TW201303564A - Improved structure of fin-type heat dissipation device - Google Patents
Improved structure of fin-type heat dissipation device Download PDFInfo
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 52
- 238000005452 bending Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 abstract description 24
- 230000008569 process Effects 0.000 abstract description 14
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 238000003466 welding Methods 0.000 abstract description 6
- 238000000465 moulding Methods 0.000 abstract 1
- 238000004080 punching Methods 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000002708 enhancing effect Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000008450 motivation Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
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Abstract
Description
本發明係一種鰭片式散熱器結構改良，尤指一種應用於散熱器所屬技術領域者。The present invention is an improved structure of a finned heat sink, and more particularly to a technical field to which the heat sink belongs.
隨著技術的發展，電子產品的尺寸越來越小，相應地單位空間的發熱量越來越大更大，這對散熱提出了更高的要求，散熱器已成為一些電子產品必備的配件。With the development of technology, the size of electronic products is getting smaller and smaller, and accordingly, the heat generation per unit space is getting larger and larger, which puts higher requirements on heat dissipation, and the radiator has become an essential accessory for some electronic products.
常用的散熱器主要是由一底座與多個具有傳熱散熱作用的鰭片組組成，鰭片組包括多個層疊排列的鰭片，散熱器還可以設置熱管以增強散熱效果。The commonly used heat sink is mainly composed of a base and a plurality of fin groups having heat transfer and heat dissipation effects. The fin set includes a plurality of stacked fins, and the heat sink can also be provided with a heat pipe to enhance the heat dissipation effect.
鰭片與底座的接觸面積大小、連接是否牢固是影響散熱器散熱效率的重要因素，將鰭片與底座連接是散熱器生產過程中的一個關鍵步驟。一種常用的方法是：將鰭片與底座通過焊接連接，其必須以錫膏或其他焊接劑作為焊接的媒介，根據鰭片與底座的材質，有些還需要進行鍍鎳處理，如中國發明專利申請號 “200410003352.9”之散熱器的焊接製備方法，即公開了一種通過焊接連接鰭片與底座的方法。The contact area between the fin and the base and the tight connection are important factors affecting the heat dissipation efficiency of the heat sink. Connecting the fin to the base is a key step in the production process of the heat sink. A common method is to connect the fins to the base by soldering, which must be soldered with solder paste or other soldering agent. According to the material of the fins and the base, some nickel plating needs to be applied, such as Chinese invention patent application. The welding preparation method of the heat sink of "200410003352.9" discloses a method of joining fins and a base by welding.
使用上述焊接的方法，工藝複雜、成本較高，並且生產效率低，對環境不友好，因此另一種常用的方法是：改進底座、鰭片的結構，將鰭片通過嵌設或鉚接等機械連接的方式連接底座。例如：中國發明專利號“03279661.7”之散熱座結構，以及中國實用新型專利號“200620063119.4”之散熱器鰭片與底座的組合改良等，該方法具體為：將各單獨的鰭片逐片置入預設有溝槽的底座，使用模具擠壓溝槽從而使溝槽變形，使鰭片的片狀根部能與變形後的溝槽形成過盈配合，從而使鰭片固定連接底座。該過程不僅加工溝槽比較麻煩，而且由於鰭片間的間隙很小，使得模具擠壓溝槽的工序加工不便、耗時較長、次品率高，因此雖然該方法相對上述焊接而成的散熱器具有一定的優點，但依然有工序較多、加工不便、成本較高的缺點，並且鰭片的片狀根部與底座的接觸面積有限，影響傳熱效率。The above welding method is complicated, high in cost, low in production efficiency, and unfriendly to the environment. Therefore, another commonly used method is to improve the structure of the base and the fin, and mechanically connect the fins by embedding or riveting. The way to connect the base. For example, the heat sink structure of the Chinese invention patent number “03279661.7” and the combination improvement of the heat sink fin and the base of the Chinese utility model patent number “200620063119.4”, the method is specifically: inserting individual fins into pieces one by one. The groove is pre-formed with a groove, and the groove is pressed by the mold to deform the groove, so that the sheet-like root of the fin can form an interference fit with the deformed groove, so that the fin is fixedly connected to the base. This process is not only troublesome in processing the groove, but also because the gap between the fins is small, the process of pressing the groove of the mold is inconvenient, time consuming, and the defective rate is high, so the method is welded to the above. The heat sink has certain advantages, but it still has the disadvantages of more processes, inconvenient processing, and high cost, and the contact area of the sheet-like root of the fin and the base is limited, which affects heat transfer efficiency.
＜發明動機＞
本發明有鑑於習知散熱器加工便利性差及使用成本高之問題，乃完成一種鰭片式散熱器結構改良。
＜發明目的＞
本發明之主要目的再於提供一種鰭片式散熱器結構改良，其係包括一底座及數散熱鰭片，該散熱鰭片根部連接於底座，所述散熱鰭片根部設置有底部開口的卡槽，所述底座伸出有與所述卡槽相應的卡接件，所述散熱鰭片通過卡槽卡接所述卡接件，所述多個散熱鰭片層疊排列形成散熱鰭片組。
所述卡槽包括相互連通的卡接槽、連接槽，所述連接槽靠近所述底座，所述卡接槽的最大寬度大於所述連接槽的最小寬度。
所述卡槽接近散熱鰭片根部的一端為矩形，另一端為圓形或矩形。
所述卡槽為梯形，該卡槽接近散熱鰭片根部的一端為該梯形較短的底邊。
所述卡槽為至少兩個，所述卡槽為矩形，不同卡槽的側面不平行。
所述卡槽一側伸出有卡箍，所述卡箍套接所述卡接件，所述卡箍的高度等於相鄰散熱鰭片的距離。
所述卡槽一側伸出有卡箍，所述卡箍套接所述卡接件，所述卡箍的高度小於相鄰散熱鰭片的距離。
該鰭片式散熱器進一步設置有熱管，所述熱管一端穿過所述散熱鰭片組，另一端連接所述底座。
所述散熱鰭片設置有彎折部，所述彎折部的折彎寬度等於相鄰散熱鰭片的距離。
所述散熱鰭片與所述熱管連接處成型有與熱管套接的扣接片。
藉由散熱鰭片根部連接所述底座，所述散熱鰭片根部設置有底部開口的卡槽，所述底座伸出有與所述卡槽相應的卡接件，所述散熱鰭片通過卡槽卡接所述卡接件，所述多個散熱鰭片層疊排列形成散熱鰭片組，散熱鰭片根部的卡槽容易通過模具成型，底座伸出的卡接件加工簡便，將卡槽通過卡接的方式連接卡接件，其連接可靠，該卡接過程可通過衝壓模具完成，相比現有技術，本發明克服了技術偏見，可以大幅減少工序，降低了生產成本，提高了生產效率。
<invention motivation>
The invention solves the problem that the conventional heat sink has poor processing convenience and high use cost, and the fin structure heat sink structure is improved.
<Invention purpose>
The main purpose of the present invention is to provide a fin-type heat sink structure improvement, which includes a base and a plurality of heat dissipation fins, the heat dissipation fin root is connected to the base, and the heat dissipation fin root portion is provided with a bottom open card slot. The base protrudes from the card slot corresponding to the card slot, and the heat dissipation fins are engaged with the card through the card slot, and the plurality of heat dissipation fins are stacked to form a heat dissipation fin group.
The card slot includes a latching slot and a connecting slot that communicate with each other. The connecting slot is adjacent to the base, and the maximum width of the latching slot is greater than a minimum width of the connecting slot.
One end of the card slot near the root of the heat dissipation fin is rectangular, and the other end is circular or rectangular.
The card slot is trapezoidal, and one end of the card slot near the root of the heat dissipation fin is a shorter base of the trapezoid.
The card slots are at least two, and the card slots are rectangular, and sides of different card slots are not parallel.
A clip is protruded from one side of the card slot, and the clip sleeves the clip, and the height of the clip is equal to the distance of the adjacent heat sink fins.
A clip is protruded from one side of the card slot, and the clip sleeves the clip, and the height of the clip is smaller than the distance of the adjacent heat sink fins.
The finned heat sink is further provided with a heat pipe, one end of the heat pipe passes through the heat dissipation fin set, and the other end is connected to the base.
The heat dissipation fin is provided with a bent portion, and the bending width of the bent portion is equal to the distance of the adjacent heat dissipation fins.
A fastening piece that is sleeved with the heat pipe is formed at a joint between the heat dissipation fin and the heat pipe.
The base of the heat dissipation fin is connected to the base, and the root of the heat dissipation fin is provided with a card slot with a bottom opening, and the base protrudes with a corresponding connector corresponding to the card slot, and the heat dissipation fin passes through the card slot. The card is connected to the card, and the plurality of heat dissipating fins are stacked to form a heat dissipating fin group. The card slot at the root of the heat dissipating fin is easily formed by a mold, and the card extending from the base is easy to process, and the card slot is passed through the card. The connection method is connected to the card connector, and the connection is reliable. The card bonding process can be completed by the stamping die. Compared with the prior art, the invention overcomes the technical prejudice, can greatly reduce the process, reduces the production cost, and improves the production efficiency.
為使 貴審查委員能進一步瞭解本發明之結構，特徵及其他目的，玆以如后之較佳實施例附以圖式詳細說明如后，惟本圖例所說明之實施例係供說明之用，並非為專利申請上之唯一限制者。The structure, features and other objects of the present invention will be further described in the following detailed description of the preferred embodiments of the present invention. It is not the only restriction on patent applications.
＜實施例一＞<Example 1>
本發明的鰭片式散熱器結構改良，如第一至三圖所示，其包括底座（１）、數散熱鰭片（２），散熱鰭片（２）根部連接底座（１），散熱鰭片（２）根部設置有底部開口的卡槽（２１），如第三圖所示，卡槽（２１）接近散熱鰭片（２）根部的一端為矩形，另一端為圓形，該圓形的直徑大於該矩形的寬度，底座（１）伸出有與卡槽（２１）相應的卡接件（１１），衝壓散熱鰭片（２）使卡槽（２１）穿過卡接件（１１），散熱鰭片（２）通過卡槽（２１）卡接卡接件（１１），由於卡槽（２１）的作用，散熱鰭片（２）與底座（１）連接牢固，數散熱鰭片（２）層疊排列形成散熱鰭片組（３）。The fin-type heat sink structure of the present invention is improved, as shown in the first to third figures, comprising a base (1), a plurality of heat sink fins (2), a heat sink fin (2) root connecting the base (1), and a heat sink fin The chip (2) is provided with a card slot (21) having a bottom opening. As shown in the third figure, the card slot (21) is close to the heat sink fin (2). One end of the root is rectangular and the other end is circular. The diameter of the rectangle is larger than the width of the rectangle, and the base (1) protrudes with a corresponding engaging member (11) corresponding to the card slot (21), and the heat-dissipating fin (2) is punched to pass the card slot (21) through the engaging member (11). ), the heat dissipation fins (2) are engaged with the card connector (11) through the card slot (21), and the heat dissipation fins (2) are firmly connected to the base (1) due to the action of the card slot (21), and the number of heat dissipation fins (2) The heat dissipation fin group (3) is formed by lamination.
現有技術中對於散熱鰭片（２）與底座（１）的連接主要為兩個方法，一種方法中散熱鰭片（２）需要通過焊接的方式連接底座（１），該過程需要對焊接部進行鍍鎳處理，焊接過程需要使用錫膏，並且焊接工藝複雜，難以保證品質，而對於另一種方法，其在底座（１）上設置多道溝槽，將溝槽擠壓變形後連接散熱鰭片（２），該過程加工不便使得生產效率較低。本發明對散熱鰭片（２）與底座（１）的連接方式進行了改良，加工時，散熱鰭片（２）根部的卡槽（２１）容易通過模具成型，底座（１）伸出的卡接件（１１）加工簡便，將卡槽（２１）通過卡接的方式連接卡接件（１１），其連接可靠，該卡接過程可通過衝壓模具完成，本發明克服了技術偏見，加工本發明的鰭片式散熱器時可以大幅減少工序，降低了生產成本，提高了生產效率。In the prior art, the connection between the heat dissipation fins (2) and the base (1) is mainly two methods. In one method, the heat dissipation fins (2) need to be connected to the base (1) by welding, and the process needs to be performed on the welded portion. Nickel plating treatment, solder paste process requires solder paste, and the welding process is complicated, it is difficult to guarantee the quality. For another method, it is provided with multiple grooves on the base (1), and the groove is pressed and deformed to connect the heat dissipation fins. (2) The inconvenience of the process makes the production efficiency low. The invention improves the connection manner of the heat dissipation fin (2) and the base (1). During processing, the card slot (21) at the root of the heat dissipation fin (2) is easily formed by the mold, and the card protruded from the base (1) The connector (11) is easy to process, and the card slot (21) is connected to the card connector (11) by means of snapping, and the connection is reliable. The card bonding process can be completed by a stamping die, and the invention overcomes the technical bias and the processing book. The finned heat sink of the invention can greatly reduce the number of processes, reduce the production cost, and improve the production efficiency.
進一步地，如第三圖所示，卡槽（２１）一側伸出有卡箍（２２），將散熱鰭片（２）衝壓至底座（１）上時，模具衝壓形成卡箍（２２），卡箍（２２）套接卡接件（１１），卡箍（２２）的高度等於或小於相鄰散熱鰭片（２）的距離，卡箍（２２）可以增加底座（１）與散熱鰭片（２）的接觸面積，既可以使兩者連接更牢固，也增加了傳熱面積，增強了散熱。Further, as shown in the third figure, a clamp (22) protrudes from one side of the card slot (21), and when the heat dissipation fin (2) is punched onto the base (1), the die is stamped to form a clamp (22). The clamp (22) is sleeved (11), the height of the clamp (22) is equal to or smaller than the distance of the adjacent heat sink fins (2), and the clamp (22) can increase the base (1) and the heat sink fin The contact area of the piece (2) not only makes the connection between the two stronger, but also increases the heat transfer area and enhances heat dissipation.
更進一步地，參閱第一、二圖所示，本實施例還設置有熱管（４），熱管（４）為U形，熱管（４）一端穿過所述散熱鰭片組（３），另一端連接底座（１）。Further, referring to the first and second figures, the embodiment is further provided with a heat pipe (4), the heat pipe (4) is U-shaped, one end of the heat pipe (4) passes through the heat dissipation fin group (3), and the other Connect the base (1) to one end.
為了控制散熱鰭片（２）之間的距離，如第三圖所示，散熱鰭片（２）設置有彎折部（２３），散熱鰭片（２）設置有多個折彎部（２３），該彎折部（２３）的折彎寬度等於相鄰散熱鰭片（２）的距離。In order to control the distance between the heat dissipation fins (2), as shown in the third figure, the heat dissipation fins (2) are provided with a bent portion (23), and the heat dissipation fins (2) are provided with a plurality of bent portions (23) The bending width of the bent portion (23) is equal to the distance of the adjacent heat sink fins (2).
為了增強熱管（４）散熱，散熱鰭片（２）與熱管（４）連接處成型有與熱管（４）套接的扣接片（２４），該扣接片（２４）與卡箍（２２）類似，也可以起到固定和增強散熱的作用。In order to enhance the heat dissipation of the heat pipe (4), a fastening piece (24) that is sleeved with the heat pipe (4) is formed at the junction of the heat dissipation fin (2) and the heat pipe (4), and the fastening piece (24) and the clamp (22) ) Similarly, it can also play a role in fixing and enhancing heat dissipation.
對於本發明的卡槽（２１），其作用是使散熱鰭片（２）卡接底座（１），可以有多種實施方式，第一圖~第四圖中卡槽（２１）的形狀為本發明的最佳實施方式，第五圖~第十圖所示為卡槽（２１）的其他實施方式。For the card slot (21) of the present invention, the function of the card slot (2) is to connect the heat sink fin (2) to the base (1), and there are various embodiments. The shape of the card slot (21) in the first to fourth figures is In the preferred embodiment of the invention, the fifth to tenth embodiments show other embodiments of the card slot (21).
當卡槽（２１）只有一個時，卡槽（２１）包括相互連通的卡接槽、連接槽，連接槽靠近底座（１），卡接槽的最大寬度大於連接槽的最小寬度，這樣卡接件（１１）就可以有效地卡接在卡槽（２１）內。當然，也可以增加卡槽（２１）的數量。如第五圖所示，卡槽（２１）接近散熱鰭片（２）根部的一端為矩形，另一端為一寬度較大的矩形。第六圖中，卡槽（２１）為一梯形，該卡槽（２１）接近散熱鰭片（２）根部的一端為該梯形較短的底邊。如第七圖中卡槽（２１）為“十”字形。需要說明的是，如第八圖所示，卡槽（２１）還可以為帶弧度的曲線，其也可以達到卡接的效果。When there is only one card slot (21), the card slot (21) includes a latching slot and a connecting slot that communicate with each other, and the connecting slot is close to the base (1), and the maximum width of the latching slot is larger than the minimum width of the connecting slot, so that the card slot The piece (11) can be effectively snapped into the card slot (21). Of course, it is also possible to increase the number of card slots (21). As shown in the fifth figure, one end of the card slot (21) near the root of the heat dissipation fin (2) is rectangular, and the other end is a rectangle having a large width. In the sixth figure, the card slot (21) is a trapezoid, and the end of the card slot (21) near the root of the heat dissipation fin (2) is the shorter base of the trapezoid. As shown in the seventh figure, the card slot (21) has a "ten" shape. It should be noted that, as shown in the eighth figure, the card slot (21) can also be a curved curve, which can also achieve the effect of the snap connection.
當卡槽（２１）為一個以上時，也可以有其他實施方式，如第九圖所述，卡槽（２１）為矩形，卡槽（２１）為兩個，兩個卡槽（２１）的側面不平行。When there are more than one card slot (21), other embodiments are also possible. As shown in the ninth figure, the card slot (21) is rectangular, the card slot (21) is two, and the two card slots (21) The sides are not parallel.
對於底座的截面不是矩形，而是其他形狀，如弧形時，如第十圖所示，其散熱鰭片（２）設置有兩個垂直於底座的卡槽（２１）。The cross section of the base is not a rectangle, but other shapes, such as an arc shape, as shown in the tenth figure, the heat dissipating fins (2) are provided with two card slots (21) perpendicular to the base.
＜實施例二＞<Embodiment 2>
可以將數卡槽（２１）組合使用，從而對實施例一進行改進，如第十一圖~第十二圖所示，其設置有一個較大的卡槽（２１）、三個較小的卡槽（２１），由於設置有多個卡槽（２１），使得散熱鰭片（２）與底座（１）的接觸面積更大，有利於增強散熱，本實施例的其他部分與實施例一相似。The card slot (21) can be used in combination to improve the first embodiment. As shown in the eleventh to twelfth drawings, a larger card slot (21) and three smaller ones are provided. The card slot (21) is provided with a plurality of card slots (21), so that the contact area of the heat dissipation fins (2) and the base (1) is larger, which is advantageous for enhancing heat dissipation, and other parts of the embodiment and the first embodiment similar.
綜上所述，本發明確實可達到上述諸項功能及目的，故本創作應符合專利申請要件，爰依法提出申請。In summary, the present invention can indeed achieve the above functions and purposes, so the creation should meet the requirements of the patent application, and apply in accordance with the law.
(1)．．．底座(1). . . Base
(11)．．．卡接件(11). . . Card connector
(2)．．．散熱鰭片(2). . . Heat sink fin
(21)．．．卡槽(twenty one). . . Card slot
(22)．．．卡箍(twenty two). . . Clamp
(23)．．．彎折部(twenty three). . . Bending section
(24)．．．扣接片(twenty four). . . Fastener
(3)．．．散熱鰭片組(3). . . Heat sink fin set
(4)．．．熱管(4). . . Heat pipe
第一圖係本發明的鰭片式散熱器實施例一的結構示意圖。The first figure is a schematic structural view of Embodiment 1 of the finned heat sink of the present invention.
第二圖係本發明的鰭片式散熱器實施例一的分解示意圖。The second drawing is an exploded view of the first embodiment of the finned heat sink of the present invention.
第三圖係本發明的散熱鰭片卡槽最佳實施方式的結構示意圖。The third figure is a schematic structural view of a preferred embodiment of the heat sink fin card slot of the present invention.
第四圖係本發明第三圖之正面示意圖。The fourth drawing is a front view of the third drawing of the present invention.
第五圖係本發明的散熱鰭片卡槽第二種實施方式的結構示意圖。The fifth figure is a schematic structural view of a second embodiment of the heat sink fin card slot of the present invention.
第六圖係本發明的散熱鰭片卡槽第三種實施方式的結構示意圖。The sixth figure is a schematic structural view of a third embodiment of the heat sink fin card slot of the present invention.
第七圖係本發明的散熱鰭片卡槽第四種實施方式的結構示意圖。The seventh figure is a schematic structural view of a fourth embodiment of the heat sink fin card slot of the present invention.
第八圖係本發明的散熱鰭片卡槽第五種實施方式的結構示意圖。The eighth figure is a schematic structural view of a fifth embodiment of the heat sink fin card slot of the present invention.
第九圖係本發明的散熱鰭片卡槽第六種實施方式的結構示意圖。The ninth drawing is a schematic structural view of a sixth embodiment of the heat sink fin card slot of the present invention.
第十圖係本發明的散熱鰭片卡槽第七種實施方式的結構示意圖。The tenth figure is a schematic structural view of a seventh embodiment of the heat sink fin card slot of the present invention.
第十一圖係本發明的鰭片式散熱器實施例二的結構示意圖。11 is a schematic structural view of a second embodiment of the finned heat sink of the present invention.
第十二圖係本發明的鰭片式散熱器實施例二的散熱鰭片的結構示意圖。Figure 12 is a schematic view showing the structure of the heat dissipating fin of the second embodiment of the finned heat sink of the present invention.
(1)．．．底座(1). . . Base
(11)．．．卡接件(11). . . Card connector
(2)．．．散熱鰭片(2). . . Heat sink fin
(22)．．．卡箍(twenty two). . . Clamp
(23)．．．彎折部(twenty three). . . Bending section
(24)．．．扣接片(twenty four). . . Fastener
(3)．．．散熱鰭片組(3). . . Heat sink fin set
(4)．．．熱管(4). . . Heat pipe
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100124138A TW201303564A (en) | 2011-07-08 | 2011-07-08 | Improved structure of fin-type heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100124138A TW201303564A (en) | 2011-07-08 | 2011-07-08 | Improved structure of fin-type heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201303564A true TW201303564A (en) | 2013-01-16 |
Family
ID=48138069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100124138A TW201303564A (en) | 2011-07-08 | 2011-07-08 | Improved structure of fin-type heat dissipation device |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW201303564A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112355590A (en) * | 2020-11-02 | 2021-02-12 | 长丰吾道智能光电科技有限公司 | Automatic assembling method for heat pipe fins |
-
2011
- 2011-07-08 TW TW100124138A patent/TW201303564A/en unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112355590A (en) * | 2020-11-02 | 2021-02-12 | 长丰吾道智能光电科技有限公司 | Automatic assembling method for heat pipe fins |
| CN112355590B (en) * | 2020-11-02 | 2021-09-28 | 长丰吾道智能光电科技有限公司 | Automatic assembling method for heat pipe fins |
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