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TWI913285B - 半導體封裝 - Google Patents

半導體封裝

Info

Publication number
TWI913285B
TWI913285B TW110124604A TW110124604A TWI913285B TW I913285 B TWI913285 B TW I913285B TW 110124604 A TW110124604 A TW 110124604A TW 110124604 A TW110124604 A TW 110124604A TW I913285 B TWI913285 B TW I913285B
Authority
TW
Taiwan
Prior art keywords
semiconductor packages
packages
semiconductor
Prior art date
Application number
TW110124604A
Other languages
English (en)
Other versions
TW202207396A (zh
Inventor
崔朱逸
朴点龍
安振鎬
吳東俊
李忠善
Jeonggi Jin
千鎭豪
Original Assignee
南韓商三星電子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020210007625A external-priority patent/KR20220015907A/ko
Application filed by 南韓商三星電子股份有限公司 filed Critical 南韓商三星電子股份有限公司
Publication of TW202207396A publication Critical patent/TW202207396A/zh
Application granted granted Critical
Publication of TWI913285B publication Critical patent/TWI913285B/zh

Links

TW110124604A 2020-07-31 2021-07-05 半導體封裝 TWI913285B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20200096147 2020-07-31
KR10-2020-0096147 2020-07-31
KR1020210007625A KR20220015907A (ko) 2020-07-31 2021-01-19 반도체 패키지
KR10-2021-0007625 2021-01-19

Publications (2)

Publication Number Publication Date
TW202207396A TW202207396A (zh) 2022-02-16
TWI913285B true TWI913285B (zh) 2026-02-01

Family

ID=

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160329299A1 (en) 2015-05-05 2016-11-10 Mediatek Inc. Fan-out package structure including antenna
US20200105696A1 (en) 2018-09-28 2020-04-02 Taiwan Semiconductor Manufacturing Company, Ltd. Metal Bumps and Method Forming Same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160329299A1 (en) 2015-05-05 2016-11-10 Mediatek Inc. Fan-out package structure including antenna
US20200105696A1 (en) 2018-09-28 2020-04-02 Taiwan Semiconductor Manufacturing Company, Ltd. Metal Bumps and Method Forming Same

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