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TWI260245B - Heat sink and method of manufacture - Google Patents

Heat sink and method of manufacture Download PDF

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Publication number
TWI260245B
TWI260245B TW93104253A TW93104253A TWI260245B TW I260245 B TWI260245 B TW I260245B TW 93104253 A TW93104253 A TW 93104253A TW 93104253 A TW93104253 A TW 93104253A TW I260245 B TWI260245 B TW I260245B
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TW
Taiwan
Prior art keywords
heat sink
base
heat
joint
section
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Application number
TW93104253A
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Chinese (zh)
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TW200528208A (en
Inventor
Chun-Yi Chang
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Hon Hai Prec Ind Co Ltd
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Priority to TW93104253A priority Critical patent/TWI260245B/en
Publication of TW200528208A publication Critical patent/TW200528208A/en
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Publication of TWI260245B publication Critical patent/TWI260245B/en

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  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat sink includes a base and a plurality of fins. A plurality of grooves is parallely defined in one side of the base. Each fin includes a heat dissipating section and an engaging section bent from a bottom of the heat dissipating section and interferentially engaged with a corresponding groove. A method of manufacture of the heat sink includes following steps: providing a base, having a plurality of grooves defined in a side thereof; providing a plurality of fins, each including a heat dissipating section and an engaging section bent from a bottom of the heat dissipating section; pressing the engaging section of each fin along a direction parallel to the base in order to make the engaging sections interferentially engaged with the grooves.

Description

…月所屬之技術領域】 方法,扣 敎哭$ ,別係關於 —及其製造方法 處理器等命 加,其&屯子元件 基座面積 月又 越奸,、下,散熱 片严声即散熱器表 子度越薄越好, 數量,你* 日加政熱器 f式製造,因此散 為之散熱性能極為 露—種焊接式散熱 上之散熱片組,基 熱杰'由於散熱片與 大地增加散熱器散 熱1從基座傳遞給 座間通過焊接方法 一種散插式散熱器 側板面上設有複數 一散熱片,相鄰插 -種i ^:Ϊ:於:種散熱器及其製造 。 、电子凡件散熱之免焊接式散 【先前技術】 處理能力^、,資i產業快速發展,中央 熱器也右 ^加強產生之熱量不斷增 片數量越T斷改良。人們均知,在同等 面積越大夕且散熱片越大時則散熱效果 這樣可以^ ^熱效果越好。理論上散熱 表面積,〃向單位基座面積上散熱片之 熱片與其严車乂薄政熱片不易以一體成型 重要。4間之組合方式對於提高散熱 器,二,大陸專利公告第2 5 34773Υ號揭 座與散政熱器包括一基座及設置於基座 基座分5=通過焊接接合。這種散 熱面積熱片可做得較薄’較 散埶Η —片接介面熱阻較大,不利於 接人 衫響散熱效果,且散熱片與基 5不利於大量生產· 中莖民 ,包 辛民國專利公告第3 5 3 5 1 6號揭露 平一=基座及一組散熱片。該基座^ 仃/、側緣之插槽,各插槽分別設置有...the technical field of the month] The method, deduction and crying, the other is about - and its manufacturing method processor and so on, its & 屯 屯 元件 基座 基座 基座 基座 基座 基座 基座 基座 基座 基座 基座 基座 基座 基座 基座 基座 基座 基座 基座 基座 基座The thinner the table, the better, the quantity, you * day plus the political heat device f-type manufacturing, so the heat dissipation performance is extremely exposed - the heat sink type on the welding type of heat, the base heat Jie' due to the heat sink and the earth Increasing the heat dissipation of the heat sink 1 is transmitted from the base to the seat. A welding method is used. A diffuser heat sink is provided with a plurality of heat sinks on the side surface of the heat sink, and adjacent plug-in type i ^:Ϊ: in: a kind of heat sink and its manufacture. , the electronic parts of the heat-dissipating welding-free dispersion [Prior Art] processing capacity ^, the i industry is developing rapidly, the central heat exchanger is also right ^ enhanced heat generated by the number of T-cut improved. It is well known that the larger the equivalent area and the larger the heat sink, the better the heat dissipation effect. Theoretically, the surface area of the heat dissipation, the heat sink on the unit base area, and the heat sheet and the thin heat sheet are not easy to form integrally. The combination of the four methods is to improve the heat sink. Second, the Continental Patent Publication No. 2 5 34773 discloses that the base and the heat exchanger comprise a base and are disposed on the base base 5 = by welding. The heat-dissipating area heat sheet can be made thinner than the thin one--the heat resistance of the chip interface is large, which is not conducive to the heat dissipation effect of the socket, and the heat sink and the base 5 are not conducive to mass production. Xinminguo Patent Announcement No. 3 5 3 5 1 6 discloses Pingyi = base and a set of heat sinks. The base ^ 仃 /, the side edge of the slot, each slot is set

BHII Η 第5頁 19^0945 五、發明說明(2) 槽間均形成 一板體往其 熱片使之固 較薄從而增 接合,散熱 給散熱片而 都較大時, 製造難度與 為使散 介面熱阻小 上述常用、欠 種散熱面積 器已成為急 【内容】 本發明 免焊接式散 本發明 側設有複數 彎折而出之 本發明 座’該基座 散熱片包括 沿平行基座 合槽内並與 槽間部,每隔一槽間部設有一 V型槽,以供 中央衝壓而變形外開,以擠抵槽間部兩側之散 定於插槽内。這種散熱器之散熱片也可以做得 大散熱面積,但其散熱片是以擠抵方式與基座 片與基座間接觸面積較小不易將熱量從基座傳 影響散熱效果,另一方面,當鰭片密度、高度 衝壓V型槽之板體易與散熱片產生干涉,增加 成本。 熱器散熱效果增強,使散熱器散熱表面積大、 ,且散熱器製造上應追求製造方便、成本低, 熱器均有其缺點無法彌補。為此,如何提供一 大、介面熱阻小、製造方便、成本低廉之散熱 待解決之問題。 之目的在於提供一種製程簡單、散熱效果好之 熱器及其製造方法。 之散熱器包括一基座及複數散熱片。該基座一 接合槽,散熱片包括一散熱部及從散熱部底端 接合部,接合部與接合槽干涉配合。 之’散熱器之製造方法包括以下步驟:提供一基 一側設有複數接合槽;提供複數散熱片,每一 一散熱部及由散熱部底端彎折而出之接合部; 方向衝壓散熱片之接合部,使接合部容置於接 接合槽干涉配合。BHII Η Page 5 19^0945 V. INSTRUCTIONS (2) When a groove is formed between the grooves, the heat is made thinner to increase the joint, and the heat dissipation to the heat sink is large, the manufacturing difficulty is The above-mentioned commonly used, under-heating area-dissipating device has become anxious. [The present invention is not provided for welding. The invention has a plurality of bent sides of the invention. The pedestal heat sink includes parallel pedestals. A V-shaped groove is formed in the groove and between the groove portions, and every other groove portion is provided for central punching to be deformed and opened to be squeezed into the slot on both sides of the groove portion. The heat sink of the heat sink can also make a large heat dissipation area, but the heat sink is in a manner of being pressed and the contact area between the base sheet and the base is small, and the heat is not transmitted from the base to affect the heat dissipation effect. On the other hand, When the fin density and the height of the stamped V-shaped plate are easily interfered with the heat sink, the cost is increased. The heat dissipation effect of the heat device is enhanced, so that the heat dissipation surface area of the heat sink is large, and the heat sink manufacturing should be easy to manufacture and low in cost, and the heat exchanger has its shortcomings. To this end, how to provide a large, low thermal resistance of the interface, easy to manufacture, and low cost to solve the problem of heat dissipation. The purpose of the invention is to provide a heat exchanger with a simple process and a good heat dissipation effect and a method of manufacturing the same. The heat sink includes a base and a plurality of heat sinks. The pedestal is engaged with the groove, and the heat sink includes a heat dissipating portion and a joint portion from the bottom end of the heat dissipating portion, and the engaging portion interferes with the engaging groove. The method for manufacturing a heat sink includes the steps of: providing a plurality of joint grooves on one side; providing a plurality of heat sinks, each heat sink portion and a joint portion bent from a bottom end of the heat sink portion; the direction stamping heat sink The joint portion allows the joint portion to be placed in the joint groove interference fit.

19^0945 五、發明說明(3) 與現有技術相比,本發明之散熱器之散熱片依次經平 行於基座方向之衝壓固定於基座上,故散熱片與模具間不 會發生干涉,從而減小製造難度;另一方面,本發明之散 熱器之散熱片與基座干涉配合,避免焊接中介面熱阻較大 之問題,具有較好散熱效果。 【實施方式】 請參考第一圖至第三圖所示本發明之散熱器之第一實 施例,該散熱器包括複數散熱片1 0及一基座2 0,散熱片1 0 與基座2 0都是由導熱性能良好之金屬材料衝壓製成。每一 散熱片1 0包括一散熱部1 1及一由散熱部11底端彎折而出之 接合部1 2、本實施例中,接合部1 2之橫斷面略呈梯形,包 括三個配合表面,即與散熱部11成一角度之上表面13、前 端面15及一底面14,其中前端面15既可為平面又可製成曲 面;基座2 0 —側設有複數相互平行之接合槽2 2,該等接合 槽2 2之開口方向與基座2 0平行,且其橫斷面呈梯形與散熱 片10之接合部12之橫斷面形狀相似,也包括上表面23、前 端面2 4及底面2 1三個配合表面,經衝壓後這三個配合表面 分別與散熱片1 0之三個配合表面干涉配合,通過金屬塑性 變形將散熱片10固定於基座20上。其中,底面14、21可以 製成略有傾斜乂表面,起導向作用有利於散熱片1 0之接合 部1 2與基座2 0之接合槽2 2接合。 本發明之散熱器之散熱片1 0之接合部1 2之橫斷面形狀 並不僅限於梯形,還可以為矩形、三角形等其他形狀,與 此相應,基座2 0之接合槽2 2應製成與接合部1 2具有相似橫19^0945 V. Inventive Description (3) Compared with the prior art, the heat sink of the heat sink of the present invention is sequentially fixed to the base by punching in a direction parallel to the base, so that no interference occurs between the heat sink and the mold. Therefore, the manufacturing difficulty is reduced; on the other hand, the heat sink of the heat sink of the present invention is interfered with the base to avoid the problem of large thermal resistance of the soldering intermediate surface, and has better heat dissipation effect. [Embodiment] Referring to the first embodiment of the heat sink of the present invention shown in the first to third figures, the heat sink includes a plurality of heat sinks 10 and a base 20, and the heat sink 10 and the base 2 0 is made of stamped metal material with good thermal conductivity. Each of the heat sinks 10 includes a heat dissipating portion 1 1 and a joint portion 1 which is bent from a bottom end of the heat dissipating portion 11. 2. In this embodiment, the cross section of the joint portion 12 is slightly trapezoidal, including three. The mating surface, that is, the surface 13 , the front end surface 15 and the bottom surface 14 at an angle to the heat dissipating portion 11 , wherein the front end surface 15 can be both a flat surface and a curved surface; the base 20 0 side is provided with a plurality of parallel joints The slot 2 2 has an opening direction parallel to the base 20 and has a cross-sectional shape similar to the cross-sectional shape of the joint portion 12 of the heat sink 10, and includes an upper surface 23 and a front end surface. 2 4 and the bottom surface 2 1 three mating surfaces, after the stamping, the three mating surfaces respectively interfere with the three mating surfaces of the fins 10, and the fins 10 are fixed to the base 20 by metal plastic deformation. Wherein, the bottom faces 14, 21 can be formed with a slightly inclined beak surface, and the guiding action is advantageous for the engaging portion 1 2 of the fins 10 to be engaged with the engaging grooves 22 of the base 20. The cross-sectional shape of the joint portion 1 of the heat sink 10 of the heat sink of the present invention is not limited to a trapezoidal shape, and may be other shapes such as a rectangle or a triangle. Accordingly, the joint groove 2 of the base 20 should be made. Forming a similar cross with the joint 1 2

第7頁 T260245_ 五、發明說明(4) 斷面之結構。如第四圖及第五圖所示為本發明之散熱器之 散熱片1 0之接合部1 2另外兩種結構。 本發明之散熱器之製造方法為:提供一基座2 0,該基 座2 0 —側設有複數接合槽2 2,該接合槽2 2包括數個配合表 面,其開口方向與基座2 0略呈平行;提供複數散熱片1 0, 每一散熱片1 0具有一散熱部1 1及由散熱部1 1底端彎折而出 之接合部1 2 ;將一散熱片1 0設置於基座2 0上,沿平行基座 2 0方向衝壓散熱片1 0之接合部1 2,使接合部1 2容置於接合 槽2 2内,並與接合槽2 2干涉配合,從而將該散熱片1 0與基 座2 Q接合成一體。按上述步驟,將複數散熱片1 0依次裝設 於基座2 (Γ上,從而形成本發明之散熱器。 如事所述,本發明之散熱器之散熱片1,0與基座2 0分開 製造,因而散熱片1 0可製得較薄,從而大幅增加散熱面積 ;散熱片10依次經平行於基座方向之衝壓固定於基座20上 ,故散熱片1 0與模具間不會發生干涉,從而減小製造難度 ,且散熱片1 0之接合部1 2與基座2 0之接合槽2 2間有數個配 合面干涉配合,散熱片10與基座20間接觸面積大,不僅可 有效降低介面熱阻且有利於將熱量從基座2 0傳遞給散熱片 因此,本’發明之散熱器及其製造方法可以克服目前常 用散熱器之缺點,可提供一種散熱面積大、介面熱阻小、 製造方便、成本低廉之散熱器。 綜上所述,本發明確已符合發明專利之要件,遂依法 提出專利申請。惟,以上所述者僅為本發明之較佳實施例Page 7 T260245_ V. INSTRUCTIONS (4) Structure of the section. As shown in the fourth and fifth figures, the joint portion 1 2 of the heat sink 10 of the heat sink of the present invention has two other configurations. The heat sink of the present invention is provided by providing a base 20 with a plurality of engaging grooves 2 2 on the side, the engaging groove 2 2 including a plurality of mating surfaces, the opening direction thereof and the base 2 0 is slightly parallel; a plurality of heat sinks 10 are provided, each heat sink 10 has a heat dissipating portion 1 1 and a joint portion 1 2 bent from a bottom end of the heat dissipating portion 1 1 ; a heat sink 10 is disposed on The joint portion 12 of the heat sink 10 is punched in the parallel base 20 direction on the base 20, and the joint portion 12 is received in the joint groove 2 2 and interferes with the joint groove 2 2 , thereby The heat sink 10 is integrally joined to the base 2 Q. According to the above steps, the plurality of heat sinks 10 are sequentially mounted on the susceptor 2 (the cymbal to form the heat sink of the present invention. As described, the heat sink of the present invention, the heat sink 1, 0 and the pedestal 2 0 Separately manufactured, the heat sink 10 can be made thinner, thereby greatly increasing the heat dissipation area; the heat sink 10 is sequentially fixed to the base 20 by punching in a direction parallel to the base, so that the heat sink 10 and the mold do not occur. Interference, thereby reducing the manufacturing difficulty, and the interference between the joint portion 1 2 of the heat sink 10 and the joint groove 2 2 of the base 20 has a large mating surface, and the contact area between the heat sink 10 and the base 20 is large, not only The heat dissipation of the interface is effectively reduced and the heat is transferred from the susceptor 20 to the heat sink. Therefore, the heat sink of the invention and the manufacturing method thereof can overcome the shortcomings of the conventional heat sink, and can provide a large heat dissipation area and interface thermal resistance. A small, easy-to-manufacture, low-cost heat sink. In summary, the present invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. However, the above is only a preferred embodiment of the present invention.

五、發明說明(5) ,自不能以此限制本案之申請專利範圍。舉凡熟悉本案技 藝之人士援依本發明之精神所作之等效修飾或變化,皆應 涵蓋於以下申請專利範圍内。5. Inventive Note (5), it is not possible to limit the scope of patent application in this case. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included in the scope of the following claims.

第9頁 19^0945 圖式簡單說明 【圖式簡單說明】 第一圖係本發明之散熱片與基座衝壓接合示意圖。 第二圖係本發明之散熱片與基座衝壓接合後示意圖。 第三圖係本發明之散熱器第一實施例之前視圖。 第四圖係本發明之散熱器之散熱片第二實施例之側視 圖。 第五圖係本發明之散熱器之散熱片第三實施例之側視 圖。 【元件符號說明】Page 9 19^0945 Brief description of the drawings [Simplified description of the drawings] The first figure is a schematic view of the stamping joint of the heat sink and the base of the present invention. The second figure is a schematic view of the heat sink and the base of the present invention after press bonding. The third drawing is a front view of the first embodiment of the heat sink of the present invention. The fourth drawing is a side view of a second embodiment of the heat sink of the heat sink of the present invention. Figure 5 is a side elevational view of a third embodiment of a heat sink for a heat sink of the present invention. [Component Symbol Description]

散熱片 10 散熱部 接合部 12 上表面 底面 14、21 前端面 基座 20 接合槽Heat sink 10 Heat sink Joint part 12 Upper surface Bottom surface 14, 21 Front end face Base 20 Engagement groove

第10頁Page 10

Claims (1)

19^0945_ 六、申請專利範圍 1. 一種散熱器之製造方法,包括以下步驟: _ 提供一基座,該基座一側設有複數接合槽; - 提供複數散熱片,每一散熱片包括一散熱部及由散熱 部底端彎折而出之接合部;及 沿平行基座方向衝壓散熱片之接合部,使接合部容置 於接合槽内並與接合槽干涉配合。 2. 如申請專利範圍第1項所述之散熱器之製造方法,其中 . 該散熱片之接合部與基座之接合槽之橫斷面呈梯形。 3. 如申請專利範圍第1項所述之散熱器之製造方法,其中 ~ 該散熱片之接合部與基座之接合槽之橫斷面呈矩形。 __ 4. 如申请專利範圍第1項所述之散熱器之製造方法,其中 該散/熱片之接合部與基座之接合槽之橫,斷面呈三角形 〇 5. 如申請專利範圍第1項所述之散熱器之製造方法,其中 該接合槽之開口方向平行於基座。 6. —種散熱器,其包括: 一基座,該基座一側設有複數接合槽;及 複數散熱片,每一散熱片包括散熱部及由散熱部底端彎 折而出之接合部,該接合部與接合槽干涉配合。 7. 如申請專利範圍第6項所述之散熱器,其中該散熱片之 接合部與散熱部相垂直,該接合槽之開口方向平行於 基座。 8. 如申請專利範圍第6項所述之散熱器,其中該散熱片之 接合部與基座之接合槽之橫斷面呈梯形。19^0945_ VI. Patent Application Range 1. A method for manufacturing a heat sink, comprising the following steps: _ providing a base having a plurality of joint grooves on one side thereof; - providing a plurality of heat sinks, each heat sink including one a heat dissipating portion and a joint portion bent from a bottom end of the heat dissipating portion; and a joint portion of the fins being punched in a direction parallel to the base, so that the joint portion is received in the joint groove and interferes with the joint groove. 2. The method of manufacturing a heat sink according to claim 1, wherein the joint groove of the heat sink and the joint groove of the base have a trapezoidal cross section. 3. The method of manufacturing a heat sink according to claim 1, wherein the joint groove of the heat sink and the joint groove of the base have a rectangular cross section. __ 4. The method for manufacturing a heat sink according to claim 1, wherein a cross section of the joint portion of the diffuser/hot sheet and the base is triangular, and the cross section is triangular 〇5. The method of manufacturing a heat sink according to the invention, wherein the opening direction of the engaging groove is parallel to the base. 6. A heat sink comprising: a base having a plurality of engagement grooves on one side thereof; and a plurality of heat sinks, each heat sink including a heat dissipation portion and a joint portion bent from a bottom end of the heat dissipation portion The joint portion is in interference fit with the engagement groove. 7. The heat sink of claim 6, wherein the junction of the heat sink is perpendicular to the heat sink, and the opening direction of the joint groove is parallel to the base. 8. The heat sink according to claim 6, wherein the joint groove of the heat sink and the joint groove of the base have a trapezoidal cross section. 第1]頁 1260245_ 六、申請專利範圍 9.如申請專利範圍第6項所述之散熱器,其中該散熱片之 接合部與基座之接合槽之橫斷面呈矩形。 1 〇.如申請專利範圍第6項所述之散熱器,其中該散熱片之 接合部與基座之接合槽之橫斷面呈三角形。</ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; The heat sink of claim 6, wherein the joint portion of the heat sink and the base have a triangular cross section. 第12頁Page 12
TW93104253A 2004-02-20 2004-02-20 Heat sink and method of manufacture TWI260245B (en)

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