TWM612412U - Wet processing apparatus - Google Patents

Abstract

A wet processing apparatus includes a carrying plate, a deionized water spraying device, a multi-fluid spraying device, and a dry gas jetting device. The carrying plate is configured to carry an object. The deionized water spraying device is disposed over the carrying plate, and is configured to spray first deionized water toward the object. The multi-fluid spraying device is disposed over the carrying plate, and is configured to spray a mixture fluid toward the object. The mixture fluid includes second deionized water, water steam, and a volatile fluid. The dry gas jetting device is disposed over the carrying plate, and is configured to jet dry gas toward the object.

Description

Wet processing equipment

The present disclosure relates to a wet treatment technology, and particularly relates to a wet treatment equipment.

Wet processing such as cleaning and etching of manufactured objects with liquids has been widely used in the electronics manufacturing industry. For example, when a single wafer rotary wet etching equipment is used to perform an etching process on a wafer, it will go through a single or multiple etching with an acid or alkaline etching solution or cleaning with a cleaning solution. In the wet processing process, deionized (DI) water is usually used to remove the residual acid or alkaline processing liquid on the wafer between the conversion between different acidic or alkaline processing solutions. In addition, after all the processing steps of the acidic or alkaline treatment solution are completed, the remaining acidic or alkaline treatment solution on the wafer needs to be rinsed with deionized water. Therefore, the amount of deionized water required for each wafer in the entire etching process is quite large. Moreover, during wet processing, most of the deionized water will be quickly thrown out of the wafer due to the high-speed rotation of the wafer, resulting in a limited cleaning effect of the deionized water.

In the case of limited water resources, major semiconductor factories have been forced to actively reduce the use of deionized water and recycle. Therefore, there is an urgent need for a wet treatment technology that can balance the improvement of the wet treatment effect and the reduction of the usage of deionized water.

Therefore, one of the objectives of the present disclosure is to provide a wet treatment equipment that can spray deionized water on objects in turn, and mist-like small molecules containing a mixed fluid of deionized water, water vapor, and volatile fluid. Small water vapor molecules can reduce the amount of deionized water used in wet processing and improve the cleaning effect. In addition, the volatilization of volatile fluids can provide kinetic energy for the diffusion and movement of processing liquids and particles remaining on the object, which can shorten the cleaning time, further reduce the amount of deionized water used, and improve the removal efficiency, and can prevent damage to the object. In turn, product defects can be reduced and yield can be improved.

Another purpose of the present disclosure is to provide a wet processing equipment, which can contain two fluids of dry nitrogen and saturated vapor of a volatile solution to spray objects. The volatilization of the saturated vapor of the volatile solution can quickly take away the remaining moisture on the object, which can spin dry the object more quickly, and can reduce the spraying time, thereby improving the drying efficiency, not only effectively reducing the amount of dry nitrogen used, but also It can also increase production capacity. In addition, the moisture on the object is quickly taken away, which can reduce the probability of forming watermark defects, thereby reducing product defects and improving yield.

According to the above objective of the present disclosure, a wet processing equipment is proposed. The wet processing equipment includes a carrier plate, a deionized water spray device, a multi-fluid spray device, and a dry gas spray device. The carrying tray is configured to carry objects. The deionized water spraying device is arranged above the carrying plate and is configured to spray the first deionized water toward the object. The multi-fluid spraying device is arranged above the carrying plate and is configured to spray mixed fluids toward the object. The mixed fluid includes second deionized water, water vapor, and volatile fluid. The dry gas spray device is arranged above the carrier plate and is configured to spray the dry gas toward the object.

According to an embodiment of the present disclosure, the aforementioned wet processing equipment further includes a multi-fluid generating device, a volatile fluid supply device, a steam generator, and a deionized water supply device. The multi-fluid generating device is in fluid communication with the multi-fluid spraying device and is configured to generate mixed fluid and supply the mixed fluid to the multi-fluid spraying device. The volatile fluid supply device is in fluid communication with the multi-fluid generating device and is configured to supply the volatile fluid to the multi-fluid generating device. The water vapor generator is in fluid communication with the multi-fluid generating device, and is configured to generate water vapor and supply water vapor to the multi-fluid generating device. The deionized water supply device is in fluid communication with the multi-fluid generating device and is configured to supply the second deionized water to the multi-fluid generating device.

According to an embodiment of the present disclosure, the above-mentioned volatile fluid is saturated vapor of a volatile solution. Moreover, the volatile fluid supply device includes a volatile solution saturated vapor generator and a carrier gas supply device. The volatile solution saturated vapor generator is configured to generate volatile solution saturated vapor. The carrier gas supply device is configured to provide nitrogen to carry the saturated vapor of the volatile solution to the multi-fluid generating device.

According to an embodiment of the present disclosure, the aforementioned carrier gas supply device further includes a temperature controller configured to control the temperature of the nitrogen gas. The aforementioned deionized water supply device further includes another temperature controller configured to control the temperature of the second deionized water.

According to an embodiment of the present disclosure, the above-mentioned dry gas injection device is a dry nitrogen injection device.

According to an embodiment of the present disclosure, the above-mentioned dry gas injection device is a dry nitrogen two-fluid injection device. Moreover, the wet processing equipment further includes a volatile solution saturated vapor generator and a carrier gas supply device. The volatile solution saturated vapor generator is in fluid communication with the dry gas injection device, and is configured to generate the volatile solution saturated vapor in the volatile fluid. The carrier gas supply device is configured to provide dry nitrogen gas to carry the saturated vapor of the volatile solution to the dry gas injection device.

According to an embodiment of the present disclosure, the above-mentioned wet processing equipment further includes a dry nitrogen spray device, which is arranged above the carrier plate and is configured to spray another dry nitrogen gas toward the object.

According to an embodiment of the present disclosure, the aforementioned carrier gas supply device further includes a temperature controller configured to control the temperature of the dry nitrogen.

According to an embodiment of the present disclosure, the above-mentioned wet processing equipment further includes an etching solution spraying device, which is disposed above the carrier plate and configured to spray the etching solution toward the object.

According to an embodiment of the present disclosure, the above-mentioned wet processing equipment further includes a clamping device, an air floatation device, a rotating shaft, and a motor. The clamping device is arranged on the carrying plate and configured to clamp the fixed object. The air flotation device is arranged on the carrying tray and is configured to lift the object to separate the object from the carrying tray. The rotating shaft is connected with the bearing plate and is configured to rotate the bearing plate. The motor is connected to the rotating shaft and is configured to drive the rotating shaft.

The spatial relationship between the two elements described in this disclosure is not only applicable to the orientation shown in the diagram, but also applicable to the orientation not shown in the diagram, such as the inverted orientation. In addition, the term "connection" or similar terms between the two components mentioned in the present disclosure is not limited to the direct connection between the two components, and may also include indirect connection as required. Regarding the “first”, “second”, etc. used in this text, it does not specifically refer to the order or sequence, but only to distinguish the elements or operations described in the same technical terms.

Please refer to FIG. 1, which is a schematic diagram of a wet processing equipment according to an embodiment of the present disclosure. The wet processing equipment 100 can be applied to wet processing in the manufacturing process of electronic devices, such as cleaning, etching, and so on. For example, the wet processing equipment 100 may be a wafer cleaning equipment, a wafer etching equipment, or a wafer etching and cleaning equipment. In some examples, the wet processing equipment 100 mainly includes a carrier plate 110, a deionized water spray device 120, a multi-fluid spray device 130, and a dry gas spray device. The dry gas spraying device may be, for example, a dry nitrogen spraying device 140 or a dry nitrogen two-fluid spraying device 150. In some examples, the wet processing equipment 100 may include a dry nitrogen spraying device 140, or a dry nitrogen two-fluid spraying device 150, or a dry nitrogen spraying device 140 and a dry nitrogen two-fluid spraying device 150.

The carrier tray 110 can be used to carry an object 160 to be wet-processed, such as a wafer. The supporting tray 110 has a supporting surface 112, and the object 160 is disposed on the supporting surface 112. In some examples, the wet processing equipment 100 may include a clamping device 170. The clamping device 170 can be arranged on the carrying surface 112 of the carrying tray 110 and can be used to clamp and fix the object 160 on the carrying surface 112. For example, the clamping device 170 may be a clamping pin. The wet processing equipment 100 may also have different fixing devices to fix the object 160. For example, an electrostatic chuck can be used to fix the object 160 on the carrying surface 112 of the carrier plate 110.

The wet processing equipment 100 may further optionally include an air flotation device 180. The air flotation device 180 can be arranged in the carrier plate 110, and the air flotation device 180 can spray gas toward the carrying surface 112 to lift the object 160 so that the object 160 is separated from the carrying surface 112 of the carrier plate 110 without directly Contact the bearing surface 112.

In some examples, the wet processing equipment 100 is a rotatable processing equipment. In such an example, the wet processing equipment 100 may further include a rotating shaft 190 and a motor 200. The rotating shaft 190 is connected to the carrier plate 110 and can rotate the carrier plate 110. The motor 200 is connected to the rotating shaft 190 and can drive the rotating shaft 190 to rotate, thereby driving the carrier plate 110 to rotate.

The deionized water spray device 120 is arranged above the carrying surface 112 of the carrying tray 110 and on the object 160 carried by the carrying tray 110. The deionized water spray device 120 can spray the first deionized water toward the surface 162 of the object 160 to clean the object 160.

The multi-fluid spraying device 130 is also arranged above the carrying surface 112 of the carrying tray 110 and above the object 160. The multi-fluid spraying device 130 may be adjacent to the deionized water spraying device 120, for example. The multi-fluid spraying device 130 can spray mixed fluids toward the surface 162 of the object 160. This mixed fluid includes a mixture of multiple fluids. In some examples, the mixed fluid includes second deionized water, water vapor, and volatile fluid. The volatile fluid may include a volatile solution and/or saturated vapor of the volatile solution. For example, the volatile solution may be isopropanol (IPA). The deionized water spraying device 120 and the multi-fluid spraying device 130 can alternately operate to spray the deionized water and the mixed fluid on the surface 162 of the object 160 in turn.

Please refer to FIG. 4 first, which is a schematic diagram of removing the processing liquid and particles remaining on the object according to an embodiment of the present disclosure. In some examples, the surface 162 of the object 160 is provided with a pattern structure 164 of many elements. The acidic or alkaline treatment liquid PF and particles PC remain on the surface 162 of the object 160 and may fall between the pattern structures 164. The multi-fluid spray device 130 can spray small molecules in the mist of mixed fluid. The thermal effect of water vapor in the mixed fluid MF can cause cavitation. Cavitation is when pure water at room temperature and high temperature water vapor are mixed, a certain degree of frequency, such as 10KHz to 1MHz, is generated due to heat exchange. Such vibrations can provide energy to decompose water molecules into hydrogen ions and hydroxide ions. The high energy generated when unstable hydrogen ions and hydroxide ions return to water molecules can be converted into mechanical shocks, thereby water molecules It can be quickly combined with the remaining acidic or alkaline treatment liquid PF and particulate PC on the surface 162 of the object 160. The multi-fluid spray device 130 sprays the mixed fluid mist-like small molecules, which can not only reduce the consumption of deionized water, but also improve the cleaning effect.

In addition, the volatilization of the volatile fluid in the mixed fluid MF sprayed by the multi-fluid spraying device 130, such as the volatile solution and/or the saturated vapor of the volatile solution, can provide additional diffusion and movement kinetic energy for the remaining processing liquid PF and particulate PC . The arrow AR in FIG. 4 indicates the moving direction of the saturated vapor of the volatile solution in the mixed fluid MF. The saturated vapor of the volatile solution provides movement and diffusion kinetic energy to the processing liquid PF and the particles PC during the volatilization process. Thereby, the processing liquid PF and the particulate PC remaining on the object 160 can be quickly taken away with the mixed fluid MF. Therefore, the amount of deionized water used can be further reduced, and the removal efficiency of the residual treatment liquid PF and particulate PC can be improved. Since the removal effect of the remaining processing liquid PF and particulate PC is improved, the multi-fluid spray device 130 can effectively remove the remaining processing liquid PF and particulate PC without using too much spray force. Therefore, the impact on the pattern structure 164 on the surface 162 of the object 160 can be reduced, for example, the impact on the device pattern structure of the wafer can be reduced, and damage to the object 160 can be avoided, thereby reducing the defects of the object 160 and effectively improving the product. Yield.

Please refer to FIG. 1 and FIG. 2 at the same time. FIG. 2 is a schematic diagram of a multi-fluid supply system of a wet processing equipment according to an embodiment of the present disclosure. In some examples, the wet processing equipment 100 may further include a multi-fluid supply system 300. The multi-fluid supply system 300 can be in fluid communication with the multi-fluid spraying device 130 and can provide a mixed fluid of multiple fluids to the multi-fluid spraying device 130. In some examples, the multi-fluid supply system 300 may mainly include a multi-fluid generating device 310, a volatile fluid supply device 320, a steam generator 330, and a deionized water supply device 340.

The multi-fluid generating device 310 may be in fluid communication with the multi-fluid spraying device 130. The multi-fluid generating device 310 can generate a mixed fluid and supply the generated mixed fluid to the multi-fluid spraying device 130. The multi-fluid generating device 310 can generate a mixed fluid of the second deionized water, a volatile fluid, and water vapor.

The volatile fluid supply device 320 may be in fluid communication with the multi-fluid generating device 310 and may supply volatile fluid to the multi-fluid generating device 310. In some exemplary examples, the volatile fluid supplied by the volatile fluid supply device 320 is saturated vapor of the volatile solution. As shown in FIG. 2, in such an example, the volatile fluid supply device 320 may include, for example, a volatile solution saturated vapor generator 322 and a carrier gas supply device 324. The volatile solution saturated vapor generator 322 may be in fluid communication with the multi-fluid generating device 310. The volatile solution saturated vapor generator 322 can generate the volatile solution saturated vapor and supply the volatile solution saturated vapor to the multi-fluid generating device 310.

The carrier gas supply device 324 can be in fluid communication with the volatile solution saturated vapor generator 322. The carrier gas supply device 324 can provide carrier gas to the volatile solution saturated vapor generator 322, so as to use the carrier gas to carry the volatile solution saturated vapor generated by the volatile solution saturated vapor generator 322 to the multi-fluid generator 310. The carrier gas may be nitrogen, for example. In some exemplary examples, the carrier gas supply device 324 may further include a temperature controller 326. The temperature controller 326 is configured to control the temperature of the carrier gas, such as nitrogen, supplied to the volatile solution saturated vapor generator 322. The configuration of the temperature controller 326 can set various temperatures of the carrier gas, and can expand the applicability of the wet processing equipment 100, such as the application of high-temperature processes.

In other examples, the volatile fluid supplied by the volatile fluid supply device 320 is a volatile solution. In such an example, the volatile solution provided by the volatile fluid supply device 320 can directly flow into the multi-fluid generating device 310 via the pipeline, so the carrier gas supply device 324 is not required. The volatile fluid supply device 320 can optionally be equipped with a temperature controller (not shown) to control the temperature of the supplied volatile solution.

The steam generator 330 may also be in fluid communication with the multi-fluid generating device 310. The water vapor generator 330 may generate water vapor and supply the water vapor to the multi-fluid generating device 310.

The deionized water supply device 340 may be in fluid communication with the multi-fluid generating device 310. In this way, the deionized water supply device 340 can supply the second deionized water to the multi-fluid generating device 310. In some exemplary examples, the deionized water supply device 340 may further include a temperature controller 342 to control the temperature of the second deionized water supplied to the multi-fluid generating device 310 so as to expand the applicability of the wet processing equipment 100.

In some examples, please continue to refer to FIG. 1, a dry gas injection device, such as a dry nitrogen gas injection device 140 and/or a dry nitrogen two-fluid injection device 150, is disposed above the carrier plate 110 and is configured to face the supporting surface 112. The surface 162 of the object 160 is sprayed with drying gas to remove the residual liquid on the object 160 to dry the object 160. The dry nitrogen spray device 140 can spray dry nitrogen toward the object 160. The dry nitrogen two-fluid spray device 150 can spray dry nitrogen and volatile solution saturated vapor toward the surface 162 of the object 160, that is, the dry gas at this time includes dry nitrogen and volatile solution saturated vapor. When the wet processing equipment 100 includes a dry nitrogen spraying device 140 and a dry nitrogen two-fluid spraying device 150, the dry nitrogen spraying device 140 and the dry nitrogen two-fluid spraying device 150 can spray dry gas on the surface 162 of the object 160 in turn.

Please refer to FIGS. 1 and 3 at the same time. FIG. 3 is a schematic diagram of a dry nitrogen two-fluid supply system of a wet processing equipment according to an embodiment of the present disclosure. In an example where the wet processing equipment 100 includes at least a dry nitrogen two-fluid injection device 150, the wet processing equipment 100 may further include a dry nitrogen two-fluid supply system 400. The dry nitrogen two-fluid supply system 400 can be in fluid communication with the dry nitrogen two-fluid injection device 150 and can provide two kinds of dry fluids to the dry nitrogen two-fluid injection device 150. In some examples, the dry nitrogen two-fluid supply system 400 may mainly include a volatile solution saturated vapor generator 410 and a carrier gas supply device 420.

The volatile solution saturated vapor generator 410 may be in fluid communication with the dry nitrogen two-fluid injection device 150. The volatile solution saturated vapor generator 410 can generate the volatile solution saturated vapor and supply the volatile solution saturated vapor to the dry nitrogen two-fluid injection device 150.

The carrier gas supply device 420 may be in fluid communication with the volatile solution saturated vapor generator 410. The carrier gas supply device 420 can provide carrier gas to the volatile solution saturated vapor generator 410. Thereby, the volatile solution saturated vapor generated by the volatile solution saturated vapor generator 410 can be carried to the dry nitrogen two-fluid injection device 150 by the carrier gas. The carrier gas can be dry nitrogen, for example. In some exemplary examples, the carrier gas supply device 420 may further include a temperature controller 422. The temperature controller 422 is configured to control the temperature of the carrier gas, such as dry nitrogen, supplied to the volatile solution saturated vapor generator 410.

The dry nitrogen two-fluid spray device 150 can spray dry nitrogen and saturated vapor of volatile solution. The volatilization of the saturated vapor of the volatile liquid can quickly take away the moisture remaining on the surface 162 of the object 160, so that the time of the drying process can be reduced, and the amount of dry nitrogen used can be reduced. In addition, since the two fluids of dry nitrogen and volatile liquid saturated steam can spin dry the moisture on the surface 162 of the object 160 more quickly, the drying efficiency can be greatly improved, and the formation of watermark defects on the surface 162 of the object 160 can be reduced. Probability, which in turn can reduce product defects and improve yield, and increase production.

In some examples, as shown in FIG. 1, the wet processing equipment 100 may be a wet etching processing equipment, and further includes an etching liquid spraying device 210. The etching liquid spraying device 210 is also arranged above the bearing surface 112 of the carrier plate 110 and can spray the etching liquid toward the surface 162 of the object 160. The etching solution can be, for example, an acidic solution or an alkaline solution. In some exemplary examples, the wet processing equipment 100 is a single wafer rotary wet etching equipment.

In some examples, the wet processing equipment 100 may be used to wet clean the object 160. Please refer to FIG. 1, in such an example, the first deionized water can be sprayed on the object 160 by the deionized water spray device 120, and the mixed fluid can be sprayed on the object 160 by the multi-fluid spray device 130. The mixed fluid may include a second deionized water, water vapor, and a volatile fluid. The volatile fluid may, for example, include a volatile solution and/or a saturated vapor of the volatile solution. Alternatively, the deionized water spray device 120 and the multi-fluid spray device 130 may be used to spray the first deionized water and the mixed fluid on the object 160 in turn. When spraying the first deionized and mixed fluid on the object 160, the motor 200 can be used to drive the rotating shaft 190 to drive the carrier plate 110 and the object 160 thereon to rotate.

Please also refer to FIG. 2, when the multi-fluid spraying device 130 is used to spray the mixed fluid on the surface 162 of the object 160, the carrier gas supply device 324 can be used to provide carrier gas, and the carrier gas can carry the saturated vapor of the volatile solution to the multi-fluid generating device 310 . The multi-fluid generating device 310 mixes the saturated vapor of the volatile solution, the water vapor generated by the water vapor generator 330, and the second deionized water supplied by the deionized water supply device 340, and then supplies the mixed fluid to the multi-fluid spraying device 130. In addition, the temperature controller 326 of the carrier gas supply device 324 can be used to control the temperature of the supplied carrier gas, and/or the temperature controller 342 of the deionized water supply device 340 can be used to control the temperature of the supplied carrier gas according to the cleaning process requirements. The temperature of the second deionized water to provide the mixed fluid at the required temperature.

Then, a dry gas spray device, such as a dry nitrogen spray device 140 and/or a dry nitrogen two-fluid spray device 150, can be used to spray a dry gas on the object 160 to dry the object 160. The dry gas sprayed by the dry nitrogen spray device 140 is dry nitrogen, and the dry gas sprayed by the dry nitrogen two-fluid spray device 150 is two fluids composed of dry nitrogen and saturated vapor of the volatile solution. In an example where the wet processing equipment 100 includes both a dry nitrogen spraying device 140 and a dry nitrogen two-fluid spraying device 150, the dry nitrogen spraying device 140 and the dry nitrogen two-fluid spraying device 150 can be alternately used to spray and dry the object 160 in turn. Nitrogen, dry nitrogen and saturated vapor of volatile solution. When the drying gas is sprayed on the object 160, the rotating shaft 190 can be used to drive the carrier plate 110 and the object 160 thereon to rotate, thereby accelerating the drying of the object 160.

Please also refer to FIG. 3, when the dry nitrogen two-fluid injection device 150 is used to spray the dry nitrogen two-fluid toward the surface 162 of the object 160, the volatile solution saturated steam generator 410 can be used to generate the volatile solution saturated steam, and the carrier gas can be used for supply The device 420 provides dry nitrogen as a carrier gas to transport the saturated vapor of the volatile solution to the dry nitrogen two-fluid injection device 150. Similarly, the temperature controller 422 of the carrier gas supply device 420 can be used to control the temperature of the provided carrier gas according to the drying process requirements to provide the second fluid at the required temperature.

In an example in which the wet processing equipment 100 includes the etching liquid spraying device 210, the wet processing equipment 100 is a wet etching processing equipment. The etching solution spray device 210 can be used to spray the etching solution toward the surface 162 of the object 160 to etch the surface 162 of the object 160. When spraying the etching solution on the object 160, the rotating shaft 190 can be used to drive the carrier plate 110 and the object 160 thereon to rotate. After each etching process, the wet processing equipment 100 can be used to clean and dry the object 160.

Hereinafter, an exemplary example is used to describe the wet etching, cleaning, and drying processing of the object 160 by the wet processing equipment 100. Please refer to FIG. 1 again, when the object 160 is loaded onto the carrier plate 110 by the conveying mechanism (not shown), the clamping device 170 is opened to accept the object 160 placed by the conveying mechanism, and then the clamping device 170 is closed to clamp The object 160 is tightened, and the object 160 is fixed on the carrying surface 112 of the carrying tray 110. Next, a wet etching process can be performed on the object 160 to use the motor 200 to drive the rotation shaft 190 to rotate, and to further drive the carrier plate 110 and the object 160 fixed thereon to rotate. Then, the carrier plate 110 can be raised and lowered to an appropriate position according to the etching solution recovery position, and then the etching solution spray device 210 is used to spray the etching solution onto the surface 162 of the object 160 to perform the etching of the object 160. At this time, the etching solution is thrown out of the object 160 due to the centrifugal force generated by the rotation of the object 160 and falls into the etching solution recovery device around the carrier plate 110. After the set number of etching seconds, the spraying of the etching solution is stopped, and the carrier plate 110 is raised and lowered to the cleaning position to remove the etching solution and particles remaining on the object 160.

During the cleaning process, the deionized water spraying device 120 and the multi-fluid spraying device 130 can be used alternately to spray the deionized water and the mixed fluid on the object 160 in turn. Depending on the process requirements, the spraying time of the deionized water spraying device 120 and the multi-fluid spraying device 130 can be set separately.

After the cleaning process is completed, the dry nitrogen injection device 140 or the dry nitrogen two-fluid injection device 150 alone, or the dry nitrogen injection device 140 and the dry nitrogen two-fluid injection device 150 can be used for the drying process according to the process requirements. Alternatively, the dry nitrogen spray device 140 and the dry nitrogen two-fluid spray device 150 can be used to spray dry nitrogen and dry nitrogen two fluids to the object 160 in turn. Similarly, depending on the process requirements, the spraying time of the dry nitrogen spray device 140 and the dry nitrogen two-fluid spray device 150 can be set separately.

After the drying process is completed, the carrier tray 110 is raised and lowered to the transfer position and then stops rotating. The clamping device 170 is opened, and the conveying device takes out the wet-processed object 160, and then places the next object 160 to be wet-processed, and then repeats the above steps until all the objects 160 are processed.

As can be seen from the above-mentioned embodiments, one of the advantages of the present disclosure is that the present disclosure can spray deionized water on the object in turn, and mist-like small molecules containing a mixed fluid of deionized water, water vapor, and volatile fluid. Small water vapor molecules can reduce the amount of deionized water used in wet processing and improve the cleaning effect. In addition, the volatilization of volatile fluids can provide kinetic energy for the diffusion and movement of processing liquids and particles remaining on the object, which can shorten the cleaning time, further reduce the amount of deionized water used, and improve the removal efficiency, and can prevent damage to the object. In turn, product defects can be reduced and yield can be improved.

Another advantage of the present disclosure is that the present disclosure can spray objects with two fluids including dry nitrogen and saturated vapor of volatile solution. The volatilization of the saturated vapor of the volatile solution can quickly take away the remaining moisture on the object, which can spin dry the object more quickly, and can reduce the spraying time, thereby improving the drying efficiency, not only effectively reducing the amount of dry nitrogen used, but also It can also increase production capacity. In addition, the moisture on the object is quickly taken away to reduce the probability of forming watermark defects, which can reduce product defects and improve yield.

Although the present disclosure has been disclosed in the above embodiments, it is not intended to limit the present disclosure. Anyone with ordinary knowledge in this technical field can make various changes and modifications without departing from the spirit and scope of the present disclosure. Therefore, the scope of protection of this disclosure shall be subject to the scope of the attached patent application.

100: Wet processing equipment 110: Carrier plate 112: bearing surface 120: Deionized water spray device 130: Multi-fluid spraying device 140: Dry nitrogen injection device 150: Dry nitrogen two-fluid injection device 160: Object 162: Surface 164: Pattern structure 170: Clamping device 180: Air flotation device 190: Hinge 200: Motor 210: Etching liquid spraying device 300: Multi-fluid supply system 310: Multi-fluid generator 320: Volatile fluid supply device 322: Volatile solution saturated steam generator 324: Carrier Gas Supply Device 326: Temperature Controller 330: Steam Generator 340: Deionized water supply device 342: Temperature Controller 400: Dry nitrogen two-fluid supply system 410: Saturated vapor generator for volatile solution 420: carrier gas supply device 422: temperature controller AR: Arrow MF: Mixed fluid PC: Particles PF: Treatment fluid

In order to make the above and other objectives, features, advantages and embodiments of the present disclosure more obvious and understandable, the description of the accompanying drawings is as follows: [Fig. 1] is a schematic diagram of a wet processing equipment according to an embodiment of the present disclosure. [Fig. 2] is a schematic diagram showing a device of a multi-fluid supply system of a wet processing equipment according to an embodiment of the present disclosure. [Fig. 3] is a schematic diagram showing a dry nitrogen two-fluid supply system of a wet processing equipment according to an embodiment of the present disclosure. [Fig. 4] is a schematic diagram showing the removal of the processing liquid and particles remaining on the object according to an embodiment of the present disclosure.

100: Wet processing equipment

110: Carrier plate

112: bearing surface

120: Deionized water spray device

130: Multi-fluid spraying device

140: Dry nitrogen injection device

150: Dry nitrogen two-fluid injection device

160: Object

162: Surface

170: Clamping device

180: Air flotation device

190: Hinge

200: Motor

210: Etching liquid spraying device

Claims (10)

A wet processing equipment, including: A carrying tray, configured to carry an object; A deionized water spraying device, arranged above the carrying plate, and configured to spray a first deionized water toward the object; A multi-fluid spraying device arranged above the carrier plate and configured to spray a mixed fluid toward the object, wherein the mixed fluid includes a second deionized water, a water vapor, and a volatile fluid; and A dry gas spray device is arranged above the carrier plate and is configured to spray a dry gas toward the object. The wet processing equipment described in claim 1, further including: A multi-fluid generating device, in fluid communication with the multi-fluid spraying device, and configured to generate the mixed fluid and supply the mixed fluid to the multi-fluid spraying device; A volatile fluid supply device in fluid communication with the multi-fluid generating device and configured to supply the volatile fluid to the multi-fluid generating device; A water vapor generator in fluid communication with the multi-fluid generating device and configured to generate the water vapor and supply the water vapor to the multi-fluid generating device; and A deionized water supply device is in fluid communication with the multi-fluid generating device and configured to supply the second deionized water to the multi-fluid generating device. The wet processing equipment according to claim 2, wherein the volatile fluid is a saturated vapor of a volatile solution, and the volatile fluid supply device includes: A volatile solution saturated vapor generator configured to generate saturated vapor of the volatile solution; and A carrier gas supply device is configured to provide a nitrogen gas to carry the saturated vapor of the volatile solution to the multi-fluid generating device. The wet processing equipment described in claim 3, wherein The carrier gas supply device further includes a temperature controller configured to control a temperature of the nitrogen; and The deionized water supply device further includes another temperature controller configured to control a temperature of the second deionized water. The wet processing equipment according to claim 1, wherein the dry gas injection device is a dry nitrogen injection device. The wet processing equipment according to claim 1, wherein the dry gas injection device is a dry nitrogen two-fluid injection device, and the wet processing equipment further comprises: A volatile solution saturated vapor generator, in fluid communication with the dry gas injection device, and configured to generate a volatile solution saturated vapor in the volatile fluid; and A carrier gas supply device is configured to provide a dry nitrogen gas to carry the saturated vapor of the volatile solution to the dry gas injection device. The wet processing equipment according to claim 6, further comprising a dry nitrogen spray device, which is arranged above the carrier plate and is configured to spray another dry nitrogen gas toward the object. The wet processing equipment according to claim 6, wherein the carrier gas supply device further includes a temperature controller configured to control a temperature of the dry nitrogen. The wet processing equipment according to claim 1, further comprising an etching solution spraying device, which is arranged above the carrier plate and configured to spray an etching solution toward the object. The wet processing equipment described in claim 1, further including: A clamping device arranged on the carrying plate and configured to clamp and fix the object; An air flotation device, arranged on the carrying tray, and configured to lift the object to separate the object from the carrying tray; A rotating shaft connected to the carrying plate and configured to rotate the carrying plate; and A motor is connected to the rotating shaft and configured to drive the rotating shaft.

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