M343249 八、新型說明： 【新型所屬之技術領域】 本創作係提供一種散熱模組，尤指一種可提供高功 率發光二極體用的散熱裝置。 【先前技術】 隨著發光二極體（LED)技術的進步，發光二極體已 被大量使用在照明產品上。由於高功率發光二極體的輸 © 入電能僅有15-20%轉換成光，其餘約85%會轉換成熱能 而影響發光二極體的性能，因此，高功率發光二極體需 要有高性能的散熱裝置來排熱，否則，發光二極體的使 用壽命將無法提升且發光效率亦不能提升。 為改善發光二極體光源之散熱問題，在專利公開資 料上揭示有多種可供發光二極體光源用的散熱裝置與方 法。例如證書號第1295115「發光二極體燈具之散熱方 * 法」及證書號第M259903「水冷式發光二極體散熱裝置」 等；其中證書號第1295115專利案之技術内容主要係將 一迴路熱管裝置結合於一發光二極體燈具上，該迴路熱 管裝置具有一内含有揮發性液體的蒸發器及一冷凝器連 通於該蒸發器，該蒸發器結合於該發光二極體燈具之底 座且該冷凝器結合於該發光二極體燈具之燈罩，使得該 等發光二極體之燈泡熱量可透過該迴路熱管裝置傳送至 該燈罩而排熱者。 5 M343249 白1用發光二極體之散熱裝置在使用上雖然已具有部 分的效果’然而-般具有結構複雜、成本高及製造麻^ 等問題存在。此外，散熱效果亦有待進—步提升以滿足 吸熱快、熱阻小及去熱迅速等要件。 【新型内容】 緣此，本創作之主要目的在提供一種發光二極體之 散熱模組，該散熱模組能提供發光二極體快速散熱的效 果，同時具有結構簡單之優點者。 依據本創作構成之發光二極體之散熱模組，係包含 一散熱本體、一内部充填有傳熱介質之熱管及至少一組 散熱鰭片；該散熱本體之内部具有一熱管收納孔，且該 散熱本體具有一可提供發光二極體晶片或載體結合的表 面，該表面上設有與該熱管收納孔連通的開口，而該熱 官具有套入該散熱本體之熱管收納孔的一第一部分及位 在該散熱本體外侧的一第二部份，該熱管具有外表面， 該熱管之第一部分之外表面之局部係露在該散熱本體之 開口處，又該組散熱鰭片係裝在該熱管之第二部份上。 在一實施例中，該散熱本體係一金屬製的長方塊 體，該塊體的一侧面形成可提供發光二極體之載體結合 的該表面，該熱管收納孔係一沿該散熱本體長度方向貫 穿该塊體之圓孔，且該散熱本體上的開口係沿該散熱本 體長度方向延伸並貫穿該表面。 6 M343249 在另一實施例中，該散熱本體係一金屬薄板形成的 管體，該管體在長度方向上具有二端分別形成一摺邊的 開口，該二摺邊形成提供該發光二極體晶片或载體結合 的該表面。 在一實施例中，該熱管具有一第一端及一第二端， 該第一端構成該第一部分，該第二端構成該第二部份。 最好，該熱管進一步包含位該散熱本體外侧的一第 三部份，該第三部份上裝設有一組散熱鰭片；在另一實 施例中，該熱管具有一第一端、一第二端及位在該二端 之間的中間部分，該中間部分構成該第一部分，該第一 端構成該第二部分，且該第二端構成該第三部份。 最好，充填在該熱管内部的傳熱介質係包含至少一 種鹽的水溶液，該至少一種鹽係由選自銅、銀、金、鎳、 鉻、鋅、鈦和鈷的一種或多種金屬離子與有機酸或無機 酸形成的配合物。最好，充填在該熱管内部的傳熱介質 之PH值係在6-1〇之範圍。 關於本創作之其他目的、優點及特徵，將可由以下 較佳實施例的詳細說明並參照所附圖式來了解。 【實施方式】 可有多種不同的結構來實施本創作。現將僅為例子 但非用以限制的一具體實施例，參照所附圖式就本創作 之較佳結構内容說明如下： M343249 請芩閱第一圖至第四圖，顯示依據本創作第一實施 例構成的散熱模組1及一可結合在該散熱模組1上的發 光二極體光源組件2 ;該發光二極體光源組件2包含一 由金屬板材構成之載體21及裝在該載體21上的複數發 光二極體晶片22或發光二極體燈。本創作之特徵在於該 散熱模組1的設計，藉以使得該發光二極體光源組件2 具有高散熱效率。 該散熱模組1包含一散熱本體U、一内部充填有傳 熱介質14之熱管12及至少一組散熱鰭片13;該散熱本 體11之内部具有一熱管收納孔m，且該散熱本體n 具有一可提供該發光二極體燈或該載體21結合的表面 112 ’該表面112係一平坦的面，且該表面112上設有與 該熱管收納孔111連通的開口 114;在本實施例中，該 散熱本體11係一由例如銅之金屬材料製成的長方塊 體，該塊體的一平直侧面形成該表面112，並在該表面 112上設有複數結合孔us用以提供該載體21連結；在 本實施例中，該載體21上設有對應的穿孔211，並利用 複數連接件3穿入該數穿孔211及該數結合孔115，使 遠載體21結合在該散熱本體11之該表面Η?上。 在本實施例中，該熱管12具有一外表面124、套在 该散熱本體11之熱管收納孔111内的中間部分123及位 在該散熱本體11外側的一第一端121及一第二端丨22 ; 8 M343249 二亥熱官12插入該熱管收納孔111内後，該中間部分 1之外表面124之局部會露在該散熱本體11之開口 ； 114處（如第四圖所示);又在本實施例中，該熱管12 . 纟例如鋼之金屬材料製成的圓管，且該熱管12内部充填 專…、w質14,該傳熱介質係一種具有超導效率的習用 . 傳熱材料’其包含至少—種鹽的水溶液，該至少—種鹽 • '、（自銅、銀、金、鎳、鉻、鋅、鈦和鈷的一種或多 種金屬離子與有機酸或無機酸形成的配合物。 忒組散熱鰭片13係由例如銅材和銘材製成的複數薄 =隔開地連結組成，並在該熱f 12的第—端Id及第 ::122各別裝設一組散熱鰭片13，各組散熱鰭片u 係露在空氣中，利用空氣對流散發熱量。 β依據本創作構成的散熱模組1，其中，該散熱本體 鲁 11提供該發光二極體燈或載體21便利地組裝，且該散 熱本體11與該熱管12具有寬大之接觸區域而能有效地 將邊發光二極體產生之熱量傳遞到該熱管12，又該熱管 12之外表面之局部係與該載體21接觸，使得發光I極 體所產生的熱量能迅速地透過該熱管12及熱管内部的 傳熱介質14帶離該載體21，接著再經由該熱管12二端 之二組散熱鰭片13與空氣自然對流，即可達成吸熱快、 熱阻小及去熱迅速之效果。 參閱第五圖至第人圖’顯示依據本創作第二實施例 M343249 構成之散熱模組1 (該實施例中，關於和第一實施例說 月者相同或同等之構件，將附上同一標號並省略細部結 構說明）；該散熱模組丨同樣包含一散熱本體u、一内 部充填有傳熱介質14之熱管12及至少一組散熱鰭片 13，该第二實施例與第一實施例之差異在於該散熱本體 U係金屬薄板形成一概呈圓狀的管體，該管體在長度方 向上具有二端分別形成一摺邊113的開口 114，該二摺 邊113形成提供該發光二極體晶片22或載體21結合的 該表面112。由於本實施例之散熱本體u之管壁相對較 薄，所以’能進一步提高該散熱模組1之散熱效率。 參閱第九圖及第十圖，顯示依據本創作第三實施例 構成之散熱模組1;該實施例與第一實施例之差異在於 该熱管12具有套在該散熱本體11之熱管收納孔丨丨丨内 的第一端121及位在該散熱本體11外側的第二端i22 , 亦即，當該熱管12插入該熱管收納孔hi内後，其一第 一部分（第一端121 )套入該散熱本體11之熱管收納孔 111内，且一第二部分（第二端122)係位在該散熱本體 11外側，而能降低該散熱模組1之長度及體積；再者， 在本實施例中顯示該發光二極體光源組件2包含一金屬 載體21、數裝在該載體21上的電路板23及裝在該電路 板2 3上的複數發光二極體燈2 4，亦即，該發光二極體 光源組件2不限制為上舉第一實施例之結構形式。 M343249 依據本創作構成的散熱模組！除了能提供發光二極 體具有高散熱效率之外，並有利數組散熱模組丨之間做 連接以便擴充形成陣列型態，亦即，只要將二散埶模植 1利用該散熱本體U之—侧面相互結合，且將二散熱模 組1之散熱鰭片13之鰭片相互間隔配置，就可擴充該散 熱模組1的數量以提供更加優越的散熱效果。 在前述說明書中，本創作僅是就特定實施例做描 述，而依本創作的設計特徵當可做多種變化或修改是可 了解的，例如，可利用該散熱本體11 一侧面做為載體而 將該發光二極體晶片22直接組裝在該散熱本體丨丨上。 是以’對於熟悉此項技藝人士可作之明顯替換與修改， 仍將併入於本創作所主張的專利範圍之内。 【圖式簡單說明】 第一圖係依據本創作第一實施例構成的散熱模組之組合 立體圖·· 第二圖係第一圖之散熱模組及一發光二極體光源組件之 元件分解略圖； 第二圖係弟二圖之一組合平面圖； 第四圖係沿第三圖之4—4線所取的剖視圖； 第五圖係依據本創作第二實施例構成的散熱模組之組合 立體圖： 第六圖係第五圖之散熱模組及該發光二極體光源組件之 11 M343249 元件分解略圖； 第七圖係第六圖之一組合平面圖； 第八圖係沿第七圖之8—8線所取的剖視圖； 第九圖係依據本創作第三實施例構成的散熱模組之組合 立體圖：及 第十圖係第九圖之散熱模組及另一發光二極體光源組件 之元件分解略圖。 B 【主要元件符號說明】 1 ·散熱模組 11.散熱本體 111 ·熱管收納孔 112.表面 113.摺邊 114·開口 115.結合孔 12.熱管 121·第一端 122·第二端 123·中間部分 12 4 ·外表面 13.散熱鰭片 14·傳熱介質 2·發光二極體光源組件 21載體 211·穿孔 22·發光二極體晶片 23.電路板 3.連接件 24·發光二極體燈 12M343249 VIII. New description: [New technical field] The creation system provides a heat dissipation module, especially a heat dissipation device for providing high power light-emitting diodes. [Prior Art] With the advancement of light-emitting diode (LED) technology, light-emitting diodes have been widely used in lighting products. Since only 15-20% of the input power of the high-power LED is converted into light, about 85% of the power is converted into thermal energy to affect the performance of the LED. Therefore, the high-power LED needs to be high. The performance of the heat sink to dissipate heat, otherwise, the life of the LED will not be improved and the luminous efficiency can not be improved. In order to improve the heat dissipation problem of the light-emitting diode light source, various heat-dissipating devices and methods for the light-emitting diode light source are disclosed in the patent publication. For example, the certificate number No. 1295115 "The heat sinking method of the light-emitting diode lamp" and the certificate number M259903 "Water-cooled light-emitting diode heat sink", etc., wherein the technical content of the certificate No. 1295115 is mainly a primary circuit heat pipe The device is coupled to a light-emitting diode device having an evaporator containing a volatile liquid and a condenser connected to the evaporator, the evaporator being coupled to the base of the light-emitting diode lamp and the The condenser is coupled to the lampshade of the light-emitting diode lamp, so that the heat of the light-emitting diode of the light-emitting diode can be transmitted to the lamp cover through the loop heat pipe device to dissipate heat. 5 M343249 The heat sink of the white light-emitting diode has a partial effect in use. However, there are problems such as complicated structure, high cost, and manufacturing problems. In addition, the heat dissipation effect needs to be improved step by step to meet the requirements of fast heat absorption, low thermal resistance and rapid heat removal. [New content] Therefore, the main purpose of the present invention is to provide a heat-dissipating module for a light-emitting diode, which can provide the effect of rapid heat-dissipation of the light-emitting diode and has the advantages of simple structure. The heat dissipation module of the light-emitting diode according to the present invention comprises a heat dissipation body, a heat pipe filled with a heat transfer medium and at least one heat dissipation fin; the heat dissipation body has a heat pipe receiving hole therein, and the heat dissipation body has a heat pipe receiving hole The heat dissipating body has a surface for providing a combination of a light emitting diode chip or a carrier, the surface is provided with an opening communicating with the heat pipe receiving hole, and the heat official has a first portion of the heat pipe receiving hole of the heat dissipating body and a second portion of the heat pipe body, the heat pipe has an outer surface, a portion of the outer surface of the first portion of the heat pipe is exposed at the opening of the heat dissipation body, and the heat dissipation fins are mounted on the heat pipe The second part. In one embodiment, the heat dissipation system is a metal long block, and one side of the block forms the surface of the carrier that can provide the light emitting diode, and the heat pipe receiving hole is along the length of the heat dissipation body. A circular hole is formed through the block, and an opening in the heat dissipation body extends along the longitudinal direction of the heat dissipation body and penetrates the surface. 6 M343249 In another embodiment, the heat dissipation system is a tube formed by a thin metal plate, and the tube body has openings at the two ends thereof to form a folded edge, and the two folded edges are formed to provide the light emitting diode. The surface to which the wafer or carrier is bonded. In one embodiment, the heat pipe has a first end and a second end, the first end forming the first portion, and the second end forming the second portion. Preferably, the heat pipe further comprises a third portion located outside the heat dissipating body, the third portion is provided with a set of heat dissipating fins; in another embodiment, the heat pipe has a first end, a first The second end and the intermediate portion between the two ends, the intermediate portion constitutes the first portion, the first end constitutes the second portion, and the second end constitutes the third portion. Preferably, the heat transfer medium filled inside the heat pipe comprises an aqueous solution of at least one salt selected from one or more metal ions selected from the group consisting of copper, silver, gold, nickel, chromium, zinc, titanium, and cobalt. A complex formed by an organic or inorganic acid. Preferably, the pH of the heat transfer medium filled inside the heat pipe is in the range of 6-1 Torr. Other objects, advantages and features of the present invention will become apparent from the following detailed description of the preferred embodiments. [Embodiment] There are many different configurations for implementing this creation. The preferred structure of the present invention will be described below with reference to the accompanying drawings. M343249 Please refer to the first to fourth figures, showing the first The heat dissipation module 1 of the embodiment and a light emitting diode light source assembly 2 that can be coupled to the heat dissipation module 1; the light emitting diode light source assembly 2 includes a carrier 21 made of a metal plate and mounted on the carrier A plurality of light-emitting diode chips 22 or light-emitting diode lamps on 21. The present invention is characterized in that the design of the heat dissipation module 1 is such that the light-emitting diode light source assembly 2 has high heat dissipation efficiency. The heat dissipation module 1 includes a heat dissipation body U, a heat pipe 12 filled with a heat transfer medium 14 and at least one heat dissipation fin 13; the heat dissipation body 11 has a heat pipe receiving hole m therein, and the heat dissipation body n has A surface 112 of the light-emitting diode lamp or the carrier 21 may be provided. The surface 112 is a flat surface, and the surface 112 is provided with an opening 114 communicating with the heat pipe receiving hole 111; in this embodiment The heat dissipating body 11 is a long block made of a metal material such as copper, a flat side of the block forms the surface 112, and a plurality of bonding holes us are provided on the surface 112 for providing the carrier. In the present embodiment, the carrier 21 is provided with a corresponding through hole 211, and the plurality of connecting members 3 are inserted into the number of through holes 211 and the plurality of coupling holes 115, so that the far carrier 21 is coupled to the heat dissipation body 11. The surface is on top. In this embodiment, the heat pipe 12 has an outer surface 124, an intermediate portion 123 disposed in the heat pipe receiving hole 111 of the heat dissipation body 11, and a first end 121 and a second end located outside the heat dissipation body 11.丨22; 8 M343249 After the second heat member 12 is inserted into the heat pipe receiving hole 111, a portion of the outer surface 124 of the intermediate portion 1 is exposed at the opening of the heat dissipating body 11; 114 (as shown in the fourth figure); In this embodiment, the heat pipe 12 is a round pipe made of a metal material such as steel, and the heat pipe 12 is filled with a concrete material, and the heat transfer medium is a conventional one having superconducting efficiency. The thermal material 'which contains at least one aqueous salt of a salt, ', (formed from one or more metal ions of copper, silver, gold, nickel, chromium, zinc, titanium and cobalt and an organic or inorganic acid) The composite fins 13 are composed of a plurality of thin strips separated by, for example, a copper material and a name material, and are disposed at the first end of the heat f 12 and the first: A group of heat dissipating fins 13, each of which is exposed to the air and dissipates heat by air convection. According to the heat dissipation module 1 of the present invention, the heat dissipation body 11 provides the light-emitting diode lamp or carrier 21 to be conveniently assembled, and the heat dissipation body 11 and the heat pipe 12 have a wide contact area and can effectively The heat generated by the light-emitting diode is transmitted to the heat pipe 12, and the portion of the outer surface of the heat pipe 12 is in contact with the carrier 21, so that the heat generated by the light-emitting diode can quickly pass through the heat pipe 12 and the heat pipe. The heat transfer medium 14 is carried away from the carrier 21, and then naturally convected by the two sets of heat dissipation fins 13 at the two ends of the heat pipe 12 to achieve rapid heat absorption, small heat resistance and rapid heat removal. The first embodiment shows a heat dissipation module 1 constructed according to the second embodiment M343249 of the present invention. (In this embodiment, the same or equivalent components as those of the first embodiment will be attached with the same reference numerals and the detailed structure will be omitted. The heat dissipation module 丨 also includes a heat dissipation body u, a heat pipe 12 internally filled with the heat transfer medium 14 and at least one set of heat dissipation fins 13. The second embodiment differs from the first embodiment in that The heat-dissipating body U-shaped metal thin plate forms a substantially circular tube body having an opening 114 at each of the two ends forming a flange 113, and the two-folded edge 113 is formed to provide the light-emitting diode wafer 22 or The surface 112 of the carrier 21 is combined. Since the wall of the heat dissipation body u of the embodiment is relatively thin, the heat dissipation efficiency of the heat dissipation module 1 can be further improved. Referring to the ninth and tenth drawings, the display is based on the creation. The heat dissipation module 1 of the third embodiment is different from the first embodiment in that the heat pipe 12 has a first end 121 disposed in the heat pipe receiving hole of the heat dissipation body 11 and is located at the heat dissipation. a second end i22 on the outer side of the body 11 , that is, a first portion (first end 121 ) of the heat pipe 12 is inserted into the heat pipe receiving hole 111 of the heat dissipation body 11 , and a heat pipe 12 is inserted into the heat pipe receiving hole The second portion (the second end 122) is located outside the heat dissipation body 11 to reduce the length and volume of the heat dissipation module 1; further, in the embodiment, the LED body assembly 2 is included a metal carrier 21, a number mounted on the carrier The circuit board 23 on the 21 and the plurality of light-emitting diode lamps 24 mounted on the circuit board 23, that is, the light-emitting diode light source unit 2 are not limited to the structure of the first embodiment. M343249 Based on the heat dissipation module of this creation! In addition to providing high-efficiency heat-dissipating efficiency of the light-emitting diodes, it is advantageous to make a connection between the array heat-dissipating modules 以便 to expand the formation of the array type, that is, as long as the second heat-dissipating mold 1 utilizes the heat-dissipating body U- The side surfaces are combined with each other, and the fins of the heat dissipation fins 13 of the two heat dissipation modules 1 are spaced apart from each other, so that the number of the heat dissipation modules 1 can be expanded to provide a more superior heat dissipation effect. In the foregoing description, the present invention is described only in terms of specific embodiments, and the design features according to the present invention can be understood as various changes or modifications. For example, one side of the heat dissipation body 11 can be used as a carrier. The LED chip 22 is directly assembled on the heat dissipation body. It is intended that the obvious substitutions and modifications made by those skilled in the art will still be incorporated in the scope of the patent claimed herein. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a combined perspective view of a heat dissipation module constructed according to the first embodiment of the present invention. The second figure is a component exploded view of the heat dissipation module of the first figure and a light emitting diode light source assembly. The second figure is a combined plan view of one of the second figures; the fourth figure is a cross-sectional view taken along line 4-4 of the third figure; the fifth figure is a combined perspective view of the heat dissipation module constructed according to the second embodiment of the present creation; The sixth figure is the heat dissipation module of the fifth figure and the exploded view of the 11 M343249 component of the light emitting diode light source assembly; the seventh figure is a combined plan view of the sixth figure; the eighth figure is along the eighth figure 8 - A cross-sectional view taken on line 8; a ninth view is a combined perspective view of a heat dissipation module constructed in accordance with a third embodiment of the present invention: and a heat dissipation module of the ninth diagram and a component of another light-emitting diode light source assembly Decompose the sketch. B [Description of main component symbols] 1 · Heat dissipation module 11. Heat dissipation body 111 · Heat pipe receiving hole 112. Surface 113. Folding 114 · Opening 115. Bonding hole 12. Heat pipe 121 · First end 122 · Second end 123 · Intermediate portion 12 4 · outer surface 13. heat sink fin 14 · heat transfer medium 2 · light emitting diode light source assembly 21 carrier 211 · perforation 22 · light emitting diode wafer 23. circuit board 3. connecting member 24 · light emitting diode Body light 12