CN201137901Y - Heat radiation structure of LED lamp - Google Patents
Heat radiation structure of LED lamp Download PDFInfo
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- CN201137901Y CN201137901Y CNU2007201949832U CN200720194983U CN201137901Y CN 201137901 Y CN201137901 Y CN 201137901Y CN U2007201949832 U CNU2007201949832 U CN U2007201949832U CN 200720194983 U CN200720194983 U CN 200720194983U CN 201137901 Y CN201137901 Y CN 201137901Y
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- heat dissipation
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- led lamp
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- 230000005855 radiation Effects 0.000 title 1
- 230000004308 accommodation Effects 0.000 claims abstract description 3
- 239000000758 substrate Substances 0.000 claims description 21
- 240000008866 Ziziphus nummularia Species 0.000 claims 1
- 238000001125 extrusion Methods 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 44
- 238000009434 installation Methods 0.000 abstract description 4
- 238000001816 cooling Methods 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
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Abstract
本实用新型关于一种LED灯具的散热结构,用以提供LED装设连接,包括散热座,其具有基板,在基板的上、下两平面上分别设有复数散热鳍片,并在基板的平面的各散热鳍片之间形成有供LED置设的容置空间;借此,在体积受限制的情况下,仍能大幅扩增其散热表面积,使各LED可在较适温的环境中运作,而提高使用寿命。
The utility model relates to a heat dissipation structure of an LED lamp, which is used to provide LED installation connection, including a heat dissipation seat, which has a base plate, and a plurality of heat dissipation fins are respectively arranged on the upper and lower planes of the base plate, and an accommodation space for the LED to be arranged is formed between the heat dissipation fins on the plane of the base plate; thereby, under the condition of limited volume, the heat dissipation surface area can still be greatly expanded, so that each LED can operate in a more suitable temperature environment, thereby increasing the service life.
Description
技术领域 technical field
本实用新型有关于一种散热结构,尤指一种用于LED灯具的散热结构。The utility model relates to a heat dissipation structure, in particular to a heat dissipation structure for LED lamps.
背景技术 Background technique
由于发光二极管(LED)具有良好的亮度、较长的寿命、更加省电等优点,目前已被厂商广泛应用在室内或户外的照明装置上;然而,影响LED使用寿命长短的最显著因素,为提供这些LED可在较适温的工作环境下运作;因此,本设计人即以提供LED灯具的散热结构,作为本实用新型的研究课题。Because light-emitting diodes (LEDs) have the advantages of good brightness, long life, and more power saving, they have been widely used in indoor or outdoor lighting devices by manufacturers; however, the most significant factor affecting the service life of LEDs is These LEDs can be provided to operate in a more suitable temperature working environment; therefore, the designer takes providing the heat dissipation structure of LED lamps as the research subject of this utility model.
公知LED灯具的散热结构,如中国台湾新型专利证书号TWM307091所揭示,该散热结构包括散热座,其具有“M”形基板,在基板的上方形成有多数散热鳍片,而基板的下方则供复数LED装设连接,并组合成LED灯具。The heat dissipation structure of the known LED lamps, as disclosed in Taiwan New Patent Certificate No. TWM307091, the heat dissipation structure includes a heat dissipation seat, which has an "M" shaped substrate, and a plurality of heat dissipation fins are formed on the top of the substrate, while the bottom of the substrate is used for cooling. A plurality of LED installations are connected and combined into LED lamps.
然而,公知LED灯具的散热结构,在实际使用上仍存在下述的问题,该基板在成本、使用条件、装配容易度、负荷等各种情况的考虑下,其体积受到相当程度的局限,并无法毫无限制地向外扩增,再加上其仅在基板的平面上设置散热鳍片,所形成的总体散热表面积相当稀少,而不能满足各种高功率LED的散热需求;着实有待加以改善。However, the heat dissipation structure of the known LED lamps still has the following problems in actual use. The volume of the substrate is limited to a considerable extent in consideration of various conditions such as cost, use conditions, ease of assembly, and load. Unable to expand outward without restriction, and it only sets heat dissipation fins on the plane of the substrate, the overall heat dissipation surface area formed is quite scarce, and cannot meet the heat dissipation requirements of various high-power LEDs; it really needs to be improved .
实用新型内容Utility model content
有鉴于此,本实用新型的目的,在于提供一种散热效果更好的LED灯具的散热结构。In view of this, the purpose of the present utility model is to provide a heat dissipation structure of an LED lamp with better heat dissipation effect.
为了达成上述的目的,本实用新型提供一种LED灯具的散热结构,用以提供LED装设连接,包括散热座,其具有基板,在该基板的上、下两平面上分别设有复数散热鳍片,并在该基板的平面的各该散热鳍片之间形成有供LED置设的容置空间。In order to achieve the above purpose, the utility model provides a heat dissipation structure for LED lamps, which is used to provide LED installation and connection, including a heat dissipation seat, which has a base plate, and a plurality of heat dissipation fins are respectively arranged on the upper and lower planes of the base plate fins, and an accommodating space for LEDs is formed between the cooling fins on the plane of the substrate.
由上述方案可知,本实用新型的LED灯具的散热结构,当LED灯座组的LED被启动后,即可借由散热座上的均温板将各LED所产生的热量传导至基板及各散热鳍片上而散热。由于,本实用新型在基板的上、下平面都设有散热鳍片,可在体积受限制的情况下,仍能大幅扩增其散热表面积,使各LED迅速降温,从而令其可在较适温的工作环境中运作,而能大幅提高各LED的使用寿命。It can be seen from the above scheme that the heat dissipation structure of the LED lamp of the present invention can conduct the heat generated by each LED to the substrate and each heat dissipation unit through the uniform temperature plate on the heat dissipation seat after the LEDs of the LED lamp holder group are activated. heat dissipation on the fins. Because the utility model is equipped with heat dissipation fins on the upper and lower planes of the substrate, it can still greatly expand its heat dissipation surface area under the condition of limited volume, so that each LED can cool down rapidly, so that it can be used at a more suitable temperature. It can operate in a warm working environment, and can greatly improve the service life of each LED.
附图说明 Description of drawings
图1为本实用新型的立体图;Fig. 1 is the perspective view of the utility model;
图2为本实用新型与均温板及灯座组分解截面图;Fig. 2 is an exploded sectional view of the utility model, a vapor chamber and a lamp holder;
图3为图2的组合截面图;Fig. 3 is a combined sectional view of Fig. 2;
图4为图2的组合立体图;Fig. 4 is a combined perspective view of Fig. 2;
图5为本实用新型的另一实施例组合截面图。Fig. 5 is a combined sectional view of another embodiment of the present invention.
附图标记说明Explanation of reference signs
LED灯具 10
散热座 1 基板 11
锁固孔 111 散热鳍片 12
凸棘 121 容置空间 13
嵌扣槽 14Embedded
均温板 2
壳体 21Shell 21
LED灯座组 3LED
灯座 31 锁固柱 311Lampholder 31
电路板 32 LED 33
透镜 34
具体实施方式 Detailed ways
有关本实用新型的详细说明及技术内容,配合附图说明如下,然而附图仅提供参考与说明用,并非用来对本实用新型加以限制。The detailed description and technical content of the present utility model are described below with the accompanying drawings, but the accompanying drawings are only for reference and illustration, and are not intended to limit the present utility model.
请参照图1所示,为本实用新型的立体图,本实用新型提供一种LED灯具的散热结构,其主要包括散热座1,散热座1呈矩形体,定义有相对两短侧边及相对两长侧边,具有铝材质的基板11,在基板11的上、下两平面上分别一体铝挤成型有复数散热鳍片12,每一散热鳍片12为等间距排列,且在每一散热鳍片12的两侧面上分别形成有凸棘121,以增加散热面积;另在基板11位于底面的复数散热鳍片12之间形成有圆形容置空间13;并且,在两外侧散热鳍片12外表面成形有复数嵌扣槽14。Please refer to Fig. 1, which is a three-dimensional view of the utility model. The utility model provides a heat dissipation structure of an LED lamp, which mainly includes a
请参照图2所示,为本实用新型与均温板及灯座组分解截面图,本实用新型的散热结构还包括均温板2,并可与LED灯座组3相互组合以构成LED灯具10,该均温板2安装在散热座1的容置空间13内,且其一平面贴设在基板1上,另一面则与LED灯座组3相贴设,此均温板2具有真空密封的壳体21,并在壳体21内部设有毛细组织及工作流体(图未示),借由汽、液相变化的热传机制来传递热量。而该LED灯座组3包括有圆盘形灯座31,以安装在容置空间13内,在灯座31内设有电路板32,电路板32一面贴附在均温板2上,电路板32另一面则安装有复数个LED 33,另在灯座31远离散热座1的外侧面处贴设有透镜34,使LED 33所产生的光线透过此透镜34发散出去。Please refer to Figure 2, which is an exploded cross-sectional view of the utility model, the vapor chamber and the lamp holder assembly. The heat dissipation structure of the present utility model also includes a
请参照图3及图4所示,为本实用新型图2的组合截面图及立体图,在散热座1对应于容置空间13的基板11上设有锁固孔111,而在灯座31内则穿接有锁固柱311;组装时,即令均温板2贴附在容置空间13内与基板11相贴合,再将安装有多个LED 33的电路板32固定于灯座31内,最后借由锁固柱311穿过灯座31锁固于基板11的锁固孔111中,而使LED灯座组3及均温板2与散热座1结合在一起。Please refer to Fig. 3 and Fig. 4, which are the combined sectional view and perspective view of Fig. 2 of the present utility model. A
经由上述结构说明后可知,当LED灯座组3的LED 33被启动后,即可借由散热座1上的均温板2将各LED 33所产生的热量传导至基板11及各散热鳍片12上而散热。由于,本实用新型在基板11的上、下平面都设有散热鳍片12,可在体积受限制的情况下,仍能大幅扩增其散热表面积,使各LED 33迅速降温,从而令其可在较适温的工作环境中运作,而能大幅提高各LED 33的使用寿命。After the description of the above structure, it can be seen that when the
请参照图5所示,为本实用新型的另一实施例组合截面图,本实用新型除了可为上述实施例外,也可如本实施例的形态,该散热座1的基板11为均温板,在此均温板的上、下两平面上,分别通过锡膏等导热介质(图未示)连接有复数散热鳍片12,且各散热鳍片12为等间距排列;另在均温板底面的各散热鳍片12之间形成有圆形容置空间13,以提供给LED灯座组3装设连接,且各LED33与均温板的底面相互贴附接触,而将各LED 33所产生的热从均温板快速导出后,再由上、下各散热鳍片12散逸出。Please refer to FIG. 5 , which is a combined cross-sectional view of another embodiment of the present invention. In addition to the above-mentioned embodiments, the present invention can also be in the form of this embodiment. The
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201949832U CN201137901Y (en) | 2007-11-14 | 2007-11-14 | Heat radiation structure of LED lamp |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201949832U CN201137901Y (en) | 2007-11-14 | 2007-11-14 | Heat radiation structure of LED lamp |
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| CN201137901Y true CN201137901Y (en) | 2008-10-22 |
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| CNU2007201949832U Expired - Fee Related CN201137901Y (en) | 2007-11-14 | 2007-11-14 | Heat radiation structure of LED lamp |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011047550A1 (en) * | 2009-10-19 | 2011-04-28 | Lin Junyi | Integrated package led light source with easy heat-dissipating |
| WO2011076219A1 (en) * | 2009-12-21 | 2011-06-30 | Martin Professional A/S | Cooling module for multiple light source projecting device |
| CN105355609A (en) * | 2015-11-30 | 2016-02-24 | 南京长峰航天电子科技有限公司 | Heat dissipation packaging structure |
| CN109668119A (en) * | 2017-10-16 | 2019-04-23 | 诚益光电科技股份有限公司 | Light projection device and its radiating module |
-
2007
- 2007-11-14 CN CNU2007201949832U patent/CN201137901Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011047550A1 (en) * | 2009-10-19 | 2011-04-28 | Lin Junyi | Integrated package led light source with easy heat-dissipating |
| WO2011076219A1 (en) * | 2009-12-21 | 2011-06-30 | Martin Professional A/S | Cooling module for multiple light source projecting device |
| CN105355609A (en) * | 2015-11-30 | 2016-02-24 | 南京长峰航天电子科技有限公司 | Heat dissipation packaging structure |
| CN109668119A (en) * | 2017-10-16 | 2019-04-23 | 诚益光电科技股份有限公司 | Light projection device and its radiating module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081022 Termination date: 20091214 |