[go: up one dir, main page]

TWI901978B - 樹脂組合物 - Google Patents

樹脂組合物

Info

Publication number
TWI901978B
TWI901978B TW112125986A TW112125986A TWI901978B TW I901978 B TWI901978 B TW I901978B TW 112125986 A TW112125986 A TW 112125986A TW 112125986 A TW112125986 A TW 112125986A TW I901978 B TWI901978 B TW I901978B
Authority
TW
Taiwan
Prior art keywords
groups
resin
resin composition
ring
formula
Prior art date
Application number
TW112125986A
Other languages
English (en)
Chinese (zh)
Other versions
TW202411342A (zh
Inventor
松本愛
青木正矩
Original Assignee
日商日本觸媒股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日本觸媒股份有限公司 filed Critical 日商日本觸媒股份有限公司
Publication of TW202411342A publication Critical patent/TW202411342A/zh
Application granted granted Critical
Publication of TWI901978B publication Critical patent/TWI901978B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
TW112125986A 2022-07-25 2023-07-12 樹脂組合物 TWI901978B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-118243 2022-07-25
JP2022118243 2022-07-25

Publications (2)

Publication Number Publication Date
TW202411342A TW202411342A (zh) 2024-03-16
TWI901978B true TWI901978B (zh) 2025-10-21

Family

ID=89706123

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112125986A TWI901978B (zh) 2022-07-25 2023-07-12 樹脂組合物

Country Status (4)

Country Link
JP (1) JP7787316B2 (ja)
CN (1) CN119278226A (ja)
TW (1) TWI901978B (ja)
WO (1) WO2024024442A1 (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000351888A (ja) * 1999-06-14 2000-12-19 Nippon Kayaku Co Ltd 光半導体封止用エポキシ樹脂組成物
CN103923438A (zh) * 2013-01-11 2014-07-16 株式会社日本触媒 叠层用树脂组合物及其用途
TW201906813A (zh) * 2017-07-06 2019-02-16 日商日本觸媒股份有限公司 乙烯化合物、紫外線吸收劑及樹脂組合物

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6079033A (ja) * 1983-10-07 1985-05-04 Sumitomo Bakelite Co Ltd 素子封止に好適なエポキシ樹脂組成物
KR987000636A (ko) * 1994-12-09 1998-03-30 로더리히 네테부쉬.롤프 옴케 표면파 부품 및 이에 대한 감쇠 구조를 제조하는 방법(surface wave component and method of producing an attenuaing struture the refor)
JP2000351831A (ja) * 1999-06-11 2000-12-19 Nippon Kayaku Co Ltd 光半導体封止用エポキシ樹脂組成物
JP2001081286A (ja) * 1999-09-13 2001-03-27 Sumitomo Bakelite Co Ltd 半導体用樹脂ペースト及びそれを用いた半導体装置
JP2005213299A (ja) * 2004-01-27 2005-08-11 Matsushita Electric Works Ltd 半導体封止用樹脂組成物とそれを用いた半導体装置
CN101189275B (zh) * 2005-05-31 2011-08-17 株式会社艾迪科 环氧树脂固化性组合物
JP4887422B2 (ja) * 2006-04-25 2012-02-29 サイテク・テクノロジー・コーポレーシヨン 紫外線および摩耗に対する抵抗性をもった複合体の表面形成用フィルム
JP6887339B2 (ja) * 2017-08-09 2021-06-16 株式会社日本触媒 樹脂組成物
JP7231430B2 (ja) * 2019-02-14 2023-03-01 株式会社日本触媒 樹脂組成物、インクおよび光学フィルター

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000351888A (ja) * 1999-06-14 2000-12-19 Nippon Kayaku Co Ltd 光半導体封止用エポキシ樹脂組成物
CN103923438A (zh) * 2013-01-11 2014-07-16 株式会社日本触媒 叠层用树脂组合物及其用途
TW201906813A (zh) * 2017-07-06 2019-02-16 日商日本觸媒股份有限公司 乙烯化合物、紫外線吸收劑及樹脂組合物

Also Published As

Publication number Publication date
WO2024024442A1 (ja) 2024-02-01
JPWO2024024442A1 (ja) 2024-02-01
JP7787316B2 (ja) 2025-12-16
CN119278226A (zh) 2025-01-07
TW202411342A (zh) 2024-03-16

Similar Documents

Publication Publication Date Title
TWI557445B (zh) 光學濾波器、固體攝像裝置及照相機模組
TWI731248B (zh) 乙烯化合物、紫外線吸收劑及樹脂組合物
CN103858028B (zh) 固体摄影装置用滤光器及使用该滤光器的固体摄影装置及照相机模块
CN103323897B (zh) 光选择透射滤光器、树脂片材和固态图像传感器
JP6788444B2 (ja) 樹脂組成物および光学フィルター
JP2019032371A (ja) 光学フィルターおよびその用途
JPWO2015025779A1 (ja) 光学フィルターおよび光学フィルターを用いた装置
JP6771880B2 (ja) 樹脂組成物及び積層体
CN116348281A (zh) 滤光片
WO2019230570A1 (ja) 近赤外線吸収色素、光学フィルタおよび撮像装置
JP6887339B2 (ja) 樹脂組成物
TWI901978B (zh) 樹脂組合物
JP7128633B2 (ja) 樹脂組成物および光学フィルター
JP2018040932A (ja) 光学フィルター
JP7061045B2 (ja) 積層体および光学物品
JP7456295B2 (ja) スクアリリウム化合物、光学フィルタ、撮像装置
JP7231430B2 (ja) 樹脂組成物、インクおよび光学フィルター
JP6530968B2 (ja) 近赤外線カットフィルター
JP6629508B2 (ja) 赤外線吸収フィルター
JP2019031637A (ja) スクアリリウム化合物
JP6723762B2 (ja) 樹脂組成物
JP2016017152A (ja) 樹脂組成物及びその用途
JP2021067709A (ja) 光学フィルタおよび撮像装置
JP2017067871A (ja) 樹脂成形体
JPWO2019230660A1 (ja) 近赤外線吸収色素、光学フィルタおよび撮像装置