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TWM643608U - Wet diaphragm plate - Google Patents

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Publication number
TWM643608U
TWM643608U TW112204298U TW112204298U TWM643608U TW M643608 U TWM643608 U TW M643608U TW 112204298 U TW112204298 U TW 112204298U TW 112204298 U TW112204298 U TW 112204298U TW M643608 U TWM643608 U TW M643608U
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Taiwan
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polymer layer
wet
plate
membrane plate
wet membrane
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TW112204298U
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Chinese (zh)
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卓冠宏
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奇鼎科技股份有限公司
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Priority to TW112204298U priority Critical patent/TWM643608U/en
Publication of TWM643608U publication Critical patent/TWM643608U/en

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Abstract

本創作係有關一種濕式膜板,藉由對高分子層進行電漿處理,使高分子層之表面形成高粗糙度的毫米、微米及奈米複合結構。同時,藉由電漿處理來快速改善濕式膜板整體的親水性,進而延長濕式洗滌塔的霧化洗滌液在通過濕式膜板時與廢氣的接觸時間。This creation is related to a wet-type membrane plate, through the plasma treatment of the polymer layer, the surface of the polymer layer forms a high-roughness millimeter, micron and nanocomposite structure. At the same time, plasma treatment is used to quickly improve the overall hydrophilicity of the wet membrane plate, thereby prolonging the contact time between the atomized washing liquid of the wet scrubber and the exhaust gas when passing through the wet membrane plate.

Description

濕式膜板wet diaphragm

本創作係有關一種濕式膜板,尤其是一種運用於濕式洗滌塔,並增加噴霧與廢氣接觸時間之濕式膜板。The invention relates to a wet membrane plate, especially a wet membrane plate used in a wet scrubber to increase the contact time between the spray and the exhaust gas.

在超大型積體電路(ULSI)製程中,晶圓洗淨之技術及其潔淨度(Cleanliness)往往是影響晶圓製程的良率(Yield)、元件品質(Quality)以及其可靠度(Reliability)的重要因素之一。因此,在相關製程中需要對晶圓進行清洗來達到潔淨度的要求。In the ultra-large integrated circuit (ULSI) process, the wafer cleaning technology and its cleanliness are often one of the important factors that affect the yield (Yield), component quality (Quality) and reliability (Reliability) of the wafer process. Therefore, it is necessary to clean the wafer to meet the cleanliness requirement in the related process.

而晶圓的清洗是將整批次或單一晶圓,藉由化學品浸泡或純水清洗來進行,主要是為了清除晶圓表面的污染物,如微粒子、有機汙染物、無機物、金屬離子等雜質。The cleaning of wafers is carried out by soaking the whole batch or a single wafer with chemicals or cleaning with pure water, mainly to remove pollutants on the surface of the wafers, such as particles, organic pollutants, inorganic substances, metal ions and other impurities.

目前業界較常使用濕式清洗法,而最為被接受的是濕式清洗法中的RCA清潔法(RCA Clean),此RCA清潔法為1960年代由RCA公司所發展。其清潔原理在於使用於不同的化學配方來進行清潔,像是標準清潔液1(SC-1)及標準清潔液2(SC-2)等。At present, the wet cleaning method is commonly used in the industry, and the most accepted one is the RCA cleaning method (RCA Clean) in the wet cleaning method. This RCA cleaning method was developed by the RCA company in the 1960s. The cleaning principle is to use different chemical formulas for cleaning, such as standard cleaning solution 1 (SC-1) and standard cleaning solution 2 (SC-2).

而在使用化學配方SC-1(APM)、SC-2(HPM)、SPM、DHF及BHF…等進行清潔的同時,常會帶有大量酸氣、鹼氣及揮發性有機物等製程混合廢氣排放。目前對於揮發性有機物的去除效率一直未能達到良好之效果。While cleaning with chemical formulas SC-1 (APM), SC-2 (HPM), SPM, DHF, and BHF, etc., there is often a large amount of process mixed waste gas such as acid gas, alkali gas, and volatile organic compounds. At present, the removal efficiency of volatile organic compounds has not been able to achieve good results.

而揮發性有機物(又稱揮發性有機氣體污染物,Volatile Organic Compounds, VOCs),係指在一大氣壓下,沸點在250℃以下之有機化合物之空氣污染物總稱,其所造成的環境污染問題,廣泛地存在於各類型工業中。Volatile organic compounds (also known as volatile organic gas pollutants, Volatile Organic Compounds, VOCs) refer to the general term for air pollutants of organic compounds with a boiling point below 250°C under atmospheric pressure. The environmental pollution problems caused by them are widely present in various types of industries.

而工業上常見的揮發性有機物以丙酮(Acetone)、異丙酮(IPA)、丙二醇單甲基醚(PGME)、乙酸丙二醇單甲基醚酯(PGMEA)、二甲基亞碸(DMSO)、乙醇胺(MEA)、氮-甲基2-四氫吡咯酮(NMP)、二乙二醇單丁醚(BDG)、四甲基氫氧化銨(TMAH)等成份為多數。The common volatile organic compounds in the industry are mostly composed of acetone (Acetone), isopropyl ketone (IPA), propylene glycol monomethyl ether (PGME), propylene glycol monomethyl ether acetate (PGMEA), dimethylsulfoxide (DMSO), ethanolamine (MEA), nitrogen-methyl 2-tetrahydropyrrolidone (NMP), diethylene glycol monobutyl ether (BDG), tetramethylammonium hydroxide (TMAH) and other components.

在解決混合廢氣的問題上,多為導入濕式洗滌塔來處理廢氣中污染物(酸、鹼、有機物質)。濕式洗滌塔多以洗滌液做為質量傳遞的淋水材媒介,藉由濕式洗滌塔中噴霧加濕系統(利用泵將洗滌液加壓產生細化成特定直徑之霧化顆粒),使噴霧與進入之廢氣進行慣性撞擊、質傳、溶解等作用進而去除廢氣中污染物(酸、鹼、有機物質)。In solving the problem of mixed exhaust gas, most of them are introduced into wet scrubbers to deal with pollutants (acid, alkali, organic substances) in exhaust gas. Wet scrubbers mostly use washing liquid as the spraying material for mass transfer. With the help of the spray humidification system in the wet washing tower (use the pump to pressurize the washing liquid to produce atomized particles with a specific diameter), the spray and the incoming exhaust gas perform inertial impact, mass transfer, and dissolution to remove pollutants (acids, alkalis, organic substances) in the exhaust gas.

然而,淋水材在濕式洗滌塔上的使用會受限於工廠設備的佔地尺寸,無法藉由設置眾多淋水材(需擴大佔地)來延長霧化顆粒與廢氣的接觸時間。However, the use of water spraying materials on wet scrubbers is limited by the size of the factory equipment, and it is impossible to prolong the contact time between atomized particles and exhaust gas by installing many water spraying materials (need to expand the footprint).

為此,如何在工廠設備有限空間的情況下,使霧化顆粒與廢氣於濕式洗滌塔內接觸時間進而達到良好淨化,為此技術領域之研究者所欲解決之問題。For this reason, how to make the atomized particles and exhaust gas contact time in the wet scrubber to achieve good purification in the case of limited space in the factory equipment is a problem that researchers in the technical field want to solve.

本創作之主要目的,係提供一種濕式膜板,藉由對高分子層進行電漿處理,使其於表面因電漿而形成毫米、微米及奈米複合結構。並藉由電漿處理來改善濕式膜板整體的親水性,進而延長霧化顆粒在通過濕式膜板時與廢氣的接觸時間。The main purpose of this creation is to provide a wet membrane plate, through the plasma treatment of the polymer layer, the composite structure of millimeter, micron and nanometer can be formed on the surface due to plasma. The overall hydrophilicity of the wet membrane plate is improved by plasma treatment, thereby prolonging the contact time between the atomized particles and the exhaust gas when passing through the wet membrane plate.

為了達到上述之目的,本創作揭示了一種濕式膜板,其結構包含:一成型板材;以及一高分子層,該高分子層係一非平面式結構,其設置於該成型板材之上表面;其中,該濕式膜板之上表面係毫米、微米及奈米複合結構,製備該濕式膜板之步驟包含:取一成型板材;於該成型板材之表面塗佈一結晶型高分子溶液後,進行一熱壓處理,使該結晶型高分子溶液於該成型板材上形成一高分子層,該高分子層係一非平面式結構;以及使用一反應性氣體對該高分子層進行一電漿處理,使該高分子層親水化及粗糙化,並形成一濕式膜板。In order to achieve the above-mentioned purpose, this creation discloses a wet-type membrane plate, its structure includes: a forming plate; and a polymer layer, the polymer layer is a non-planar structure, which is arranged on the upper surface of the forming plate; wherein, the upper surface of the wet-type membrane plate is a composite structure of millimeter, micron and nanometer, and the steps of preparing the wet-type membrane plate include: taking a forming plate; forming a polymer layer, the polymer layer is a non-planar structure; and using a reactive gas to perform a plasma treatment on the polymer layer to make the polymer layer hydrophilic and rough, and to form a wet membrane plate.

本創作提供一實施例,其內容在於濕式膜板,其中該成型板材之高度係介於1mm至10mm之間。The invention provides an embodiment, which is a wet-type membrane plate, wherein the height of the formed plate is between 1 mm and 10 mm.

本創作提供一實施例,其內容在於濕式膜板,其中該成型板材係一波浪型板材、一鋸齒型板材或一圓弧型板材。The invention provides an embodiment, which is a wet-type membrane plate, wherein the formed plate is a corrugated plate, a zigzag plate or an arc-shaped plate.

本創作提供一實施例,其內容在於濕式膜板,其中該高分子層係於該成型板材之上表面塗佈一結晶型高分子溶液後,進行一熱壓處理而成。This creation provides an embodiment, which is a wet-type membrane plate, wherein the polymer layer is formed by coating a crystalline polymer solution on the upper surface of the formed plate, and then performing a heat-pressing treatment.

本創作提供一實施例,其內容在於濕式膜板,其中該高分子層之厚度係介於2至3微米之間。The invention provides an embodiment, which is a wet membrane plate, wherein the thickness of the polymer layer is between 2 and 3 microns.

為使貴審查委員對本創作之特徵及所達成之功效有更進一步之瞭解與認識,謹佐以實施例及配合說明,說明如後:In order to enable your review committee to have a better understanding and understanding of the characteristics of this creation and the functions achieved, I would like to provide examples and accompanying explanations, as follows:

有鑑於習知霧化顆粒與廢氣接觸時間過短,因而淨化效率不高的問題。據此,本創作遂提出一種濕式膜板,以解決習知技術所造成之問題。In view of the known problem that the contact time between the atomized particles and the exhaust gas is too short, the purification efficiency is not high. Accordingly, this creation then proposes a wet membrane plate to solve the problems caused by the prior art.

以下將進一步說明本創作之一種濕式膜板其包含之結構以及所搭配之方法:The following will further illustrate the structure and matching method of a wet membrane plate of this creation:

請參閱第1圖,其係本創作之一實施例之步驟流程圖。如第1圖所示,一種濕式膜板之製備方法,其步驟包含:Please refer to Fig. 1, which is a flow chart of the steps of one embodiment of the invention. As shown in Figure 1, a method for preparing a wet membrane plate, the steps include:

S1:取成型板材;S1: Take the formed plate;

S2:於成型板材之表面塗佈結晶型高分子溶液後,進行熱壓處理,使結晶型高分子溶液於成型板材上形成高分子層,該高分子層係非平面式結構;以及S2: After coating the crystalline polymer solution on the surface of the forming board, hot-pressing treatment is carried out so that the crystalline polymer solution forms a polymer layer on the forming board, and the polymer layer has a non-planar structure; and

S3:使用反應性氣體對高分子層進行電漿處理,使高分子層親水化及粗糙化,並形成濕式膜板。S3: Plasma treatment is performed on the polymer layer with a reactive gas to make the polymer layer hydrophilic and rough, and form a wet membrane.

其中於步驟S1之前,進一步包含步驟S0:取塑料於以150℃~200℃之溫度下進行成型處理。Wherein, before the step S1, a step S0 is further included: taking the plastic and performing molding treatment at a temperature of 150° C. to 200° C.

並如步驟S0所示,取一塑料於以150℃~200℃之溫度下進行一成型處理,並形成步驟S1中所使用之一成型板材11。其中該成型處理係一滾壓成型處理、一模壓成型處理或一熱壓成型處理,而該塑料係選自由一聚對苯二甲酸乙二酯、一尼龍、一聚對苯二甲酸丁二酯、一聚縮醛及一聚丙烯所組成之群組之其中之一或其組合。And as shown in step S0, a plastic is taken and subjected to a molding process at a temperature of 150° C. to 200° C. to form a molding plate 11 used in step S1. Wherein the molding treatment is a rolling forming treatment, a compression molding treatment or a thermoforming treatment, and the plastic is selected from one or a combination of a group consisting of a polyethylene terephthalate, a nylon, a polybutylene terephthalate, a polyacetal and a polypropylene.

而根據步驟S0所形成之該成型板材11,其高度係介於1mm至10mm之間。且該成型板材11除了平面板材外,該成型板材11係一波浪型板材、一鋸齒型板材或一圓弧型板材等等(請分別參閱第2A至2C圖,其係本創作之一實施例之成型板材之結構示意圖),其形狀可提供氣體流通即可,為此該成型板材11之形狀不以此為限。The height of the shaped board 11 formed according to step S0 is between 1 mm and 10 mm. And this forming plate 11 except plane plate, this forming plate 11 is a corrugated plate, a zigzag plate or an arc-shaped plate etc.

接續,如步驟S2所示,於該成型板材11之表面塗佈一結晶型高分子溶液後,進行一熱壓處理,使該結晶型高分子溶液於該成型板材11上形成一高分子層12。其中該結晶型高分子溶液係選自由該聚對苯二甲酸乙二酯、該尼龍、該聚對苯二甲酸丁二酯、該聚縮醛及該聚丙烯所組成之群組之其中之一或其組合。Next, as shown in step S2, after coating a crystalline polymer solution on the surface of the forming board 11, a hot-pressing treatment is performed to make the crystalline polymer solution form a polymer layer 12 on the forming board 11. Wherein the crystalline polymer solution is selected from one or a combination of the group consisting of the polyethylene terephthalate, the nylon, the polybutylene terephthalate, the polyacetal and the polypropylene.

其該結晶型高分子溶液之製備實施例如下:將高分子顆粒如該聚對苯二甲酸乙二酯溶於2-氯苯酚(2-chlorophenol)中並於60℃溫度下進行攪拌至完全溶解。溶液的配方為重量比為7%的高分子顆粒/2-氯苯酚(2-chlorophenol)混合液。塗佈之該結晶型高分子溶液其厚度控制在2~3微米,並以60℃在烘箱加熱3小時後自然冷卻。The preparation example of the crystalline polymer solution is as follows: polymer particles such as polyethylene terephthalate are dissolved in 2-chlorophenol and stirred at 60° C. until completely dissolved. The formula of the solution is a mixture of polymer particles/2-chlorophenol (2-chlorophenol) with a weight ratio of 7%. The thickness of the coated crystalline polymer solution is controlled at 2-3 microns, heated in an oven at 60°C for 3 hours and then cooled naturally.

且,該熱壓處理係於該成型板材11上塗佈完該結晶型高分子溶液後,於60至70℃之溫度下,取具有階層式的毫米及微米結構之PDMS(Polydimethylsiloxane)印章以軟壓印於該成型板材11上之該結晶型高分子溶液,並以該滾壓成型處理、該模壓成型處理或該熱壓成型處理滾壓,並控制在10~30秒,其壓力則控制在2~10kg/cm 2,之後便在60℃之烘箱內加熱3小時後自然冷卻,此時該結晶型高分子溶液於該成型板材上形成該高分子層12(剝離PDMS印章即可)。 In addition, the hot pressing treatment is after the crystalline polymer solution is coated on the forming plate 11, at a temperature of 60 to 70° C., a PDMS (Polydimethylsiloxane) stamp with a hierarchical millimeter and micron structure is softly embossed on the crystalline polymer solution on the forming plate 11, and rolled by the roll forming process, the compression molding process or the thermocompression forming process, and the pressure is controlled at 10 to 30 seconds. 10kg/cm 2, and then heated in an oven at 60° C. for 3 hours and then cooled naturally. At this time, the crystalline polymer solution forms the polymer layer 12 on the molding plate (just peel off the PDMS stamp).

其中,PDMS印章之製備:將PDMS主劑及硬化劑以重量比10:1的比例先在燒杯內攪拌均勻後,再傾倒在模具(具有階層式的毫米及微米結構,以雷射蝕刻製備)上,由於過程中有大量的氣體,而且為了能夠將溶液中的空氣排出,先將培養皿移到真空罐內抽真空,促使整個系統內的空氣能夠全部移走。之後再將培養皿移到加熱板上以60℃加熱12小時以上,以促使PDMS印章能夠固化反應完全。待其反應終結後,即可撕下擁有階層式的毫米及微米結構之PDMS印章。Among them, the preparation of PDMS stamp: Stir the PDMS main agent and hardener in a beaker with a weight ratio of 10:1, and then pour it on the mold (with hierarchical millimeter and micron structures, prepared by laser etching). Because there is a large amount of gas in the process, and in order to be able to discharge the air in the solution, first move the petri dish to a vacuum tank to evacuate, so that the air in the entire system can be completely removed. Then move the petri dish to a heating plate and heat it at 60°C for more than 12 hours to promote the complete curing reaction of the PDMS stamp. After the reaction is finished, the PDMS stamp with hierarchical millimeter and micron structures can be torn off.

此時,使用PDMS印章所形成之該高分子層12係一非平面式結構(為階層式),其厚度介於2至3微米之間外,該非平面式結構之表面具有毫米及微米結構。At this time, the polymer layer 12 formed by using the PDMS stamp is a non-planar structure (hierarchical), the thickness of which is between 2 and 3 microns, and the surface of the non-planar structure has millimeter and micron structures.

最後,如步驟S3所示,使用一反應性氣體對該高分子層進行一電漿處理,使該高分子層親水化及粗糙化,並形成一濕式膜板1。Finally, as shown in step S3 , a reactive gas is used to perform a plasma treatment on the polymer layer to hydrophilize and roughen the polymer layer, and form a wet membrane 1 .

其利用金屬環電極驅動的射頻式電容耦合電漿(rf-capacitively coupled)來進行該電漿處理,將待電漿物品放置於電漿腔體內部,其中,該電漿處理之固定頻率係13.56MHz,該電漿處理之壓力係10 mTorr,該電漿處理之功率係介於10W至100W之間,較佳為低於100W及該電漿處理之蝕刻時間係介於1至5分鐘,較佳為低於5分鐘。且,於金屬環與基板距離4.6cm以及氧氣流動速度為2.1sccm之情況下採用該反應性氣體(O 2)來進行。除了氧氣外,該反應性氣體可以選用氨氣或大氣。 It utilizes rf-capacitively coupled plasma (rf-capacitively coupled) driven by a metal ring electrode to carry out the plasma treatment, and places the item to be plasma inside the plasma chamber, wherein the fixed frequency of the plasma treatment is 13.56MHz, the pressure of the plasma treatment is 10 mTorr, the power of the plasma treatment is between 10W and 100W, preferably less than 100W, and the etching time of the plasma treatment is between 1 to 5 minutes, preferably for less than 5 minutes. And, the reaction gas (O 2 ) was used under the condition that the distance between the metal ring and the substrate was 4.6 cm and the oxygen flow rate was 2.1 sccm. In addition to oxygen, ammonia or atmospheric air can be selected as the reactive gas.

且,射頻式電容耦合電漿的主要優點是:沒有電極腐蝕或污染的問題,電極的材質也不會干擾電漿狀態,且由於電場的波長強度大於容器的大小,可產生均勻的電漿。Moreover, the main advantages of radio-frequency capacitively coupled plasma are: there is no problem of electrode corrosion or contamination, and the material of the electrode will not interfere with the state of the plasma, and because the wavelength intensity of the electric field is greater than the size of the container, uniform plasma can be generated.

再者,經過該電漿處理,使其粗糙化及親水化後,除了毫米及微米結構外,還會進一步形成奈米結構,為此該濕式膜板1之表面係具高粗糙度的毫米、微米及奈米複合結構。因,在該電漿處理之過程中,材料表面較弱鍵結會先被電漿活性粒子破壞,進而被該反應性氣體解離生成之高反應性官能基所取代,達到活化高分子表面的效應,而常見的反應性官能基有-O、-COOH及-NH2等,可藉此來改變材料表面的反應活性或改善浸潤性、黏著性等機能,進而達到洗滌液的擴散性。Furthermore, after the plasma treatment to roughen and hydrophilize, in addition to the millimeter and micron structures, nanostructures will be further formed. Therefore, the surface of the wet membrane plate 1 has millimeter, micron and nanocomposite structures with high roughness. Therefore, in the process of plasma treatment, the weak bonds on the surface of the material will be destroyed by the plasma active particles first, and then replaced by the highly reactive functional groups generated by the dissociation of the reactive gas to achieve the effect of activating the polymer surface. Common reactive functional groups include -O, -COOH and -NH2, etc., which can be used to change the reactivity of the material surface or improve wettability, adhesion and other functions, and then achieve the diffusivity of the cleaning solution.

並請參閱第3圖,其係本創作之一實施例之濕式膜板之結構示意圖。經由上述步驟後,本創作之一種濕式膜板1,其結構包含:該成型板材11(高度係介於1mm至10mm之間,並以平面板材為例)以及該高分子層12(厚度係介於2至3微米之間),該高分子層係該非平面式結構(階層式),其係透過該熱壓處理(此時形成毫米及微米結構)設置於該成型板材之上表面後,並進行該電漿處理使該高分子層具有粗糙化表面121,且更進一步形成奈米結構,其中該濕式膜板之上表面係具高粗糙度的毫米、微米及奈米複合結構。And please refer to the 3rd figure, it is the structural representation of the wet membrane plate of one embodiment of this creation. After the above steps, the structure of a wet membrane plate 1 of the present invention includes: the forming plate 11 (height is between 1 mm and 10 mm, taking a flat plate as an example) and the polymer layer 12 (thickness is between 2 and 3 microns), the polymer layer is the non-planar structure (hierarchical type), and it is arranged on the upper surface of the forming plate through the hot-pressing treatment (at this time forming a millimeter and micron structure), and the plasma treatment is performed to make the polymer layer have a roughened surface 121 , and further form a nanostructure, wherein the upper surface of the wet membrane plate is a millimeter, micrometer and nanocomposite structure with high roughness.

進一步,為本創作之濕式膜板1之實驗檢測,由下表1可以看出,經過該電漿處理(O 2)後,該濕式膜板上水滴之接觸角度隨著電漿之蝕刻時間的增加也隨之降低。 表1、水滴接觸角實驗數據表 經電漿處理之表面 0分鐘 1分鐘 2分鐘 3分鐘 4分鐘 5分鐘 水滴接觸角 51∘ 32∘ 18∘ 3∘ 2∘ 2∘ Furthermore, the experimental test of the wet membrane plate 1 created by this invention can be seen from Table 1 below. After the plasma treatment (O 2 ), the contact angle of water droplets on the wet membrane plate decreases with the increase of the plasma etching time. Table 1. Experimental data table of water droplet contact angle plasma treated surface 0 minutes 1 minute 2 minutes 3 minutes 4 minutes 5 minutes water droplet contact angle 51∘ 32∘ 18∘ 3∘ 2∘ 2∘

接觸角(contact angle)是意指在液體/氣體界面接觸固體表面而形成的夾角。接觸角是由三個不同界面相互作用的一個系統。且,接觸角也是作為衡量材料本身親、疏水性的重要指標。當材料與水滴的接觸角越小時,顯示其材料親水性越高。顯示本創作經電漿處理後,確實可以改善濕式膜板1的親水性。The contact angle refers to the angle formed when the liquid/gas interface touches the solid surface. The contact angle is a system of three different interfaces interacting. Moreover, the contact angle is also an important index to measure the affinity and hydrophobicity of the material itself. The smaller the contact angle between the material and water droplets, the higher the hydrophilicity of the material. It shows that the invention can indeed improve the hydrophilicity of the wet membrane plate 1 after plasma treatment.

又,請參閱第4圖:其係本創作之一實施例之掃描電子顯微鏡圖。如圖所示,藉由掃描電子顯微鏡的觀察可知,經過電漿處理(O 2)後,濕式膜板1之階層式表面隨著電漿處理的蝕刻時間((a)0、(b)1、(c)2、(d)3、(e)4、(f)5分鐘)加劇,其表面越呈現粗糙化,顯示電漿處理除了會使濕式膜板整體更加親水性外(其水滴接觸角逐漸減少),還可進一步使其形成粗糙化表面121,以便增加霧化洗滌顆粒與廢氣接觸時間。 Again, please refer to Fig. 4: it is the scanning electron microscope picture of one embodiment of this creation. As shown in the figure, observation by a scanning electron microscope shows that after plasma treatment (O 2 ), the hierarchical surface of the wet membrane plate 1 becomes rougher as the etching time of the plasma treatment ((a) 0, (b) 1, (c) 2, (d) 3, (e) 4, (f) 5 minutes) increases. The contact time between atomized scrubbing particles and exhaust gas.

為此,相較於習知需要噴砂且為無機材料的技術,本創作以結晶型有機高分子材料來製備具毫米及微米結構之濕式膜板,且濕式膜板經電漿表面處理後達成具毫米、微米及奈米結構的高粗糙度濕式膜板,並且透過電漿後所快速改善的親水性質來有效提升霧化顆粒與廢氣接觸時的擴散性,以此來增加接觸時間及面積。For this reason, compared to the conventional technology that requires sandblasting and is made of inorganic materials, this creation uses crystalline organic polymer materials to prepare wet membrane panels with millimeter and micron structures, and the wet membrane panels are treated with plasma surface treatment to achieve high-roughness wet membrane panels with millimeter, micron and nanometer structures, and the rapidly improved hydrophilic properties after plasma can effectively improve the diffusivity of atomized particles when they come into contact with exhaust gas, thereby increasing the contact time and area.

故本創作實為一具有新穎性、進步性及可供產業上利用者,應符合我國專利法專利申請要件無疑,爰依法提出新型專利申請,祈  鈞局早日賜准專利,至感為禱。Therefore, this creation is indeed novel, progressive and can be used in industry. It should meet the patent application requirements of our country's patent law.

惟以上所述者,僅為本創作之較佳實施例而已,並非用來限定本創作實施之範圍,舉凡依本創作申請專利範圍所述之形狀、構造、特徵及精神所為之均等變化與修飾,均應包括於本創作之申請專利範圍內。However, the above is only a preferred embodiment of this creation, and is not used to limit the scope of implementation of this creation. For example, all equal changes and modifications made in accordance with the shape, structure, characteristics and spirit described in the patent scope of this creation should be included in the patent scope of this creation.

S1、S2、S3:步驟流程 1:濕式膜板 11:成型板材 12:高分子層 121:粗糙化表面 S1, S2, S3: step process 1: wet diaphragm 11: Formed sheet 12: polymer layer 121: Roughened surface

第1圖:其係本創作之一實施例之步驟流程圖;Fig. 1: It is a flow chart of the steps of one embodiment of this creation;

第2A-2C圖:其係本創作之一實施例之成型板材之結構示意圖Figures 2A-2C: It is a structural schematic diagram of the forming plate of one embodiment of this creation

第3圖:其係本創作之一實施例之濕式膜板之結構示意圖;以及Fig. 3: It is a structural schematic diagram of a wet membrane plate of an embodiment of the invention; and

第4圖:其係本創作之一實施例之掃描式電子顯微鏡圖。Fig. 4: It is the scanning electron microscope picture of one embodiment of this creation.

1:濕式膜板 1: wet diaphragm

11:成型板材 11: Formed sheet

12:高分子層 12: polymer layer

121:粗糙化表面 121: Roughened surface

Claims (5)

一種濕式膜板,其結構包含: 一成型板材;以及 一高分子層,該高分子層係一非平面式結構,其設置於該成型板材之上表面; 其中,該濕式膜板之上表面係毫米、微米及奈米複合結構,製備該濕式膜板之步驟包含: 取一成型板材; 於該成型板材之表面塗佈一結晶型高分子溶液後,進行一熱壓處理,使該結晶型高分子溶液於該成型板材上形成一高分子層,該高分子層係一非平面式結構;以及 使用一反應性氣體對該高分子層進行一電漿處理,使該高分子層親水化及粗糙化,並形成一濕式膜板。 A wet membrane plate, its structure includes: a formed panel; and A polymer layer, the polymer layer is a non-planar structure, which is arranged on the upper surface of the formed board; Wherein, the upper surface of the wet membrane plate is a composite structure of millimeters, microns and nanometers, and the steps of preparing the wet membrane plate include: Take a forming plate; After coating a crystalline polymer solution on the surface of the forming board, performing a heat press treatment, so that the crystalline polymer solution forms a polymer layer on the forming board, and the polymer layer has a non-planar structure; and A reactive gas is used to perform a plasma treatment on the polymer layer to hydrophilize and roughen the polymer layer and form a wet membrane plate. 如請求項1所述之濕式膜板,其中該成型板材之高度係介於1mm至10mm之間。The wet membrane plate as claimed in claim 1, wherein the height of the formed plate is between 1mm and 10mm. 如請求項1所述之濕式膜板,其中該成型板材係一波浪型板材、一鋸齒型板材或一圓弧型板材。The wet membrane panel as described in Claim 1, wherein the formed panel is a corrugated panel, a zigzag panel or an arc-shaped panel. 如請求項1所述之濕式膜板,其中該高分子層係於該成型板材之上表面塗佈一結晶型高分子溶液後,進行一熱壓處理而成。The wet-type membrane plate as described in Claim 1, wherein the polymer layer is formed by coating a crystalline polymer solution on the upper surface of the formed plate, and then performing a hot-pressing treatment. 如請求項1所述之濕式膜板,其中該高分子層之厚度係介於2至3微米之間。The wet membrane plate as claimed in claim 1, wherein the thickness of the polymer layer is between 2 and 3 microns.
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Publication number Priority date Publication date Assignee Title
TWI852531B (en) * 2023-05-04 2024-08-11 奇鼎科技股份有限公司 Wet membrane plate and a preparation method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI852531B (en) * 2023-05-04 2024-08-11 奇鼎科技股份有限公司 Wet membrane plate and a preparation method thereof

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