CN206506817U - Directional Heat Dissipation Structure for Electronic Devices - Google Patents

Abstract

A directional heat dissipation structure of an electronic device comprises a circuit board, a heat radiation layer and a heat reflection cover. One side of the circuit board is provided with a heating source. The heat radiation layer covers a surface of the circuit board and covers the heat generation source. The heat reflection cover covers the heat source and the heat radiation layer. The heat radiation layer is used for radiating heat, and the heat reflection cover is used for changing partial heat radiation direction of the heat radiation layer, so that the heat conduction direction of heat radiation can be effectively controlled.

Description

Directional Heat Dissipation Structure for Electronic Devices

technical field

The utility model relates to a radiator, in particular to a directional heat dissipation structure of an electronic device.

Background technique

In the field of heat dissipation, heat conduction and heat convection are commonly used as heat transfer methods. However, with the development of heat radiation material technology, heat radiation is more commonly used as a heat transfer method for heat dissipation.

Generally speaking, heat radiation does not require medium transmission, and the way heat energy passes is radially radiated and diverged. Therefore, heat radiation is different from heat conduction and heat convection. It is easy to control the direction of heat transfer through the layout of the medium. When the heat radiation is applied to a small electronic device, it is easy to cause the whole machine to heat up, especially the hand-held electronic device may burn the user.

In view of this, the inventor of the present invention aimed at the above-mentioned prior art, devoted himself to research and combined with the application of theories, and tried his best to solve the above-mentioned problems, which became the goal of the inventor's improvement.

Contents of the invention

The utility model provides a directional heat dissipation structure of an electronic device, which is used to dissipate heat from a heat source on a circuit board, and its heat radiation direction faces the heat source.

The utility model provides a directional heat dissipation structure of an electronic device, which comprises a circuit board, a heat radiation layer and a heat reflection cover. One side of the circuit board is provided with a heat source. The heat radiation layer covers the surface of the circuit board and covers the heat source. The heat reflection cover covers the heat source and the heat radiation layer.

Preferably, the heat radiation layer and the heat reflection cover are spaced apart from each other.

Preferably, the above-mentioned heat radiation layer is a sheet-shaped heat radiation material.

Preferably, the above-mentioned heat radiation layer is made of sheet-like graphene.

Preferably, the above-mentioned heat radiation layer is composed of a single sheet of graphene.

Preferably, the above-mentioned heat radiation layer is composed of a plurality of sheets of graphene jointed and extended.

Preferably, the heat radiation layer includes a fixing structure and a plurality of heat radiation particles dispersed and embedded in the fixing structure.

Preferably, the above-mentioned heat radiation particles are graphene fragments.

Preferably, the above-mentioned heat radiation particles are carbon nanospheres.

Preferably, the above-mentioned fixing structure is a cured colloidal material.

Preferably, the above-mentioned heat reflection cover is made of metal.

Preferably, the area covered by the heat radiation layer on the surface of the circuit board is greater than the area occupied by the heat source on the surface of the circuit board.

Preferably, the above-mentioned heat source is located within the range where the above-mentioned heat radiation layer covers the surface of the above-mentioned circuit board.

Preferably, the utility model also includes a casing, the casing has a heat radiation penetration area, the above-mentioned circuit board is accommodated in the casing, and the above-mentioned heat radiation layer is opposite to the heat radiation penetration area respectively corresponding to the circuit board two-sided configuration.

Preferably, the above-mentioned heat reflection cover is a metal foil attached to the above-mentioned heat radiation layer.

The directional heat dissipation structure of the electronic device of the present utility model performs radiative heat dissipation through the heat radiation layer, and further changes the part of the heat radiation direction of the heat radiation layer by the heat reflection cover, so that the directional heat dissipation structure of the electronic device of the present utility model can Directional heat radiation dissipates heat, so the heat transfer direction of heat radiation can be effectively controlled.

Description of drawings

FIG. 1 is a schematic diagram of a directional heat dissipation structure of an electronic device according to a first embodiment of the present invention.

2 is a cross-sectional view of the heat radiation layer in the directional heat dissipation structure of the electronic device according to the first embodiment of the present invention.

3 is a cross-sectional view of another embodiment of the heat radiation layer in the directional heat dissipation structure of the electronic device according to the first embodiment of the present invention.

4 is a cross-sectional view of yet another embodiment of the heat radiation layer in the directional heat dissipation structure of the electronic device according to the first embodiment of the present invention.

FIG. 5 is a schematic diagram of the directional heat dissipation structure of the electronic device according to the second embodiment of the present invention.

FIG. 6 is a schematic diagram of a directional heat dissipation structure of an electronic device according to a third embodiment of the present invention.

【Description of main component symbols】

10 shell

11 Thermal Radiation Penetration Zone

100 circuit boards

110 heat source

200 thermal radiation layers

210 Fixed structure

220 Heat Radiant Particles

230 Adhesive layer

240 insulation

300 heat reflector

detailed description

Referring to FIG. 1 and FIG. 2 , the first embodiment of the present invention provides a directional heat dissipation structure of an electronic device, which includes a housing 10 , a circuit board 100 , a heat radiation layer 200 and a heat reflection cover 300 .

In this embodiment, the housing 10 is preferably made of non-metal, which can be penetrated by heat radiation. Therefore, at least a part of the housing 10 forms a heat radiation penetrating region 11 .

The circuit board 100 is accommodated in the casing 10 , and a heat source 110 is disposed on one side of the circuit board 100 .

The heat radiation layer 200 covers the surface of the circuit board 100 and covers the heat source 110, the area covered by the heat radiation layer 200 on the surface of the circuit board 100 is greater than the area occupied by the heat source 110 on the surface of the circuit board 100, and the heat source 110 is located on the heat radiation layer 200 Within the range covering the surface of the circuit board 100 , the heat radiation layer 200 and the heat radiation penetrating area 11 are opposite to the two sides of the circuit board 100 respectively. In this embodiment, the heat radiation layer 200 includes a fixing structure 210 and a plurality of heat radiation particles 220 scattered and embedded in the fixing structure 210 . Wherein, the fixation structure 210 is a cured colloidal material, and the heat radiation particles 220 may be Graphene fragments or carbon nanospheres. Graphene is a single-layer planar bond structure composed of hexagonal bonds of carbon atoms, and carbon nanospheres are a spherical bond structure composed of carbon atoms, both of which have good thermal radiation characteristics. The colloidal material and the heat radiation particles 220 are pre-mixed so that the heat radiation particles 220 are evenly dispersed in the colloidal material, and then the mixture is covered on the heat source 110 by coating, spraying or printing, and the colloidal material is cured to form After fixing the structure 210 , the heat radiation layer 200 is fixedly covered on the heat source 110 .

The heat reflection cover 300 covers the circuit board 100 to cover the heat source 110 and the heat radiation layer 200 , and the heat radiation layer 200 and the heat reflection cover 300 are spaced apart from each other. In this way, the heat conduction channel between the heat radiation layer 200 and the heat reflection cover 300 can be blocked, preventing the heat radiation layer 200 from conducting the heat energy generated by the heat source 110 to the heat reflection cover 300 .

FIG. 3 shows another embodiment of the heat radiation layer 200 . Wherein, the heat radiation layer 200 is a sheet-shaped heat radiation material, and the heat radiation layer 200 is preferably composed of a sheet-shaped graphene. The sheet-shaped graphene may be composed of a single sheet-shaped graphene, or may be composed of a plurality of sheet-shaped graphenes joined together and extended. An adhesive layer 230 is interposed between one side of the heat radiation layer 200 and the circuit board 100 , and the heat radiation layer 200 is fixed on the surface of the circuit board 100 and covered on the heat source 110 by the adhesive layer 230 .

FIG. 4 shows yet another embodiment of the heat radiation layer 200 . The heat radiation layer 200 includes a fixing structure 210 and a plurality of heat radiation particles 220 scattered and embedded in the fixing structure 210 . Wherein, the fixation structure 210 is a cured colloidal material, and the heat radiation particles 220 may be graphene fragments or carbon nanospheres. The colloidal material and the heat radiation particles 220 are pre-mixed so that the heat radiation particles 220 are evenly dispersed in the colloidal material, and then the mixture is covered on an adhesive layer 230 by coating, spraying or printing, and the colloidal material is cured to form After the structure 210 is fixed, it becomes the heat radiation layer 200 in the form of a patch. Then attach and fix the heat radiation layer 200 on the heat source 110 .

Referring to FIG. 5 , the second embodiment of the present invention provides a directional heat dissipation structure of an electronic device, which includes a housing 10 , a circuit board 100 , a heat radiation layer 200 and a heat reflection cover 300 .

In this embodiment, at least a part of the casing 10 is made of non-metal, thus forming a heat radiation penetrating area 11 capable of being penetrated by heat radiation. The circuit board 100 is accommodated in the casing 10 , and a heat source 110 is disposed on one side of the circuit board 100 . The heat radiation layer 200 covers the surface of the circuit board 100 and covers the heat source 110, the area covered by the heat radiation layer 200 on the surface of the circuit board 100 is greater than the area occupied by the heat source 110 on the surface of the circuit board 100, and the heat source 110 is located on the heat radiation layer 200 Within the range covering the surface of the circuit board 100 , the heat radiation layer 200 and the heat radiation penetrating area 11 are opposite to the two sides of the circuit board 100 respectively. In this embodiment, the heat radiation layer 200 can be in any form as described in the first embodiment.

At least another part of the housing 10 is made of metal to form a heat reflection cover 300. The heat reflection cover 300 covers the circuit board 100 to cover the heat source 110 and the heat radiation layer 200, and the heat radiation layer 200 and the heat reflection cover 300 Interval configuration. In this way, the heat conduction channel between the heat radiation layer 200 and the heat reflection cover 300 can be blocked, preventing the heat radiation layer 200 from conducting the heat energy generated by the heat source 110 to the heat reflection cover 300 .

Referring to FIG. 6 , the third embodiment of the present invention provides a directional heat dissipation structure of an electronic device, which includes a circuit board 100 , a heat radiation layer 200 and a heat reflection cover 300 .

A heat source 110 is disposed on one side of the circuit board 100 . The heat radiation layer 200 covers the surface of the circuit board 100 and covers the heat source 110, the area covered by the heat radiation layer 200 on the surface of the circuit board 100 is greater than the area occupied by the heat source 110 on the surface of the circuit board 100, and the heat source 110 is located on the heat radiation layer 200 within the range covering the surface of the circuit board 100 . In this embodiment, the heat radiation layer 200 can be in any form as described in the first embodiment. The heat reflection cover 300 is preferably a metal foil, which covers one side of the heat radiation layer 200 , and the other side of the heat radiation layer 200 is provided with an adhesive layer for sticking the heat source 110 and the circuit board 100 . Therefore, the heat radiation layer 200 is combined with the heat reflector in the form of a patch for easy installation. An insulating layer 240 is preferably sandwiched between the heat radiation layer 200 and the adhesive layer, so as to prevent the heat source 110 from conducting with the heat radiation layer 200 and the heat reflection cover to cause a short circuit or electromagnetic interference.

The directional heat dissipation structure of the electronic device of the present invention performs radiation heat dissipation through the heat radiation layer 200, and further changes the part of the heat radiation direction of the heat radiation layer 200 by the heat reflection cover 300, so that the orientation of the electronic device of the present invention The heat dissipation structure can dissipate heat through directional heat radiation, so the heat transfer direction of heat radiation can be effectively controlled. Taking a fixed electronic device as an example, the heat radiation penetration area 11 can be arranged at the bottom of the electronic device to avoid accidental contact and burns, thereby preventing the exposed surface from continuing to heat up. Taking a hand-held touch electronic device as an example, the heat radiation penetration area 11 can be formed by its display, so the heat radiation can avoid passing through the parts that the hand touches for a long time.

The above description is only a preferred embodiment of the utility model, and is not intended to limit the scope of protection of the patent of the utility model. Other equivalent changes using the spirit of the patent of the utility model should all belong to the scope of protection of the patent of the utility model. .

Claims (15)

1. A directional heat dissipation structure for an electronic device, characterized in that it comprises: a circuit board, one side of the circuit board is provided with a heat source; a heat radiation layer covers the surface of the circuit board and covers the heat source; and a The heat reflection cover covers the heat source and the heat radiation layer. 2 . The directional heat dissipation structure of an electronic device according to claim 1 , wherein the heat radiation layer and the heat reflection cover are spaced apart from each other. 3 . 3. The directional heat dissipation structure of an electronic device according to claim 1, wherein the heat radiation layer is a sheet-shaped heat radiation material. 4 . The directional heat dissipation structure of an electronic device as claimed in claim 3 , wherein the heat radiation layer is made of sheet-like graphene. 5 . The directional heat dissipation structure of an electronic device according to claim 4 , wherein the heat radiation layer is composed of a single sheet of graphene. 6 . 6 . The directional heat dissipation structure of an electronic device as claimed in claim 4 , wherein the heat radiation layer is composed of a plurality of sheet-shaped graphenes that are jointed and extended. 7 . 7 . The directional heat dissipation structure of an electronic device according to claim 3 , wherein the heat radiation layer comprises a fixing structure and a plurality of heat radiation particles scattered and embedded in the fixing structure. 8 . 8 . The directional heat dissipation structure of an electronic device according to claim 7 , wherein each heat radiation particle is a graphene fragment. 9. The directional heat dissipation structure of an electronic device according to claim 7, wherein each of the heat radiation particles is carbon nanospheres. 10. The directional heat dissipation structure of an electronic device as claimed in claim 7, wherein the fixing structure is a cured colloidal material. 11. The directional heat dissipation structure of an electronic device according to claim 1, wherein the heat reflection cover is made of metal. 12 . The directional heat dissipation structure of an electronic device according to claim 1 , wherein the area covered by the heat radiation layer on the surface of the circuit board is larger than the area occupied by the heat source on the surface of the circuit board. 13 . 13 . The directional heat dissipation structure of an electronic device according to claim 12 , wherein the heat source is located within a range where the heat radiation layer covers the surface of the circuit board. 14 . 14. The directional heat dissipation structure of an electronic device according to claim 1, further comprising a casing, the casing has a heat radiation penetration area, the circuit board is housed in the casing, and the heat radiation layer and the The heat radiation penetrating regions are oppositely disposed on two sides of the circuit board. 15. The directional heat dissipation structure of an electronic device according to claim 1, wherein the heat reflection cover is a metal foil attached to the heat radiation layer.