CN201206818Y - Heat radiation module - Google Patents

Abstract

The utility model discloses a LED's heat dissipation module contains: the heat dissipation structure comprises a heat dissipation body, a heat pipe and a group of heat dissipation fins; the heat dissipation body is internally provided with a heat pipe accommodating hole, the heat dissipation body is provided with a surface which can be combined with a light-emitting diode lamp or a carrier, and the surface is provided with an opening communicated with the heat pipe accommodating hole; the heat pipe is provided with a first part sleeved in the heat pipe accommodating hole of the heat dissipation body and a second part positioned outside the heat dissipation body, the heat pipe is provided with an outer surface, and part of the outer surface of the first part is exposed at the opening of the heat dissipation body; and the group of radiating fins are arranged on the second part of the heat pipe. When the light emitting diode carrier is combined on the surface of the heat dissipation body, the carrier can be contacted with the outer surface of the heat pipe, and the heat dissipation efficiency is improved.

Description

Cooling module

technical field

The utility model relates to a heat dissipation module, in particular to a heat dissipation device capable of providing high-power light-emitting diodes.

Background technique

With the advancement of light-emitting diode (LED) technology, light-emitting diodes have been widely used in lighting products. Since only 15-20% of the input electrical energy of high-power LEDs is converted into light, the remaining 85% will be converted into heat energy and affect the performance of LEDs. Therefore, high-power LEDs need high-performance heat sinks to discharge heat. Otherwise, the service life of the light-emitting diodes cannot be improved and the luminous efficiency cannot be improved either.

In order to improve the heat dissipation problem of the LED light source, various heat dissipation devices and methods for the LED light source are disclosed in the patent publications. For example, China Taiwan Certificate No. I295115 "Heat Dissipation Method for Light-Emitting Diode Lamps" and China Taiwan Certificate No. M259903 "Water-cooled LED Heat Dissipation Device", etc.; the technical content of the certificate No. I295115 patent is mainly to combine the primary circuit heat pipe device On an LED lamp, the loop heat pipe device has an evaporator containing a volatile liquid and a condenser connected to the evaporator, the evaporator is connected to the base of the LED lamp and the condenser is connected to the luminous The lampshade of the diode lamp, so that the bulb heat of the light emitting diodes can be transmitted to the lampshade through the loop heat pipe device for heat dissipation.

Although existing heat sinks for light emitting diodes have partial effects in use, they generally have problems such as complex structures, high costs, and troublesome manufacturing. In addition, the heat dissipation effect needs to be further improved to meet the requirements of fast heat absorption, small thermal resistance and rapid heat removal.

Utility model content

The main purpose of the present utility model is to provide a heat dissipation module for light emitting diodes, which can provide the effect of rapid heat dissipation for light emitting diodes and has the advantage of simple structure.

The utility model is realized by adopting the following technical means:

A heat dissipation module for light emitting diodes, comprising: a heat dissipation body, a heat pipe and a set of heat dissipation fins; the heat dissipation body has a heat pipe receiving hole inside, and the heat dissipation body has a light emitting diode lamp or a carrier combination The surface is provided with an opening communicating with the heat pipe receiving hole; the heat pipe has a first part inserted into the heat pipe receiving hole of the heat dissipation body and a second part outside the heat dissipation body, and the heat pipe has The outer surface, part of the outer surface of the first part is exposed at the opening of the heat dissipation body; and a set of heat dissipation fins, which are installed on the second part of the heat pipe.

The heat dissipation body mentioned above is a block made of metal material, one side of the block forms the surface that can provide LED lamps or carriers, and the heat pipe receiving hole passes through the block along the length direction of the heat dissipation body body hole.

The heat dissipation body mentioned above is a tube body formed by a thin metal plate. The tube body has an opening formed by a folded edge at two ends in the length direction, and the two folded edges form the surface for combining the LED lamp or the carrier.

The aforementioned opening extends along the length direction of the heat dissipation body.

There are a plurality of combination holes on the surface of the aforementioned heat dissipation body.

The aforementioned second end constitutes the second part.

The aforementioned heat pipe further includes a third portion located outside the heat dissipation body.

The aforementioned heat pipe has a first end, a second end and an intermediate portion between the two ends, the intermediate portion constitutes the first portion, the first end constitutes the second portion, and the second end constitutes the third part, and the third part is equipped with a set of cooling fins.

The aforementioned heat pipe is filled with a heat transfer medium.

The aforementioned heat transfer medium is an aqueous solution comprising at least one salt, the at least one salt is composed of one or more metal ions selected from copper, silver, gold, nickel, chromium, zinc, titanium and cobalt and an organic acid or Complexes formed from inorganic acids.

Compared with the prior art, the utility model has the following obvious advantages and beneficial effects:

In addition to providing high heat dissipation efficiency for light-emitting diodes, the cooling module formed by the utility model is also beneficial for connecting groups of cooling modules so as to expand and form arrays. As long as the two cooling modules are combined with each other by using one side of the cooling body, And by arranging the fins of the heat dissipation fins of the two heat dissipation modules at a distance from each other, the number of the heat dissipation modules can be expanded to provide a more superior heat dissipation effect.

Description of drawings

Fig. 1 is a combined perspective view of the heat dissipation module according to the first embodiment of the present invention:

FIG. 2 is an exploded schematic diagram of the heat dissipation module and an LED light source assembly of FIG. 1;

Fig. 3 is a combined plan view of Fig. 2;

Fig. 4 is a sectional view taken along line 4-4 of Fig. 3;

Fig. 5 is a combined perspective view of the heat dissipation module according to the second embodiment of the present invention:

FIG. 6 is an exploded schematic diagram of the heat dissipation module of FIG. 5 and the LED light source assembly;

Fig. 7 is a combined plan view of Fig. 6;

Fig. 8 is a sectional view taken along line 8-8 of Fig. 7;

Fig. 9 is a combined perspective view of the heat dissipation module according to the third embodiment of the present invention: and

FIG. 10 is an exploded schematic diagram of the heat dissipation module and another LED light source assembly of FIG. 9 .

Detailed ways

The utility model can have multiple different structures to implement. Now will only be an example but not in order to limit a specific embodiment, with reference to the accompanying drawings, the preferred structural content of the present utility model is described as follows:

Please refer to FIG. 1 to FIG. 4 , which show a heat dissipation module 1 according to the first embodiment of the present invention and an LED light source assembly 2 that can be combined on the heat dissipation module 1; the LED light source assembly 2 includes a metal plate The formed carrier 21 and a plurality of light-emitting diode chips 22 or light-emitting diode lamps mounted on the carrier 21. The design of the heat dissipation module 1 of the present invention enables the LED light source assembly 2 to have high heat dissipation efficiency.

The heat dissipation module 1 includes a heat dissipation body 11, a heat pipe 12 filled with a heat transfer medium 14 and at least one set of heat dissipation fins 13; the heat dissipation body 11 has a heat pipe receiving hole 111 inside, and the heat dissipation body 11 has a The surface 112 on which the light-emitting diode lamp or the carrier 21 is combined can be provided, and the surface 112 is a flat surface, and the opening 114 communicating with the heat pipe receiving hole 111 is provided on the surface 112; in this embodiment, the heat dissipation The main body 11 is a rectangular block made of a metal material such as copper, a flat side of the block forms the surface 112, and a plurality of bonding holes 115 are provided on the surface 112 to provide the connection of the carrier 21; In this embodiment, the carrier 21 is provided with corresponding through holes 211, and a plurality of connectors 3 are used to penetrate the number of through holes 211 and the number of coupling holes 115, so that the carrier 21 is combined with the surface 112 of the heat dissipation body 11 superior.

In this embodiment, the heat pipe 12 has an outer surface 124, a middle portion 123 sleeved in the heat pipe receiving hole 111 of the heat dissipation body 11, and a first end 121 and a second end located outside the heat dissipation body 11. 122; when the heat pipe 12 is inserted into the heat pipe receiving hole 111, part of the outer surface 124 of the middle part 123 will be exposed at the opening 114 of the heat dissipation body 11 (as shown in FIG. 4 ); and in this embodiment , the heat pipe 12 is a round pipe made of a metal material such as copper, and the inside of the heat pipe 12 is filled with a heat transfer medium 14, which is an existing heat transfer material with superconducting efficiency, which includes at least one An aqueous solution of two salts, the at least one salt is a complex formed by one or more metal ions selected from copper, silver, gold, nickel, chromium, zinc, titanium and cobalt and an organic acid or an inorganic acid.

The group of heat dissipation fins 13 is composed of a plurality of thin sheets made of copper and aluminum, which are separated and connected, and a group of heat dissipation fins 13 are respectively installed at the first end 121 and the second end 122 of the heat pipe 12. , each group of cooling fins 13 is exposed in the air, and utilizes air convection to dissipate heat.

According to the heat dissipation module 1 of the present invention, the heat dissipation body 11 provides the light-emitting diode lamp or the carrier 21 to be assembled conveniently, and the heat dissipation body 11 and the heat pipe 12 have a wide contact area so that the light-emitting diode can be effectively The generated heat is transferred to the heat pipe 12, and part of the outer surface of the heat pipe 12 is in contact with the carrier 21, so that the heat generated by the light-emitting diode can quickly pass through the heat pipe 12 and the heat transfer medium 14 inside the heat pipe. The carrier 21 is then naturally convected with the air through the two sets of cooling fins 13 at the two ends of the heat pipe 12, so that the effects of fast heat absorption, small thermal resistance and rapid heat removal can be achieved.

Referring to Fig. 5 to Fig. 8, it shows the heat dissipation module 1 according to the second embodiment of the present invention (in this embodiment, regarding the same or equivalent components as described in the first embodiment, the same reference numerals will be added and the detailed structure will be omitted description); the heat dissipation module 1 also includes a heat dissipation body 11, a heat pipe 12 filled with a heat transfer medium 14 and at least one set of heat dissipation fins 13; the difference between the second embodiment and the first embodiment is that the heat dissipation body 11 is a generally circular tube body formed by a thin metal plate. The tube body has an opening 114 with two ends respectively forming a folded edge 113 in the length direction. The surface 112 . Since the tube wall of the heat dissipation body 11 in this embodiment is relatively thin, the heat dissipation efficiency of the heat dissipation module 1 can be further improved.

Referring to Fig. 9 and Fig. 10, it shows the heat dissipation module 1 according to the third embodiment of the present invention; The first end 121 and the second end 122 located outside the heat dissipation body 11, that is, when the heat pipe 12 is inserted into the heat pipe receiving hole 111, a first part (first end 121) of the heat pipe 12 is inserted into the heat dissipation body 11 In the heat pipe receiving hole 111, and a second part (second end 122) is located outside the heat dissipation body 11, so that the length and volume of the heat dissipation module 1 can be reduced; moreover, in this embodiment, the LED light source is shown The assembly 2 includes a metal carrier 21, a number of circuit boards 23 mounted on the carrier 21, and a plurality of LED lamps 24 mounted on the circuit board 23. The LED light source assembly 2 is not limited to the above-mentioned first embodiment. structure type.

In one embodiment, the heat dissipation body is a rectangular block made of metal, one side of the block forms the surface that can provide the carrier bonding of the light emitting diode, and the heat pipe receiving hole is a hole that runs through the heat dissipation body along the length direction. The round hole of the block body, and the opening on the heat dissipation body extends along the length direction of the heat dissipation body and penetrates the surface.

In another embodiment, the heat dissipation body is a tube body formed of a thin metal plate, and the tube body has two ends in the length direction respectively forming an opening with a folded edge, and the two folded edges form a joint for the light emitting diode chip or carrier. of the surface.

In one embodiment, the heat pipe has a first end and a second end, the first end constitutes the first part, and the second end constitutes the second part.

Preferably, the heat pipe further includes a third part located outside the heat dissipation body, and a group of heat dissipation fins is installed on the third part; in another embodiment, the heat pipe has a first end, a second end and an intermediate portion between the two ends, the intermediate portion constitutes the first portion, the first end constitutes the second portion, and the second end constitutes the third portion.

Preferably, the heat transfer medium filled inside the heat pipe comprises an aqueous solution of at least one salt composed of one or more metals selected from copper, silver, gold, nickel, chromium, zinc, titanium and cobalt. A complex of ions with organic or inorganic acids. Preferably, the pH value of the heat transfer medium filled inside the heat pipe is in the range of 6-10.

In the foregoing description, the utility model is only described with respect to specific embodiments, and it is understandable that various changes or modifications can be made according to the design features of the utility model. For example, one side of the heat dissipation body 11 can be used as a The light emitting diode chip 22 is directly assembled on the heat dissipation body 11 by using a carrier. Therefore, although this specification has described the utility model in detail with reference to the above-mentioned various embodiments, those skilled in the art should understand that the utility model can still be modified or equivalently replaced; and everything does not depart from the utility model The technical solutions and their improvements in the spirit and scope should all be included in the scope of the claims of the present utility model.

Claims (9)

1. A heat dissipation module of a light-emitting diode, comprising: a heat dissipation body, a heat pipe, and a group of heat dissipation fins; it is characterized in that: The heat dissipation body has a heat pipe storage hole inside, and the heat dissipation body has a surface that can provide LED lamps or carriers, and an opening communicating with the heat pipe storage hole is provided on the surface; The heat pipe has a first part inserted into the heat pipe receiving hole of the heat dissipation body and a second part outside the heat dissipation body. The heat pipe has an outer surface, and a part of the outer surface of the first part is exposed on the heat dissipation body. openings in the body; and The set of cooling fins is mounted on the second part of the heat pipe. 2. The heat dissipation module according to claim 1, characterized in that: the heat dissipation body is a block made of metal material, one side of the block forms the surface that can provide LED lamps or carriers, and the heat pipe The receiving hole is a circular hole passing through the block along the length direction of the heat dissipation body. 3. The heat dissipation module according to claim 1, characterized in that: the heat dissipation body is a tube body formed of a thin metal plate, and the tube body has openings with two ends forming a folded edge in the length direction, and the two folded edges form Provide the surface to which the LED lamp or carrier is bound. 4. The heat dissipation module according to claim 2 or 3, wherein the opening extends along the length direction of the heat dissipation body. 5. The heat dissipation module according to claim 2 or 3, characterized in that: the surface of the heat dissipation body has a plurality of coupling holes. 6. The heat dissipation module according to claim 1, wherein the heat pipe has a first end and a second end, the first end forms the first part, and the second end forms the second part. 7. The heat dissipation module according to claim 1, wherein the heat pipe further comprises a third portion located outside the heat dissipation body. 8. The heat dissipation module according to claim 7, wherein the heat pipe has a first end, a second end and an intermediate portion between the two ends, the intermediate portion constitutes the first portion, and the first end The second part is constituted, the second end constitutes the third part, and a group of cooling fins are installed on the third part. 9. The heat dissipation module according to claim 1, wherein the heat pipe is filled with a heat transfer medium.

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