200846776 九、發明說明： 【發明所屬之技術領域】 本毛明係關於一種發光模組，特別關於一種侧向式發 光模組。 【先前技術】200846776 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a lighting module, and more particularly to a lateral lighting module. [Prior Art]
X光〜極體是由半導體材料所製成之發光元件，元件 二1兩们電極端子，在端子間施加極小的電壓，藉由電子 電洞之結合，可將能量以光的形式激發釋出。 不同於一般白熾燈泡，發光二極體係屬冷發光，且有 耗電詈牯、- 士 八 -凡件哥命長、無須暖燈時間、反應速度快等優 "占\ =加上其體積小、耐震動、適合量產，容易配合應用 上的而求製成極小或陣列式的元件。目前發光二極體已普 遍使用於貝訊、通訊、消費性電子產品的指示器、廣告看 板及頦示裴置上，儼然成為曰常生活中不可或缺的重要電 子元件近來，發光二極體更被應用作為液晶顯示器 (Liquid Crystal Dispiay，LCD)之中背光模組之光源，並 有逐漸取代傳統冷陰極螢光燈管作為光源的趨勢。 U、複數發光二極體12、一軟性電路板（Fpc) 13、一光 源罩14、—導光板15以及—反射片16。框體U係為一 中空矩形框體，該等發光二極體12係設置於軟性電路板 13上，而軟性電路板13之—部分係穿出框體u而與驅動 請參照圖1所示，其係為習知液晶顯示器中一侧向式 背光模組之一示意圖。侧向式背光模組i係包含一框體 5 200846776 電路板（圖中未示）電性連結，而光源罩14係連結於樞 體11之一侧邊。 請參照圖2所示，其係為組裝後之側向式背光模組1 沿圖1之直線D-D之一剖面示意圖。發光二極體12具有 一晶片121、一導線架122以及一塑膠殼體123。晶片i2l 係設置於導線架122，塑膠殼體123係包覆導線架122之 一部分而露出導線（lead，L)。發光二極體12係表面黏著 於軟性電路板13，然後再利用膠體P來將軟性電路板13 平貼於光源罩14，而晶片121所發出的光係經由塑膠殼體 123内壁的反射層反射，而射出塑膠殼體123。 該等發光二極體12係面對導光板15之一入光面151 設置成一列，當發光二極體12所發出之光線係經由入光 面151進入導光板15時，光線會在導光板15内進行全反 射並達到混光的效果，且當光線經過導光板15底面之印 刷網點時，會產生散射而破壞光線的全反射現象，造成部 分光線折射出導光板15之出光面152，而形成一面光源。 另外’設置於導光板15底面之反射片16則可提高側向式 背光模組1之光線利用率。 然而，由於發光二極體12所發出的熱能，係由導熱 性差的軟性電路板13,通過高熱阻係數的膠體p而將熱能 傳$至金屬材質的光源罩14，進而協助散熱。由此可知， 發光二極體12之散熱效果並不好，甚至會降低發光二極 體12之發光效能。 爰因於此，如何提供一種能夠解決散熱問題之發光模 6 200846776 組，正是當前的重要課題之一。 【發明内容】 有鐘於上述課題，本發明之目的為挺 的马如供一種能夠提升 散熱效率之側向式發光模組。 緣是，為達上述目的’依本發明之—種側 桓 •組包含一導熱架、一金屬基材電路板、一道土上 尤犋 κ 蜍先板以及一癸 光二極體。金屬基材電路板係設置於導熱架，導"广 有一出光面，金屬基材電路板係鄰設於導=板且二卞二/、 導光板之出光面平行設置。發光二極體传且且只質上與 及一底面，發光二極體係以底面表面黏著於金屬基材带: 承上所述，因依據本發明之一種側向式發 發光二極體係表面黏著於金屬基材電路板。與習知、、且丄其 比’由於發光二極體係表面黏著於金屬基材電路σ技術相 鲁屬基材電路板之導熱效果比較好，因此發光二極體可:金 '較好的散熱效率，進而提升發光二模組之產品。斯”有 -者，金屬基材電路板係平躺於侧向式發光模組^^可^ 加金屬基材電路板表面走線的面積。 s 【實施方式】 之 以下將翏照相關圖式，說明依本發明複數實施 種側向式發光模組。 式 請參考圖3至圖5以說明本發明第一實施例之侧向 7 200846776 發光模組。 . 請參照圖3所示，本發明較佳實施例之側向式發光模 組2包含-導熱架21、—金屬基材電路板& 一導光板 23以及-發光二極體24。其中’側向式發光模組2可為 一用於日常照明之照明模組、—掃猫器之光源模組、一戶 外顯示器的光源或者是-液晶顯示裝置之背光模組。本實 知例中’發光模組2係' 以液晶顯示裝置之背光模組為例。 明同時參照圖3及圖4，圖4係為圖3發光模組2組 裝後沿直線A-A之一部分剖面示意圖。 本實施例中，侧向式發光模組2更可包含一反射片 25，反射片25係設置於導光板23之一底面231，底面231 係與導光板23之一出光面232相對設置。導熱架21係以 一矩形框架為例，導熱架21係支持導光板23及反射片25 設置，其材質係為金屬或合金，有較高的熱傳導係數，可 協助發光二極體24散熱。 金屬基材電路板（Metal Core Printed Circuit Board， MCPCB) 22係設置於導熱架21。在此，金屬基材電路板 22係指具有金展核心（例如銘或铭合金）的電路板或印刷 電路板’金屬基材電路板22具有較高的傳導係數。於金 屬基材電路板22表面上，可具有一金屬導線圖案，而與 發光二極體24電性連接。此外，由於金屬基材電路板22 係平躺且鄰設於發光二極體24，如此一來，係比·習知立設 於發光二極體24 —側的作法，具有減少側向式發光模組2 之厚度的優點，再加上為平躺的作法，所以金屬基材電路 8 200846776 板22之面積可作得較大，其表面可具有較多的金屬導線 圖案，有利於走線的設計佈置。 另外’侧向式發光模組2更可包含一導熱材料26，係 位於金屬基材電路板22與導熱架21之間。導熱材料26 ~例如為導熱膏、導熱矽膠、導熱膠或導熱墊，可提高金屬 、基材電路板22與導熱架21之結合可靠度，以及結合平整 度。 鲁 導光板23之材質通常為聚碳酸酯（PC)、聚甲基丙烯 酸甲酯（PMMA)或壓克力系樹脂，導光板23係具有一出 光面232 ’金屬基材電路板22係鄰設於導光板23且實質 上與導光板23之出光面232平行設置，也就是說，金屬 基材電路板22係平躺且鄰設於導光板23。 餐光一極體24可為一發光二極體元件（device )或為 一裸晶（die)。本實施例中，係以侧向式發光模組2係以 具有衩數發光二極體元件為例，且各個發光二極體元件所 _ 發出的光線可為相同或不相同（例如可混成白光）。 如圖4所示，發光二極體24具有一裸晶241、一基板 〜242、一封裝體243以及一塑膠反射件244。其中，裸晶 241係電性連結於基板242，基板242可為一印刷電路板 或疋一導線架（lead frame)。本實施例中係以基板242為 導線架為例。塑膠反射件244可為射出成型，利用塑料來 包覆至少-部分之導線架。塑膠反射件施具有一容置空 間s，裸晶糾係位於容置空間s，而封裝體（其材質例 如為石夕膠或5衣氧樹脂）243係包覆裸晶且填充於容置 9 200846776 空間s中。另外，塑膠反射件244之内壁係具有一反射層， 以將裸晶241所發出的光線反射出塑膠反射件244。 當然’若發光二極體24即為一裸晶時，則裸晶也可 利用打線接合、覆晶接合或表面黏著等方式而與基板242 接合。 如圖4所示，發光二極體24之侧發光面245係實質 ' 上與金屬基材電路板22垂直。由側發光面245所發出的 光，則直接入射於鄰近導光板23之一入光面233，光線會 在導光板23内進行全尽射並達到混光的效果，且當光線 經過導光板底面231之印刷網點時，會產生散射而破壞光 線的全反射現象，造成部分光線折射出導光板23之出光 面232 ’而形成一面光源。 本實施例中，側向式發光模組2更可包含一反射罩 27，反射罩27係連結於導勢架21，以使發光二極體24所 發出的光線射至導光板23，並提高光線利用率。其中，反 丨 射罩27與導熱架21結合的方式可例如為鎖附、黏附、卡 ， 合以及銲接等等。 -接著，請參考圖5A，其係為第一實施例中之發光二極 體24之一放大示意圖。發光二極體24係具有一侧發光面 245及一底面246，其中，侧發光面245即為發光二極體 24之出光面。本實施例中，發光二極體24之引腳l係彎 折於塑膠反射件244之二側，發光二極體24係為一側光 式（Side Emitting Type)發光二極體元件，也就是說，發 光二極體24之侧發光面245係與導線架之引腳l之連接 200846776 面L1部分實質上呈九十度。 請同時參照圖4及圖5A，引腳；l部分利用銲錫等方 式來表面黏著（surface mount)於金屬基材電路板22上。 如此一來，散熱路徑與電性導通之路徑係為相同，均是由 發光二極體24之裸晶241傳導至導線架之引腳L。然後， 熱能再經由金屬基材電路板22及導熱材料％傳遞至 架21來協助散熱。 ^ 請同時參照圖4及圖5Β，其係為第一實施例之發光二 極體24’之另--種態樣，其中’發光二極體24’之散熱與電 性導通之路徑並不相同。發光二極體24，係具有一散熱片、 Η，散熱片Η係與裸晶241接觸，並由後方伸出塑膠㈣ 件244’並，折至其底面246，發光二極體冰係藉由散熱片 Η表面黏著於金屬基材電路板22，以使發光二極體24，的 熱能可傳導至導熱架21。而於通電時，發光二極體Μ，之 裸晶241缝由導丨腳以電性連結於金屬基材電 路板22。如此一來，發光二極 路徑並不㈣，Τ但能降心# 冑…、“性導通之 此降低發光二極體24之 到散熱效率的影響，也可以驻±^ & 手又 來協助散熱。 由熱傳係數較高的導熱架21The X-ray to the polar body is a light-emitting element made of a semiconductor material, and the electrode terminals of the two elements are applied with a very small voltage between the terminals, and the energy can be excitedly emitted in the form of light by the combination of the electron holes. . Different from ordinary incandescent light bulbs, the light-emitting diode system is cold-emitting, and has power consumption, - Shiba - all things are long, no need for warming time, fast response, etc. " \ = plus its volume Small, shock-resistant, suitable for mass production, easy to make small or array components with the application. At present, LEDs have been widely used in indicators, advertising billboards and display devices of Beixun, communication and consumer electronics, and have become an important electronic component that is indispensable in everyday life. It is also used as a light source for backlight modules in Liquid Crystal Dispiay (LCD), and has gradually replaced traditional cold cathode fluorescent lamps as a light source. U, a plurality of light-emitting diodes 12, a flexible circuit board (Fpc) 13, a light source cover 14, a light guide plate 15, and a reflection sheet 16. The frame U is a hollow rectangular frame, and the light-emitting diodes 12 are disposed on the flexible circuit board 13, and the flexible circuit board 13 is partially driven out of the frame u and driven as shown in FIG. It is a schematic diagram of a side-lit backlight module in a conventional liquid crystal display. The lateral backlight module i includes a frame 5 200846776 A circuit board (not shown) is electrically connected, and the light source cover 14 is coupled to one side of the pivot body 11. Please refer to FIG. 2 , which is a schematic cross-sectional view of the assembled lateral backlight module 1 along the line D-D of FIG. 1 . The LED 12 has a wafer 121, a lead frame 122, and a plastic housing 123. The wafer i2l is disposed on the lead frame 122, and the plastic case 123 covers a portion of the lead frame 122 to expose the lead (L). The surface of the light-emitting diode 12 is adhered to the flexible circuit board 13, and then the flexible circuit board 13 is flatly attached to the light source cover 14 by the colloid P, and the light emitted by the wafer 121 is reflected by the reflective layer on the inner wall of the plastic case 123. And the plastic casing 123 is shot. The light-emitting diodes 12 are disposed in a row facing the light-incident surface 151 of the light guide plate 15. When the light emitted by the light-emitting diode 12 enters the light guide plate 15 via the light-incident surface 151, the light is incident on the light guide plate. 15 is totally reflected and achieves the effect of light mixing, and when the light passes through the printing dot on the bottom surface of the light guide plate 15, a total reflection phenomenon which scatters and destroys the light is generated, and part of the light is reflected off the light emitting surface 152 of the light guide plate 15, and Form a light source. Further, the reflection sheet 16 disposed on the bottom surface of the light guide plate 15 can improve the light utilization efficiency of the lateral backlight module 1. However, due to the thermal energy emitted by the light-emitting diode 12, the thermal circuit board 13 having poor thermal conductivity transmits thermal energy to the light source cover 14 of the metal material through the colloid p having a high thermal resistance coefficient, thereby assisting heat dissipation. It can be seen that the heat dissipation effect of the light-emitting diode 12 is not good, and the light-emitting efficiency of the light-emitting diode 12 can be lowered. Because of this, how to provide a kind of illuminating mode that can solve the heat dissipation problem is one of the current important topics. SUMMARY OF THE INVENTION In view of the above problems, the object of the present invention is to provide a lateral type light-emitting module capable of improving heat dissipation efficiency. The edge is that, in order to achieve the above object, the group includes a heat conducting frame, a metal substrate circuit board, a soil 犋 κ 蜍 板 plate, and a light diode. The metal substrate circuit board is disposed on the heat conducting frame, and the conductive substrate has a light emitting surface, and the metal substrate circuit board is adjacent to the guiding plate and the second light emitting plate and the light emitting surface of the light guiding plate are arranged in parallel. The light-emitting diode transmits and only has a top surface and a bottom surface, and the light-emitting diode system adheres to the metal substrate strip with the bottom surface: as described above, the surface adhesion of the lateral light-emitting diode system according to the present invention On metal substrate boards. Compared with the conventional, and 丄 ' 'Because the surface of the light-emitting diode system is adhered to the metal substrate circuit σ technology phase, the heat conduction effect of the substrate is better, so the light-emitting diode can: Efficiency, which in turn enhances the products of the illuminating two modules. "There is a case where the metal substrate circuit board is lying flat on the side-mounted light-emitting module ^^ can be added to the area of the surface of the metal substrate circuit board. s [Embodiment] The following will refer to the relevant drawings. A side-by-side light-emitting module according to the present invention will be described. Referring to FIG. 3 to FIG. 5, a lateral 7 200846776 light-emitting module according to a first embodiment of the present invention will be described. Referring to FIG. 3, the present invention is shown. The lateral light-emitting module 2 of the preferred embodiment comprises a heat-conducting frame 21, a metal substrate circuit board & a light guide plate 23 and a light-emitting diode 24. The 'lateral light-emitting module 2 can be a A lighting module for daily lighting, a light source module for sweeping a cat, a light source for an outdoor display, or a backlight module for a liquid crystal display device. In the present embodiment, the 'lighting module 2 is' is a liquid crystal display device. The backlight module is taken as an example. Referring to FIG. 3 and FIG. 4 simultaneously, FIG. 4 is a schematic cross-sectional view of a portion of the light-emitting module 2 of FIG. 3 along a line AA. In this embodiment, the lateral light-emitting module 2 is further applicable. A reflective sheet 25 is disposed, and the reflective sheet 25 is disposed on a bottom surface 231 of the light guide plate 23, The surface 231 is disposed opposite to the light emitting surface 232 of the light guide plate 23. The heat conducting frame 21 is exemplified by a rectangular frame, and the heat conducting frame 21 supports the light guiding plate 23 and the reflecting sheet 25, and the material is made of metal or alloy. The high heat transfer coefficient can assist the light-emitting diode 24 to dissipate heat. The Metal Core Printed Circuit Board (MCPCB) 22 is disposed on the heat-conducting frame 21. Here, the metal substrate circuit board 22 has a gold exhibition. The core (for example, Ming or Ming alloy) circuit board or printed circuit board 'metal substrate circuit board 22 has a higher conductivity. On the surface of the metal substrate circuit board 22, there may be a metal wire pattern, and the light emitting two The electrode body 24 is electrically connected. Further, since the metal substrate circuit board 22 is lying flat and adjacent to the light-emitting diode 24, the method is conventionally disposed on the side of the light-emitting diode 24, The utility model has the advantages of reducing the thickness of the lateral type light-emitting module 2, and the method of lying flat, so that the area of the metal substrate circuit 8 200846776 board 22 can be made larger, and the surface thereof can have more metal wire patterns. ,beneficial to In addition, the lateral light-emitting module 2 may further comprise a heat-conducting material 26 between the metal substrate circuit board 22 and the heat-conducting frame 21. The heat-conducting material 26 is, for example, a thermal conductive paste, a thermal conductive silicone, The thermal conductive adhesive or the thermal pad can improve the bonding reliability of the metal, the substrate circuit board 22 and the heat conducting frame 21, and the flatness. The material of the Lu light guide plate 23 is usually polycarbonate (PC), polymethyl methacrylate. (PMMA) or acrylic resin, the light guide plate 23 has a light-emitting surface 232. The metal substrate circuit board 22 is disposed adjacent to the light guide plate 23 and substantially parallel to the light-emitting surface 232 of the light guide plate 23, that is, The metal substrate circuit board 22 is laid flat and adjacent to the light guide plate 23. The meal light body 24 can be a light emitting diode device or a die. In this embodiment, the lateral light-emitting module 2 is exemplified by a plurality of light-emitting diode elements, and the light emitted by each of the light-emitting diode elements may be the same or different (for example, white light may be mixed). ). As shown in FIG. 4, the LED 24 has a die 241, a substrate 242, a package 243, and a plastic reflector 244. The bare crystal 241 is electrically connected to the substrate 242, and the substrate 242 can be a printed circuit board or a lead frame. In this embodiment, the substrate 242 is taken as an example of a lead frame. The plastic reflector 244 can be injection molded, using plastic to cover at least a portion of the lead frame. The plastic reflector has an accommodating space s, the bare crystal is located in the accommodating space s, and the package (the material is, for example, shijiao or 5 oxy-resin) 243 is covered with bare crystal and filled in the accommodating 9 200846776 Space s. In addition, the inner wall of the plastic reflecting member 244 has a reflective layer for reflecting the light emitted by the bare crystal 241 out of the plastic reflecting member 244. Of course, if the light-emitting diode 24 is a bare crystal, the bare crystal may be bonded to the substrate 242 by wire bonding, flip chip bonding, or surface adhesion. As shown in FIG. 4, the side light-emitting surface 245 of the light-emitting diode 24 is substantially perpendicular to the metal substrate circuit board 22. The light emitted by the side light-emitting surface 245 is directly incident on the light-incident surface 233 of the adjacent light-guide plate 23, and the light is completely radiated in the light-guide plate 23 to achieve the effect of light mixing, and when the light passes through the bottom surface of the light guide plate. When the dot is printed at 231, a total reflection phenomenon that scatters and destroys the light is generated, and part of the light is reflected off the light-emitting surface 232' of the light guide plate 23 to form a light source. In this embodiment, the lateral light-emitting module 2 further includes a reflector 27, and the reflector 27 is coupled to the waveguide 21 to cause the light emitted by the LED 24 to be incident on the light guide plate 23 and improved. Light utilization. The manner in which the reticle cover 27 is combined with the heat transfer frame 21 can be, for example, locking, adhering, carding, welding, and the like. - Next, please refer to Fig. 5A, which is an enlarged schematic view of one of the light-emitting diodes 24 in the first embodiment. The light-emitting diode 24 has a light-emitting surface 245 and a bottom surface 246, wherein the side light-emitting surface 245 is the light-emitting surface of the light-emitting diode 24. In this embodiment, the pins l of the LEDs 24 are bent on two sides of the plastic reflector 244, and the LEDs 24 are Side Emitting Type LED components, that is, It is said that the side light-emitting surface 245 of the light-emitting diode 24 is connected to the lead l of the lead frame. The portion of the surface L1 of the 200846776 surface is substantially ninety degrees. Referring to FIG. 4 and FIG. 5A simultaneously, the pin portion 1 is surface mounted on the metal substrate circuit board 22 by soldering or the like. In this way, the heat dissipation path and the electrical conduction path are the same, and both are conducted by the bare crystal 241 of the light emitting diode 24 to the lead L of the lead frame. Thermal energy is then transferred to the shelf 21 via the metal substrate circuit board 22 and the thermally conductive material % to assist in heat dissipation. ^ Please refer to FIG. 4 and FIG. 5 simultaneously, which is another aspect of the light-emitting diode 24' of the first embodiment, wherein the path of heat dissipation and electrical conduction of the 'light-emitting diode 24' is not the same. The light-emitting diode 24 has a heat sink and a heat sink, and the heat sink is in contact with the bare crystal 241, and protrudes from the rear of the plastic (four) piece 244', and is folded to the bottom surface 246 thereof, and the light-emitting diode ice is used. The surface of the heat sink is adhered to the metal substrate circuit board 22 so that the thermal energy of the light emitting diode 24 can be conducted to the heat conducting frame 21. When the current is applied, the LED 241 is electrically connected to the metal substrate board 22 by the guide pin. In this way, the light-emitting diode path is not (four), but can reduce the heart # 胄..., "sexual conduction reduces the effect of the light-emitting diode 24 to the heat dissipation efficiency, and can also be stationed in the ^^ & Heat dissipation. Heat conduction frame 21 with higher heat transfer coefficient
接著，請同時參照圖6及圖7以說明本發明第一實施 例之側向式發光模組，其中 月乐一 ANext, please refer to FIG. 6 and FIG. 7 simultaneously to explain the lateral type light-emitting module according to the first embodiment of the present invention, wherein Yuele-A
之部分剖面示意圖。中圖7係為沿圖6中之直線W 側向式發光模組3包含一 板％、-導光板33以及…卞31、一金屬基材電路 I光_極體34。其令，金屬基 11 200846776 材電路板32、導光板33以及發光二極體34係與第一實施 例中之金屬基材電路板22、導光板23以及發光二極體24 具有相同之技術特徵及功效，於此不再贅述。 與第一實施例不同的地方在於，本實施例中，側向式 、 發光模組3更包含一框體37，其係與導熱架31結合，其 ，中’框體37係支持導光板33及反射片35 ,且框體37之 材質可為金屬、合金或塑膠。須注意者，導熱架31係為 鲁一導熱側架，且設置於框體37之一側邊，導熱架31之截 面係貫質呈L开>。發光二極體34係設置於導熱架31上， 發光二極體34所發出的熱，可由金屬基材電路板32傳遞 至$熱架31，再由導熱架31傳遞至框體37以協助散熱。 當然，導熱架31之形狀可視實際產品需求來設計，於此 不再贅述。 最後’請同時參照圖8及圖9以說明本發明第三實施 例之侧向式發光模組，其中圖9係為沿圖8中之直線c_c 之部分剖面7ft意圖。 • 與第二實施例不同的地方在於，本實施例中，侧向式 .發光模組3’之框體37,為一下蓋體，也就是框體37,具有底 部371，，而框體37’與導熱架31之對應結合處則為一破孔 pl，破孔中則間隔設置了複數承載部372，以承载導熱架 31。因此，框體37,與導熱架31可較緊密地結合。 卞 綜上所述，因依據本發明之一種侧向式發光模組，其 發光二極體係表面黏著於金屬基材電路板。與習知技術相 比，由於發光二極體係表面黏著於金屬基材電路杯 双，而金 12 200846776 助散熱 以 屬基材電路板之導熱效果比較好，因此發光二極體可具有 較好的散熱效率，進而提升發光模組之產品品質。再者， 金屬基材電路板係平躺於侧向式發光模組中，故與習知技 術比較，可有效劇、侧向式發光模組之厚度，並且可增加 二電路板表面走線的面積。除此之外，發光二i體 經由金屬基材電路板傳遞至導熱架來進一步協 本發明縣舉触，时為_性者。任何未脫離 =π砷與乾嚀，而對其進行之等效修改 應包含於後附之申請專利範圍中。 μ更均 【圖式簡單說罘】 一圖1為顯不習知液晶顯示器中一侧向式背光模組之一 不意圖； 圖2為圖1中組裝後之側向式背光模組沿直線D-D之 一剖面示意圖； 一圖3為顯示本發明第一實施例之側向式發光模組之一 示意圖； 圖4為顯示圖3發光模組組裝後沿直線Α-Α之一部分 剖面示意圖； |^| 5 i, 為 " 為顯示第一實施例中之發光二極體之一放大示 意圖； 一圖為顯示為第一實施例之發光二極體之另一放大 示意圖； 13 200846776 圖6為顯示本發明第二實施例之側向式發光模組之一 示意圖； 圖7為顯示圖6發光模組組裝後沿直線B-B之一部分 剖面示意.圖； 圖8為顯示本發明第三實施例之侧向式發光模組之一 示意圖；以及 " 圖9為顯示圖8發光模組組裝後沿直線C-C之一部分 剖面示意圖。 元件符號說明： I :側向式背光模組. ， 2、3、3’ ：側向式發光模組 II :框體 12、24、24’、34 :發光二極體 121 :晶片 φ 122 :導線架 一 123·•塑膠殼體 ^ 13 :軟性電路板 14 :光源罩 15、 23、33 :導光板 151、 233 :入光面 152、 232 :出光面 16、 25、35 :反射片 21、31 :導熱架 14 200846776 22、32 ·•金屬基材電路板 231、246 :底面 241 .裸晶 242 :基板 243 :封裝體 Μ 244、244’ ：塑膠反射件 245 :侧發光面 26 :導熱材料 27 :反射罩 37、37’ ：框體 37Γ :底部 372 :承載部 Α-Α、Β-Β、C-C、D-D :直線 Η :散熱片 L、L’ ：引腳 ⑩ L1 :連接面 * Ρ :.膠體 - Ρ1 :破孔 S :容置空間 15A partial cross-sectional view. 7 is a straight line along the line W in FIG. 6. The lateral light-emitting module 3 includes a board %, a light guide plate 33, and a 卞 31, and a metal substrate circuit I photo-polar body 34. Therefore, the metal base 11 200846776 circuit board 32, the light guide plate 33, and the light emitting diode 34 have the same technical features as the metal base material circuit board 22, the light guide plate 23, and the light emitting diode 24 in the first embodiment. And efficacy, no longer repeat here. The difference from the first embodiment is that in the embodiment, the lateral type and the light-emitting module 3 further comprise a frame 37 which is combined with the heat-conducting frame 31. The middle frame 37 supports the light guide plate 33. And the reflective sheet 35, and the material of the frame 37 can be metal, alloy or plastic. It should be noted that the heat conducting frame 31 is a heat conducting side frame and is disposed on one side of the frame 37, and the cross section of the heat conducting frame 31 is L-opening. The light emitting diodes 34 are disposed on the heat conducting frame 31, and the heat generated by the light emitting diodes 34 can be transferred to the heat rack 31 by the metal substrate circuit board 32, and then transferred to the frame body 37 by the heat conducting frame 31 to assist in heat dissipation. . Of course, the shape of the heat conducting frame 31 can be designed according to actual product requirements, and will not be described herein. Finally, please refer to FIG. 8 and FIG. 9 simultaneously to explain the lateral type light-emitting module according to the third embodiment of the present invention, wherein FIG. 9 is a partial cross-sectional view of the line c_c in FIG. The difference from the second embodiment is that, in this embodiment, the frame 37 of the lateral type illumination module 3' is a lower cover, that is, the frame 37, having a bottom 371, and the frame 37 The corresponding joint with the heat conducting frame 31 is a broken hole pl, and the plurality of carrying portions 372 are spaced apart in the broken holes to carry the heat conducting frame 31. Therefore, the frame 37 can be more tightly coupled to the heat transfer frame 31. In summary, according to a lateral type light-emitting module according to the present invention, the surface of the light-emitting diode system is adhered to the metal substrate circuit board. Compared with the conventional technology, since the surface of the light-emitting diode system is adhered to the metal substrate circuit cup double, and the gold 12 200846776 helps heat dissipation, the heat conduction effect of the substrate circuit board is better, so the light-emitting diode can have better performance. The heat dissipation efficiency further enhances the product quality of the light-emitting module. Furthermore, the metal substrate circuit board is lying flat in the lateral light-emitting module, so that compared with the prior art, the thickness of the horizontal and lateral light-emitting modules can be effectively increased, and the surface of the two circuit boards can be increased. area. In addition, the light-emitting body is transferred to the heat-conducting frame via the metal substrate circuit board to further cope with the invention. Any deviation from =π arsenic and cognac shall be included in the scope of the appended patent application. μ is more uniform [simplification of the drawing] Figure 1 is not intended to be a conventional one-way backlight module in the liquid crystal display; Figure 2 is a straight line of the assembled lateral backlight module in Figure 1. FIG. 3 is a schematic view showing a side view of a light-emitting module according to a first embodiment of the present invention; FIG. 4 is a schematic cross-sectional view showing a portion of the light-emitting module of FIG. ^| 5 i, is an enlarged view showing one of the light-emitting diodes in the first embodiment; one is another enlarged schematic view showing the light-emitting diode of the first embodiment; 13 200846776 FIG. 7 is a schematic cross-sectional view showing a portion of a lateral illuminating module according to a second embodiment of the present invention; FIG. 7 is a cross-sectional view showing a portion of the illuminating module of FIG. A schematic diagram of a lateral light-emitting module; and FIG. 9 is a schematic cross-sectional view showing a portion of the light-emitting module of FIG. 8 along a straight line CC. Description of component symbols: I: Lateral backlight module. , 2, 3, 3': Lateral light-emitting module II: frame 12, 24, 24', 34: light-emitting diode 121: wafer φ 122: Lead frame 123·•plastic housing ^ 13 : flexible circuit board 14 : light source cover 15 , 23 , 33 : light guide plate 151 , 233 : light incident surface 152 , 232 : light emitting surface 16 , 25 , 35 : reflective sheet 21 , 31: heat conduction frame 14 200846776 22, 32 · metal substrate circuit board 231, 246: bottom surface 241. bare crystal 242: substrate 243: package Μ 244, 244': plastic reflection member 245: side light-emitting surface 26: heat-conductive material 27: Reflector 37, 37': Frame 37Γ: Bottom 372: Bearing Α-Α, Β-Β, CC, DD: Straight line 散热: Heat sink L, L': Pin 10 L1: Connection surface * Ρ : .Colloid - Ρ1 : Broken hole S : accommodating space 15