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TWM329320U - Improvement of ramming and tightly assembly structure for heat sink with heat-conducting pipe - Google Patents

Improvement of ramming and tightly assembly structure for heat sink with heat-conducting pipe Download PDF

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Publication number
TWM329320U
TWM329320U TW96213047U TW96213047U TWM329320U TW M329320 U TWM329320 U TW M329320U TW 96213047 U TW96213047 U TW 96213047U TW 96213047 U TW96213047 U TW 96213047U TW M329320 U TWM329320 U TW M329320U
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TW
Taiwan
Prior art keywords
heat
groove
base
pipe
heat sink
Prior art date
Application number
TW96213047U
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Chinese (zh)
Inventor
Shi-Ming Chen
Original Assignee
Shi-Ming Chen
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Application filed by Shi-Ming Chen filed Critical Shi-Ming Chen
Priority to TW96213047U priority Critical patent/TWM329320U/en
Publication of TWM329320U publication Critical patent/TWM329320U/en

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Description

^329320 八、新型說明: 【新型所屬之技術領域】 之間的 本創作關於一種包含冑導熱管之散熱裂 結構造改良,主要應用於電腦或電子設備的散勃J汁反緊 利用開設有管槽的底座及相對應的散熱片鱼^勒置’其 沖壓緊結構造改良。 ^& 【先前技術】 處理ι§及晶片組需要有效率的散熱器提供散熱工 作’散熱器對處理器的重要性將與運算速度成吾:正 比關係,使用電腦的時間越長,處理器產生的^度當 然也是越高。處理器的高溫在可被接受範圍内,戋可 以利用本身内部散熱降溫,以維持在可接受的溫度值 内,一切的溫升問題就不會發生,否則就必須以外在 特殊設計的零組件降低處理器的溫升,以維持處理器 的南溫在可被接受的數值範圍内,使電腦運作一切正 常。最常見的是在電子元件上加上散熱組件(HeatSjnk^329320 VIII. New description: [New technical field] The creation between the two is related to the improvement of the heat-dissipating structure of the heat-conducting tube. It is mainly used in the computer or electronic equipment. The base of the groove and the corresponding heat sink fins are arranged to improve the stamping structure. ^& [Prior Art] Handling ι§ and chipset requires efficient heat sink to provide heat dissipation. 'The importance of the heatsink to the processor will be proportional to the speed of the operation: the proportional relationship, the longer the computer is used, the processor The resulting degree is of course higher. The high temperature of the processor is within the acceptable range, and the internal heat dissipation of the processor can be used to maintain the temperature within the acceptable temperature. All temperature rise problems will not occur, otherwise it must be reduced by specially designed components. The temperature rise of the processor to maintain the processor's south temperature within acceptable values allows the computer to function properly. The most common is to add heat sink components to the electronic components (HeatSjnk

Assembly),但不同形式的散熱組件所表現出的散熱效 益往往具有相異性。 雖然散熱裝置已是一項成熟的產業,不過仍有改 善提升散熱效率的空間。即如同本案申請人所申請的 本國專利申請第93208345號「散熱片與底座的沖壓 肷组結構」,主要特點在底座的表面成型有多道凸面, M329320 以及異於凸面的軸向,具有複數與該若干凸面呈徑向 貫通的凹槽;該散熱片恰可對應插入凹槽中,藉一底 面具嚙齒之成型模具沖壓散熱片兩側的凸面,使凸面 受力而產生外擴形變,且將散熱片嵌組植立於底座 上。此方式利用凸面增加形變的裕度,達到較佳的嵌 組密接效果,並且不需要藉錫膏及高溫填縫,簡化工 時並且避免加工污染,同時具有提升生產效率。 y 另外,請參閱第一圖及第二圖所示,為本案申請 人所提出的另一件本國專利申請第93214321號「包 含有導熱管之散熱裝置的沖壓緊結構造」,主要利用底 座1 〇、散熱器12和導熱管14所構成,本案於底座 10的頂面102具有凹溝104,異於凹溝104的軸向成 型多道凹槽106,導熱管14預置於凹溝104中。散熱Assembly), but the heat dissipation benefits of different forms of heat sink components are often different. Although the heat sink is already a mature industry, there is still room to improve the efficiency of heat dissipation. The main feature is that the surface of the base is formed with a plurality of convex surfaces, the M329320 and the axial direction different from the convex surface, and have a complex number and the same as the national patent application No. 93208345 filed by the applicant of the present application. The plurality of convex surfaces are radially penetrating grooves; the heat sink is correspondingly inserted into the groove, and the convex surface on both sides of the heat sink is stamped by a forming mold of the bottom mask rod, so that the convex surface is forced to expand and deform, and The heat sink inlay is implanted on the base. This method utilizes the convex surface to increase the deformation margin, achieves a better embedded adhesion effect, and does not require the use of solder paste and high temperature caulking, which simplifies the working hours and avoids processing pollution, and at the same time improves production efficiency. y In addition, please refer to the first figure and the second figure, and the other applicant's domestic patent application No. 93,231,421, "The stamped tight structure including the heat sink of the heat pipe" is mainly used for the base 1 〇 The radiator 12 and the heat pipe 14 are formed. The top surface 102 of the base 10 has a groove 104. The plurality of grooves 106 are formed in the axial direction of the groove 104. The heat pipe 14 is preset in the groove 104. Heat dissipation

器,12之鰭片122對應插入凹槽106,同時壓掣導熱管 I ^ 14定位於底座1◦上,藉成型模具16沖壓鰭片122兩 側之底座10表面,令其受壓產生外擴形變,使鰭片 122得與底座10鉚合,且將導熱管14緊結定位於鰭 片122和底座10間,本案之散熱效果將更勝前一習知 案。不過,該導熱管的設置必須藉其他定位機構輔助, 以維持在較佳的結合準位,再者,導熱管之固定係藉 由底座以及散熱器兩者對合包覆而成,將難以避免其 M329320 成型公差和組裝結合的誤差,結合的間隙可控制性較 差,甚至散熱器無法與導熱管緊密接觸,將使產品形 成熱傳導效率未如預期。 創作人於此一領域已投入多年,對於產品研究開 發不遺餘力,為尋求更精進的散熱緊結結構及其散熱 效率提升,故完成本創作之開發設計。 【新型内容】 本創作所述之目的在於提供一種包含有導熱管之散熱裝 置的沖壓緊結構造改良,其利用在底座上直接開設可供導 熱管穿設之管槽,利用成型模具沖壓散熱片兩側且透過^桿 之開口壓摯導熱管形變迫緊管槽,同時夾摯散熱片,而產^ 緊結一體之作用,避免過多的包覆組裝結構,可減少組裝結 合的誤差、公差,使結合的間隙變小。 本創作之次一目的在於提升散熱裝置之效率,透 過設於散熱片下方的折面,使散熱片與導熱管的接觸 面積增加,所以熱能透過底座由散熱片傳導之外,也 可經由折面直接傳導至散熱片上,藉以提升散熱效率。 本創作之再一目的在於開設該可供導熱管穿設之 管槽,使導熱管在一個動作下即完成沖壓前的定位, 將有效節省製作時間和提昇產品的精準度。 本創作解決問題之技術手段: 本創作之沖壓緊結構造改良,包含散熱管、底座 以及數散熱片組裝而成,該底座上開設一可供導熱管 M329320 穿設乏管槽,管槽上具有一與底座表面相連通之開 口,底座表面形成有與管槽交錯的複數凹槽及齒槽, 散熱片可對應插入凹槽,藉以一具有嚙齒之成形模具 沖壓散熱片兩側之齒槽,散熱片下壓時,同時使底座 受力產生變形、成型模具透過開口壓摯導熱管形變迫 緊管槽,同時底座產生夾摯散熱片,使底座導熱管及 散熱片緊結為一體。 為增加緊結度,在底座的表面上形成與管槽交錯 之數凹槽及齒槽,而所述散熱片可對應插入凹槽,各 散熱片下方具有折面,該折面將覆於管槽上,兩側之 齒槽,齒槽受力產生變形,使散熱片能嵌組植立在底 座上,並使散熱片之折面緊貼於導熱管 所述之散熱片的折面覆於管槽時也將同時覆貼在 導熱管上,經過該具有响齒之成形模具沖壓散熱片和 導熱管,在擠壓緊迫作用下散熱片之折面將緊貼於導 熱管,同時散熱片嵌組植立在底座上。 本創作對照先前技術之功效: 1、 改善以往製作散熱裝置之複雜度,簡化沖壓前 零組件的組裝時間。 2、 簡化過多對於導熱管的包覆結構,可減少組裝 結合的誤差、公差,使結合的間隙變小,提昇散熱效 M329320 月£ ° 以下將配合圖式說明本創作的較佳實施例,下述 所列舉的實施例係用以_本創作,並非用以限定本 創作之範圍,任何熟習此技藝者,當可做些許更動盘 潤飾’因此本_之賴_當視後附之申請專利範 圍所界定者為準。 【實施方式】 请芩閱第三圖,本創作組成主要包括有:底座2〇、 導熱官22、數散熱片24N,而數散熱片24N可預先組 合形成一散熱器24。其中,在底座2〇適當位置處開 设有可供導熱管22穿設之管槽202,管槽202有一與 底座20之表面2〇〇相連通之開口 204。本實施例中所 繪製的為開設單條管槽,開設複數條管槽於底座上亦 可。底座20的表面2〇〇形成有與管槽202交錯之數 凹槽206及齒槽2〇8,該凹槽2〇6與齒槽2〇8彼此呈 現依序相鄰排列。 若底座20上具有凹槽206時,每一片散熱片24N 將可對應依序插入底座20上的凹槽206,使散熱片 24N呈現直立在底座2〇上的狀態,再者,各散熱片 24N下緣均具有一折面240N,該折面240N恰巧可覆 蓋在管槽202上方開口端204,且令該折面240N於 M329320 沖壓後能與導熱管22緊密貼合。在直接沖壓的情況 下,散熱片24N是可以利用沖壓設備直接沖壓其兩側 之底座20表面而與底座2〇結合為一體,而不需要在 底座20上設置齒槽208,所以在此實施例中,齒槽208 主要疋提供散熱片24N及沖壓設備更佳的導引。 組合後,本創作將呈現如第四圖所示之狀態,由 於導熱官22將直接穿套於底座20之管槽202中,所 以在組I動作上將較為簡易,本創作之特色在於下方 導熱管22、底座20及散熱器24之緊結密度上更甚習 知技術,至於上方散熱器24與導熱管22將利用任何 可貫订的方式套接,如本實闕為在各散熱片24N各 具有一環面242N經沖壓包覆於導熱管22周圍。回到 底座20部位說明部分,除了露出在開口 2〇4的部份, 戎導熱官22大部份的散熱區域將直接與底座2〇貼 合,本創作為了避免任何可能影響散熱效率之因素, 故進一步設計各散熱片24N下方具有折面24〇N,以 提升導熱面積和效果。 請同時參閱第五圖、第六圖及第七圖之一系列分 解沖壓過程說明’本糸列說明之部件包含有凹槽2Q6、 齒槽208以及折面240N。第五圖為本創作尚未沖壓時 之組合侧視圖’散熱片24N及其折面240N透過組裝 10 M329320 設備韌作而設在底座20之凹槽206的上方,另導熱管 22已套接於底座20之管槽202内,此時導熱管22之 上緣部位位於開口 204且高出於凹槽2〇6底部一預定 距鬲度未沖壓變形。緊接著利用一種成形模具3〇壓迫 導熱管22,故可以從第六圖瞭解導熱管22之上緣部 位將產生形變,形變的導熱管22與管槽202緊結,相 對即與底座20緊結。同時間,散熱片24N受到壓迫 而嵌入底座20之凹槽206内,因凹槽206之槽身相 交於導熱管22,使散熱片24N緊壓導熱管22、故亦 與底座20緊結一體。折面240N將覆於管槽202内也 將同時緊結在導熱管22上緣。 請繼續參閱第七圖,該成形模具30之唾齒32之 沖壓散熱片24N兩側之齒槽208,齒槽208受力產生 外擴變形,將使原本齒槽208產生向兩側推擠的動 作,而此一動作將使設置在凹槽206内的散熱片24N 與底座20成為鉚合狀態,迫使底座2〇、導熱管22及 散熱片24N確實緊結為一體’達到散熱片24N嵌組植 立在底座20上’同時散熱片24N之折面240N緊結於 導熱管22。 11 M329320 【圖式'簡單說明】 第一圖為本國專利申請第93214321號之分解圖; 第二圖為本國專利申請第93214321號之沖壓完成圖; 第三圖為本創作之立體分解圖; 第四圖為本創作尚未沖壓時之組合立體圖; 第五圖為本創作尚未沖壓時之組合側視圖; 第六圖為本創作沖壓過程之組合側視圖;以及 第七圖為本創作沖壓完成之側視圖。 【主要元件符號說明】 10 底座 102 頂面 104 凹溝 106 凹槽 12 散熱器 122 雜片 14 熱導管 20 底座 200 表面 202 管槽 204 開口端 206 凹槽 208 齒槽 22 導熱管 24 散熱器 24N 散熱片 240N 折面 242N 環面 30 成形模具 32 嚙齒 12The fins 122 of the 12 are correspondingly inserted into the recesses 106, and the heat-conducting heat pipes I ^ 14 are positioned on the base 1 , and the surface of the base 10 on both sides of the fins 122 is punched by the molding die 16 to cause the pressure to be expanded. The deformation causes the fins 122 to be riveted to the base 10, and the heat pipe 14 is tightly positioned between the fins 122 and the base 10. The heat dissipation effect of the present case will be better than the prior art. However, the arrangement of the heat pipe must be assisted by other positioning mechanisms to maintain a good bonding level. Furthermore, the fixing of the heat pipe is made by the combination of the base and the heat sink, which is difficult to avoid. Its M329320 molding tolerance and assembly combined error, the combined gap controllability is poor, and even the heat sink can not be in close contact with the heat pipe, which will make the product heat transfer efficiency is not as expected. The creators have been investing in this field for many years, and have spared no effort in product research and development. In order to seek a more sophisticated heat-tight structure and improve heat dissipation efficiency, the development and design of this creation has been completed. [New content] The purpose of the present invention is to provide an improved stamping structure including a heat dissipating device of a heat pipe, which uses a pipe groove for the heat pipe to be directly opened on the base, and the heat sink is stamped by a molding die. On the side and through the opening of the rod, the heat-conducting tube is pressed to tighten the tube groove, and the heat sink is clamped at the same time, and the joint is integrated to avoid excessive coating assembly structure, which can reduce the error and tolerance of assembly and combination, and make the combination The gap becomes smaller. The second purpose of this creation is to improve the efficiency of the heat sink. The contact area between the heat sink and the heat pipe is increased by the folded surface provided under the heat sink, so that the heat can be transmitted through the heat sink through the base, and the heat can also be passed through the folded surface. Directly transmitted to the heat sink to improve heat dissipation efficiency. A further object of the present invention is to open the tube slot through which the heat pipe can be placed, so that the heat pipe can be positioned before the punching in one action, which will effectively save the production time and improve the precision of the product. The technical means for solving the problem in this creation: The stamping and compact structure of the creation is improved, and comprises a heat pipe, a base and a plurality of heat sinks. The base is provided with a heat pipe M329320 for wearing a pipe slot, and the pipe groove has a An opening communicating with the surface of the base, the surface of the base is formed with a plurality of grooves and slots which are interlaced with the tube groove, and the heat sink can be correspondingly inserted into the groove, whereby a toothed molding die has stamped the groove on both sides of the heat sink, the heat sink When the pressure is pressed, the base is deformed by force, and the molding die is pressed through the opening to pressurize the heat pipe to change the tube groove. At the same time, the base generates a heat sink, so that the base heat pipe and the heat sink are tightly integrated. In order to increase the degree of tightness, a plurality of grooves and slots intersecting with the tube groove are formed on the surface of the base, and the heat sink may be correspondingly inserted into the groove, and each of the heat sinks has a folded surface, and the folded surface will cover the tube groove. The upper and the other side of the tooth groove, the tooth groove is deformed by force, so that the heat sink can be embedded in the base, and the folded surface of the heat sink is closely attached to the heat sink of the heat sink to cover the tube. The groove will also be pasted on the heat pipe at the same time, and the heat sink and the heat pipe will be punched through the forming die with the tooth, and the folded surface of the heat sink will be closely attached to the heat pipe under the pressing force, and the heat sink is embedded. Planted on the base. This creation compares the effects of the prior art: 1. Improves the complexity of making heat sinks in the past and simplifies the assembly time of components before stamping. 2. Simplify too much for the coating structure of the heat pipe, which can reduce the error and tolerance of the assembly and joint, make the combined gap smaller, and improve the heat dissipation effect. The following is a description of the preferred embodiment of the creation. The examples listed are used for the purpose of this creation, and are not intended to limit the scope of the present invention. Anyone who is familiar with the art can make some changes to the movement. Therefore, the scope of the patent application is attached. The definition is final. [Embodiment] Please refer to the third figure. The composition of the present invention mainly includes: a base 2 〇, a heat conducting member 22, and a plurality of heat sinks 24N, and the plurality of heat sinks 24N can be combined in advance to form a heat sink 24. Wherein, a pipe groove 202 through which the heat pipe 22 can be passed is formed at a suitable position of the base 2, and the pipe groove 202 has an opening 204 communicating with the surface 2 of the base 20. In the embodiment, a single tube groove is opened, and a plurality of tube grooves are opened on the base. The surface 2 of the base 20 is formed with a plurality of grooves 206 and slots 2 交错 8 interlaced with the tube grooves 202, and the grooves 2 〇 6 and the gullets 2 〇 8 are arranged adjacent to each other in order. If the base 20 has a recess 206, each fin 24N can be inserted into the recess 206 on the base 20 in sequence, so that the fin 24N is in a state of standing upright on the base 2, and further, each fin 24N The lower edge has a folded surface 240N. The folded surface 240N can cover the open end 204 above the tube groove 202, and the folded surface 240N can be closely adhered to the heat pipe 22 after being stamped by M329320. In the case of direct stamping, the fins 24N can be integrally joined to the base 2 by directly stamping the surfaces of the bases 20 on both sides thereof by a punching apparatus, without providing the slots 208 on the base 20, so in this embodiment In the middle, the slot 208 mainly provides a better guide for the heat sink 24N and the stamping device. After the combination, the creation will show the state as shown in the fourth figure. Since the heat-conducting member 22 will be directly put into the tube groove 202 of the base 20, the operation of the group I will be relatively simple, and the feature of the creation is the heat conduction below. The tightness density of the tube 22, the base 20 and the heat sink 24 is even more conventional. As for the upper heat sink 24 and the heat transfer tube 22, it can be sleeved by any splicable manner, as in the present embodiment, each of the heat sinks 24N A ring surface 242N is stamped and wrapped around the heat pipe 22. Returning to the description of the base 20, except for the portion exposed at the opening 2〇4, most of the heat-dissipating area of the heat-conducting member 22 will directly fit the base 2, and this creation is to avoid any factors that may affect the heat dissipation efficiency. Therefore, it is further designed that each of the fins 24N has a folded surface 24〇N to enhance the heat transfer area and effect. Please also refer to the fifth, sixth and seventh diagrams for a series of explanations of the stamping process. The parts described in this column contain grooves 2Q6, slots 208 and folds 240N. The fifth figure is a combination of the side view of the creation of the heat sink 24N and its folded surface 240N is placed above the groove 206 of the base 20 through the assembly 10 M329320 device toughness, and the heat pipe 22 has been sleeved on the base In the tube groove 202 of the tube 20, the upper edge portion of the heat pipe 22 is located at the opening 204 and is not stamped and deformed at a predetermined distance from the bottom of the groove 2〇6. Immediately after the heat transfer tube 22 is pressed by a forming die 3, it can be understood from the sixth figure that the upper edge portion of the heat transfer pipe 22 is deformed, and the deformed heat pipe 22 is tightly coupled to the pipe groove 202, and is relatively tightly coupled to the base 20. At the same time, the heat sink 24N is pressed into the recess 206 of the base 20, and the groove of the recess 206 intersects the heat pipe 22, so that the heat sink 24N presses the heat pipe 22, and is also tightly integrated with the base 20. The folded surface 240N will be overlaid in the tube groove 202 and will also be tightly bonded to the upper edge of the heat pipe 22. Referring to the seventh figure, the tooth grooves 208 on both sides of the stamping fins 24N of the salient teeth 32 of the forming mold 30, the slots 208 are subjected to external expansion deformation, which will cause the original slots 208 to be pushed to both sides. Action, and this action will make the heat sink 24N disposed in the groove 206 and the base 20 riveted, forcing the base 2〇, the heat pipe 22 and the heat sink 24N to be tightly integrated into one. Standing on the base 20', the folded surface 240N of the heat sink 24N is fastened to the heat pipe 22. 11 M329320 [Simplified description of the drawing] The first drawing is an exploded view of the national patent application No. 93213321; the second drawing is the stamping completion drawing of the national patent application No. 93213321; The third drawing is an exploded view of the creation; The four figures are the combined perspective view when the creation has not been stamped; the fifth picture is the combined side view of the original stamping process; the sixth figure is the combined side view of the creative stamping process; and the seventh figure is the side of the finished stamping process. view. [Main component symbol description] 10 Base 102 Top surface 104 Groove 106 Groove 12 Heat sink 122 Chip 14 Heat pipe 20 Base 200 Surface 202 Tube groove 204 Open end 206 Groove 208 Groove 22 Heat pipe 24 Heat sink 24N Heat sink Sheet 240N Folding surface 242N Torus 30 Forming mold 32 Rodion 12

Claims (1)

M329320 九、申請專利範圍: 1. 一種包含有導熱管之散熱裝置的沖壓緊結構造改 良,係包含導熱管、底座以及散熱片組裝而成,該底 座上開設一可供導熱管穿設之管槽,管槽具有一與底 座之表面相連通之開口,底座表面形成有與管槽交錯 的複數凹槽及齒槽,散熱片可對應插入凹槽;藉一成 型模具與散熱片兩側之齒槽對應沖壓,以及成型模具 1 . 透過開口壓摯導熱管,形變的導熱管與管槽緊結,同 時間受力形變的底座夾掣散熱片,底座、導熱管及散 熱片緊結為一體。 2-如申請專利範圍第1項所述之包含有導熱管之散熱 裝置的沖壓緊結構造改良,其中,在底座的表面上形 成與管槽交錯之數凹槽及齒槽,使散熱片可對應插入 凹槽,成型模具穿入散熱片對其兩側面之齒槽沖壓。 \ 3.如申請專利範圍第1項所述之包含有導熱管之散熱 裝置的沖壓緊結構造改良,其中,該複數凹槽及齒槽 係對應設於底座表面形成的管槽之垂直軸向。 4. 如申請專利範圍第1項所述之包含有導熱管之散熱 裝置的沖壓緊結構造改良,其中,該散熱片之下緣具 有一折面,該折面將自管槽之開口覆於導熱管上。 5. 如申請專利範圍第1項所述之包含有導熱管之散熱 13 M329320 裝置的沖壓緊結構造改良,其中導熱管設於管槽内, 其上緣部位於開口且高出於凹槽底部。 6·如申請專利範圍第2項所述之包含有導熱管之散熱 裝置的沖壓緊結構造改良,其中,模具具有嚙齒,可 對散熱片兩側之齒槽進行沖壓,齒槽受力產生外擴變 形,使設置在凹槽内的散熱片與底座成為鉚合狀態。M329320 Nine, the scope of application for patents: 1. A stamping tight structure improvement comprising a heat dissipating device of a heat pipe, comprising a heat pipe, a base and a heat sink assembled with a pipe slot through which the heat pipe can be inserted The tube groove has an opening communicating with the surface of the base, and the surface of the base is formed with a plurality of grooves and slots which are interlaced with the tube groove, and the heat sink can be correspondingly inserted into the groove; and a molding die and the groove on both sides of the heat sink are formed Corresponding stamping, and forming mold 1. The heat-conducting tube is pressed through the opening, and the deformed heat-conducting tube is tightly connected with the tube groove, and the base member, the heat-dissipating tube and the heat sink are tightly integrated. 2- The stamping compact structure comprising the heat dissipating device of the heat pipe is improved according to the first aspect of the patent application, wherein the groove and the tooth groove intersect with the pipe groove are formed on the surface of the base, so that the heat sink can correspond The groove is inserted, and the molding die is inserted into the fin to punch the slots on both sides thereof. 3. The stamping compact structure comprising the heat dissipating device of the heat pipe according to claim 1 is characterized in that the plurality of grooves and slots are corresponding to the vertical axial direction of the pipe groove formed on the surface of the base. 4. The stamping compact structure comprising the heat dissipating device of the heat pipe according to claim 1 is characterized in that the lower edge of the fin has a folded surface, and the folded surface covers the heat conduction from the opening of the pipe groove. On the tube. 5. The stamped compact structure of the heat sink 13 M329320 device as described in claim 1 is provided, wherein the heat pipe is disposed in the pipe groove, and the upper edge portion is located at the opening and is higher than the bottom of the groove. 6. The improvement of the stamping tight structure comprising the heat dissipating device of the heat pipe as described in claim 2, wherein the mold has a rod tooth, and the groove on both sides of the fin can be punched, and the cogging is forced to expand. The deformation causes the heat sink and the base disposed in the groove to be riveted. 1414
TW96213047U 2007-08-08 2007-08-08 Improvement of ramming and tightly assembly structure for heat sink with heat-conducting pipe TWM329320U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW96213047U TWM329320U (en) 2007-08-08 2007-08-08 Improvement of ramming and tightly assembly structure for heat sink with heat-conducting pipe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW96213047U TWM329320U (en) 2007-08-08 2007-08-08 Improvement of ramming and tightly assembly structure for heat sink with heat-conducting pipe

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Publication Number Publication Date
TWM329320U true TWM329320U (en) 2008-03-21

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