• M285044 八、新型說明： 【新型所屬之技術領域】 本創作係關於一種發光二極體元件，尤指一種呈立體 多層結構的發光二極體元件。 【先前技術】 一由於發光二極體的製作技術成熟，使得其應用範圍相 當廣泛，而目前的發光二極體元件的結構，也隨著不同應 φ用需求而有不同，舉例來說，早期發光二極體元件配合電 2板銲接製程，而設計為雙插腳的單顆晶片構裝態樣，隨 著封裝技術的成熟，發光二極體元件的構裝不再僅包含一 顆日曰片，可月匕使用為二至三顆甚至更多的晶片。 誠如第四圖所示，-種平面多顆晶片的發光二極體元 件（5 0 )的構裝結構，其主要於—基板（5丄）上設置 有複數發光二極體晶ΓβίΊ、 . 日片（6 Q ) ’以使整個該發光二極體 元件（5 0)的出光輝唐媒古，a # 衅棱同或疋猎由不同顏色晶片（5 • ❸使用，達到混出不同顏色光的效果。 顆蘇^ "的發光—極體元件相較於早期雙插腳的單 ^光二極體元件的出光輝度佳，且其產品尺寸亦較薄， 發光二極體元件的設計必,然有其需求的市場。 的省電低功耗、高亮度等特性，使得 的需戈，各A廠商亦提供針對客戶端產品 日J而求，開發合適的構梦涕 有更多不Γ]㈣H “戈冓服務，目此可預見未來 有更夕不同教先—極體的構裝或結構問世。 【新型内容】 M285044 為此，本倉Η乍的新目的係提# 一種立體結構的發光 务體兀件彳於有限的面積下提高發光二極體元件的整 體出光輝度。 /、達上述目的所提供的主要技術手段係令該立體式發 光二極體元件包含有·· -多層反射晶座，係主要包含有一底座、至少一層基 座及一支撐架，該支撐架係設於該底座上，而各基座則順 序固定在支撑架上，令底座與基座呈一重叠的立體架構； 其中各基座至少具有—下斜面，該下斜面係為一反射面； 及 複數發光二極體晶片，係分別置放於各基座的上端 面’其發光面朝上。 上述發光二極體元件係主要設計一個立體多層式的晶 座，供大量的發光二極體晶片置於其上，以增加出光輝度 以及提高出光面積。 本創作的次一目的係提供一更佳散熱效果的發光二極 體元件，係上述晶座之支撐架内形成一容置空間，供一外 部散熱裝置插設於其中，當晶片被驅動點亮時，其產生的 熱可透過該底座、基座及支撐架傳導至該散熱裝置中，由 散熱裝置將其散熱到外部，而使發光二極體元件具更佳的 散熱效果。 八 【實施方式】 首先請參閱第一圖所示，係為本創作一 ρ #父佳實施例的 立體圖，配合第二圖所示，本創作發光二極體元件（丄⑹ M285044 包含有： 一多層反射晶座（20)，係主要包含有一底座（2 1) 、至少一層基座（22)及一支撐架（23)，該支 撐架（23)係設於該底座（2 1)上，而各基座（22) 則順序固定在支撐架（2 3 )上，令底座（2 1 )與基座 (22)呈一重疊的立體架構，如二圖所示，各基座（2 2) 與邊支撐架（2 3)係一體成型；其中各基座（22) 至少具有—下斜面（222)，該下斜面（222)係為 一反射面；又，各基座（2 2 )的上端面（2 2 1 )亦可 形成為一外斜面，同樣具有反射功能；及 複數發光二極體晶片（3〇)，係分別置放於各基座 (22)的上端面（221)，其發光面朝上。 上述各基座（2 2 )的形壯可&々& 形為最佳，而支撐苹（2 3) 為各種形狀’其中以圓 2)之間可為-體成=:二(21)及各基座 ^及各基座（”）係為熱傳支導:1(2广 此即可提供各發光二極體晶片（材貝，如鋁、銅等，如 散熱途徑，特別是各基板之間又3 〇)點亮時，一個好的 的熱交換面積。 θ 有間隔一距離，具有較大 請配合參閱第三圖所示 樓架（23)㈣成有一容置？ 傳導性的散熱裝置（4 二間 底座（2 1 ) &各層基座（：二’ 面圖，上述實施例的戈 山(231) ’供， 當該支撐架（2 3 )、 M具熱傳導性的材料製 (1 〇 a )另一較佳實例的部份气本創作發光二極體元件 •M285044 作時，各晶片（q 基座（ 二）所產生的熱會藉由底座（川、 散逸，具有… (23)及散熱裝置（40)對外 …’阿散熱功效。 由多：:：：！二圖所示’該發光二極體元件Ο 〇)藉 〇)在有^座（2〇)設計，使得發光二極晶片㈡ 二極體元件（如笛m 、瓜呈千面排列的發光 因為能置放萝> /、 的出光面積，並能 面的設計，# 7 士 ^及日日座（2 0 )斜 【圖η彳效提高各散射方向的出光輝度。 【圖式簡單說明】 第一圖 第二圖 第三圖 第四圖 係本創作一較佳實施例的立體外觀圖。 係本創作一較佳實施例的部份剖面圖 係本創作另一較佳實施例 ° 危TO 士、τ ， ⑺4面圖。 係既有平面式發光二極體元 圖。 仵的部份剖面 主要元件符號說明】 0 )( 1 0 a )發光二極體元件 (2 〇 )晶座 (2 2 )基座 (222)下斜面 (2 3 1 )容置空間 (4 〇 )散熱裝置 (51)基座 (2 1 )底座 (2 2 1 )上端面 (2 3 )支樓架 (3 0 )晶片 (5 0 )發光二極 Q體7L件 (6 0 )晶片• M285044 VIII. New Description: [New Technology Field] This creation is about a light-emitting diode component, especially a light-emitting diode component in a three-dimensional multilayer structure. [Prior Art] Since the fabrication technology of the light-emitting diode is mature, its application range is quite extensive, and the structure of the current light-emitting diode component is also different depending on the demand of different φ, for example, early The light-emitting diode component is matched with the electric 2-plate soldering process, and is designed as a single-pin single-pin package. With the maturity of the packaging technology, the LED component is no longer included in only one sundial. It can be used for two to three or more wafers. As shown in the fourth figure, the structure of the light-emitting diode element (50) of a plurality of planar planar wafers is mainly provided with a plurality of light-emitting diodes ΊβίΊ on the substrate (5丄). The film (6 Q ) 'to make the whole of the light-emitting diode element (50) out of the light, the a # 衅 同 or 疋 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由The effect of light. The luminescence-polar element of the sue " is better than the light-emitting diode of the early two-pin diode, and its product size is also thin, and the design of the illuminating diode component is necessary. However, there is a market for its demand. The characteristics of power saving, low power consumption, high brightness, etc. make the demand, and each A manufacturer also provides for the client product, and the development of a suitable structure is more and more] (4) H “Gao Wei service, it is foreseeable that there will be different teachings in the future – the structure or structure of the polar body will come out. [New content] M285044 For this reason, the new purpose of this warehouse is to raise a three-dimensional structure. The physical components increase the overall output of the light-emitting diode components under a limited area The main technical means provided by the above-mentioned objects is that the three-dimensional light-emitting diode element comprises a multi-layer reflective crystal seat, which mainly comprises a base, at least one base and a support frame. The support frame is disposed on the base, and each base is sequentially fixed on the support frame, so that the base and the base have an overlapping three-dimensional structure; wherein each base has at least a lower slope, and the lower slope is a reflection And the plurality of light-emitting diode chips are respectively placed on the upper end surface of each of the pedestals, and the light-emitting surface thereof faces upward. The above-mentioned light-emitting diode element is mainly designed with a three-dimensional multilayer crystal seat for a large number of light-emitting diodes. The polar body wafer is placed thereon to increase the brightness and increase the light-emitting area. The second purpose of the present invention is to provide a light-emitting diode component with better heat dissipation effect, and a receiving space is formed in the support frame of the above-mentioned crystal holder. An external heat sink is inserted therein, and when the wafer is driven to illuminate, heat generated by the wafer can be transmitted to the heat sink through the base, the base and the support frame, and the heat sink The heat is radiated to the outside, and the light-emitting diode component has a better heat-dissipating effect. [Embodiment] First, please refer to the first figure, which is a perspective view of the creation of a ρ #父佳 embodiment, with the second figure As shown, the present LED component (丄(6) M285044 includes: a multilayer reflective crystal seat (20), which mainly includes a base (2 1), at least one base (22) and a support frame (23). The support frame (23) is attached to the base (2 1), and each base (22) is sequentially fixed on the support frame (23), so that the base (2 1 ) and the base (22) In an overlapping three-dimensional structure, as shown in FIG. 2, each base (2 2) is integrally formed with the side support frame (23); wherein each base (22) has at least a lower slope (222), the lower The inclined surface (222) is a reflecting surface; further, the upper end surface (2 2 1 ) of each base (2 2 ) can also be formed as an outer inclined surface, which also has a reflecting function; and a plurality of light emitting diode chips (3〇) ), respectively placed on the upper end surface (221) of each of the pedestals (22) with the light-emitting surface facing upward. The above-mentioned pedestal (2 2 ) is optimal in shape and size, and the support ping (2 3) is in various shapes 'where the circle 2) can be - body formation =: two (21) And each pedestal ^ and each pedestal (") is a heat transfer branch: 1 (2 can provide each illuminating diode chip (such as aluminum, copper, etc., such as heat dissipation, especially 3 〇) between the substrates, a good heat exchange area. θ There is a distance between the two, which is larger. Please refer to the frame (23) (4) shown in the third figure for a housing. Conductivity Heat sink (4 two bases (2 1 ) & each layer base (: two 'top view, Goshan (231)' of the above embodiment), when the support frame (23), M is thermally conductive Material made (1 〇a ) Another part of the preferred embodiment of the light-emitting diode element • M285044, the heat generated by each wafer (q pedestal (2) will be passed through the base (Chuan, Dissipate, With ... (23) and heat sink (40) external ... 'A heat dissipation effect. From the more::::! 2 picture shown 'the light-emitting diode component Ο 〇) borrowed) in the ^ seat (2 〇) design, The light-emitting diode chip (2) diode element (such as the flute m, the melon is arranged in a thousand-sided arrangement because of the light-emitting area of the radish > /, and the design of the surface, #7士^和日日座(2 0) oblique [Fig. η effect improves the light emission in each scattering direction. [Simplified illustration] The first figure, the second figure, the third figure, the fourth figure, is a three-dimensional appearance of a preferred embodiment of the present invention. A partial cross-sectional view of a preferred embodiment is another preferred embodiment of the present invention. The τ, (7) 4-side diagram is a planar light-emitting diode diagram. Description] 0) (1 0 a) illuminating diode component (2 〇) crystal holder (2 2 ) pedestal (222) lower slope (2 3 1 ) accommodating space (4 〇) heat sink (51) pedestal (2 1 ) base (2 2 1 ) upper end face (2 3 ) branch frame (30) wafer (50) light-emitting diode Q body 7L piece (60) wafer