the bottom surface of the first magnetic core is provided with a second magnetic core. The top surface of the core is attached to the first mirror surface, and the top surface of the second magnetic core is provided with a second mirror surface opposite to the first mirror surface. This can reduce or even eliminate the gap between the first magnetic core and the second magnetic core. This allows the magnetic flux loop between the first magnetic core and the second magnetic core to be connected, thus reducing the problem of low inductance caused by magnetic leakage and magnetic field weakening, thereby enhancing the signal transmission capability and reducing interference between the magnetic cores of electronic devices. , reduce the loss of network signals, thereby improving the electronic performance of electronic devices.
本申請的實施方式部分使用的術語僅用於對本申請的具體實施例進行解釋,而非旨在限制本申請。The terms used in the implementation part of the present application are only used to explain specific embodiments of the present application and are not intended to limit the present application.
除非上下文另有要求,否則,在整個說明書和權利要求書中,術語“包括(comprise)”及其其他形式例如第三人稱單數形式“包括(comprises)”和現在分詞形式“包括(comprising)”被解釋為開放、包含的意思,即為“包含,但不限於”。在說明書的描述中,術語“一個實施例(one embodiment)”、“一些實施例(some embodiments)”、“示例性實施例(exemplary embodiments)”、“示例(example)”或“一些示例(some examples)”等旨在表明與該實施例或示例相關的特定特徵、結構、材料或特性包括在本公開的至少一個實施例或示例中。上述術語的示意性表示不一定是指同一實施例或示例。此外,所述的特定特徵、結構、材料或特點可以以任何適當方式包括在任何一個或多個實施例或示例中。Unless the context otherwise requires, throughout the specification and claims, the term "comprise" and its other forms such as the third person singular "comprises" and the present participle "comprising" are used Interpreted as open and inclusive, it means "including, but not limited to." In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example" or "some examples" are used. examples)" and the like are intended to indicate that a particular feature, structure, material or characteristic associated with the embodiment or example is included in at least one embodiment or example of the present disclosure. The schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials or characteristics described may be included in any suitable manner in any one or more embodiments or examples.
此外,本申請中,“前”、“後”等方位術語是相對於附圖中的部件示意置放的方位來定義的,應當理解到,這些方向性術語是相對的概念,它們用於相對於的描述和澄清,其可以根據附圖中部件所放置的方位的變化而相應地發生變化。In addition, in this application, directional terms such as "front" and "back" are defined relative to the schematically placed directions of the components in the drawings. It should be understood that these directional terms are relative concepts and they are used relative to each other. The descriptions and clarifications may change accordingly according to the changes in the orientation of the components in the drawings.
在本申請實施例中,“和/或”,僅僅是一種描述關聯物件的關聯關係,表示可以存在三種關係,例如,A和/或B,可以表示:單獨存在A,同時存在A和B,單獨存在B這三種情況。另外,本文中字元“/”,一般表示前後關聯物件是一種“或”的關係。隨著網路技術的發展,人們在對網速的要求也越來越高,而網速與網路變壓器的電感量規格密切相關。In the embodiment of this application, "and/or" is just an association relationship describing related objects, indicating that there can be three relationships. For example, A and/or B can mean: A exists alone, and A and B exist simultaneously. There are three cases of B alone. In addition, the character "/" in this article generally indicates that the related objects are in an "or" relationship. With the development of network technology, people have higher and higher requirements for network speed, and network speed is closely related to the inductance specifications of network transformers.
網路變壓器通常包括兩個磁芯,並且兩個磁芯之間透過膠水連接,但是由於膠水的設置使得兩個磁芯之間存在間隙,這樣就導致兩個磁芯之間的磁通路不閉合,從而導致弱磁、漏磁等問題,從而導致網路變壓器的電感量規格無法滿足要求。Network transformers usually include two magnetic cores, and the two magnetic cores are connected through glue. However, due to the setting of the glue, there is a gap between the two magnetic cores, which causes the magnetic path between the two magnetic cores not to be closed. , which leads to problems such as magnetic field weakening and magnetic leakage, causing the inductance specifications of the network transformer to fail to meet the requirements.
目前,為了解決上述問題,通常採用在膠水中添加導磁材料,以增加膠水的磁導率,然而這種方法並不能大幅度提高膠水的磁導率,還會導致膠水的黏性降低,使得兩個磁芯之間的連接穩固性降低,導致網路變壓器容易報廢。另外,還可以透過將膠水設置在網路變壓器的繞組上,這樣可以有效減小兩個磁芯之間的間隙,改善漏磁的問題。然而,在繞組上設置膠水以後,由於膠水的介電常數要大於空氣的介電常數,所以會導致繞組上產生寄生電容,進而導致網路變壓器的高頻參數性能變差。At present, in order to solve the above problems, magnetically conductive materials are usually added to the glue to increase the magnetic permeability of the glue. However, this method cannot greatly increase the magnetic permeability of the glue, and will also cause the viscosity of the glue to decrease, making the glue less viscous. The connection stability between the two magnetic cores is reduced, causing the network transformer to be easily scrapped. In addition, glue can also be placed on the windings of the network transformer, which can effectively reduce the gap between the two cores and improve the problem of magnetic leakage. However, after glue is placed on the winding, since the dielectric constant of the glue is greater than the dielectric constant of air, parasitic capacitance will be generated on the winding, which will lead to the deterioration of the high-frequency parameter performance of the network transformer.
為了解決上述問題,第一方面,本申請實施例提供了一種電子器件,透過將第一磁芯和第二磁芯之間的連接面設置成鏡面,以減小第一磁芯和第二磁芯之間的間隙,以達到提高電感量的目的。In order to solve the above problems, in a first aspect, embodiments of the present application provide an electronic device, which reduces the size of the first magnetic core and the second magnetic core by configuring the connection surface between the first magnetic core and the second magnetic core to be a mirror surface. The gap between cores is used to increase the inductance.
本申請提供的電子器件可以為變壓器或電感器,也可以為網路變壓器或者其它的電子器件,下面具體以該電子器件網路變壓器為例進行說明。The electronic device provided in this application may be a transformer or an inductor, or may be a network transformer or other electronic device. The electronic device network transformer will be specifically described below as an example.
以下對本申請實施例的電子器件的具體結構進行詳細說明。The specific structure of the electronic device according to the embodiment of the present application will be described in detail below.
圖1是本申請一實施例提供的一種電子器件的結構示意圖。圖2是圖1的爆炸結構示意圖。如圖1和圖2所示,本實施例提供一種電子器件100,該電子器件100至少可以包括:第一磁芯110和第二磁芯120,其中,第一磁芯110的底面111與第二磁芯120的頂面121貼合連接,且第一磁芯110的底面111上設置有與第二磁芯120的頂面121貼合的第一鏡面116,第二磁芯120的頂面121上設置有與第一鏡面116相對的第二鏡面125;第一磁芯110上設置有第一連接面117,第二磁芯120上設置有第二連接面126,第一連接面117和第二連接面126之間透過黏合物130連接。FIG. 1 is a schematic structural diagram of an electronic device provided by an embodiment of the present application. Figure 2 is a schematic diagram of the explosion structure of Figure 1. As shown in Figures 1 and 2, this embodiment provides an electronic device 100. The electronic device 100 may at least include: a first magnetic core 110 and a second magnetic core 120, wherein the bottom surface 111 of the first magnetic core 110 is in contact with the second magnetic core 120. The top surfaces 121 of the two magnetic cores 120 are closely connected, and the bottom surface 111 of the first magnetic core 110 is provided with a first mirror surface 116 that is bonded to the top surface 121 of the second magnetic core 120 . The top surface of the second magnetic core 120 121 is provided with a second mirror surface 125 opposite to the first mirror surface 116; the first magnetic core 110 is provided with a first connection surface 117, the second magnetic core 120 is provided with a second connection surface 126, the first connection surface 117 and The second connecting surfaces 126 are connected through an adhesive 130 .
第一鏡面116和第二鏡面125可以相互平行,第一連接面117和第一鏡面116相互垂直(相當於也與第二鏡面125相互垂直),第二連接面126設置在第二磁芯120的頂面121上,並且第二連接面126位於第二鏡面125的延長面上,也就是說,第二連接面126和第二鏡面125平行。當然,在一些實施例中,只要是第一連接面117和第二連接面126其中的一個與第一鏡面116相互垂直,就可以保證第一連接面117和第二連接面126不會占用第一鏡面116和第二鏡面125的空間,進而減小第一磁芯110和第二磁芯120之間的接觸面積,從而保證電子器件100的電感量較高。The first mirror surface 116 and the second mirror surface 125 can be parallel to each other, the first connection surface 117 and the first mirror surface 116 are perpendicular to each other (equivalent to also perpendicular to the second mirror surface 125 ), and the second connection surface 126 is provided on the second magnetic core 120 on the top surface 121 , and the second connecting surface 126 is located on the extended surface of the second mirror surface 125 , that is to say, the second connecting surface 126 and the second mirror surface 125 are parallel. Of course, in some embodiments, as long as one of the first connection surface 117 and the second connection surface 126 is perpendicular to the first mirror surface 116, it can be ensured that the first connection surface 117 and the second connection surface 126 will not occupy the third connection surface. The space between the first mirror surface 116 and the second mirror surface 125 further reduces the contact area between the first magnetic core 110 and the second magnetic core 120, thereby ensuring a high inductance of the electronic device 100.
本申請實施例中的電子器件100透過將第一磁芯110的底面111和第二磁芯120的頂面121貼合連接,並在第一磁芯110的底面111上設置有與第二磁芯120的頂面121貼合的第一鏡面116,第二磁芯120的頂面121上設置有與第一鏡面116相對的第二鏡面125,由於鏡面的表面比較光滑,粗糙度小,所以可以使第一磁芯110和第二磁芯120緊密貼合,這樣可以減少甚至消除第一磁芯110和第二磁芯120之間的間隙,從而使第一磁芯110和第二磁芯120之間的磁通回路連通,進而減少漏磁、弱磁導致的電感量偏低的問題,進而加強訊號傳輸能力,減少電子器件磁芯之間的干擾,減少網路訊號的損耗。The electronic device 100 in the embodiment of the present application is connected by fitting the bottom surface 111 of the first magnetic core 110 and the top surface 121 of the second magnetic core 120, and is provided with a second magnetic core on the bottom surface 111 of the first magnetic core 110. The top surface 121 of the core 120 is attached to the first mirror surface 116, and the top surface 121 of the second magnetic core 120 is provided with a second mirror surface 125 opposite to the first mirror surface 116. Since the surface of the mirror surface is relatively smooth and has small roughness, The first magnetic core 110 and the second magnetic core 120 can be closely adhered to each other, so that the gap between the first magnetic core 110 and the second magnetic core 120 can be reduced or even eliminated, thereby making the first magnetic core 110 and the second magnetic core The magnetic flux loops between 120 are connected, thereby reducing the problem of low inductance caused by magnetic flux leakage and weak magnetic field, thereby enhancing the signal transmission capability, reducing the interference between the magnetic cores of electronic devices, and reducing the loss of network signals.
另外,透過在第一磁芯110上設置第一連接面117,透過在第二磁芯120上設置第二連接面126,然後將第一連接面117和第二連接面126透過黏合物130連接,可以使第一磁芯110和第二磁芯120固定連接,另外,由於第一連接面117和第二連接面126中的至少一個與第一鏡面116或第二鏡面125相互垂直,所以第一連接面117和第二連接面126不會同時位於第一鏡面116和第二鏡面125上,這樣第一連接面117和第二連接面126就不會占用第一磁芯110和第二磁芯120的連接空間,從而保證第一磁芯110和第二磁芯120的電感量。In addition, the first connection surface 117 is provided on the first magnetic core 110 , the second connection surface 126 is provided on the second magnetic core 120 , and then the first connection surface 117 and the second connection surface 126 are connected through the adhesive 130 , the first magnetic core 110 and the second magnetic core 120 can be fixedly connected. In addition, since at least one of the first connecting surface 117 and the second connecting surface 126 is perpendicular to the first mirror surface 116 or the second mirror surface 125, the first magnetic core 110 and the second magnetic core 120 are perpendicular to each other. The first connection surface 117 and the second connection surface 126 will not be located on the first mirror surface 116 and the second mirror surface 125 at the same time, so that the first connection surface 117 and the second connection surface 126 will not occupy the first magnetic core 110 and the second magnetic core. The connection space of the core 120 is thus ensured to ensure the inductance of the first magnetic core 110 and the second magnetic core 120 .
如圖2所示,第二磁芯120包括第一端部122、第二端部123和繞線部124;其中,第一端部122和第二端部123分別位於繞線部124的兩端,以使第二磁芯120呈工字型結構;第一端部122和第二端部123的頂面121上均設置有第二鏡面125。As shown in FIG. 2 , the second magnetic core 120 includes a first end 122 , a second end 123 and a winding part 124 . The first end 122 and the second end 123 are respectively located on both sides of the winding part 124 . end, so that the second magnetic core 120 has an I-shaped structure; a second mirror 125 is provided on the top surface 121 of the first end 122 and the second end 123 .
第一磁芯110為板狀結構,且第一磁芯110包括:前側壁112、後側壁113、左側壁114和右側壁115;其中,前側壁112和後側壁113相對設置;左側壁114和右側壁115相對設置。The first magnetic core 110 has a plate-like structure, and the first magnetic core 110 includes: a front side wall 112, a rear side wall 113, a left side wall 114 and a right side wall 115; wherein the front side wall 112 and the rear side wall 113 are arranged oppositely; the left side wall 114 and The right side walls 115 are arranged oppositely.
為了方便描述,在本實施例中,將前側壁112所在的一面作為電子器件100的前面,將後側壁113所在的一面作為電子器件100的後面,將左側壁114所在的一面作為電子器件100的左面,將右側壁115所在的一面作為電子器件100的右面。For convenience of description, in this embodiment, the side where the front side wall 112 is located is regarded as the front of the electronic device 100 , the side where the rear side wall 113 is located is regarded as the back of the electronic device 100 , and the side where the left side wall 114 is located is regarded as the back side of the electronic device 100 . On the left side, the side where the right side wall 115 is located is regarded as the right side of the electronic device 100 .
如圖2所示,前側壁112的左右兩端分別設有一個第一連接面117,後側壁113的左右兩端分別設有一個第一連接面117;其中,前側壁112上的第一連接面117和後側壁113上的第一連接面117相對設置;第一連接面117與第一鏡面116或第二鏡面125相互垂直。As shown in Figure 2, the left and right ends of the front side wall 112 are respectively provided with a first connection surface 117, and the left and right ends of the rear side wall 113 are respectively provided with a first connection surface 117; wherein, the first connection surface 117 on the front side wall 112 The surface 117 and the first connecting surface 117 on the rear side wall 113 are arranged oppositely; the first connecting surface 117 and the first mirror surface 116 or the second mirror surface 125 are perpendicular to each other.
第一磁芯110在繞線部124徑向方向上的寬度L1小於第二磁芯120的寬度L2,如圖1所示,這樣可以使第一磁芯110的前側壁112和後側壁113內縮於第二磁芯120的外側邊緣,以使第一連接面117與第二磁芯120的外側邊緣之間均形成第二連接面126;第二連接面126位於第二磁芯120的頂面121上,也就是說,第二連接面126位於第二鏡面125的延長面上,第二連接面126與第一連接面117相互垂直。透過將第一磁芯110的寬度L1設置的小於第二磁芯120的寬度L2,可以給第二連接面126的設置提供空間,進而方便將第一磁芯110和第二磁芯120固定連接。The width L1 of the first magnetic core 110 in the radial direction of the winding portion 124 is smaller than the width L2 of the second magnetic core 120 , as shown in FIG. 1 , so that the front side wall 112 and the rear side wall 113 of the first magnetic core 110 can be is retracted from the outer edge of the second magnetic core 120 so that a second connecting surface 126 is formed between the first connecting surface 117 and the outer edge of the second magnetic core 120; the second connecting surface 126 is located on the top of the second magnetic core 120. On the surface 121 , that is to say, the second connection surface 126 is located on the extended surface of the second mirror surface 125 , and the second connection surface 126 and the first connection surface 117 are perpendicular to each other. By setting the width L1 of the first magnetic core 110 to be smaller than the width L2 of the second magnetic core 120, space can be provided for the arrangement of the second connection surface 126, thereby facilitating the fixed connection of the first magnetic core 110 and the second magnetic core 120. .
本申請實施例中,透過將第一連接面117設置在前側壁112和後側壁113上,可以使第一連接面117與第一鏡面116或第二鏡面125相互垂直,進而防止第一連接面117占用第一磁芯110和第二磁芯120之間的連接空間,保證第一鏡面116和第二鏡面125的尺寸較大,進而提高電子器件100的電感量,進而加強訊號傳輸能力。In the embodiment of the present application, by disposing the first connection surface 117 on the front side wall 112 and the rear side wall 113, the first connection surface 117 and the first mirror surface 116 or the second mirror surface 125 can be made perpendicular to each other, thereby preventing the first connection surface from being 117 occupies the connection space between the first magnetic core 110 and the second magnetic core 120 to ensure that the sizes of the first mirror 116 and the second mirror 125 are larger, thereby increasing the inductance of the electronic device 100 and thereby enhancing the signal transmission capability.
第一連接面117和第二連接面126之間設置黏合物130,以使第一磁芯110和第二磁芯120透過第一連接面117和第二連接面126固定連接。An adhesive 130 is disposed between the first connection surface 117 and the second connection surface 126 so that the first magnetic core 110 and the second magnetic core 120 are fixedly connected through the first connection surface 117 and the second connection surface 126 .
另外,在第一磁芯110在繞線部124徑向方向上的寬度L1小於第二磁芯120的寬度L2的情況下,第二磁芯120的還可以為其它形狀的結構,如圖3和圖4所示,第二磁芯120的第一端部122上設有兩個向上延伸的第一凸壁127,兩個第一凸壁127相對設置,一個第一凸壁127與一個第一連接面117相對應,在第一凸壁127的內壁上設置有第二連接面126,第二連接面126與第一連接面117相對設置,在第一連接面117和第二連接面126之間設置有黏合物130,黏合物130用於將第一連接面117和第二連接面126固定連接。In addition, when the width L1 of the first magnetic core 110 in the radial direction of the winding portion 124 is smaller than the width L2 of the second magnetic core 120 , the second magnetic core 120 may also have other shapes, as shown in FIG. 3 As shown in Figure 4, the first end 122 of the second magnetic core 120 is provided with two upwardly extending first protruding walls 127. The two first protruding walls 127 are arranged oppositely, and one first protruding wall 127 and a third protruding wall 127 are arranged oppositely. Corresponding to a connecting surface 117, a second connecting surface 126 is provided on the inner wall of the first protruding wall 127. The second connecting surface 126 is arranged opposite to the first connecting surface 117. Between the first connecting surface 117 and the second connecting surface An adhesive 130 is provided between the first connection surface 117 and the second connection surface 126 . The adhesive 130 is used to firmly connect the first connection surface 117 and the second connection surface 126 .
如圖4所示,在第二端部123上設有兩個第一凸壁127,兩個第一凸壁127相對設置,且一個第一凸壁127與一個第一連接面117相對應;在第一凸壁127的內壁上設置有第二連接面126,第二連接面126與第一連接面117相對設置,且第一連接面117和第二連接面126之間設置有黏合物130,黏合物130用於將第一連接面117和第二連接面126固定連接。As shown in Figure 4, two first protruding walls 127 are provided on the second end 123, the two first protruding walls 127 are arranged oppositely, and one first protruding wall 127 corresponds to a first connecting surface 117; A second connection surface 126 is provided on the inner wall of the first protruding wall 127. The second connection surface 126 is opposite to the first connection surface 117, and an adhesive is provided between the first connection surface 117 and the second connection surface 126. 130, the adhesive 130 is used to firmly connect the first connection surface 117 and the second connection surface 126.
其中,第一連接面117和第二連接面126相互平行,且第一連接面117和第二連接面126均與第一鏡面116或第二鏡面125相互垂直。The first connection surface 117 and the second connection surface 126 are parallel to each other, and both the first connection surface 117 and the second connection surface 126 are perpendicular to the first mirror surface 116 or the second mirror surface 125 .
這樣透過在第二磁芯120上設置向上延伸的第一凸壁127,可以使第二連接面126設置在第一凸壁127上,這樣可以將第一連接面117和第二連接面126均設置在第一磁芯110的外側,這樣第一連接面117和第二連接面126均不會占用第一鏡面116和第二鏡面125的空間,從而保證第一鏡面116和第二鏡面125的接觸面積足夠大,進而提高磁芯的磁導率,提高電子器件100的訊號傳輸能力。另外,透過設置第一凸壁127,可以增大第二連接面126的面積,從而增加第一磁芯110和第二磁芯120之間的連接可靠性,並且,第一凸壁127可以將第一磁芯110限制在第二磁芯120內,以使第一磁芯110不會相對於第二磁芯120移動,進而增加第一磁芯110和第二磁芯120之間的連接穩固性。In this way, by arranging the upwardly extending first convex wall 127 on the second magnetic core 120, the second connecting surface 126 can be disposed on the first convex wall 127, so that the first connecting surface 117 and the second connecting surface 126 can be evenly spaced. It is arranged outside the first magnetic core 110, so that neither the first connection surface 117 nor the second connection surface 126 takes up the space of the first mirror surface 116 and the second mirror surface 125, thereby ensuring the safety of the first mirror surface 116 and the second mirror surface 125. The contact area is large enough, thereby increasing the magnetic permeability of the magnetic core and improving the signal transmission capability of the electronic device 100 . In addition, by providing the first protruding wall 127, the area of the second connection surface 126 can be increased, thereby increasing the connection reliability between the first magnetic core 110 and the second magnetic core 120, and the first protruding wall 127 can The first magnetic core 110 is restricted within the second magnetic core 120 so that the first magnetic core 110 does not move relative to the second magnetic core 120, thereby increasing the stability of the connection between the first magnetic core 110 and the second magnetic core 120. sex.
需要說明的是,本申請實施例中,對於第一凸壁127的形狀、數量以及尺寸均不作具體限制,只要是能夠設置第二連接面126即屬於本申請技術方案的保護範圍。It should be noted that in the embodiment of the present application, there are no specific restrictions on the shape, number and size of the first protruding walls 127. As long as the second connection surface 126 can be provided, it falls within the scope of the technical solution of the present application.
應當理解的是,黏合物130的兩面即為第一連接面117和第二連接面126相對設置,換句話說就是,塗抹黏合物130的位置即為設置第一連接面117和第二連接面126的位置,所以第一連接面117和第二連接面126的位置、大小以及數量與黏合物130設置的位置大小以及數量有關,因此,在本申請實施例中對此並不加以限制。It should be understood that the first connecting surface 117 and the second connecting surface 126 are arranged opposite each other on both sides of the adhesive 130 . In other words, the position where the adhesive 130 is applied is where the first connecting surface 117 and the second connecting surface are arranged. 126, so the position, size and quantity of the first connection surface 117 and the second connection surface 126 are related to the location, size and quantity of the adhesive 130, and therefore are not limited in the embodiment of the present application.
需要說明的是,第一磁芯110相對於繞線部124的軸向上的中心軸線呈軸對稱結構,也就是說,第一磁芯110設置在第二磁芯120的中間位置,這樣可以使第一磁芯110位於繞線部124中心軸線兩側的長度相同,以使繞線部124產生磁通能夠均勻的透過第一磁芯110,進而提高電子器件100的電感量。It should be noted that the first magnetic core 110 has an axially symmetrical structure with respect to the central axis in the axial direction of the winding portion 124. That is to say, the first magnetic core 110 is disposed at the middle position of the second magnetic core 120, so that The lengths of the first magnetic core 110 on both sides of the central axis of the winding portion 124 are the same, so that the magnetic flux generated by the winding portion 124 can evenly pass through the first magnetic core 110 , thereby increasing the inductance of the electronic device 100 .
當然,在一些實施例中,第一磁芯110也可以不設置在第二磁芯120中間的位置,只要是能夠滿足電子器件100的電感量即可,因此,本申請實施例對此並不加以限制。Of course, in some embodiments, the first magnetic core 110 may not be disposed in the middle of the second magnetic core 120 as long as it can meet the inductance of the electronic device 100. Therefore, the embodiment of the present application does not be restricted.
在一種可選的實現方式中,如圖1所示,第一鏡面116和第二鏡面125在繞線部124軸向方向上的長度d3大於繞線部124的長度d4。這樣可以增大第一鏡面116和第二鏡面125的面積,進而提高第一磁芯110和第二磁芯120的接觸面積,從而提高磁導率,進而提高電子器件100的電感量。當然,在一些實施例中,第一鏡面116和第二鏡面125在繞線部124軸向方向上的長度d3也可以小於或等於繞線部124的長度d4,具體可以根據電子器件100的電感量要求來確定,本實施例中對此並不加以限制。In an optional implementation, as shown in FIG. 1 , the length d3 of the first mirror surface 116 and the second mirror surface 125 in the axial direction of the winding part 124 is greater than the length d4 of the winding part 124 . In this way, the areas of the first mirror surface 116 and the second mirror surface 125 can be increased, thereby increasing the contact area of the first magnetic core 110 and the second magnetic core 120 , thereby increasing the magnetic permeability and thereby increasing the inductance of the electronic device 100 . Of course, in some embodiments, the length d3 of the first mirror surface 116 and the second mirror surface 125 in the axial direction of the winding part 124 may also be less than or equal to the length d4 of the winding part 124 , specifically according to the inductance of the electronic device 100 It is determined according to the quantity requirement, which is not limited in this embodiment.
在本申請實施例中,黏合物130為耐回流溫度超過270℃的膠水。這樣在將電子器件100焊接到電路板上時,黏合物130不會應為焊接溫度過高而融化,可以理解的是,膠水融化後延展性變大,這樣就會導致第一磁芯110和第二磁芯120之間的連接不穩定。而將黏合物130為耐回流溫度設置為超過270℃的膠水,這樣就可以避免膠水受熱融化,避免了第一磁芯110和第二磁芯120開裂,從而減少電子器件100的報廢率。In the embodiment of the present application, the adhesive 130 is glue that can withstand a reflow temperature exceeding 270°C. In this way, when the electronic device 100 is soldered to the circuit board, the adhesive 130 will not melt due to the high soldering temperature. It is understandable that the glue becomes more ductile after melting, which will cause the first magnetic core 110 and The connection between the second magnetic cores 120 is unstable. The adhesive 130 is a glue whose reflow resistance temperature is set to exceed 270° C. This can prevent the glue from melting due to heat and prevent the first magnetic core 110 and the second magnetic core 120 from cracking, thus reducing the scrap rate of the electronic device 100 .
需要說明的是,電路板的焊接溫度一般在270℃左右。因此選擇耐回流溫度超過270℃的膠水可以滿足需要,當然,在一些焊接溫度更高的實施例中,也可選擇耐回流溫度超過300℃、320℃或者更高的膠水作為黏合物130,在本申請實施例中對此並不加以限制。It should be noted that the soldering temperature of circuit boards is generally around 270°C. Therefore, choosing glue with a reflow temperature resistance exceeding 270°C can meet the needs. Of course, in some embodiments with higher soldering temperatures, glue with a reflow temperature resistance exceeding 300°C, 320°C or higher can also be selected as the adhesive 130. This is not limited in the embodiments of the present application.
在本申請實施例中,黏合物130可以為環氧膠水。當然,黏合物130也可以為其它的膠水,只要是符合耐回流溫度超過270℃即可。In this embodiment of the present application, the adhesive 130 may be epoxy glue. Of course, the adhesive 130 can also be other glues, as long as the adhesive can withstand a reflow temperature exceeding 270°C.
透過將黏合物130設置成環氧膠水,相對於現有技術中採用添加導磁材料的膠水,本申請實施例中的環氧膠水的黏結性能更好,因為在膠水中摻入顆粒狀的導磁材料會破壞膠水內部的分子之間的作用力,導致膠水的黏結性能變差。另外,環氧膠水能夠耐高溫,這樣在將該電子器件100焊接到電路板上時,可以保證黏合物130在受熱情況下不會融化變軟,最後導致第一磁芯110和第二磁芯120之間出現脫落、偏移,最終導致產品報廢等問題。By configuring the adhesive 130 to be epoxy glue, compared to the glue with magnetic conductive materials added in the prior art, the epoxy glue in the embodiment of the present application has better bonding performance because granular magnetic conductive materials are mixed into the glue. The material will destroy the interaction between the molecules inside the glue, causing the glue's bonding performance to deteriorate. In addition, the epoxy glue can withstand high temperatures, so that when the electronic device 100 is welded to the circuit board, it can be ensured that the adhesive 130 will not melt and become soft when heated, eventually causing the first magnetic core 110 and the second magnetic core to 120, there will be problems such as falling off and shifting, which will eventually lead to product scrapping.
在一種可選的實現方式中,第一鏡面116和第二鏡面125的粗糙度Ra的取值範圍均為0.05~0.2um。In an optional implementation manner, the roughness Ra of the first mirror surface 116 and the second mirror surface 125 both ranges from 0.05 to 0.2um.
其中,本申請實施例中的第一鏡面116和第二鏡面125的粗糙度Ra的取值可以相同,也可以不同,本申請實施例對此並不加以限制。Among them, the values of the roughness Ra of the first mirror surface 116 and the second mirror surface 125 in the embodiment of the present application may be the same or different, and the embodiment of the present application does not limit this.
示例性的,第一鏡面116和第二鏡面125的粗糙度Ra的取值可以相同,例如:第一鏡面116和第二鏡面125的粗糙度Ra均可以為0.05um、0.1um、0.15um、0.2um等合適的數值。在另外一些實施例中,第一鏡面116和第二鏡面125的粗糙度Ra的取值可以不相同,例如:第一鏡面116的粗糙度Ra的取值為0.1um,第二鏡面125的粗糙度Ra的取值為0.05um。For example, the roughness Ra of the first mirror surface 116 and the second mirror surface 125 can have the same value. For example, the roughness Ra of the first mirror surface 116 and the second mirror surface 125 can both be 0.05um, 0.1um, 0.15um, 0.2um and other suitable values. In other embodiments, the values of the roughness Ra of the first mirror surface 116 and the second mirror surface 125 may be different. For example, the value of the roughness Ra of the first mirror surface 116 is 0.1um, and the value of the roughness Ra of the second mirror surface 125 is 0.1um. The value of degree Ra is 0.05um.
需要說明的是,本申請實施例涉及的數值和數值範圍為近似值,受製造工藝的影響,可能會存在一定範圍的誤差,這部分誤差本領域技術人員可以認為忽略不計。It should be noted that the numerical values and numerical ranges involved in the embodiments of this application are approximate values. Affected by the manufacturing process, there may be a certain range of errors. Those skilled in the art can consider these errors to be negligible.
本申請實施例中的第一鏡面116和第二鏡面125均為研磨而成的鏡面,由於鏡面的表面光滑,粗糙度小,因此,第一鏡面116和第二鏡面125貼合在一起後,可以使第一磁芯110和第二磁芯120之間的間隙很小甚至沒有間隙。這樣就可以使第一磁芯110和第二磁芯120之間的磁通路閉合,進而提高電子器件100的電感量。The first mirror surface 116 and the second mirror surface 125 in the embodiment of the present application are both ground mirror surfaces. Since the mirror surfaces have smooth surfaces and small roughness, after the first mirror surface 116 and the second mirror surface 125 are bonded together, The gap between the first magnetic core 110 and the second magnetic core 120 can be made small or even non-existent. In this way, the magnetic path between the first magnetic core 110 and the second magnetic core 120 can be closed, thereby increasing the inductance of the electronic device 100 .
需要說明的是,本申請實施例中的第一磁芯110的結構包括但不限於上述實施例中的結構,其還可以為其它結構,例如,第一磁芯110在繞線部124軸向方向上的長度d1還可以小於第二磁芯120的長度d2。It should be noted that the structure of the first magnetic core 110 in the embodiment of the present application includes but is not limited to the structure in the above-mentioned embodiment, and it can also be other structures. For example, the first magnetic core 110 is axially aligned with the winding portion 124 The length d1 in the direction may also be smaller than the length d2 of the second magnetic core 120 .
如圖5和圖6所示,本申請實施例提供的電子器件100至少可以包括:第一磁芯110和第二磁芯120,第一磁芯110的底面111與第二磁芯120的頂面121貼合連接,第二磁芯120包括第一端部122、第二端部123和繞線部124;第一端部122和第二端部123分別位於繞線部124的兩端,以使第二磁芯120呈工字型結構;第一磁芯110的底面111上設置有與第二磁芯120的頂面121貼合的第一鏡面116,第一端部122和第二端部123的頂面121上均設置有與第一鏡面116相對的第二鏡面125。在第一磁芯110上設置有第一連接面117,在第二磁芯120上設置有與第一連接面117相對的第二連接面126,第一連接面117和第二連接面126之間透過黏合物130連接。As shown in FIGS. 5 and 6 , the electronic device 100 provided by the embodiment of the present application may at least include: a first magnetic core 110 and a second magnetic core 120 , the bottom surface 111 of the first magnetic core 110 and the top surface of the second magnetic core 120 . The second magnetic core 120 includes a first end 122, a second end 123 and a winding part 124; the first end 122 and the second end 123 are respectively located at both ends of the winding part 124, So that the second magnetic core 120 has an I-shaped structure; the bottom surface 111 of the first magnetic core 110 is provided with a first mirror surface 116 that is in contact with the top surface 121 of the second magnetic core 120. The first end 122 and the second The top surface 121 of the end portion 123 is provided with a second mirror surface 125 opposite to the first mirror surface 116 . A first connection surface 117 is provided on the first magnetic core 110 , and a second connection surface 126 opposite to the first connection surface 117 is provided on the second magnetic core 120 . are connected through adhesive 130 .
如圖5所示,第一磁芯110在繞線部124軸向方向上的長度d1還可以小於第二磁芯120的長度d2,在第一磁芯110的左側壁114上可以設置第一連接面117,在右側壁115上也可以設置第一連接面117,其中,左側壁114上的第一連接面117和右側壁115上的第一連接面117相對設置;第一連接面117與第一鏡面116或第二鏡面125相互垂直。As shown in FIG. 5 , the length d1 of the first magnetic core 110 in the axial direction of the winding portion 124 can also be smaller than the length d2 of the second magnetic core 120 , and a first magnetic core 110 can be provided on the left side wall 114 of the first magnetic core 110 . The connecting surface 117 can also be provided on the right side wall 115. The first connecting surface 117 on the left side wall 114 and the first connecting surface 117 on the right side wall 115 are arranged oppositely; the first connecting surface 117 and The first mirror surface 116 or the second mirror surface 125 is perpendicular to each other.
由於,第一磁芯110在繞線部124軸向方向上的長度d1還可以小於第二磁芯120的長度d2,第一磁芯110的左側壁114和右側壁115均內縮於第二磁芯120之上,以使在第二磁芯120的第一端部122的頂面121上以及在第二端部123的頂面121上均可以有設置第二連接面126的空間,如圖6所示,第二連接面126設置在第一端部122和第二端部123的頂面121上,並且第二連接面126從第一端部122和第二端部123的外側邊緣向靠近繞線部124的方向延伸,並且,第二連接面126位於第二鏡面125上,第二連接面126與第一連接面117相互垂直。Since the length d1 of the first magnetic core 110 in the axial direction of the winding portion 124 can be smaller than the length d2 of the second magnetic core 120 , the left side wall 114 and the right side wall 115 of the first magnetic core 110 are both retracted from the second side. above the magnetic core 120, so that there is space for setting the second connecting surface 126 on both the top surface 121 of the first end 122 of the second magnetic core 120 and the top surface 121 of the second end 123, such as As shown in FIG. 6 , the second connection surface 126 is provided on the top surface 121 of the first end 122 and the second end 123 , and the second connection surface 126 is formed from the outer edges of the first end 122 and the second end 123 . Extending in a direction close to the winding portion 124 , the second connection surface 126 is located on the second mirror surface 125 , and the second connection surface 126 and the first connection surface 117 are perpendicular to each other.
黏合物130設置在第一連接面117和第二連接面126上,第一磁芯110和第二磁芯120透過黏合物130固定連接。The adhesive 130 is disposed on the first connection surface 117 and the second connection surface 126 , and the first magnetic core 110 and the second magnetic core 120 are fixedly connected through the adhesive 130 .
需要說明的是,如圖4所示,第一連接面117覆蓋了第一磁芯110的整個左側壁114和整個右側壁115,當然在一些實施例中,也可以將第一連接面117設計為多個尺寸較小的平面,然後間隔設置在左側壁114和右側壁115上。因為,在將第一磁芯110和第二磁芯120進行連接時,可以將黏合物130塗抹至不同的位置,而在第一磁芯110上塗抹黏合物130的位置均屬於第一連接面117,在第二磁芯120上塗抹黏合物130的位置均屬於第二連接面126。因此,在本實施例中,對於第一連接面117和第二連接面126的位置、大小和數量均不作具體限制,只要是第一連接面117位於左側壁114和右側壁115上,且第二連接面126位於第二鏡面125上即屬於本申請技術方案保護的範圍。It should be noted that, as shown in FIG. 4 , the first connection surface 117 covers the entire left side wall 114 and the entire right side wall 115 of the first magnetic core 110 . Of course, in some embodiments, the first connection surface 117 can also be designed. A plurality of planes with smaller sizes are arranged on the left side wall 114 and the right side wall 115 at intervals. Because when connecting the first magnetic core 110 and the second magnetic core 120 , the adhesive 130 can be applied to different positions, and the positions where the adhesive 130 is applied on the first magnetic core 110 all belong to the first connection surface. 117. The positions where the adhesive 130 is applied on the second magnetic core 120 all belong to the second connection surface 126. Therefore, in this embodiment, there are no specific restrictions on the position, size and number of the first connection surface 117 and the second connection surface 126, as long as the first connection surface 117 is located on the left side wall 114 and the right side wall 115, and the The fact that the second connection surface 126 is located on the second mirror surface 125 falls within the scope of protection of the technical solution of this application.
另外,需要說明的是,在一些實施例中,例如:第一磁芯110的大小和第二磁芯120的大小相同時,即,第一磁芯110的外側邊緣和第二磁芯120的外側邊緣平齊時,第一連接面117可以位於第一磁芯110的外側邊緣,第二連接面126可以位於第二磁芯120上與第一連接面117垂直方向上相對的位置,這樣也能將第一磁芯110和第二磁芯120固定連接。並且,這樣還能進一步增加第一鏡面116和第二鏡面125的接觸面積,從而進一步提高電子器件100的電感量。In addition, it should be noted that in some embodiments, for example, when the size of the first magnetic core 110 and the size of the second magnetic core 120 are the same, that is, the outer edge of the first magnetic core 110 and the outer edge of the second magnetic core 120 When the outer edges are flush, the first connection surface 117 can be located on the outer edge of the first magnetic core 110, and the second connection surface 126 can be located on the second magnetic core 120 at a position vertically opposite to the first connection surface 117. In this way, The first magnetic core 110 and the second magnetic core 120 can be fixedly connected. Moreover, this can further increase the contact area between the first mirror surface 116 and the second mirror surface 125, thereby further increasing the inductance of the electronic device 100.
需要說明的是,圖5和圖6中的實施例除了上述特徵不同之外,其它的特徵例如第一鏡面116和第二鏡面125的粗糙度等,均可參見對圖1和圖2中實施例的描述,在此不再贅述。It should be noted that, in addition to the above-mentioned features, the embodiments in Figures 5 and 6 are different. For other features, such as the roughness of the first mirror surface 116 and the second mirror surface 125, etc., please refer to the embodiments in Figures 1 and 2. The description of the example will not be repeated here.
另外,在第一磁芯110在繞線部124軸向方向上的長度d1還可以小於第二磁芯120的長度d2的情況下,第二磁芯120的還可以為其它形狀的結構,如圖7和圖8所示,第一磁芯110在繞線部124軸向方向上的長度d1還可以小於第二磁芯120的長度d2,第一連接面117設置在第一磁芯110的左側壁114和右側壁115上。在本實施例中,第一連接面117與左側壁114和右側壁115的大小相同,所以在本實施例中,左側壁114即為第一連接面117,右側壁115也為第一連接面117。當然,在一些實施例中,第一連接面117的尺寸也可以小於左側壁114和右側壁115,在本申請實施例中對於第一連接面117的尺寸和數量並不加以限制。In addition, when the length d1 of the first magnetic core 110 in the axial direction of the winding portion 124 can be smaller than the length d2 of the second magnetic core 120 , the second magnetic core 120 can also have other shapes, such as As shown in FIGS. 7 and 8 , the length d1 of the first magnetic core 110 in the axial direction of the winding portion 124 can also be smaller than the length d2 of the second magnetic core 120 , and the first connection surface 117 is provided on the first magnetic core 110 On the left side wall 114 and the right side wall 115 . In this embodiment, the first connection surface 117 is the same size as the left side wall 114 and the right side wall 115 . Therefore, in this embodiment, the left side wall 114 is the first connection surface 117 and the right side wall 115 is also the first connection surface. 117. Of course, in some embodiments, the size of the first connection surface 117 may also be smaller than the left side wall 114 and the right side wall 115 . In the embodiment of the present application, the size and number of the first connection surface 117 are not limited.
如圖8所示,第一端部122的上設置有向上延伸的第二凸壁128,且第二凸壁128與左側壁114上的第一連接面117相對設置;第二端部123上設置有第二凸壁128,且第二凸壁128與右側壁115上的第一連接面117相對設置;第二凸壁128上設置有第二連接面126,第二連接面126與第一連接面117相對設置;在第一連接面117和第二連接面126之間設置有黏合物130,黏合物130用於將第一連接面117和第二連接面126固定連接。As shown in FIG. 8 , a second protruding wall 128 extending upward is provided on the first end 122 , and the second protruding wall 128 is opposite to the first connecting surface 117 on the left side wall 114 ; A second convex wall 128 is provided, and the second convex wall 128 is opposite to the first connection surface 117 on the right side wall 115; a second connection surface 126 is provided on the second convex wall 128, and the second connection surface 126 is connected to the first connection surface 126. The connecting surfaces 117 are arranged oppositely; an adhesive 130 is provided between the first connecting surface 117 and the second connecting surface 126 , and the adhesive 130 is used to firmly connect the first connecting surface 117 and the second connecting surface 126 .
其中,第一連接面117和第二連接面126相互平行,且第一連接面117和第二連接面126均與第一鏡面116或第二鏡面125相互垂直。The first connection surface 117 and the second connection surface 126 are parallel to each other, and both the first connection surface 117 and the second connection surface 126 are perpendicular to the first mirror surface 116 or the second mirror surface 125 .
需要說明的是,本申請實施例中,對於第二凸壁128的形狀、數量以及尺寸均不作具體限制,只要是能夠設置第二連接面126即屬於本申請技術方案的保護範圍。It should be noted that in the embodiment of the present application, there are no specific restrictions on the shape, number and size of the second protruding walls 128. As long as the second connection surface 126 can be provided, it falls within the scope of the technical solution of the present application.
透過將第一連接面117設置在第一磁芯110的左側壁114和右側壁115,可以使第一連接面117與第一鏡面116或第二鏡面125相互垂直,進而防止第一連接面117占用第一磁芯110和第二磁芯120之間的連接空間,保證第一鏡面116和第二鏡面125的尺寸較大,進而提高電子器件100的電感量,進而加強訊號傳輸能力。By disposing the first connection surface 117 on the left side wall 114 and the right side wall 115 of the first magnetic core 110 , the first connection surface 117 and the first mirror surface 116 or the second mirror surface 125 can be made perpendicular to each other, thereby preventing the first connection surface 117 from being Occupying the connection space between the first magnetic core 110 and the second magnetic core 120 ensures that the sizes of the first mirror 116 and the second mirror 125 are larger, thereby increasing the inductance of the electronic device 100 and thereby enhancing the signal transmission capability.
透過將第一磁芯110的長度設置的小於第二磁芯120,可以給第二連接面126的設置提供空間,進而方便將第一磁芯110和第二磁芯120固定連接。By setting the length of the first magnetic core 110 to be shorter than the second magnetic core 120 , space can be provided for the second connection surface 126 , thereby facilitating the fixed connection of the first magnetic core 110 and the second magnetic core 120 .
這樣透過在第二磁芯120上設置向上延伸的第二凸壁128,可以使第二連接面126設置在第二凸壁128上,進而為第二連接面126提供空間,另外,這樣可以將第一連接面117和第二連接面126均設置在第一磁芯110的外側,以使第一連接面117和第二連接面126均不會占用第一鏡面116和第二鏡面125的空間,從而保證第一鏡面116和第二鏡面125的接觸面積足夠大,進而提高磁芯的磁導率,提高電子器件100的訊號傳輸能力。另外,透過設置第二凸壁128,可以增大第二連接面126的面積,從而增加第一磁芯110和第二磁芯120之間的連接可靠性。In this way, by arranging the upwardly extending second convex wall 128 on the second magnetic core 120, the second connecting surface 126 can be disposed on the second convex wall 128, thereby providing space for the second connecting surface 126. In addition, this can The first connection surface 117 and the second connection surface 126 are both arranged outside the first magnetic core 110 so that neither the first connection surface 117 nor the second connection surface 126 takes up the space of the first mirror surface 116 and the second mirror surface 125 , thereby ensuring that the contact area between the first mirror surface 116 and the second mirror surface 125 is large enough, thereby increasing the magnetic permeability of the magnetic core and improving the signal transmission capability of the electronic device 100 . In addition, by providing the second protruding wall 128 , the area of the second connection surface 126 can be increased, thereby increasing the connection reliability between the first magnetic core 110 and the second magnetic core 120 .
需要說明的是,圖7和圖8中的實施例除了上述特徵不同之外,其它的特徵例如第一鏡面116和第二鏡面125的粗糙度等,均可參見對圖1和圖2中實施例的描述,在此不再贅述。It should be noted that, in addition to the above-mentioned features, the embodiments in Figures 7 and 8 are different. For other features, such as the roughness of the first mirror surface 116 and the second mirror surface 125, etc., please refer to the embodiments in Figures 1 and 2. The description of the example will not be repeated here.
另外,上述實施例中均為第一磁芯110是板狀結構的電子器件100,在一些實施例中,第一磁芯110還可以為其它結構。In addition, in the above embodiments, the first magnetic core 110 is an electronic device 100 with a plate-like structure. In some embodiments, the first magnetic core 110 may also have other structures.
如圖9所示,第一磁芯110的底面111的外側邊緣設置有向下延伸的凸沿118;其中,兩個凸沿118分別位於第一磁芯110的左側壁114和右側壁115之下;並且凸沿118位於第二磁芯120的外側,凸沿118的內壁與第二磁芯120的外壁相對設置,凸沿118的內壁上設置有第一連接面117,第二磁芯120的外壁上設置有第二連接面126,第一連接面117和第二連接面126相對設置;且凸沿118的內壁和第二磁芯120的外壁之間存在間隙,黏合物130設置在該間隙中,以使第一磁芯110和第二磁芯120固定連接。As shown in FIG. 9 , the outer edge of the bottom surface 111 of the first magnetic core 110 is provided with a downwardly extending convex edge 118 . The two convex edges 118 are respectively located between the left side wall 114 and the right side wall 115 of the first magnetic core 110 . and the convex edge 118 is located outside the second magnetic core 120. The inner wall of the convex edge 118 is opposite to the outer wall of the second magnetic core 120. The first connecting surface 117 is provided on the inner wall of the convex edge 118. A second connection surface 126 is provided on the outer wall of the core 120. The first connection surface 117 and the second connection surface 126 are arranged oppositely; and there is a gap between the inner wall of the convex edge 118 and the outer wall of the second magnetic core 120, and the adhesive 130 It is disposed in the gap so that the first magnetic core 110 and the second magnetic core 120 are fixedly connected.
在本實施例中,第一連接面117和第二連接面126均與第一鏡面116或第二鏡面125相互垂直。In this embodiment, the first connection surface 117 and the second connection surface 126 are both perpendicular to the first mirror surface 116 or the second mirror surface 125 .
透過在第一磁芯110的底面111的外側設置向下延伸的凸沿118,並且,凸沿118位於第二磁芯120的外側,這樣可以使第二磁芯120和第一磁芯110之間的第一鏡面116和第二鏡面125的尺寸達到最大,進而提高電子器件100的電感量。另外,透過設置凸沿118,可以給第一連接面117的設置提供空間,並且將第一連接面117設置在凸沿118上可以增加第一連接面117和第二連接面126的接觸面積,進而提高第一磁芯110和第二磁芯120的連接穩固性。By providing a downwardly extending convex edge 118 on the outside of the bottom surface 111 of the first magnetic core 110 , and the convex edge 118 is located on the outside of the second magnetic core 120 , the relationship between the second magnetic core 120 and the first magnetic core 110 can be The size of the first mirror surface 116 and the second mirror surface 125 is maximized, thereby increasing the inductance of the electronic device 100 . In addition, by providing the convex edge 118, space can be provided for the arrangement of the first connection surface 117, and arranging the first connection surface 117 on the convex edge 118 can increase the contact area between the first connection surface 117 and the second connection surface 126. This further improves the connection stability between the first magnetic core 110 and the second magnetic core 120 .
需要說明的是,第一磁芯110的凸沿118不局限於設置在第一磁芯110的左側壁114和右側壁115上。示例性的:如圖10所示,也可以將第一磁芯110的凸沿118設置在第一磁芯110的前側壁112和後側壁113上,第一磁芯110的前側壁112和後側壁113的底端均設置有一個凸沿118;每個凸沿118與第二磁芯120相對的位置均設置有第一連接面117;第二磁芯120上與第一連接面117相對的位置為第二連接面126。或者如圖11所示,也可以在第一磁芯110的外周邊緣設置一圈向下延伸的凸沿118,其中凸沿118和第二磁芯120之間存在間隙,在間隙中設置有黏合物130,第一磁芯110和第二磁芯120透過黏合物130固定連接。It should be noted that the convex edge 118 of the first magnetic core 110 is not limited to being disposed on the left side wall 114 and the right side wall 115 of the first magnetic core 110 . Exemplary: As shown in Figure 10, the convex edge 118 of the first magnetic core 110 can also be provided on the front side wall 112 and the rear side wall 113 of the first magnetic core 110. The bottom ends of the side walls 113 are each provided with a convex edge 118; each convex edge 118 is provided with a first connecting surface 117 at a position opposite to the second magnetic core 120; The location is the second connection surface 126. Alternatively, as shown in FIG. 11 , a downwardly extending convex edge 118 may also be provided on the outer peripheral edge of the first magnetic core 110 . There is a gap between the convex edge 118 and the second magnetic core 120 , and an adhesive layer is provided in the gap. The first magnetic core 110 and the second magnetic core 120 are fixedly connected through the adhesive 130 .
需要說明的是,黏合物130的厚度很小,圖中為了方便查看將黏合物130畫的較厚,圖中僅為示意圖,因此對本申請技術方案的保護範圍不夠成限制。It should be noted that the thickness of the adhesive 130 is very small. The adhesive 130 is drawn thicker in the figure for the convenience of viewing. The figure is only a schematic diagram, and therefore does not limit the scope of protection of the technical solution of the present application.
需要說明的是,在本實施例中的其他結構與圖1和圖2的實施例中的結構相同,具體可參見圖1和圖2的實施例中的描述,在此不再贅述。It should be noted that other structures in this embodiment are the same as those in the embodiment of FIGS. 1 and 2 . For details, please refer to the description in the embodiment of FIGS. 1 and 2 , which will not be described again here.
本申請實施例的電子器件100可以為變壓器或電感器,還可以為網路變壓器,其中作為網路變壓器時可以應用於RJ45網卡、乙太網交換機、網路路由器、ADSL、VDSL數位設備、EOC終端、網路機上盒、智慧電視、網路攝像機、PC主機板、電腦周邊、工業主機板、網路伺服器、電信通訊基站、監控設備等。The electronic device 100 in the embodiment of the present application can be a transformer or an inductor, or a network transformer. When used as a network transformer, it can be applied to RJ45 network cards, Ethernet switches, network routers, ADSL, VDSL digital equipment, and EOC. Terminals, network set-top boxes, smart TVs, network cameras, PC motherboards, computer peripherals, industrial motherboards, network servers, telecommunications base stations, monitoring equipment, etc.
需要說明的是,本申請實施例中的電子器件作為電感器的應用場景也很多,在此不再一一列舉。It should be noted that the electronic devices in the embodiments of the present application are used as inductors in many application scenarios, and they will not be listed one by one here.
第二方面,本申請實施例還提供一種電子設備,該電子設備可以包括電路板以及上述實施例中的電子器件100,其中該電子器件100設置在電路板上並與電路板電連接。另外,需要說明的是,該電子設備還可以包括殼體以及其他部件,本申請實施例對此不做具體限制。In a second aspect, embodiments of the present application further provide an electronic device, which may include a circuit board and the electronic device 100 in the above embodiment, wherein the electronic device 100 is disposed on the circuit board and is electrically connected to the circuit board. In addition, it should be noted that the electronic device may also include a housing and other components, which are not specifically limited in the embodiments of the present application.
示例性地,該電子設備可以為RJ45網卡、乙太網交換機、網路路由器、ADSL、VDSL數位設備、EOC終端、網路機上盒、智慧電視、網路攝像機、PC主機板、電腦周邊、工業主機板、網路伺服器、電信通訊基站、監控設備等。For example, the electronic device can be an RJ45 network card, an Ethernet switch, a network router, ADSL, VDSL digital device, EOC terminal, network set-top box, smart TV, network camera, PC motherboard, computer peripherals, Industrial motherboards, network servers, telecommunications base stations, monitoring equipment, etc.
需要說明的是,包括第一方面的電子器件的電子設備的種類很多,因此,本申請實施例對此不做具體限制,只要是設置有上述實施例中的電子器件的電子設備均屬於本申請技術方案的保護範圍。It should be noted that there are many types of electronic equipment including the electronic device of the first aspect. Therefore, the embodiments of the present application do not specifically limit this. All electronic equipment provided with the electronic devices in the above embodiments belong to the present application. The scope of protection of technical solutions.
在本申請實施例的描述中,需要說明的是,除非另有明確的規定和限制,術語“安裝”、“相連”、“連接”應作廣義理解,例如,可以是固定連接,也可以是透過中間媒介間接相連,可以是兩個元件內部的連通或者兩個元件的相互作用關係。對於本領域的普通技術人員而言,可以根據具體情況理解上述術語在本申請實施例中的具體含義。In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and restricted, the terms "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a fixed connection or a fixed connection. Indirect connection through an intermediary can be the internal connection between two components or the interaction between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of this application can be understood according to specific circumstances.
本申請實施例的說明書和權利要求書及上述附圖中的術語“第一”、“第二”、“第三”、“第四”等(如果存在)是用於區別類似的物件,而不必用於描述特定的順序或先後次序。The terms "first", "second", "third", "fourth", etc. (if present) in the description and claims of the embodiments of this application and the above-mentioned drawings are used to distinguish similar objects, and It is not necessary to describe a specific order or sequence.
100:電子器件 110:第一磁芯 111:底面 112:前側壁 113:後側壁 114:左側壁 115:右側壁 116:第一鏡面 117:第一連接面 118:凸沿 120:第二磁芯 130:黏合物 121:頂面 122:第一端部 123:第二端部 124:繞線部 125:第二鏡面 126:第二連接面 127:第一凸壁 128:第二凸壁 100: Electronic devices 110:First magnetic core 111: Bottom surface 112: Front side wall 113:Rear side wall 114: Left wall 115:Right side wall 116:First mirror 117: First connection surface 118:convex edge 120: Second magnetic core 130: Adhesive 121:Top surface 122: first end 123:Second end 124: Winding Department 125:Second mirror 126: Second connection surface 127:First convex wall 128:Second convex wall
圖1是本申請一實施例提供的一種電子器件的結構示意圖。 圖2是圖1的爆炸結構示意圖。 圖3是本申請一實施例提供的一種電子器件的結構示意圖。 圖4是圖3的爆炸結構示意圖。 圖5是本申請一實施例提供的一種電子器件的結構示意圖。 圖6是圖5的爆炸結構示意圖。 圖7是本申請一實施例提供的一種電子器件的結構示意圖。 圖8是圖7的爆炸結構示意圖。 圖9是本申請一實施例提供的一種電子器件的結構示意圖。 圖10是本申請一實施例提供的一種電子器件的結構示意圖。 圖11是本申請一實施例提供的一種電子器件的結構示意圖。 FIG. 1 is a schematic structural diagram of an electronic device provided by an embodiment of the present application. Figure 2 is a schematic diagram of the explosion structure of Figure 1. FIG. 3 is a schematic structural diagram of an electronic device provided by an embodiment of the present application. Figure 4 is a schematic diagram of the exploded structure of Figure 3. FIG. 5 is a schematic structural diagram of an electronic device provided by an embodiment of the present application. Figure 6 is a schematic diagram of the exploded structure of Figure 5 . FIG. 7 is a schematic structural diagram of an electronic device provided by an embodiment of the present application. Figure 8 is a schematic diagram of the exploded structure of Figure 7. FIG. 9 is a schematic structural diagram of an electronic device provided by an embodiment of the present application. FIG. 10 is a schematic structural diagram of an electronic device provided by an embodiment of the present application. FIG. 11 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.
100:電子器件 100: Electronic devices
110:第一磁芯 110:First magnetic core
111:底面 111: Bottom surface
112:前側壁 112: Front side wall
113:後側壁 113:Rear side wall
114:左側壁 114: Left wall
115:右側壁 115:Right side wall
116:第一鏡面 116:First mirror
117:第一連接面 117: First connection surface
120:第二磁芯 120: Second magnetic core
130:黏合物 130: Adhesive
121:頂面 121:Top surface
122:第一端部 122: first end
123:第二端部 123:Second end
124:繞線部 124: Winding Department
125:第二鏡面 125:Second mirror
126:第二連接面 126: Second connection surface
Claims (18)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123402194.2U CN217157906U (en) | 2021-12-30 | 2021-12-30 | Electronic device and electronic apparatus |
| CN202123402194.2 | 2021-12-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM648064U true TWM648064U (en) | 2023-11-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW111214267U TWM648064U (en) | 2021-12-30 | 2022-12-23 | Electronic component and electronic device |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN217157906U (en) |
| TW (1) | TWM648064U (en) |
| WO (1) | WO2023124884A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN217157906U (en) * | 2021-12-30 | 2022-08-09 | 华为技术有限公司 | Electronic device and electronic apparatus |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009117627A (en) * | 2007-11-07 | 2009-05-28 | Tdk Corp | Surface-mounted type coil component |
| JP2009302321A (en) * | 2008-06-13 | 2009-12-24 | Tdk Corp | Coil component and method of manufacturing the same |
| JP6264805B2 (en) * | 2013-09-25 | 2018-01-24 | Tdk株式会社 | Pulse transformer |
| CN210489381U (en) * | 2019-09-26 | 2020-05-08 | 四川经纬达科技集团有限公司 | Sheet type network transformer |
| CN111091956B (en) * | 2019-12-27 | 2021-02-23 | 广州金升阳科技有限公司 | Current transformer and manufacturing method thereof |
| CN217157906U (en) * | 2021-12-30 | 2022-08-09 | 华为技术有限公司 | Electronic device and electronic apparatus |
-
2021
- 2021-12-30 CN CN202123402194.2U patent/CN217157906U/en active Active
-
2022
- 2022-12-08 WO PCT/CN2022/137684 patent/WO2023124884A1/en not_active Ceased
- 2022-12-23 TW TW111214267U patent/TWM648064U/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023124884A1 (en) | 2023-07-06 |
| CN217157906U (en) | 2022-08-09 |
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