TWI443771B - Package substrate fixing device and method of manufacturing semiconductor chip package - Google Patents

Description

Package substrate fixing device and method of manufacturing semiconductor chip package

The present invention relates to a substrate fixing device for packaging and a method for manufacturing a semiconductor chip package, and more particularly to a method for manufacturing a wafer-type flip chip package substrate fixing device and a wafer type flip chip package.

The conventional wafer-type flip chip packaging technology (Flip Chip CSP, abbreviated as fcCSP), after flipping the wafer, is bonded to the laminated substrate through the metal conductor in a face-down manner, and is widely used in high performance and high speed. High density, as well as components on small package sizes.

As the size of the semiconductor device is reduced, the pitch of the electrical connection bumps is gradually reduced. When the conventional wafer type flip chip packaging technology is used, when the wafer is inverted and attached to the laminated substrate, the laminated substrate is warped by an external force, so that bridging between adjacent bumps is liable to occur, or a very brittle cold solder joint is formed ( Cold joint). In particular, when the wafer is placed on the laminated substrate, it is not fixed by the fixing jig, and after the reflowing step, and then the cleaning process for subsequently removing the flux is performed, the laminated substrate is fixed using the jig. edge. However, when the step of taking up the wafer on the laminated substrate, the laminated substrate is easily warped, resulting in bump bridging or cold solder joint defects. As far as it is concerned, there is a need in the industry for a method for fabricating a substrate for a package and a method for manufacturing a semiconductor chip package, which can effectively avoid bridging or cold solder joint defects between bumps, and avoid the cleaning process after removing the flux. Causes flux and easy residue.

According to an embodiment of the invention, a substrate fixing device for packaging includes: a bottom plate; a laminated substrate having a plurality of wafer dicing regions for at least one wafer bonding; and an upper fixing cover plate by magnetic or mechanical force The laminated substrate is flatly fixed between the bottom plate and the upper cover fixing plate; wherein the upper cover fixing plate has a plurality of opening regions corresponding to the wafer dicing regions.

According to another embodiment of the present invention, a method of fabricating a semiconductor chip package includes: providing a substrate fixing device for packaging, comprising: a substrate; a laminate substrate having a plurality of wafer dicing regions for at least one wafer bonding, and a The upper fixing cover plate is flatly fixed between the bottom plate and the upper cover fixing plate by magnetic force or mechanical force, wherein the upper cover fixing plate has a plurality of opening regions corresponding to the wafer dicing regions; Transmitting the wafer seeding region on the laminated substrate; performing a reflow process on the wafer substrate-containing package fixing device; and cleaning the wafer-containing substrate for packaging using a solution containing deionized water and a solvent Fix the device to remove residual flux.

In order to make the invention more apparent, the following detailed description of the embodiments and the accompanying drawings are as follows:

The following is a detailed description of the embodiments and examples accompanying the drawings, which are the basis of the present invention. In the drawings or the description of the specification, the same drawing numbers are used for similar or identical parts. In the drawings, the shape or thickness of the embodiment may be expanded and simplified or conveniently indicated. In addition, the components of the drawings will be described separately, and it is noted that the components not shown or described in the drawings are known to those of ordinary skill in the art, and in particular, The examples are merely illustrative of specific ways of using the invention and are not intended to limit the invention.

Fig. 1A is a perspective view showing a substrate fixing device for a package according to an embodiment of the present invention, and Fig. 1B is a schematic cross-sectional view showing a substrate fixing device for packaging according to Fig. 1A. 1A and 1B, a package substrate fixing device 100 includes a bottom plate 150, a laminated substrate 130, a plurality of wafer morphing regions 135 for bonding at least one wafer 160, and an upper cover fixing plate 110 having a plurality of openings. Region 125 corresponds to some of the wafer dicing regions 135. It should be understood that in the process of removing the flux, in order to facilitate the elimination of the solution composed of deionized water and solvent, the thickness T of the upper cover fixing plate 110 should be designed to be less than or equal to the thickness of the wafer 160. A plurality of pin holes 115 are provided in the peripheral region 126 of the upper cover fixing plate 110. The fixing holes 115 and the guide pins of the bottom plate are used to bond the guide pins of the bottom plate to fix the upper cover fixing plate 110, the laminated substrate 130 and the bottom plate 150. The open area of the upper cover fixing plate 110 includes a lattice-shaped thin strip 122 that separates the wafers in the array.

2A is a perspective view showing a substrate fixing device for packaging according to another embodiment of the present invention, and FIG. 2B is a schematic cross-sectional view showing a substrate fixing device for packaging according to FIG. 2A. In the 2A and 2B drawings, a package substrate fixing device 200 includes a bottom plate 250, a laminated substrate 230, a plurality of wafer morphing regions 235 for bonding at least one wafer 260, and an upper cover fixing plate 210 having a plurality of openings. Region 225 corresponds to some wafer morphing regions 235. In this embodiment, each wafer morphing region 235 is adhered to an array of wafers 260. A plurality of fixing holes 215 are provided in a peripheral region of the upper cover fixing plate 210. The fixing holes 215 are used to fix the upper cover fixing plate 210, the laminated substrate 230 and the bottom plate 250 in combination with a guide pin of the bottom plate. It should be understood that there is a broadband 228 between adjacent two open regions 225, wherein the width D of the broadband 228 is larger than the width d of a cutting groove 232 of the laminated substrate, but smaller than the spacing D between two adjacent array wafers. '. Further, in the process of removing the flux, in order to facilitate the elimination of the solution composed of the deionized water and the solvent, the thickness T of the upper cover fixing plate 110 should be designed to be less than or equal to the thickness of the wafer 160.

3A is a perspective view showing a substrate fixing device for packaging according to another embodiment of the present invention, and FIG. 3B is an exploded perspective view showing the substrate fixing device for packaging according to FIG. 3A. In FIGS. 3A and 3B, an upper cover fixing plate 310 includes a first fixing member 310a and a second fixing member 310b. The first fixing member 310a is a top cover ring, and the edge of the second fixing member 310b is pressed, wherein the outer periphery of the top cover ring has a plurality of buckles 318 for fixing the bottom plate, the laminated substrate, the upper fixing cover, and Top cover ring.

The second fixing member 310b is similar to the upper cover fixing plate 110 of FIG. 1 and has a plurality of opening regions 325 corresponding to the wafer dicing regions. A plurality of fixing holes 315 are provided in a peripheral region of the upper cover fixing plate 310. The fixing holes 315 are used for fixing the upper cover fixing plate, the laminated substrate and the bottom plate. Similarly, the opening region of the second fixing member 310b includes a lattice-shaped thin strip 322 which partitions each wafer in the array.

4A is a perspective view showing a substrate fixing device for a package according to another embodiment of the present invention, and FIG. 4B is a partially enlarged schematic view showing a peripheral region 4B of the substrate fixing device for package of FIG. 4A. In FIG. 4A and FIG. 4B, a package substrate fixing device 400 includes a bottom plate 450, a laminated substrate 430 having a plurality of wafer dicing regions for bonding at least one wafer, and an upper cover fixing plate 410 having a plurality of opening regions 425. The wafer area is corresponding to some wafers. In one embodiment, the bottom plate 450 is embedded with a plurality of magnets 458 to planarly fix the laminated substrate 430 between the bottom plate 450 and the upper cover fixing plate 410. The upper cover fixing plate 410 has a fixing hole 415 for fixing the upper cover fixing plate 410, the laminated substrate 430, and the bottom plate 450 in combination with a guide pin 416 of the bottom plate. In another embodiment, the bottom plate 450 has a plurality of vacuum suction holes 455 to adsorb the laminated substrate 430.

Furthermore, a plurality of fixing holes 415 are provided in the peripheral region 426 of the upper cover fixing plate 410. The peripheral region 426 of the upper cover fixing cover 410 has a plurality of dark grooves 428 connecting the opening regions 425 to the outside. 4C is a top view showing the combination of the package substrate fixing device 400 of FIG. 4A, and FIG. 4D is a schematic cross-sectional view showing the package substrate fixing device 400 of FIG. 4C. In FIG. 4D, the laminated substrate 430 can be flatly pressed and fixed on the bottom plate 450 by the upper cover fixing cover 410 to prevent warpage of the laminated substrate 430. It should be understood that in the process of removing the flux, in order to allow the solution composed of deionized water and solvent to be easily removed to the outside through the dark trench 428, the thickness T of the upper cover fixing plate 410 should be designed to be larger than the thickness of the wafer, and Greater than the height T1 of the dark trench 428.

5A is a top view showing a combination of a substrate fixing device 500 for packaging according to another embodiment of the present invention, and FIG. 5B is a cross-sectional view showing a substrate fixing device 500 for packaging according to FIG. 5A, and FIG. 5C is a view showing a fifth embodiment. A partially enlarged schematic view of a peripheral region 5C of the substrate fixing device for packaging. In the 5A and 5B drawings, a package substrate fixing device 500 includes a bottom plate 550, a laminated substrate 530, a plurality of wafer morphing regions 535 for bonding at least one wafer 560, and an upper cover fixing plate 510 having a plurality of openings. Region 525 corresponds to the crystallized region 535 of the wafer. The upper cover fixing plate 510 includes a lattice-like thin strip 522 that separates the positions of the respective wafers in the array. In this embodiment, the peripheral region of the upper cover fixing cover 510 has a plurality of channels 528. It should be understood that in the process of removing the flux, in order to allow the solution composed of deionized water and solvent to be easily removed to the outside through the channel 528, the opening region 525 is connected to the outside. The peripheral region of the upper cover fixing plate 510 is a stepped shape against the laminated substrate 530, and has a protruding portion 526, wherein the bottom of the channel 528 is approximately equal in height to the laminated substrate 530.

6A is a top view showing a combination of a substrate fixing device 600 for packaging according to another embodiment of the present invention, and FIG. 6B is a cross-sectional view showing a substrate fixing device 600 for packaging according to FIG. 6A, and FIG. 6C is a view showing a sixth embodiment. A partially enlarged schematic view of a peripheral region 6C of the substrate fixing device for packaging. In the sixth embodiment of FIG. 6A-6C, a package substrate fixing device 600 is substantially similar to the package substrate fixing device 500 described in the fifth embodiment of FIG. 5A-5C. For the sake of brevity, the same description will be omitted. The difference is that the peripheral area of the upper cover fixing plate 610 is a stepped shape and is pressed against the edge of the laminated substrate 630, and has a protruding portion 626, wherein the bottom of the channel 628 is substantially higher than the surface of the laminated substrate 630. The flux cleaning solution is removed to the outside through the channel 628.

According to the embodiment of the present invention, the wafer-type flip chip package can be manufactured by the above-described package substrate fixing device 100-600. For example, the above-described substrate fixing device for packaging is provided, and a wafer is reversely overlaid on a crystallized region of a wafer of a laminated substrate, and then a wafer-based package substrate fixing device is subjected to a reflow process to contain deionized ions. A solution of water and solvent cleans the wafer-containing package substrate fixing device to remove residual flux, wherein the wafer reverse coating step, the reflow process, and the cleaning to remove the residual flux step are performed in a continuous process equipment . Since the laminated substrate is flattened by the upper cover fixing plate, the inter-bump bridging or the cold joint defect caused by the warpage of the substrate can be avoided in the flip chip step. Furthermore, by providing a channel or a ditch in the peripheral region of the upper cover fixing plate, the flux removal solution can be completely removed to the outside during the removal of the flux, and the flux and the solution remain. Furthermore, since the substrate fixing device for packaging according to the embodiment of the present invention can integrally fix the bottom plate, the laminated substrate, and the upper cover fixing plate, it can be applied to the manufacturing process of the continuous wafer type flip chip package, and the external process is reduced due to the interrupt process. The resulting ultra-low dielectric constant dielectric delamination (ELK de-lamination).

The present invention has been disclosed in the above various embodiments, and is not intended to limit the scope of the present invention. Any one of ordinary skill in the art can make a few changes and refinements without departing from the spirit and scope of the invention. . The scope of the invention is defined by the scope of the appended claims.

100, 200, 300, 400, 500, 600. . . Substrate fixing device for packaging

110, 210, 310, 410, 510, 610. . . Upper cover fixing plate

115, 215, 315, 415. . . Fixed hole

416. . . Bottom plate pile

122, 322, 422, 522, 622. . . Lattice strip

125, 225, 325, 425, 525, 625. . . Open area

126, 226, 426. . . Peripheral area of the upper cover fixing plate

130, 230, 430, 530, 630. . . Laminated substrate

135, 235, 535, 635. . . Wafer placement area

150, 250, 450, 550, 650. . . Bottom plate

160, 260, 560, 660. . . Wafer

228. . . Broadband

232. . . Cutting slot

310a. . . First fixing member

310b. . . Second fixing member

318. . . Buckle

455. . . Vacuum suction hole

458. . . magnet

428. . . underground drain

526, 626. . . Protrusion

528, 628. . . Channel

T. . . Thickness of the upper cover fixing plate

T1. . . Dark trench height

D. . . Broadband width

D’. . . Spacing between two sets of array wafers

d. . . Cutting groove width

Fig. 1A is a perspective view showing a substrate fixing device for packaging according to an embodiment of the present invention.

Fig. 1B is a schematic cross-sectional view showing the package substrate fixing device of Fig. 1A.

2A is a perspective view showing a substrate fixing device for packaging according to another embodiment of the present invention.

Fig. 2B is a schematic cross-sectional view showing the package substrate fixing device of Fig. 2A.

3A is a perspective view showing a substrate fixing device for packaging according to another embodiment of the present invention.

Fig. 3B is an exploded perspective view showing the substrate fixing device for packaging of Fig. 3A.

4A is a perspective view showing a substrate fixing device for packaging according to another embodiment of the present invention.

Fig. 4B is a partially enlarged schematic view showing a peripheral region 4B of the package substrate fixing device of Fig. 4A.

Fig. 4C is a top view showing the combination of the package substrate fixing device 400 of Fig. 4A.

Fig. 4D is a schematic cross-sectional view showing the package substrate fixing device 400 of Fig. 4C.

Fig. 5A is a top plan view showing the combination of the substrate fixing device 500 for packaging according to another embodiment of the present invention.

Fig. 5B is a schematic cross-sectional view showing the package substrate fixing device 500 of Fig. 5A.

Fig. 5C is a partially enlarged schematic view showing a peripheral region 5C of the package substrate fixing device of Fig. 5A.

Fig. 6A is a top plan view showing the combination of the substrate fixing device 600 for packaging according to another embodiment of the present invention.

Fig. 6B is a schematic cross-sectional view showing the package substrate fixing device 600 of Fig. 6A.

Fig. 6C is a partially enlarged schematic view showing a peripheral region 6C of the package substrate fixing device of Fig. 6A.

400. . . Substrate fixing device for packaging

410. . . Upper cover fixing plate

415. . . Fixed hole

416. . . Bottom pile

422. . . Lattice strip

425. . . Open area

426. . . Peripheral area of the upper cover fixing plate

430. . . Laminated substrate

450. . . Bottom plate

455. . . Vacuum suction hole

458. . . magnet

428. . . underground drain

Claims (13)

A substrate fixing device for packaging, comprising: a bottom plate; a laminated substrate having a plurality of wafer dicing regions for bonding at least one wafer; and an upper fixing cover plate for fixing the laminated substrate to the bottom plate by magnetic force The upper cover fixing plate has a plurality of opening areas corresponding to the wafer dicing areas. The substrate fixing device for packaging according to claim 1, wherein the thickness of the upper cover fixing plate is less than or equal to the thickness of the wafer. The substrate fixing device for packaging according to claim 2, wherein a width of the adjacent two open regions is greater than a width of the plurality of slits of the laminated substrate, but less than two sets of arrays The spacing between the wafers. The substrate fixing device for packaging according to claim 1, further comprising a top cover ring for pressing an edge of the upper fixing cover, wherein a periphery of the top cover ring has a plurality of buckles for fixing the bottom plate The laminated substrate, the upper fixed cover, and the top cover ring are integrated. The substrate fixing device for packaging according to claim 1, wherein the peripheral region of the upper fixing cover has a plurality of dark grooves, and each of the dark grooves connects the opening regions to the outside. The substrate fixing device for packaging according to claim 1, wherein the thickness of the upper cover fixing plate is less than or equal to the thickness of the wafer, and the peripheral region of the upper fixing cover is a stepped shape having a plurality of The channel connects the open areas to the outside. A method for manufacturing a semiconductor chip package, comprising: providing a substrate fixing device for packaging, comprising: a bottom plate; a laminated substrate having a plurality of wafer dicing regions for bonding at least one wafer; and an upper fixing cover plate Magnetically fixing the laminated substrate between the bottom plate and the upper cover fixing plate; wherein the upper cover fixing plate has a plurality of opening regions corresponding to the wafer dicing regions; and the wafer is reversely overlaid on the laminated substrate Forming the wafer on the wafer; performing a reflow process on the substrate holder for the package; and cleaning the wafer-containing substrate holder with a solution containing deionized water and a solvent to remove the residual flux. The method of manufacturing a semiconductor chip package according to claim 7, wherein the step of reversing the wafer, the step of reflowing, and the step of removing the residual flux by cleaning are performed in a continuous process apparatus. The method of manufacturing a semiconductor chip package according to claim 7, wherein the thickness of the upper cover fixing plate is less than or equal to the thickness of the wafer. The method for fabricating a semiconductor chip package according to claim 7, wherein a broadband is provided between adjacent two open regions. Wherein the width of the broadband is greater than the width of a dicing groove of the laminated substrate, but less than the spacing between the two arrays of wafers. The method for manufacturing a semiconductor chip package according to claim 7, further comprising a top cover ring for pressing an edge of the upper fixing cover, wherein the outer periphery of the top cover ring has a plurality of buckles for fixing The bottom plate, the laminated substrate, the upper fixed cover, and the top cover ring are integrated. The method for manufacturing a semiconductor chip package according to claim 7, wherein the peripheral region of the upper fixed cover has a plurality of dark trenches, and each of the dark trenches connects the open regions to the outside. The method for manufacturing a semiconductor chip package according to claim 7, wherein the thickness of the upper cover fixing plate is less than or equal to the thickness of the wafer, and the peripheral region of the upper fixing cover is a stepped shape having a plurality of The channel connects the open areas to the outside.