TWI900881B - Manufacturing method for optical film in combination type - Google Patents

Abstract

The present invention provides a manufacturing method for an optical film in combination type, which includes: providing an embossing mask that has an embossing layer allowing a curing light to pass therethrough; forming a plurality of colloid layers on a carrier by being are spaced apart from each other, and sequentially embossing and solidifying the colloid layers by the embossing layer so as to form a plurality of unit layers. The embossing layer has a first outer edge and a second outer edge that is opposite to the first outer edge, and the first outer edge and the second outer edge have irregular shapes that are complement in shape. Each of the unit layers includes a first outer side and a second outer side that are formed by being embossed from the first outer edge and the second outer edge and that have irregular shapes being complement in shape. The first outer side and the second outer side adjacent to each other and respectively belonging to different two of the unit layers have a gap there-between that is less than or equal to 50 μm.

Description

Method for manufacturing composite optical film

The present invention relates to a method for manufacturing an optical film, and more particularly to a method for manufacturing a modular optical film.

When conventional optical film manufacturing methods employ embossing to form a pattern composed of multiple unit patterns, noticeable gaps often form between adjacent unit patterns, hindering subsequent applications. The inventors, believing this drawback could be improved, conducted intensive research and applied scientific principles to develop the present invention, which is rationally designed and effectively mitigates this drawback.

The present invention provides a method for manufacturing a modular optical film, which can effectively improve the defects that may occur in existing optical film manufacturing methods.

The present invention discloses a method for manufacturing a modular optical film, which includes: a preparation step: providing an embossing mask having an embossing layer through which a curing light can pass; wherein the embossing layer has a unit pattern, and the unit pattern has a first outer edge and a second outer edge located on opposite sides; wherein the first outer edge and the second outer edge are both irregular and complementary in shape; and an embossing and curing step: forming a plurality of adhesive layers spaced apart and of uniform thickness on a carrier, and sequentially embossing and curing the plurality of adhesive layers with the embossing layer. The unit film layers are formed by a lithography process to form a plurality of unit film layers; wherein each of the unit film layers includes a first outer edge and a second outer edge located on opposite sides, respectively, which are embossed by the first outer edge and the second outer edge of the unit pattern, and the first outer edge and the second outer edge are both irregular and complementary in shape; wherein, among two unit film layers adjacent to each other along a first direction, the first outer edge of one of the unit film layers is adjacent to the second outer edge of the other of the unit film layers and is separated by a first gap of no more than 50 microns.

In summary, the disclosed method for manufacturing a modular optical film according to the embodiments of the present invention can be used to form a plurality of unit film layers by utilizing the structure of the embossing mask (e.g., having the first outer edge and the second outer edge having an irregular shape and complementary shapes) and other accompanying steps. This allows a first gap of a specific size (e.g., no greater than 50 microns) to be formed between any two adjacent unit film layers by the first outer edge and the second outer edge having an irregular shape and complementary shapes. This gap is thus invisible to the naked eye.

To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, such description and drawings are only used to illustrate the present invention and are not intended to limit the scope of protection of the present invention.

The following describes the implementation of the "Method for Manufacturing a Component Optical Film" disclosed in the present invention through specific embodiments. Those skilled in the art will understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can be modified and altered based on different viewpoints and applications without departing from the concept of the present invention. In addition, the accompanying figures of the present invention are for simple schematic illustration only and are not depicted in actual size. Please note that the following embodiments will further explain the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of protection of the present invention.

It should be understood that while terms such as "first," "second," and "third" may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. Furthermore, the term "or" as used herein may include any one or more combinations of the associated listed items, as appropriate.

[Example 1]

Please refer to Figures 1 to 8 , which illustrate a first embodiment of the present invention. This embodiment discloses a method for manufacturing a modular optical film, comprising a preparation step ( S100 ) and an embossing and curing step ( S300 ). To facilitate understanding of this embodiment, the preparation step ( S100 ) and the embossing and curing step ( S300 ) will be described separately below.

The preparation step S100: As shown in Figures 1 and 2, an imprint mask 1 is provided. The preparation step S100 in this embodiment can also be regarded as a method for manufacturing an imprint mask, which includes a pre-step, a mark forming step, and a pattern forming step.

The preceding step involves providing a substrate 11, which is illustrated in this embodiment as a flat plate, but the present invention is not limited thereto. The substrate 11 comprises a penetrating region 111, an annular alignment region 112 surrounding the penetrating region 111, and an annular non-penetrating region 113 surrounding the alignment region 112.

Specifically, the substrate 11 is only penetrated by a curing light L (e.g., ultraviolet light as shown in FIG5 ) provided by the transmissive block 111; that is, the curing light L cannot penetrate the alignment block 112 and the non-transmissive block 113. Furthermore, in this embodiment, the alignment block 112 is in the shape of a square ring and allows for the penetration of an alignment light IR (e.g., infrared light as shown in FIG4 ). Preferably, the alignment light IR cannot penetrate the non-transmissive block 113, and the wavelength of the curing light L is different from that of the alignment light IR.

The mark forming step forms a plurality of spaced-apart mask alignment marks 12 in the alignment area 112 of the substrate 11. In this embodiment, the plurality of mask alignment marks 12 are illustrated as being formed at the corners of the alignment area 112. Each mask alignment mark 12 may be cross-shaped to facilitate alignment in two perpendicular directions, but the present invention is not limited thereto.

The pattern forming step involves forming an embossing layer 13 in the penetrating area 111. The embossing layer 13 allows the curing light L to pass through and has a unit pattern 130 on the surface remote from the substrate 11. In this embodiment, the embossing layer 13 is formed by irradiating a photoresist layer with ultraviolet light (UV) through a mask M or interferometer. The default exposure wavelength of the UV exposure falls outside the default curing wavelength band of the curing light L (e.g., FIG5 ). For example, the default exposure wavelength may be 190 nm to 250 nm, while the default curing wavelength band differs from the default exposure wavelength by at least 100 nm (e.g., the default curing wavelength band is 350 nm to 410 nm).

More specifically, the unit pattern 130 has a generally square outline (e.g., a rectangle or square), but the edges of the unit pattern 130 are irregular. The unit pattern 130 has a first outer edge 131 and a second outer edge 132 located on opposite sides, and an upper edge 133 and a lower edge 134 located on the other opposite sides. Furthermore, the ends of the first outer edge 131 and the ends of the second outer edge 132 are respectively adjacent to the plurality of mask alignment marks 12. In other words, the embossing mask 1 has a plurality of mask alignment marks 12 formed on the outer side of the embossing layer 13.

The first outer edge 131 and the second outer edge 132 are spaced apart along a first direction D1 on opposite outer sides of the embossed layer 13. Both the first outer edge 131 and the second outer edge 132 are irregularly shaped and their shapes complement each other. Furthermore, the upper edge 133 and the lower edge 134 are spaced apart along a second direction D2 perpendicular to the first direction D1 on opposite outer sides of the embossed layer 13. Both the upper edge 133 and the lower edge 134 are irregularly shaped and their shapes complement each other, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the unit pattern 130 may also adopt the regular upper edge 133 and the regular lower edge 134 as required.

It should be noted that in this embodiment, the unit pattern 130 comprises a plurality of irregularly arranged reflective embossed portions 135 having the same appearance. Each reflective embossed portion 135 has a plurality of reflective embossed areas 1351 arranged in a matrix, which reflect light in the same direction. Furthermore, the reflective directions of the plurality of reflective embossed portions 135 are irregularly arranged. In other words, when the plurality of reflective embossed portions 135 are illuminated by visible light, they reflect light in a variety of colors.

Furthermore, each of the reflective embossed portions 135 is circular, and the multiple reflective embossed portions 135 of the unit pattern 130 are overlapped with each other, so that the first outer edge 131, the second outer edge 132, the upper edge 133, and the lower edge 134 are each composed of the arc edges of the multiple reflective embossed portions 135.

The above describes the technical details of the preparation step S100 (or the embossing mask manufacturing method) in this embodiment. In other words, this embodiment also discloses an embossing mask 1 that has a different, irregular structure than conventional embossing masks. The following describes the technical details of the embossing curing step S300.

The embossing and curing step S300: As shown in Figures 3 to 6, multiple spaced-apart adhesive layers 3a of uniform thickness are formed on a carrier 2. The embossing layer 13 of the embossing mask 1 sequentially embosses and cures the multiple adhesive layers 3a to form multiple unit film layers 3. In this embodiment, the multiple adhesive layers 3a are illustrated as multiple light-curable adhesive layers formed by coating or spraying, which can be cured by irradiation with the curing light L. The multiple unit film layers 3 are spaced-apart on the carrier 2 and together form a set of patterned optical films 200.

More specifically, in this embodiment, the carrier 2 is illustrated as a flat sheet having a plurality of carrier alignment marks 21 spaced apart from one another, but the present invention is not limited thereto. During the imprint and curing step S300, each adhesive layer 3a is substantially formed within the area surrounded by four of the carrier alignment marks 21 (that is, each unit film layer 3 is disposed within the area surrounded by four of the carrier alignment marks 21), and the plurality of carrier alignment marks 21 are not obscured by the adhesive layers 3a.

Furthermore, in the imprint curing step S300, the imprint mask 1 is aligned with at least two of the carrier alignment marks 21 located next to any one of the adhesive layers 3a along a height direction H perpendicular to the first direction D1 and the second direction D2 using the plurality of mask alignment marks 12, and then the imprint curing operation is performed along the height direction H using the imprint layer 13, so that the plurality of unit film layers 3 can be precisely formed at preset positions while maintaining preset intervals and having substantially the same appearance.

Furthermore, as shown in Figures 1, 7, and 8, the following describes the modular optical film 200 formed after implementing the modular optical film manufacturing method of this embodiment. Specifically, the following description of this embodiment is equivalent to disclosing a modular optical film 200 having a different irregular structure than conventional ones. While the multiple unit film layers 3 of the modular optical film 200 are described as being arranged in a matrix, the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the multiple unit film layers 3 may also be arranged in a row along the first direction D1.

In this embodiment, each of the unit film layers 3 includes a first outer edge 31 and a second outer edge 32 located on opposite sides, respectively, which are embossed by the first outer edge 131 and the second outer edge 132 of the unit pattern 130, respectively. Therefore, the first outer edge 31 and the second outer edge 32 are both irregular and complementary in shape. Furthermore, each of the unit film layers 3 also has an upper edge 33 and a lower edge 34 located on the other two opposite sides, which are respectively embossed by the upper edge 133 and the lower edge 134 of the unit pattern 130, so that the upper edge 33 and the lower edge 34 are both irregular and complementary in shape.

Furthermore, each unit film layer 3 includes a plurality of irregularly arranged reflective portions 35, which are embossed by the unit pattern 130 of the embossed layer 13 and have a uniform appearance. Specifically, within each unit film layer 3 of this embodiment, each reflective portion 35 comprises a plurality of reflective areas 351 arranged in a matrix, reflecting light in the same direction. Furthermore, the reflective directions of the plurality of reflective portions 35 are irregularly arranged. In other words, when the plurality of reflective portions 35 are illuminated by visible light, they reflect light in a variety of colors.

Furthermore, each of the reflective portions 35 is circular in this embodiment, and the multiple reflective portions 35 of each unit film layer 3 are arranged to overlap with each other, so that the first outer edge 31, the second outer edge 32, the upper edge 33, and the lower edge 34 of each unit film layer 3 are each composed of the arc edges of multiple reflective portions 35.

From another perspective, among the two unit film layers 3 adjacent to each other along the first direction D1, the first outer edge 31 of one unit film layer 3 is adjacent to the second outer edge 32 of the other unit film layer 3 (having mutually complementary irregular shapes), and is separated by a first gap G1 of no more than 50 microns. Furthermore, among the two unit film layers 3 adjacent to each other along the second direction D2, the upper edge 33 of one unit film layer 3 is adjacent to the lower edge 34 of the other unit film layer 3 along the second direction D2 (having mutually complementary irregular shapes), and is separated by a second gap G2 of no more than 50 microns.

In other words, the carrier alignment marks 21 are exposed in the first gaps G1 and the second gaps G2 between the unit film layers 3. In this embodiment, the first gaps G1 and the second gaps G2 are interconnected and generally form a checkerboard pattern. Preferably, each of the first gaps G1 and the second gaps G2 is no larger than 30 microns, but the present invention is not limited thereto.

Furthermore, as shown in Figures 1 and 3 through 6, this embodiment also discloses a modular embossing apparatus 100. The modular optical film manufacturing method can be implemented using the modular embossing apparatus 100, but the present invention is not limited thereto. In other words, the modular optical film manufacturing method can also be implemented using other apparatuses. Furthermore, in this embodiment, the modular embossing apparatus 100 is used to manufacture the modular optical film 200 described above. Therefore, the specific structure of the modular optical film 200 will not be further described in the following description.

In this embodiment, the plate-forming embossing apparatus 100 includes a worktable 4, a displacement mechanism 5 mounted on the worktable, a coating mechanism 6 positioned corresponding to the worktable 4, the embossing mask 1 and a camera mechanism 7 connected to the displacement mechanism 5, and a curing light source 8 connected to the displacement mechanism 5 and positioned corresponding to the embossing mask 1. In this embodiment, the specific structure of the embossing mask 1 is similar to that described in the aforementioned plate-forming optical film manufacturing method, and therefore will not be further described in the following description.

It should be noted that the plate-type imprinting device 100 is described in this embodiment using the combination of the aforementioned components, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the camera mechanism 7 and/or the curing light source 8 may be omitted or replaced with other components.

The workbench 4 is used for placing the carrier 2 , and the specific structure of the carrier 2 is roughly the same as that described in the above-mentioned method for manufacturing the assembly type optical film, so it will not be repeated in the following description.

The displacement mechanism 5 is movable relative to the worktable 4 along the mutually orthogonal height direction H, the first direction D1, and the second direction D2. Furthermore, in this embodiment, the coating mechanism 6 is mounted on the displacement mechanism 5 and driven by the displacement mechanism 5 to sequentially form a plurality of spaced-apart adhesive layers 3a of uniform thickness on the carrier 2. However, the present invention is not limited to this embodiment. For example, in other embodiments not shown, the coating mechanism 6 may operate independently of the displacement mechanism 5.

It should be noted that the coating mechanism 6 accurately forms the plurality of adhesive layers 3a by a coating or spraying method other than dispensing glue, so that each adhesive layer 3a has a uniform thickness and is formed within the area surrounded by the four carrier alignment marks 21 and does not cover any of the carrier alignment marks 21.

In addition, the embossing mask 1, the camera mechanism 7, and the curing light source 8 can be synchronously moved by the displacement mechanism 5. The embossing mask 1 can also move relative to the camera mechanism 7 and the curing light source 8 along the height direction H, but the present invention is not limited thereto.

Accordingly, the modular embossing apparatus 100 can use the camera mechanism 7 to align the plurality of mask alignment marks 12 of the embossing mask 1 with at least two carrier alignment marks 21 adjacent to any one of the adhesive layers 3a along the height direction H. The displacement mechanism 5 can then be used to drive the embossing mask 1 along the height direction H, so that the plurality of adhesive layers 3a are sequentially embossed to form each of the unit film layers 3. The curing light source 8 can be used to emit the curing light L toward the substrate 11 onto which the embossing mask 1 is to be embossed, so that the curing light passes through the penetration area 111 and the embossing layer 13, thereby curing the unit film layers 3.

As described above, the assembly optical film manufacturing method or the assembly embossing device 100 in this embodiment can manufacture the assembly optical film 200 through the structure of the embossing mask 1 (e.g., having the first outer edge 131 and the second outer edge 132 that are irregular and complementary in shape) and its other matching components or steps, so that the first gap G1 is formed between any two adjacent unit film layers 3 of the assembly optical film 200 by the first outer edge 31 and the second outer edge 32 that are irregular and complementary in shape with a specific size (e.g., not more than 50 microns), thereby making the first gap G1 invisible to the naked eye. On the other hand, if the gap is defined by two edges of a regular shape, the size of the gap needs to be at least smaller than 5 microns to make it difficult to observe directly with the naked eye.

In other words, as shown in Figures 1, 7, and 8, the optical film assembly 200 provided in this embodiment has a different structure than conventional ones, thereby facilitating manufacturing and effectively expanding its application range. Alternatively, the embossing mask 1 or its manufacturing method provided in this embodiment can form the optical film assembly 200 with the first gap G1 (and the second gap G2) being invisible to the naked eye with relatively low manufacturing difficulty.

[Example 2]

Please refer to Figures 9 and 10 , which illustrate a second embodiment of the present invention. Since this embodiment is similar to the first embodiment described above, the similarities between the two embodiments will not be reiterated. The main difference between this embodiment and the first embodiment described above is that the unit pattern 130 of the imprint mask 1 in this embodiment (e.g., during the pattern forming step) is formed with a first pattern 130-1 and a second pattern 130-2 spaced apart from each other, so that each unit film layer 3 also has two spaced-apart sub-blocks 30 formed therein.

More specifically, the first pattern 130-1 has a first outer edge 131 and a first inner edge 136 located on opposite sides (along the first direction D1). The second pattern 130-2 has a second outer edge 132 and a second inner edge 137 located on opposite sides (along the first direction D1). The first inner edge 136 and the second inner edge 137 are both irregular and complementary in shape. The first inner edge 136 and the second inner edge 137 are adjacent to each other and separated by an elongated slit S13 of no more than 50 microns along the first direction D1. The elongated slit S13 is preferably no more than 30 microns, and its long axis is non-parallel to (e.g., substantially perpendicular to) the first direction D1.

The first pattern 130-1 has a first upper edge 133-1 and a first lower edge 134-1 located on opposite sides, each of which is irregular and complementary in shape. One end of the first upper edge 133-1 and the first lower edge 134-1 are respectively connected to the ends of the first inner edge 136, and the other ends of the first upper edge 133-1 and the first lower edge 134-1 are respectively connected to the ends of the first outer edge 131.

The second pattern 130-2 has a second upper edge 133-2 and a second lower edge 134-2 located on opposite sides, both of which are irregular and complementary in shape. One end of the second upper edge 133-2 and the second lower edge 134-2 are respectively connected to the ends of the second inner edge 137, and the other ends of the second upper edge 133-2 and the second lower edge 134-2 are respectively connected to the ends of the second outer edge 132.

That is, in this embodiment, the upper edge 133 is divided into the first upper edge 133-1 and the second upper edge 133-2 by the elongated slit S13, and the lower edge 134 is divided into the first lower edge 134-1 and the second lower edge 134-2 by the elongated slit S13. In addition, in other embodiments not shown in the present invention, the unit pattern 130 can also be divided into more than three patterns as needed.

Furthermore, in this embodiment, the first pattern 130-1 and the second pattern 130-2 each include a plurality of reflective embossed portions 135 that are irregularly arranged and have the same appearance, each of which has a plurality of reflective embossed areas (not shown in the figure) arranged in a matrix and reflecting in the same direction, and the reflective directions of the plurality of reflective embossed portions 135 are irregularly arranged.

The above is a description of the differences between the embossing layer 13 of this embodiment and that of the first embodiment. The differences between the assembly optical film 200 embossed by the embossing layer 13 of this embodiment (through the embossing and curing step S300 ) and that of the first embodiment will be described below.

Specifically, each unit film layer 3 has a first inner edge 36 and a second inner edge 37 adjacent to each other, a first outer edge 31 and a second outer edge 32 located on opposite sides (along the first direction D1), and an upper edge 33 and a lower edge 34 located on opposite sides (along the second direction D2). The first inner edge 36 and the second inner edge 37 are both irregular and complementary in shape, the first outer edge 31 and the second outer edge 32 are both irregular and complementary in shape, and the upper edge 33 and the lower edge 34 are both irregular and complementary in shape.

In each of the unit film layers 3, the first inner edge 36 and the second inner edge 37 are embossed by the first inner edge 136 and the second inner edge 137 of the unit pattern 130, respectively, and are separated by a slit S3 of no more than 50 microns. Preferably, the slit S3 is no more than 30 microns, and its long axis is non-parallel to (e.g., substantially perpendicular to) the first direction D1.

That is, in this embodiment, the upper edge 33 and the lower edge 34 are each separated into two sections by the assembly slit S3, and are located in two sub-blocks 30, respectively. However, the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the unit film layer 3 may be divided into more than three sub-blocks 30 as needed.

Furthermore, the specific structure of each unit film layer 3 (e.g., the reflective portion 35 or the multiple reflective regions therein), and the first gap G1 or the second gap G2 formed between any two adjacent unit film layers 3 along the first direction D1 or the second direction D2, are the same as those described in the first embodiment and are not further described here. It should be noted that any one of the build-up slits S3 is connected to two of the second gaps G2.

As described above, the assembly optical film manufacturing method or the assembly embossing device 100 in this embodiment can manufacture the assembly optical film 200 through the structure of the embossing mask 1 (such as: having the first inner edge 136 and the second inner edge 137 that are irregular and complementary in shape) and its other matching components or steps, so that any of the unit film layers 3 of the assembly optical film 200 is formed with the assembly gap S3 that cannot be observed by the user with the naked eye, thereby facilitating the production of the embossing mask 1.

From another perspective, the modular optical film 200 provided in this embodiment has a different structure than conventional ones, which further facilitates the production and manufacturing of the embossing mask 1, thereby facilitating its promotion and mass production. Furthermore, the embossing mask 1 or its manufacturing method provided in this embodiment can utilize the elongated modular slits S13 to form the unit pattern 130, thereby effectively reducing the manufacturing difficulty of the embossing mask 1 and allowing the unit film layer 3 to be formed in which the modular slits S3 are not visible to the naked eye.

The contents disclosed above are merely preferred feasible embodiments of the present invention and do not limit the patent scope of the present invention. Therefore, any equivalent technical changes made by using the contents of the description and drawings of the present invention are included in the patent scope of the present invention.

100: Plate-forming imprinting equipment 1: Imprinting mask 11: Substrate 111: Transparent area 112: Alignment area 113: Non-transparent area 12: Mask alignment mark 13: Imprinting layer 130: Unit pattern 130-1: First pattern 130-2: Second pattern 131: First outer edge 132: Second outer edge 133: Upper edge 133-1: First upper edge 133-2: Second upper edge 134: Lower edge 134-1: First lower edge 134-2: Second lower edge 135: Reflective embossing unit 1351: Reflective embossing area 136: First inner edge 137: Second inner edge 2: Carrier 21: Carrier alignment mark 3a: Adhesive layer 3: Unit film layer 30: Sub-block 31: First outer edge 32: Second outer edge 33: Upper edge 34: Lower edge 35: Reflective unit 351: Reflective area 36: First inner edge 37: Second inner edge 4: Workbench 5: Displacement mechanism 6: Coating mechanism 7: Camera mechanism 8: Curing light source 200: Formatting optical film S100: Preparation step S300: Imprint curing step G1: First gap G2: Second gap S13: Long plate assembly gap S3: Plate assembly gap D1: First direction D2: Second direction H: Height M: Photomask UV: Exposure UV L: Curing light IR: Registration light

FIG1 is a schematic three-dimensional diagram of the preparation steps of the method for manufacturing a modular optical film (or the method for manufacturing an embossing mask) according to the first embodiment of the present invention.

FIG2 is an enlarged schematic diagram of region II in FIG1 .

FIG3 is a schematic three-dimensional diagram of the modular plate-type imprinting device according to the first embodiment of the present invention.

4 to 6 are plan views of the embossing and curing steps of the method for manufacturing a modular optical film according to the first embodiment of the present invention.

FIG7 is a partial top view of the modular optical film according to the first embodiment of the present invention.

FIG8 is an enlarged schematic diagram of region VIII in FIG7 .

FIG9 is a schematic three-dimensional diagram of the preparation step of the method for manufacturing a modular optical film (or the method for manufacturing an embossing mask) according to the second embodiment of the present invention.

FIG10 is a partial top view of the modular optical film according to the second embodiment of the present invention.

1: Imprinting mask

11: Base Material

111: Penetrating Block

112: Alignment Block

113: Non-penetrating block

12: Mask alignment mark

13: Embossed layer

130: Unit pattern

131: First outer edge

132: Second outer edge

133: Upper edge

134: Lower edge

S100: Preparation Steps

D1: First Direction

D2: Second Direction

H: Height direction

M: Mask

UV: Ultraviolet exposure

Claims (10)

A method for manufacturing a modular optical film comprises: A preparatory step: providing an embossing mask having an embossing layer through which a curing light can pass; wherein the embossing layer has a unit pattern, and the unit pattern has a first outer edge and a second outer edge located on opposite sides; wherein the first outer edge and the second outer edge are both irregular and complementary in shape; and An embossing and curing step: forming a plurality of spaced-apart, uniformly thickened adhesive layers on a carrier, and sequentially embossing and curing the adhesive layers with the embossing layer to form a plurality of unit film layers. Each unit film layer includes a first outer edge and a second outer edge located on opposite sides, respectively, embossed by the first outer edge and the second outer edge of the unit pattern, and both the first outer edge and the second outer edge are irregular and complementary in shape. Among the two unit film layers adjacent to each other along a first direction, the first outer edge of one of the unit film layers is adjacent to the second outer edge of the other unit film layer and is separated by a first gap of no more than 50 microns. A method for manufacturing a group-type optical film as described in claim 1, wherein, in the preparation step, the unit pattern has an upper edge and a lower edge respectively located on two opposite sides, which are arranged at intervals along a second direction perpendicular to the first direction, and the upper edge and the lower edge are both irregular and their shapes complement each other; wherein, in the embossing and curing step, each of the unit film layers has an upper edge and a lower edge respectively located on two opposite sides, which are embossed and formed by the upper edge and the lower edge of the unit pattern, and the upper edge and the lower edge are both irregular and their shapes complement each other. A method for manufacturing a group-type optical film as described in claim 2, wherein, among the two unit film layers adjacent to each other along the second direction, the upper edge of one of the unit film layers is adjacent to the lower edge of the other unit film layer along the second direction and is separated by a second gap of no more than 50 microns. A method for manufacturing a panelized optical film as described in claim 1, wherein, in the imprint curing step, the carrier has a plurality of carrier alignment marks, and each of the adhesive layers is formed within an area surrounded by four of the carrier alignment marks, and the plurality of the carrier alignment marks are not obscured by the plurality of the adhesive layers. A method for manufacturing a group-type optical film as described in claim 4, wherein, in the preparation step, the embossing mask forms a plurality of mask alignment marks on the outer side of the embossing layer; in the embossing curing step, the plurality of mask alignment marks of the embossing mask are aligned with at least two carrier alignment marks next to any one of the adhesive layers along a height direction, and then the embossing layer is used to perform the embossing curing operation along the height direction. The method for manufacturing a modular optical film as described in claim 5, wherein, in the preparation step, a plurality of the mask alignment marks are respectively adjacent to two ends of the first outer edge and two ends of the second outer edge. A method for manufacturing a plate-type optical film as described in claim 1, wherein, in the imprint curing step, each of the unit film layers includes a first inner edge and a second inner edge, which are arranged adjacent to each other and separated by a set of plate gaps of no more than 50 microns, and the first inner edge and the second inner edge are both irregular and complementary in shape. A method for manufacturing a group-type optical film as described in claim 7, wherein, in the preparation step, the unit pattern includes a first pattern and a second pattern arranged at intervals from each other, and the first pattern has the first outer edge and a first inner edge, and the second pattern has the second outer edge and a second inner edge adjacent to the first inner edge; in the embossing and curing step, the first inner edge and the second inner edge of each of the unit film layers are embossed by the first inner edge and the second inner edge of the unit pattern, respectively. A method for manufacturing a group-type optical film as described in claim 8, wherein, in the preparation step, the embossing layer is formed by irradiating a photoresist layer with an exposure ultraviolet ray through a mask or interference, and the preset exposure wavelength of the exposure ultraviolet ray falls outside the preset light curing band of the curing light. A method for manufacturing a modular optical film as described in claim 1, wherein, in the embossing and curing step, each of the unit film layers includes a plurality of irregularly arranged reflective portions, which are embossed by the unit pattern of the embossing layer and have the same appearance; in each of the unit film layers, each of the reflective portions has a plurality of reflective areas arranged in a matrix, which reflect in the same direction, and the reflective directions of the plurality of reflective portions are irregularly arranged.